Multi-mode integrated circuit packaging device

Abstract

The utility model belongs to the technical field of integrated circuit packaging, and discloses a multi-mode integrated circuit packaging device which comprises a frame main body, a packaging table and a positioning assembly, the frame main body is used for supporting or installing a structural member, the packaging table is movably arranged on the frame main body and used for bearing an integrated circuit board needing to be packaged, and the positioning assembly is used for positioning the integrated circuit board. The positioning assembly comprises a first positioning piece, a second positioning piece, an elastic piece, an extrusion piece, a sponge pad and a first protection piece, the first positioning piece is connected to the packaging table, the second positioning piece is connected to the packaging table, the elastic piece is arranged on the first positioning piece, the extrusion piece is connected to the elastic piece, and the sponge pad is arranged on the first protection piece. And the extrusion part is movably arranged on the positioning part I. The multi-mode integrated circuit board can be extruded and fixed, so that the integrated circuit board is kept stable when being packaged, the packaging efficiency of the integrated circuit board is ensured, and the reliability of the device is effectively improved.

Description

Technical Field

[0001] This utility model belongs to the field of integrated circuit packaging technology, and in particular relates to a multi-mode integrated circuit packaging device. Background Technology

[0002] With the continuous development of various industries such as aerospace, aviation, machinery, light industry, and chemical industry, the overall equipment is also changing towards multi-functionality and miniaturization. This requires the integration degree of multi-mode integrated circuits to be higher and the functions to be more complex. Correspondingly, it requires the integrated circuit packaging density to be higher and the number of leads to be more and more, while the size is smaller and the weight is lighter and the replacement is faster. The rationality and scientific nature of the packaging structure will directly affect the quality of integrated circuits.

[0003] Existing multi-mode integrated circuit packaging devices lack an effective multi-mode integrated circuit board positioning structure, which makes it impossible to ensure the stability of the integrated circuit board during packaging. This not only affects the packaging efficiency of the integrated circuit board, but also the packaging effect. Utility Model Content

[0004] This invention addresses the problem that existing multi-mode integrated circuit packaging devices lack an effective multi-mode integrated circuit board positioning structure, which leads to the inability to ensure the stability of the integrated circuit board during packaging. This not only affects the packaging efficiency but also the packaging effect of the integrated circuit board. The following technical solution is proposed:

[0005] A multi-mode integrated circuit packaging device, comprising:

[0006] The main frame, used to support or install structural components;

[0007] The packaging stage is movably mounted on the main frame body and is used to support the integrated circuit board that needs to be packaged;

[0008] The positioning assembly includes a positioning element one, a positioning element two, an elastic element, a squeezing element, a sponge pad, and a protective element one. The positioning element one is connected to the packaging stage, the positioning element two is connected to the packaging stage, the elastic element is disposed on the positioning element one, the squeezing element is connected to the elastic element and is movably disposed on the positioning element one, the sponge pad is disposed on the positioning element two, and the protective element one is adhered to the positioning element one and the positioning element two. The elastic element drives the integrated circuit board to contact the sponge pad through the squeezing element.

[0009] Preferably, the first positioning member and the second positioning member are provided with a limiting component. The limiting component includes an electric telescopic rod, a connecting member, a limiting plate, and a second protective member. The electric telescopic rod is connected to the first positioning member and the second positioning member. The connecting member is rotatably disposed on the electric telescopic rod. The limiting plate is connected to the connecting member. The connecting member is adhered to the limiting plate. The electric telescopic rod drives the limiting plate to move in the vertical direction through the connecting member.

[0010] Preferably, two positioning elements are provided at equal intervals on the packaging stage, and the positioning elements are provided in a one-to-one correspondence.

[0011] Preferably, the extrusion member is connected to a limiting block, and the limiting block is slidably disposed between the first positioning member and the second positioning member.

[0012] Preferably, the first positioning member and the second positioning member are provided with limiting grooves, and the connecting member is movably disposed inside the limiting grooves.

[0013] Preferably, the second protective component is located above the first protective component.

[0014] The beneficial effects of this utility model are as follows:

[0015] (1) It can form a compression fixation on the multi-mode integrated circuit board, ensuring stability when packaging the integrated circuit board, guaranteeing the packaging efficiency of the integrated circuit board, and effectively improving the reliability of the device.

[0016] (2) It can effectively limit the position of the multi-mode integrated circuit board, prevent the integrated circuit board from shifting position during packaging, thereby affecting the packaging effect of the integrated circuit board and effectively improving the product quality of the integrated circuit board. Attached Figure Description

[0017] Figure 1 The diagram shown is a structural schematic of a multi-mode integrated circuit packaging device;

[0018] Figure 2 The diagram shows the installation structure of the encapsulation stage;

[0019] Figure 3 The diagram shown is a schematic of the installation structure of the positioning component one;

[0020] Figure 4 The diagram shown is a schematic of the installation structure of positioning component two;

[0021] Figure 5 The diagram shown is a schematic of the installation structure of the limiting plate;

[0022] In the diagram: 1. Frame body; 2. Encapsulation platform; 3. Positioning component one; 4. Positioning component two; 5. Elastic component; 6. Extrusion component; 7. Sponge pad; 8. Protective component one; 9. Electric telescopic rod; 10. Connecting component; 11. Limiting plate; 12. Protective component two; 13. Limiting block; 14. Limiting groove. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0024] Example 1

[0025] This utility model provides a multi-mode integrated circuit packaging device, such as... Figures 1 to 5 As shown, the system includes: a frame body 1, a packaging platform 2, and positioning components. The frame body 1 consists of a base, a processing table, a control console, and a welding head. An electric slide rail structure is installed inside the processing table. The slider of the electric slide rail structure is connected to the welding head, driving the welding head to move horizontally. The welding head consists of a movable plate and a welding device. The electric slide rail structure is installed inside the movable plate. The slider of the electric slide rail structure is connected to the welding device, driving the welding device to move vertically. The frame body 1 is used to support or install structural components. The electric slide rail structure is installed inside the base. The slider of the electric slide rail structure is connected to the packaging platform 2, driving the packaging platform 2 to move horizontally. The packaging platform 2 is movably mounted on the frame body 1 to support the integrated circuit board to be packaged. The positioning components include positioning element 3, positioning element 4, elastic element 5, extrusion element 6, sponge pad 7, and protective element 8. Positioning element 3 and positioning element 4 can provide positioning functionality. The cylinder, positioning component 3 and positioning component 4 both have positioning grooves inside. Positioning component 3 is connected to the packaging platform 2, and positioning component 4 is connected to the packaging platform 2. The elastic component 5 can be a spring and is set on positioning component 3. The extrusion component 6 can be a rectangular block with an extrusion effect. The top and bottom of one end of the extrusion component 6 are both cut into bevels. The extrusion component 6 is connected to the elastic component 5 and is movably set on positioning component 3. The sponge pad 7 is at the same horizontal height as the extrusion component 6 and is set on positioning component 4. The protective component 8 can be a rubber pad and is bonded to positioning component 3 and positioning component 4. The elastic component 5 drives the integrated circuit board to contact the sponge pad 7 through the extrusion component 6. There are two positioning components 3 and two positioning components 4 equidistantly set on the packaging platform 2. Positioning component 3 and positioning component 4 are set one-to-one. The extrusion component 6 is connected to the limit block 13, and the limit block 13 is slidably set on positioning component 3 and positioning component 4.

[0026] By using positioning components, multi-mode integrated circuit boards can be squeezed and fixed, ensuring stability during the packaging of integrated circuit boards, guaranteeing packaging efficiency, and effectively improving the reliability of the device.

[0027] In use, first place the multi-mode integrated circuit board to be packaged on the top of the packaging stage 2, positioning it between positioning member 3 and positioning member 4. Then tilt the integrated circuit board so that one end of the integrated circuit board contacts the extrusion member 6. Then move the integrated circuit board towards the extrusion member 6. The integrated circuit board will exert a force on the extrusion member 6, and the extrusion member 6 will exert a force on the elastic member 5, causing the elastic member 5 to deform, thereby driving the extrusion member 6 to move inward. The movement of the extrusion member 6 causes the limiting block 13 to slide synchronously inside the positioning member 3, thereby enabling the integrated circuit board to continue moving towards the extrusion member 6. When the integrated circuit board contacts the outer surface of the positioning member 3, stop moving the integrated circuit board. Then move the other end of the integrated circuit board so that it contacts the sponge pad 7. Then, since the sponge pad 7 and the extrusion member 6 are at the same horizontal height, and due to the elastic force of the elastic member 5, the extrusion member 6 is driven to move towards the integrated circuit board, forming a compression fixation on one end of the integrated circuit board, so that the other end of the integrated circuit board remains in contact with the sponge pad 7. At this time, the initial positioning of the integrated circuit board is completed.

[0028] Specifically, one end of positioning component 3 is fixedly connected to the inside of the packaging platform 2, one end of positioning component 4 is fixedly connected to the inside of the packaging platform 2, one end of elastic component 5 is fixedly connected to the inside of positioning component 3, the outer surface of extrusion component 6 is fixedly connected to the other end of elastic component 5, the outer surface of extrusion component 6 is movably connected to the inside of positioning component 3, one end of sponge pad 7 is fixedly connected to the outer surface of positioning component 4, and multiple protective components 8 are respectively bonded to the outer surfaces of positioning component 3 and positioning component 4.

[0029] To achieve limit operation on multi-mode integrated circuit boards, such as Figures 1 to 5 As shown, positioning component 3 and positioning component 4 are equipped with limiting components. The limiting components include an electric telescopic rod 9, a connecting component 10, a limiting plate 11, and a protective component 12. The electric telescopic rod 9 is connected to positioning component 3 and positioning component 4. The connecting component 10 is rotatably mounted on the electric telescopic rod 9. The connecting component 10 can be a connecting rod. The bottom end of the connecting component 10 is rotatably connected to the movable end of the electric telescopic rod 9. The limiting plate 11 is connected to the connecting component 10. The limiting plate 11 can be a semi-circular plate. The limiting plate 11 is located above the positioning groove. The connecting component 10 is bonded to the limiting plate 11. The electric telescopic rod 9 drives the limiting plate 11 to move in the vertical direction through the connecting component 10. Positioning component 3 and positioning component 4 are equipped with limiting grooves 14. The size of the connecting component 10 is the same as that of the connecting component 10. The connecting component 10 is movably mounted inside the limiting groove 14. The protective component 12 is located above the protective component 8.

[0030] By using a limiting component, the multi-mode integrated circuit board can be effectively limited, preventing the integrated circuit board from shifting position during packaging, which would affect the packaging effect and effectively improve the product quality of the integrated circuit board.

[0031] In use, rotating the connector 10 causes the limiting plate 11 to rotate synchronously, which in turn causes the protective component 12 to rotate synchronously. When the connector 10 is positioned above the limiting groove 14 and the two are aligned, the electric telescopic rod 9 is activated via the control console. The movable end of the electric telescopic rod 9 causes the connector 10 to move downwards, which in turn causes the limiting plate 11 and the protective component 12 to move downwards synchronously. As the connector 10 moves, it enters the limiting groove 14. When the connector 10 reaches the bottom of the limiting groove 14, the limiting plate 11 causes the protective component 12 to contact the integrated circuit board and press and fix the top of the integrated circuit board. At this point, the secondary positioning of the integrated circuit board is completed, and the integrated circuit board can be packaged using the welding head.

[0032] Specifically, multiple electric telescopic rods 9 are fixedly connected to the inside of positioning component 1 3 and positioning component 2 4 respectively. One end of the connector 10 is rotatably connected to the movable end of the electric telescopic rod 9. The outer surface of the limiting plate 11 is fixedly connected to one end of the connector 10. The top of the protective component 2 12 is bonded to the bottom of the limiting plate 11. The connector 10 is movably connected to the inside of the limiting groove 14.

[0033] Working Principle: In actual use, the multi-mode integrated circuit board to be packaged is first placed on the top of the packaging stage 2, positioned between positioning element 3 and positioning element 4. Then, the integrated circuit board is tilted so that one end contacts the extruder 6. The integrated circuit board is then moved towards the extruder 6, applying a force to the extruder 6. The extruder 6 then applies a force to the elastic element 5, causing the elastic element 5 to deform. This deforms the extruder 6, causing it to move inward. The movement of the extruder 6 causes the limiting block 13 to slide synchronously within the positioning element 3, thus allowing the integrated circuit board to continue moving towards the extruder 6. When the integrated circuit... When the integrated circuit board contacts the outer surface of the positioning member 3, the movement of the integrated circuit board stops. Then, the other end of the integrated circuit board is moved to contact the sponge pad 7. Since the sponge pad 7 and the extruder 6 are at the same horizontal height, and the elastic force of the elastic member 5 drives the extruder 6 to move towards the integrated circuit board, one end of the integrated circuit board is squeezed and fixed, so that the other end of the integrated circuit board remains in contact with the sponge pad 7. At this time, the initial positioning of the integrated circuit board is completed. At this time, the multi-mode integrated circuit board can be squeezed and fixed to ensure stability when the integrated circuit board is packaged, thus ensuring the packaging efficiency of the integrated circuit board and effectively improving the reliability of the device.

[0034] Then, the connector 10 is rotated, which drives the limiting plate 11 to rotate synchronously. The limiting plate 11 then drives the second protective component 12 to rotate synchronously. When the connector 10 is positioned above the limiting groove 14 and the two are aligned, the electric telescopic rod 9 is activated via the control console. The movable end of the electric telescopic rod 9 drives the connector 10 to move downward. The downward movement of the connector 10 drives the limiting plate 11 and the second protective component 12 to move downward synchronously. As the connector 10 moves, it enters the limiting groove 14. When the connector 10 reaches the bottom of the limiting groove 14, the limiting plate 11 drives the second protective component 12 to contact the integrated circuit board and press and fix the top of the integrated circuit board. At this point, the secondary positioning of the integrated circuit board is completed. The integrated circuit board can then be packaged using the welding head. This effectively limits the positioning of multi-mode integrated circuit boards, preventing positional displacement of the integrated circuit board during packaging, which would affect the packaging effect and effectively improve the product quality of the integrated circuit board.

[0035] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A multi-mode integrated circuit packaging device, characterized in that, include: The main frame (1) is used to support or install structural components; The packaging stage (2) is movably set on the frame body (1) and is used to support the integrated circuit board to be packaged; The positioning component includes a positioning element one (3), a positioning element two (4), an elastic element (5), a squeezing element (6), a sponge pad (7), and a protective element one (8). The positioning element one (3) is connected to the packaging stage (2), the positioning element two (4) is connected to the packaging stage (2), the elastic element (5) is disposed on the positioning element one (3), the squeezing element (6) is connected to the elastic element (5), the squeezing element (6) is movably disposed on the positioning element one (3), the sponge pad (7) is disposed on the positioning element two (4), and the protective element one (8) is bonded to the positioning element one (3) and the positioning element two (4). The elastic element (5) drives the integrated circuit board to contact the sponge pad (7) through the squeezing element (6).

2. The multi-mode integrated circuit packaging device according to claim 1, characterized in that: The positioning component one (3) and the positioning component two (4) are provided with a limiting component. The limiting component includes an electric telescopic rod (9), a connector (10), a limiting plate (11) and a protective component two (12). The electric telescopic rod (9) is connected to the positioning component one (3) and the positioning component two (4). The connector (10) is rotatably disposed on the electric telescopic rod (9). The limiting plate (11) is connected to the connector (10). The connector (10) is bonded to the limiting plate (11). The electric telescopic rod (9) drives the limiting plate (11) to move in the vertical direction through the connector (10).

3. The multi-mode integrated circuit packaging device according to claim 1, characterized in that: Two positioning components (3) and two positioning components (4) are equally spaced on the packaging platform (2), and the positioning components (3) and the positioning components (4) are arranged in a one-to-one correspondence.

4. The multi-mode integrated circuit packaging device according to claim 1, characterized in that: The extrusion member (6) is connected to a limiting block (13), and the limiting block (13) is slidably disposed between the first positioning member (3) and the second positioning member (4).

5. A multi-mode integrated circuit packaging device according to claim 2, characterized in that: The positioning component one (3) and the positioning component two (4) are provided with limiting grooves (14), and the connecting component (10) is movably disposed inside the limiting grooves (14).

6. The multi-mode integrated circuit packaging device according to claim 2, characterized in that: The second protective component (12) is located above the first protective component (8).

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