EFEM device for rapid annealing of wafer

Abstract

The utility model relates to the technical field of semiconductors, and especially relates to an EFEM device used for wafer rapid annealing. Comprising a rack module, a wafer robot installed in the rack module, an external wafer boat module detachably installed on the rack module and used for allowing the wafer robot to grab a graphite box, and a calibration device installed on the rack module and used for calibrating a wafer. The caching platform is arranged on the rack module and is used for caching the wafer; and the cooling device is arranged on the rack module and is used for opening the graphite box. Compared with the prior art, feeding, detecting, caching and cooling stations are integrated through the rack module, and the concentration degree and compatibility of equipment are improved; therefore, the overall space occupation of the equipment can be reduced, the time required by the whole processing flow can be shortened, and the wafer processing efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to an EFEM device for rapid wafer annealing. Background Technology

[0002] In modular wafer fabrication, cooling chambers are required to cool the wafers according to processing needs. In related technologies, the graphite box containing the wafer is picked up by a robotic arm and transferred to a conveyor mechanism. The conveyor mechanism then transfers the graphite box to an opening chamber for opening, and the robotic arm picks up the wafer from the graphite box and feeds it into the cooling chamber for cooling. The drawbacks of this method are that the devices used for wafer loading in each process step occupy a large space, have low compatibility, and the entire process is lengthy, significantly impacting wafer processing efficiency.

[0003] Therefore, a new technical solution needs to be researched to address the above problems. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology and its main objective is to provide an EFEM device for rapid wafer annealing, effectively solving the technical defects of existing wafer loading devices, which occupy a large space and have a long processing flow, thereby improving wafer processing efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an EFEM device for rapid wafer annealing, comprising a rack module, a wafer robot installed inside the rack module, an external wafer boat module detachably installed in the rack module for the wafer robot to grasp graphite boxes, a calibration device installed in the rack module for calibrating the wafer, a buffer platform installed in the rack module for buffering the wafer, and a cooling device installed in the rack module for opening the graphite boxes;

[0006] The wafer robot is located in the center of the rack module, the external wafer boat module is located on the front and / or rear side of the rack module, the calibration device and cooling device are located on the left side of the wafer robot with front and rear spacing, and the buffer platform is located on the right side of the wafer robot.

[0007] The beneficial effects of the EFEM device for rapid wafer annealing provided in this application are as follows: Compared with the prior art, by setting an external wafer boat module on the front or rear side of the wafer robot, setting a calibration device and a cooling device on the left side of the wafer robot, and setting a buffer platform on the right side of the wafer robot, the wafer robot can grasp the graphite box of the external wafer boat module, transfer it to the calibration device for calibration, input it into the buffer platform or annealing device, and then transfer the annealed graphite box to the cooling device for opening and cooling the wafer. This structure can integrate the loading, inspection, buffering and cooling stations through the rack module, improving the concentration and compatibility of the equipment. It can not only reduce the overall space occupation of the equipment, but also shorten the time required for the entire processing flow, thereby improving the wafer processing efficiency.

[0008] As a preferred embodiment, the rack module includes a frame body and a protective plate on the outer surface of the frame body. The frame body is equipped with a control box, which integrates a control system and an operating console.

[0009] As a preferred embodiment, the external crystal boat module includes a first housing, a first base frame mounted on the first housing and enclosing a first receiving cavity, a first photoelectric recognition module mounted in the first receiving cavity, a first limit switch mounted on the first base frame, and a second limit switch mounted on the first base frame;

[0010] When the first base frame is input with a crystal boat of the first specification, the first limit switch can be triggered; when the first base frame is input with a crystal boat of the second specification, the second limit switch can be triggered.

[0011] As a preferred embodiment, the first base frame is provided with a first limiting protrusion and a first limiting plate, and the front and rear spacing of the first limiting protrusion and the first limiting plate is set to form a limiting space for limiting the first type of crystal boat;

[0012] The first base frame is provided with a second limiting protrusion and a second limiting pin. The front and rear spacing of the second limiting protrusion and the second limiting pin is set to form a limiting space for restricting the second type of crystal boat.

[0013] As a preferred embodiment, the caching platform includes a first base and a support fixture installed on the first base and spaced apart from top to bottom. The support fixture has a first support recess for storing a graphite box of a first specification and a second support recess for storing a graphite box of a second specification.

[0014] As a preferred embodiment, the cooling device includes a first base and an opening mechanism mounted on the first base. The opening mechanism includes a first base plate, a first top post mounted on the first base plate for opening the graphite box, and a second top post mounted on the first base plate for lifting the wafer.

[0015] As a preferred embodiment, the graphite box includes an upper box body and a lower box body assembled together, the lower box body having a first through hole for a first top post to pass through and a second through hole for a second top post to pass through;

[0016] When the first top post passes through the first perforation and abuts against the bottom of the upper box, and the second top post passes through the second perforation, the lower box can move down relative to the upper box to complete the opening, and the second top post lifts the wafer.

[0017] As a preferred embodiment, the first base is provided with first clamping plates on both sides, and the first clamping plates are used to fix and install the first base plate;

[0018] The first clamp is equipped with a second photoelectric recognition module.

[0019] As a preferred embodiment, the wafer robot includes a first tray, a second tray, a first robotic arm for driving the first tray to move, and a second robotic arm for driving the second tray to move.

[0020] As a preferred option, a panoramic camera is installed inside the rack module, positioned above the cooling unit and the wafer robot. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural schematic diagram of the EFEM device for rapid wafer annealing provided in the embodiments of this application;

[0023] Figure 2 yes Figure 1 The diagram shows a detailed structure of the EFEM device used for rapid wafer annealing.

[0024] Figure 3 yes Figure 1 The top view of the EFEM apparatus for rapid wafer annealing, showing the top fan assembly hidden;

[0025] Figure 4 yes Figure 2 The diagram shows a three-dimensional structural schematic of the external wafer boat module of the EFEM device used for rapid wafer annealing.

[0026] Figure 5 yes Figure 4 The diagram shows a partial three-dimensional structure of an external crystal boat module with a crystal boat of the first specification installed.

[0027] Figure 6 yes Figure 4 The diagram shows a partial three-dimensional structure of an external crystal boat module with a second type of crystal boat installed.

[0028] Figure 7 yes Figure 2 The diagram shows a three-dimensional structure of the calibration and cooling devices of the EFEM device used for rapid wafer annealing.

[0029] Figure 8 yes Figure 7 A schematic diagram of the specific structure of the cooling device shown;

[0030] Figure 9 yes Figure 2 A three-dimensional structural schematic diagram of the cache platform of the EFEM device used for rapid wafer annealing is shown.

[0031] Figure 10 yes Figure 2 The diagram shows a three-dimensional structural schematic of a wafer robot in an EFEM device used for rapid wafer annealing.

[0032] The following are the labeling elements in the figure:

[0033] 100. EFEM apparatus for rapid wafer annealing;

[0034] 10. Rack module; 11. Main frame; 12. Protective plate; 13. Control panel; 14. Panoramic camera; 15. Fan assembly; 16. Negative ion fan bar;

[0035] 20. Wafer robot; 21. First tray; 22. Second tray; 23. First robotic arm; 24. Second robotic arm; 25. Actuator;

[0036] 30. External crystal boat module; 31. First housing; 32. First base frame; 33. First photoelectric recognition module; 331. First fiber optic transmitter; 332. First fiber optic receiver; 34. First limit switch; 341. First trigger pin; 342. First mechanical switch; 35. Second limit switch; 351. Second trigger pin; 352. Second mechanical switch; 36. First limit protrusion; 37. First limit plate; 38. Second limit protrusion; 39. Second limit pin;

[0037] 40. Calibration device;

[0038] 50. Cache platform; 51. First base; 52. Support fixture; 53. First support recess; 54. Second support recess;

[0039] 60. Cooling device; 61. First base; 611. First clamping plate; 612. Second photoelectric recognition module; 6121. Second light emitter; 6122. Second light receiver; 62. First base plate; 63. First top column; 64. Second top column;

[0040] 2001, First specification crystal boat; 2002, Second specification crystal boat;

[0041] 3001, Upper box body; 3002, Lower box body; 3003, First perforation; 3004, Second perforation. Detailed Implementation

[0042] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0043] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0044] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0046] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0047] Please refer to the following: Figures 1 to 10 The EFEM apparatus 100 for rapid wafer annealing provided in the embodiments of this application will now be described.

[0048] The EFEM apparatus 100 for rapid wafer annealing includes a rack module 10, a wafer robot 20 installed inside the rack module 10, an external wafer boat module 30 detachably installed in the rack module 10 for the wafer robot 20 to grasp graphite boxes, a calibration device 40 installed in the rack module 10 for calibrating the wafer, a buffer platform 50 installed in the rack module 10 for buffering the wafer, and a cooling device 60 installed in the rack module 10 for opening the graphite boxes. The wafer robot 20 is located at the center inside the rack module 10, the external wafer boat module 30 is located at the front and / or rear of the rack module 10, the calibration device 40 and the cooling device 60 are located to the left of the wafer robot 20 with a front-to-back spacing, and the buffer platform 50 is located to the right of the wafer robot 20.

[0049] Specifically, an external wafer boat module 30 is set on the front or rear side of the wafer robot 20, a calibration device 40 and a cooling device 60 are set on the left side of the wafer robot 20, and a buffer platform 50 is set on the right side of the wafer robot 20. This allows the wafer robot 20 to pick up the graphite box from the external wafer boat module 30, transfer it to the calibration device 40 for calibration, and then input it into the buffer platform 50 or the annealing device. The wafer robot 20 then transfers the annealed graphite box to the cooling device 60 for opening and cooling the wafer. With this structure, the rack module 10 integrates the loading, inspection, buffering, and cooling stations, improving the concentration and compatibility of the equipment. This not only reduces the overall space occupied by the equipment but also shortens the time required for the entire processing flow, thereby improving the wafer processing efficiency.

[0050] In some embodiments, the rack module 10 includes a frame body 11 and a protective plate 12 disposed on the outer surface of the frame body 11. The frame body 11 is provided with a control box, which integrates a control system and an operating console 13. The operating status of each module or device is controlled by the control system, which is a conventional design method for those skilled in the art.

[0051] Specifically, the external crystal boat module 30 includes a first housing 31, a first base frame 32 installed on the first housing 31 and enclosing a first receiving cavity, a first photoelectric recognition module 33 installed in the first receiving cavity, a first limit switch 34 installed on the first base frame 32, and a second limit switch 35 installed on the first base frame 32; when the first base frame 32 receives a first specification crystal boat 2001, the first limit switch 34 can be triggered; when the first base frame 32 receives a second specification crystal boat 2002, the second limit switch 35 can be triggered.

[0052] It should be noted that the first housing 31 is provided with a first window, and the protective plate 12 is provided with a second window that is electrically connected to the first window. The wafer robot 20 can enter the first receiving chamber through the first window and the second window to grab the graphite box of the wafer boat and input it into the EFEM device.

[0053] For example, the first-specification crystal boat 2001 is provided with a plurality of recesses for carrying a first-specification graphite box, and the first-specification graphite box carries a first-specification wafer; the second-specification crystal boat 2002 is provided with a plurality of recesses for carrying a second-specification graphite box, and the second-specification graphite box carries a second-specification wafer; when the first-specification crystal boat 2001 is loaded onto the first base frame 32, the first limit switch 34 can be triggered so that the control system can obtain the state of the crystal boat; when the second-specification crystal boat 2002 is loaded onto the second rack, the second limit switch 35 can be triggered so that the control system can obtain the state of the crystal boat.

[0054] More specifically, the first limit switch 34 includes a first mechanical switch 342 mounted on the bottom of the first base frame 32 and a first trigger pin 341 mounted vertically on the first base frame 32. When the first specification crystal boat 2001 is input into the first base frame 32, the first trigger pin 341 can be activated to move downward and trigger the first mechanical switch 342, and the signal obtained by the first mechanical switch 342 is fed back to the control system. The second limit switch 35 includes a second mechanical switch 352 mounted on the bottom of the first base frame 32 and a second trigger pin 351 mounted vertically on the first base frame 32. When the second specification crystal boat 2002 is input into the first base frame 32, the second trigger pin 351 can be activated to move downward and trigger the second mechanical switch 352, and the signal obtained by the second mechanical switch 352 is fed back to the control system.

[0055] Furthermore, the first photoelectric identification module 33 includes a first optical fiber transmitter 331 installed on the first housing 31 and a first optical fiber receiver 332 installed on the first base frame 32. The first optical fiber transmitter 331 can emit light for the first optical fiber receiver 332 to receive. When the crystal boat is input into the first base frame 32, the light position can be disconnected to trigger the input crystal boat signal.

[0056] Understandably, to accommodate the installation of both the first-specification crystal boat 2001 and the second-specification crystal boat 2002, the first base frame 32 is provided with a first limiting protrusion 36 and a first limiting plate 37. The front-to-back spacing of the first limiting protrusion 36 and the first limiting plate 37 forms a limiting space for restricting the first-specification crystal boat 2001. The first base frame 32 is also provided with a second limiting protrusion 38 and a second limiting pin 39. The front-to-back spacing of the second limiting protrusion 38 and the second limiting pin 39 forms a limiting space for restricting the second-specification crystal boat 2002. In other words, the first limiting protrusion 36 and the first limiting plate 37 are used to restrict the installation of the first-specification crystal boat 2001; the second limiting protrusion 38 and the second limiting pin 39 are used to facilitate the installation of the second-specification crystal boat 2002.

[0057] In other embodiments, the cache platform 50 includes a first base 51 and a support fixture 52 mounted on the first base 51 and arranged sequentially from top to bottom at intervals. The support fixture 52 is provided with a first support recess 53 for storing a graphite box of a first specification and a second support recess 54 for storing a graphite box of a second specification.

[0058] Specifically, the cache platform 50 can serve as a temporary storage area for graphite cartridges. Graphite cartridges that have undergone wafer calibration by the calibrator can be temporarily stored in the cache platform 50, awaiting further processing. This helps reduce standby time, thereby improving the efficiency of wafer annealing and cooling operations. Furthermore, the support fixture 52 has a first support recess 53 and a second support recess 54, which can support graphite cartridges of various specifications, thus improving the versatility of the cache platform 50.

[0059] In some embodiments, the cooling device 60 includes a first base 61 and an opening mechanism mounted on the first base 61. The opening mechanism includes a first base plate 62, a first top post 63 mounted on the first base plate 62 for opening the graphite box, and a second top post 64 mounted on the first base plate 62 for lifting the wafer.

[0060] Specifically, the graphite box includes an upper box body 3001 and a lower box body 3002 assembled together. The lower box body 3002 is provided with a first through hole 3003 for the first top post 63 to pass through and a second through hole 3004 for the second top post 64 to pass through. When the first top post 63 passes through the first through hole 3003 and abuts against the bottom of the upper box body 3001, and the second top post 64 passes through the second through hole 3004, the lower box body 3002 can move down relative to the upper box body 3001 to complete the opening of the box, and the second top post 64 lifts up the wafer. During the graphite box opening process, the graphite box is first fed into the cooling device 60. Then, the first top post 63 passes through the first through hole 3003 and abuts against the bottom surface of the upper box 3001, while the second top post 64 abuts against the bottom surface of the wafer. At this time, the lower box 3002 can move downward away from the upper box 3001 by its own weight to complete the opening of the upper box 3001, and the upper box 3001, the wafer, and the lower box 3002 are spaced from bottom to top. Wafer cooling in this state can reduce the impact of the residual heat of the graphite box on the wafer, improve the wafer cooling efficiency, and thus further improve the wafer production efficiency.

[0061] More specifically, the first base 61 has first clamping plates 611 on both sides, which are used to fix the first base plate 62. The first clamping plates 611 are equipped with second photoelectric recognition modules 612. There are several box-opening mechanisms, which are installed on the first clamping plates 611 at intervals from top to bottom. The second photoelectric recognition modules 612 are set according to the number of box-opening mechanisms. Each second photoelectric recognition module 612 includes a second light emitter 6121 installed on one side of the first clamping plate 611 and a second light receiver 6122 installed on the other side of the first clamping plate 611. When the graphite box is entered into the box-opening mechanism, the opening status of the graphite box can be identified by the second photoelectric recognition module 612.

[0062] In some embodiments, the wafer robot 20 includes a first tray 21, a second tray 22, a first robotic arm 23 for driving the first tray 21 to move, and a second robotic arm 24 for driving the second tray 22 to move. Both the first robotic arm 23 and the second robotic arm 24 are mounted in an execution device 25. The execution device 25 can drive the first robotic arm 23 and the second robotic arm 24 to move up and down, change their different heights, and drive them to move horizontally, thereby driving the first tray 21 and the second tray 22 to move on a horizontal plane. This type of wafer robot 20 is a conventional design approach for those skilled in the art and will not be described in detail here.

[0063] It should be noted that the key design feature of the EFEM device 100 for rapid wafer annealing provided in this embodiment is that, by setting up a wafer robot 20, an external crystal boat module 30 is set on the front side of the wafer robot 20, a calibration device 40 and a cooling device 60 are set on the left side of the wafer robot 20, and a buffer platform 50 is set on the right side of the wafer robot 20. The rear side of the wafer robot 20 serves as the connection end to the annealing furnace. When the wafer robot 20 is working, it can move longitudinally forward into the external crystal boat module 30 to extract the graphite box and move laterally to the right into the calibration device 40. After calibration, the graphite box can move longitudinally backward into the annealing furnace or move laterally to the right into the buffer platform 50 to wait for material. When the wafer robot 20 feeds the graphite box into the annealing furnace for annealing, it can also extract the annealed graphite box in the annealing furnace and transfer it to the cooling device 60 for cooling. The rack module 10 can integrate feeding, inspection, buffering and cooling stations, which improves the concentration and compatibility of the equipment; it can not only reduce the overall space occupied by the equipment, but also shorten the time required for the entire process, thereby improving the wafer processing efficiency.

[0064] In some embodiments, a panoramic camera 14 is installed inside the rack module 10, located above the cooling device 60 and the wafer robot 20. A fan assembly 15 is installed on the top of the frame body 11, which blows cold air downwards to assist in wafer cooling and reduce the temperature inside the frame body 11. At the same time, a negative ion bar 16 is provided below the fan assembly 15 in the frame body 11, which releases negative ions into the cold air source to neutralize the static charge on the wafer surface, thereby reducing electrostatic adsorption, preventing impurities from adhering to the wafer surface, ensuring wafer cleanliness, and improving product quality. Furthermore, it can effectively prevent electrostatic discharge, protect the integrity of the wafer's circuit structure, and reduce the defect rate during the production process.

[0065] The above are merely preferred embodiments of the present utility model, and only specifically describe the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. An EFEM apparatus for wafer rapid thermal annealing, characterized by, The device includes a rack module (10), a wafer robot (20) installed inside the rack module (10), an external wafer boat module (30) detachably installed in the rack module (10) for the wafer robot (20) to grasp graphite boxes, a calibration device (40) installed in the rack module (10) for calibrating wafers, a buffer platform (50) installed in the rack module (10) for buffering wafers, and a cooling device (60) installed in the rack module (10) for opening graphite boxes. The wafer robot (20) is located in the center of the rack module (10), the external crystal boat module (30) is located on the front and / or rear side of the rack module (10), the calibration device (40) and the cooling device (60) are located on the left side of the wafer robot (20) and are spaced apart front and back, and the cache platform (50) is located on the right side of the wafer robot (20).

2. The EFEM apparatus for wafer rapid thermal annealing of claim 1, wherein, The frame module (10) includes a frame body (11) and a protective plate (12) on the outer surface of the frame body (11). The frame body (11) is equipped with a control box, which integrates a control system and an operating console (13).

3. The EFEM apparatus for wafer rapid thermal annealing of claim 2, wherein, The external crystal boat module (30) includes a first housing (31), a first base frame (32) installed on the first housing (31) and enclosing a first receiving cavity, a first photoelectric recognition module (33) installed in the first receiving cavity, a first limit switch (34) installed on the first base frame (32) and a second limit switch (35) installed on the first base frame (32); When the first base frame (32) inputs the first specification crystal boat (2001), it can trigger the first limit switch (34); when the first base frame (32) inputs the second specification crystal boat (2002), it can trigger the second limit switch (35).

4. The EFEM apparatus for wafer rapid thermal annealing of claim 3, wherein, The first base frame (32) is provided with a first limiting protrusion (36) and a first limiting plate (37). The front and rear spacing of the first limiting protrusion (36) and the first limiting plate (37) constitutes a limiting space for limiting the first specification crystal boat (2001). The first base frame (32) is provided with a second limiting protrusion (38) and a second limiting pin (39). The front and rear spacing of the second limiting protrusion (38) and the second limiting pin (39) forms a limiting space for restricting the second type of crystal boat (2002).

5. The EFEM apparatus for rapid wafer annealing according to any one of claims 1-4, characterized in that, The cache platform (50) includes a first base (51) and a support fixture (52) installed on the first base (51) and spaced apart from top to bottom. The support fixture (52) has a first support recess (53) for storing a first type of graphite box and a second support recess (54) for storing a second type of graphite box.

6. The EFEM apparatus for rapid wafer annealing according to any one of claims 1-4, characterized in that, The cooling device (60) includes a first base (61) and an opening mechanism mounted on the first base (61). The opening mechanism includes a first base plate (62), a first top post (63) mounted on the first base plate (62) for opening the graphite box, and a second top post (64) mounted on the first base plate (62) for lifting the wafer.

7. The EFEM apparatus for rapid wafer annealing according to claim 6, characterized in that, The graphite box includes an upper box body (3001) and a lower box body (3002) assembled together. The lower box body (3002) is provided with a first through hole (3003) for the first top post (63) to pass through and a second through hole (3004) for the second top post (64) to pass through. When the first top post (63) passes through the first perforation and abuts against the bottom of the upper box (3001) and the second top post (64) passes through the second perforation (3004), the lower box (3002) can move down relative to the upper box (3001) to complete the opening and make the second top post (64) lift the wafer.

8. The EFEM apparatus for rapid wafer annealing according to claim 6, characterized in that, The first base (61) has first clamping plates (611) on both sides, and the first clamping plates (611) are used to fix the first base plate (62). The first clamping plate (611) is equipped with a second photoelectric recognition module (612).

9. The EFEM apparatus for rapid wafer annealing according to any one of claims 1-4 or 6-7, characterized in that, The wafer robot (20) includes a first tray (21), a second tray (22), a first robotic arm (23) for driving the first tray (21) to move, and a second robotic arm (24) for driving the second tray (22) to move.

10. The EFEM apparatus for rapid wafer annealing according to claim 9, characterized in that, A panoramic camera (14) is installed inside the rack module (10). The panoramic camera (14) is located above the cooling device (60) and the wafer robot (20).

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