Wafer assembly and die bonding equipment

Abstract

The utility model relates to the technical field of die bonders, in particular to a wafer assembly and die bonding equipment, which comprises a base, a wafer seat plate mounted on the base, an adjusting mechanism capable of adjusting the position of the wafer seat plate in a horizontal plane, a top ring integrally in a circular tube shape and vertically arranged, and clamping plates arranged at the position of an upper end tube opening of the top ring at intervals. A clamp provided with a blue film to be expanded is guided to the position between the clamping plate and an upper end pipe opening of the top ring, the lifting mechanism drives the clamping plate to vertically ascend and descend to clamp the edge of the clamp, the upper end pipe opening of the top ring achieves film expanding operation, and the rotation adjusting mechanism is used for rotating the top ring to adjust the rotation angle of the top ring. The wafer guide plates are arranged between the clamping plates and the upper end pipe opening of the top ring, the channels for leading in the clamp are formed between the wafer guide plates, the distance between the wafer guide plates is adjustable, the positioning assembly can be adjusted or replaced according to wafers of different sizes, the production and use requirements of the wafers of different sizes can be met, and the adaptability of the whole equipment is improved.

Description

Technical Field

[0001] This utility model relates to the field of die bonding machine technology, and in particular to a wafer assembly and die bonding equipment. Background Technology

[0002] In the semiconductor packaging and chip manufacturing industry, die bonders are key equipment, their function being to precisely mount chips onto packaging substrates. Within the die bond process, the film expansion device is an indispensable component. Its main function is to stretch and expand the blue film on which the chips are bonded, increasing the spacing between the chips and facilitating precise positioning and gripping of the chips by the subsequent vision recognition system of the die bonder.

[0003] Currently, the die bonding equipment used in the industry generally employs fixed-size die rings. Taking common wafer sizes as an example, traditional die bonding equipment is mostly designed for 8-inch wafers, and the die ring sizes that fit it are also relatively fixed. However, with the rapid development of semiconductor manufacturing technology and the continuous advancement of chip manufacturing processes, wafer sizes are gradually evolving towards larger sizes, with 12-inch wafers being widely used in modern chip production. Because existing die bonding equipment and its associated film expansion devices can only be adapted to a single fixed-size die ring, when processing wafers of different sizes (such as 6-inch, 8-inch, and 12-inch), it is impossible to achieve compatibility with different wafer sizes by simply changing the die ring; the entire set of compatible die bonding equipment and film expansion devices must be replaced. This limitation not only leads to a significant increase in equipment procurement costs, but frequent equipment replacements also reduce production efficiency, increase production cycles and maintenance costs, making it difficult to meet the current semiconductor manufacturing industry's demand for diversified and flexible production. Therefore, developing a film expansion device and die bonding equipment that can be compatible with die rings of different sizes has become the key to solving the current production challenges. Utility Model Content

[0004] The purpose of this utility model is to provide a wafer assembly and die bonding equipment, which aims to solve the problems of wafer size incompatibility, low efficiency and limitations in the above-mentioned technical problems, so as to improve the adaptability of the die bonding equipment and improve the die bonding efficiency.

[0005] The technical problem solved by this utility model is addressed by the following technical solution: a wafer assembly, comprising:

[0006] The base is mounted on the rack.

[0007] A wafer mount is mounted on the base, and the base is provided with an adjustment mechanism that can adjust the position of the wafer mount in the horizontal plane.

[0008] The top ring is cylindrical in shape and vertically arranged. The top ring is rotatably mounted on the wafer base plate and forms a detachable connection.

[0009] A clamping plate is set at the upper end of the top ring and spaced apart. The clamping plate and the upper end of the top ring are detachably connected. A fixture equipped with the blue film to be expanded is guided between the clamping plate and the upper end of the top ring. A lifting mechanism drives the clamping plate to rise and fall vertically and performs locking and lifting of the edge of the fixture. The upper end of the top ring abuts against the blue film to be expanded to realize the film expansion operation.

[0010] The rotation adjustment mechanism is used to rotate the top ring and adjust the rotation angle of the top ring;

[0011] Two sets of wafer guide plates are provided between the clamping plate and the upper end of the top ring. The two sets of wafer guide plates form a channel for the jig to be introduced, and the spacing between them is adjustable.

[0012] This utility model also has the following technical features:

[0013] In one embodiment of this utility model, a first support bearing is provided on the outer wall of the top ring, and the first support bearing is rotatably mounted on the wafer base plate. A bearing seat is provided circumferentially on the upper outer wall of the top ring, and a second support bearing is provided on the bearing seat. The clamping plate forms a rotatable engagement with the bearing seat through the second support bearing. The lifting mechanism drives the bearing seat to rise and fall vertically, and performs locking and lifting of the edge of the clamp.

[0014] In one embodiment of this utility model, the two sets of wafer guide plates are adjustablely mounted on the bearing seat.

[0015] In one embodiment of the present invention, the rotation adjustment mechanism includes a synchronous wheel disposed on the outer wall of the lower end of the top ring. The synchronous wheel meshes with a first synchronous belt. A first drive pulley is fitted on the first synchronous belt. The first drive pulley is rotatably mounted on the wafer mount and connected to the output shaft of the drive motor.

[0016] In one embodiment of the present invention, the lifting mechanism includes a lead screw mounted on the bearing seat, the lead screw being arranged vertically, a lifting pulley being rotatably arranged on the wafer base plate, the center of the lifting pulley being provided with a threaded hole, the lower end of the lead screw engaging with the threaded hole, the lifting pulley rotating and driving the lead screw to move vertically up and down.

[0017] In one embodiment of this utility model, multiple sets of lifting pulleys are provided on the wafer mount plate, and the multiple sets of lifting pulleys are synchronously connected to each other by a second synchronous belt. A second drive pulley is rotatably provided on the wafer mount plate, and the second drive pulley is concentrically arranged with one of the sets of second synchronous belts and connected to the output shaft of the lifting motor.

[0018] In one embodiment of this utility model, the bearing seat is further provided with a plurality of first guide slide rods, the first guide slide rods being vertical and forming a sliding fit with the wafer base plate.

[0019] In one embodiment of this utility model, a rotating ring is provided below the clamping plate, and the upper ends of the clamping plate and the rotating ring are spaced apart. The edge of the clamp is locked between the clamping plate and the rotating ring. The rotating ring is installed at the outer ring position of the second support bearing. Multiple sets of second guide slide rods are circumferentially provided at the lower end of the rotating ring. The second guide slide rods and the upper end of the synchronous pulley form a vertical sliding fit.

[0020] In one embodiment of the present invention, the adjustment mechanism includes a first slide rail disposed on the base, a slider slidably disposed on the first slide rail, a first adjustment power unit driving the slider to slide on the first slide rail, a second slide rail disposed on the slider, the first slide rail and the second slide rail being arranged horizontally and perpendicularly to each other, the wafer base plate being slidably disposed on the second slide rail, and a second adjustment power unit driving the wafer base plate to slide on the second slide rail.

[0021] Another objective of this invention is to provide a die bonding device, which includes the aforementioned wafer assembly.

[0022] Compared with existing technologies, the beneficial effects of this utility model are as follows: the blue film is pre-installed on the fixture, and the fixture is guided between the clamping plate and the upper end of the top ring through two sets of wafer guide plates. The lifting mechanism drives the clamping plate to rise and fall vertically, and performs locking and lifting of the edge of the fixture. The rotation adjustment mechanism is activated to correct the angle of the fixture on the horizontal plane, so that the chip to be installed on the blue film is in the set position. Furthermore, by activating the lifting mechanism, the edge of the blue film is unfolded downward, which facilitates the precise positioning of the chip and ensures the precise installation of the chip and the PCB board. The two sets of wafer guide plates used to implement the clamping are adjustablely installed on the expansion ring fixing base. The positioning components can be adjusted or replaced according to different wafer sizes, which can be compatible with the production and use requirements of different wafer sizes and improve the adaptability of the entire equipment. Attached Figure Description

[0023] Figure 1 and Figure 2 These are schematic diagrams of the wafer assembly from two different perspectives in one embodiment of the present invention.

[0024] Figure 3 This is an exploded view of a wafer assembly in one embodiment of the present invention;

[0025] Figure 4 This is a front view of some components of a wafer assembly in one embodiment of the present invention;

[0026] Figure 5 for Figure 4 AA section view;

[0027] Figure 6 for Figure 5 Enlarged view of I in the image;

[0028] Explanation of icon numbers:

[0029] 10. Base; 11. First slide rail; 12. Slider; 121. Second slide rail;

[0030] 20. Wafer mount; 21. Lifting pulley; 22. Second synchronous belt; 23. Second drive pulley; 24. Lifting motor;

[0031] 30. Top ring; 31. First support bearing; 32. Second support bearing; 33. Bearing housing; 331. Lead screw; 332. First guide slide rod; 34. Synchronous pulley; 35. First synchronous belt; 351. First drive pulley; 352. Drive motor;

[0032] 40. Clamping plate; 41. Rotary ring; 411. Second guide slide rod;

[0033] 50. Wafer guide plate. Detailed Implementation

[0034] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0035] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0036] It's important to note that die bonding is a crucial step in semiconductor packaging. Its main purpose is to precisely place the wafer in a designated area on a substrate and bond it together with an adhesive, forming thermal or electrical pathways to facilitate subsequent wire bonding. This process is essential for fields such as LED packaging, chip semiconductor packaging, and precision mounting of cameras. Taking semiconductor chip packaging as an example, after the existing wafer is produced through the previous dicing process, there are chips arranged in an array on the blue film. The chips are attached to the blue film, and the spacing between the chips is small. To ensure accurate positioning of individual chips by the fixing equipment, it is necessary to increase the spacing between the chips on the blue film. This has led to the development of a process of expanding the blue film using a crystal ring. Since the blue film has a certain deformation capability, the expansion process causes the blue film to stretch and deform, thereby increasing the spacing between the chips. This facilitates scanning of the chips on the blue film by a positioning lens, thus facilitating the positioning of the chips to be mounted. However, existing expansion equipment can only expand the wafers of one type, resulting in low compatibility. To address this, this utility model proposes a wafer assembly, including: a base 10, mounted on a rack; and a wafer mount 20, mounted on the base 10. The base 10 is provided with an adjustment mechanism, which can adjust the position of the wafer mount 20. Adjustment of position in the horizontal plane; Top ring 30, which is cylindrical and vertically arranged, is rotatably mounted on the wafer base plate 20 and forms a detachable connection; Clamping plates 40 are located at the upper end of the top ring 30 and are spaced apart, forming a detachable connection between the clamping plates 40 and the upper end of the top ring 30; A fixture equipped with the blue film to be expanded is guided between the clamping plates 40 and the upper end of the top ring 30; A lifting mechanism drives the clamping plates 40... The clamping mechanism is vertically raised and lowered, and the edge of the clamping device is locked and raised. The upper end of the top ring 30 abuts against the blue film to be expanded, so as to realize the film expansion operation. The rotation adjustment mechanism is used to rotate the top ring 30 and adjust the rotation angle of the top ring 30. Two sets of wafer guide plates 50 are provided between the clamping plate 40 and the upper end of the top ring 30. The two sets of wafer guide plates 50 form a channel for the clamping device to enter, and the distance between them is adjustable.

[0037] In one embodiment, the top ring 30 and the clamping plate 40 are detachably connected to the wafer assembly. Therefore, the top ring 30 and the clamping plate 40 can be replaced with different models according to actual production needs to meet the wafer production needs of different sizes and specifications, thereby reducing actual production costs.

[0038] In one embodiment, when the jig containing the blue film enters the position between the upper end of the clamping plate 40 and the top ring 30 through the two sets of wafer guide plates 50, the clamping plate 40 is lowered by activating the lifting mechanism, thereby pressing down on the edge of the jig. After the edge of the jig is pressed down, the blue film on the jig abuts against the upper end of the top ring 30, thereby expanding the blue film and increasing the chip spacing on the blue film. The top ring 30 can be rotated by the rotation adjustment mechanism, thereby rotating the blue film and adjusting the angle of the chips on the blue film to cooperate with the bonding head for adsorption and transfer of the chips.

[0039] In one embodiment, a pin assembly is provided below the top ring 30. By raising and lowering the pin assembly, the chip of the blue film can be lifted and positioned to ensure chip pickup.

[0040] In one embodiment, see Figure 3 The outer wall of the top ring 30 is provided with a first support bearing 31, which is rotatably mounted on the wafer base plate 20. The upper outer wall of the top ring 30 is provided with a bearing seat 33, and a second support bearing 32 is provided on the bearing seat 33. The clamping plate 40 is rotatably engaged with the bearing seat 33 through the second support bearing 32. The lifting mechanism drives the bearing seat 33 to rise and fall vertically, and performs locking and lifting of the edge of the clamp.

[0041] In the above embodiments, a dual radial positioning mechanism is formed by the rotatable connection between the first support bearing 31 and the wafer mount 20, and the rotatable engagement between the second support bearing 32 and the clamping plate 40. This design controls the coaxiality error between the top ring 30 and the clamping plate 40 within the design range, effectively improving the uniformity of force on the blue film during the film expansion process, significantly reducing the risk of chip displacement due to uneven force, and effectively improving the chip pickup position accuracy.

[0042] In addition, the aforementioned clamping plate 40 is rotatably coupled to the bearing seat 33 via the second support bearing 32. When the rotation adjustment mechanism is used to rotate the top ring 30, the blue film and the linkage clamping plate 40 are located on the second support bearing 32 and rotate accordingly, thereby avoiding damage to the chip on the blue film.

[0043] In one embodiment, the two sets of wafer guide plates 50 are adjustablely mounted on the bearing housing 33.

[0044] In the above embodiment, a strip hole can be provided on the bearing seat 33, and the two sets of wafer guide plates 50 are respectively connected to the strip hole by bolts, so that the spacing between the two sets of wafer guide plates 50 can be adjusted.

[0045] In one embodiment, to rotate the top ring 30 to adjust the angle of the chip on the blue film, the rotation adjustment mechanism includes a synchronous wheel 34 disposed on the lower outer wall of the top ring 30. The synchronous wheel 34 meshes with a first synchronous belt 35. A first drive pulley 351 is fitted on the first synchronous belt 35. The first drive pulley 351 is rotatably mounted on the wafer mount 20 and connected to the output shaft of the drive motor 352.

[0046] In the above embodiment, the first synchronous belt 35 is a flexible rack belt, and a support wheel is rotatably provided on the wafer base plate 20, so that the first synchronous belt 35 abuts against the support wheel, thereby constraining the first synchronous belt 35 to the synchronous wheel 34. By starting the drive motor 352, the top ring 30 rotates on the first support bearing 31, which can synchronously drive the blue film and the clamping plate 40 to rotate on the second support bearing 32, so as to perform fine adjustment of the angle of the chip on the blue film.

[0047] In one embodiment, see Figure 1 and Figure 2 To enable vertical lifting of the bearing seat 33 for unfolding the blue film, the lifting mechanism includes a lead screw 331 mounted on the bearing seat 33. The lead screw 331 is vertically arranged. A lifting pulley 21 is rotatably mounted on the wafer base plate 20. A threaded hole is provided at the center of the lifting pulley 21. The lower end of the lead screw 331 engages with the threaded hole. The lifting pulley 21 rotates and drives the lead screw 331 to lift vertically.

[0048] In the above embodiment, when the lifting pulley 21 rotates, the connecting screw 331 and the threaded hole on the lifting pulley 21 form a screw-nut pair, thereby causing the connecting screw 331 to move up and down, thereby causing the clamping plate 40 and the bearing seat 33 to move in the vertical direction, thereby causing the clamp to move downward, so that the top ring 30 can perform the film expansion operation on the blue film.

[0049] In one embodiment, to provide reliable vertical support for the bearing housing 33 and the clamping plate 40, multiple sets of lifting pulleys 21 are provided on the wafer base plate 20. The multiple sets of lifting pulleys 21 are synchronously connected to each other by a second synchronous belt 22. A second drive pulley 23 is rotatably provided on the wafer base plate 20. The second drive pulley 23 is concentrically arranged with one of the sets of second synchronous belts 22 and connected to the output shaft of the lifting motor 24.

[0050] In one embodiment, two sets of lifting pulleys 21 can be implemented and symmetrically distributed on both sides of the top ring 30, thereby ensuring stable and reliable support for the bearing seat 33.

[0051] In one embodiment, in order to implement precise vertical guidance and lifting of the bearing seat 33 and the clamping plate 40, the bearing seat 33 is further provided with a plurality of first guide slide rods 332, the first guide slide rods 332 being vertical and forming a sliding engagement with the wafer base plate 20.

[0052] In one embodiment, the first guide slide rods 332 are symmetrically distributed on both sides of the top ring 30, which can ensure reliable guidance of the bearing seat 33 in the vertical direction.

[0053] In one specific embodiment, in order to enable the clamping plate 40 and the bearing seat 33 to form a rotational fit and to enable reliable clamping and limiting of the fixture, a rotating ring 41 is provided below the clamping plate 40. The upper ends of the clamping plate 40 and the rotating ring 41 are spaced apart. The edge of the fixture is locked between the clamping plate 40 and the rotating ring 41. The rotating ring 41 is installed at the outer ring position of the second support bearing 32. Multiple sets of second guide slide rods 411 are circumferentially provided at the lower end of the rotating ring 41. The second guide slide rods 411 form a vertical sliding fit with the upper end of the synchronous wheel 34.

[0054] In the above embodiment, the lower end of the rotating ring 41 is provided with multiple sets of second guide slide rods 411, which form a vertical sliding fit with the upper end of the synchronous wheel 34. This ensures that the clamping plate 40 and the rotating ring 41 can effectively follow the synchronous wheel 34 to rotate, and also enables the clamping plate 40 and the rotating ring 41 to rotate on the second support bearing 32.

[0055] In the above embodiment, the top ring 30 and the synchronous pulley 34 are separate structures, and the top ring 30 and the synchronous pulley 34 are fixed together by multiple sets of bolts arranged circumferentially.

[0056] In one embodiment, the adjustment mechanism includes a first slide rail 11 disposed on the base 10, a slider 12 slidably disposed on the first slide rail 11, a first adjustment power unit driving the slider 12 to slide on the first slide rail 11, a second slide rail 121 disposed on the slider 12, the first slide rail 11 and the second slide rail 121 being arranged horizontally and perpendicularly to each other, the wafer base plate 20 being slidably disposed on the second slide rail 121, and a second adjustment power unit driving the wafer base plate 20 to slide on the second slide rail 121.

[0057] In one embodiment, the first adjustment power unit and the second adjustment power unit may be a motor or a lead screw and nut pair that works with the motor, or other devices such as a motor that can be precisely adjusted.

[0058] This utility model also proposes a die bonding device, which includes a wafer assembly. Through the wafer assembly, the die bonding device can achieve full automation of the die bonding process, improving production efficiency and reducing labor costs. By activating the lifting unit, the edge of the blue film unfolds downwards, facilitating precise chip positioning and ensuring accurate chip mounting to the PCB board. The two sets of wafer guide plates 50 used for implementing the clamping fixture are detachably mounted on the bearing seat 33. The positioning components can be adjusted or replaced according to different wafer sizes, making it compatible with the production requirements of wafers of different sizes and improving the overall adaptability of the equipment. The specific structure of the wafer assembly is as described in the above embodiments. Since this die bonding device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here.

[0059] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0060] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer assembly, characterized in that, include: The base (10) is mounted on the frame; A wafer mount (20) is mounted on the base (10), and the base (10) is provided with an adjustment mechanism that can adjust the position of the wafer mount (20) in the horizontal plane. The top ring (30) is in the shape of a cylindrical tube and is arranged vertically. The top ring (30) is rotatably mounted on the wafer base plate (20) and forms a detachable connection. A clamping plate (40) is set at the upper end of the top ring (30) and spaced apart. The clamping plate (40) and the upper end of the top ring (30) form a detachable connection. A fixture equipped with a blue film to be expanded is guided to the space between the clamping plate (40) and the upper end of the top ring (30). The lifting mechanism drives the clamping plate (40) to rise and fall vertically, and performs locking and lifting of the edge of the fixture. The upper end of the top ring (30) abuts against the blue film to be expanded to realize the film expansion operation. The rotation adjustment mechanism is used to rotate the top ring (30) and adjust the rotation angle of the top ring (30); Two sets of wafer guide plates (50) are provided between the upper end of the clamping plate (40) and the top ring (30). The two sets of wafer guide plates (50) form a channel for the jig to be introduced and the spacing between them is adjustable.

2. The wafer assembly according to claim 1, characterized in that: The outer wall of the top ring (30) is provided with a first support bearing (31), which is rotatably mounted on the wafer base plate (20). The upper outer wall of the top ring (30) is provided with a bearing seat (33) in the circumferential direction. The bearing seat (33) is provided with a second support bearing (32). The clamping plate (40) is rotated with the bearing seat (33) through the second support bearing (32). The lifting mechanism drives the bearing seat (33) to rise and fall vertically, and performs locking and lifting of the edge of the clamp.

3. The wafer assembly according to claim 2, characterized in that: The two sets of wafer guide plates (50) are adjustablely mounted on the bearing housing (33).

4. The wafer assembly according to claim 2, characterized in that: The rotation adjustment mechanism includes a synchronous pulley (34) disposed on the outer wall of the lower end of the top ring (30). The synchronous pulley (34) meshes with the first synchronous belt (35). The first synchronous belt (35) is fitted with a first drive pulley (351). The first drive pulley (351) is rotatably mounted on the wafer base plate (20) and connected to the output shaft of the drive motor (352).

5. The wafer assembly according to claim 2, characterized in that: The lifting mechanism includes a lead screw (331) mounted on the bearing seat (33). The lead screw (331) is arranged vertically. A lifting pulley (21) is rotatably arranged on the wafer base plate (20). A threaded hole is provided in the center of the lifting pulley (21). The lower end of the lead screw (331) is engaged with the threaded hole. The lifting pulley (21) rotates and drives the lead screw (331) to move vertically up and down.

6. The wafer assembly according to claim 5, characterized in that: Multiple sets of lifting pulleys (21) are provided on the wafer base plate (20). The multiple sets of lifting pulleys (21) are synchronously connected to each other through a second synchronous belt (22). A second drive pulley (23) is rotatably provided on the wafer base plate (20). The second drive pulley (23) is concentrically arranged with one of the sets of second synchronous belts (22) and connected to the output shaft of the lifting motor (24).

7. The wafer assembly according to claim 6, characterized in that: The bearing housing (33) is also provided with a plurality of first guide slide rods (332), the first guide slide rods (332) are vertical and form a sliding fit with the wafer base plate (20).

8. The wafer assembly according to claim 4, characterized in that: A rotating ring (41) is provided below the clamping plate (40). The upper ends of the clamping plate (40) and the rotating ring (41) are spaced apart. The edge of the clamp is fixed between the clamping plate (40) and the rotating ring (41). The rotating ring (41) is installed on the outer ring of the second support bearing (32). Multiple sets of second guide slide rods (411) are circumferentially provided at the lower end of the rotating ring (41). The second guide slide rods (411) and the upper end of the synchronous wheel (34) form a vertical sliding fit.

9. The wafer assembly according to claim 1, characterized in that: The adjustment mechanism includes a first slide rail (11) disposed on the base (10), a slider (12) is slidably disposed on the first slide rail (11), a first adjustment power unit drives the slider (12) to slide on the first slide rail (11), a second slide rail (121) is disposed on the slider (12), the first slide rail (11) and the second slide rail (121) are arranged horizontally and perpendicularly to each other, the wafer base plate (20) is slidably disposed on the second slide rail (121), and a second adjustment power unit drives the wafer base plate (20) to slide on the second slide rail (121).

10. A die bonding apparatus, characterized in that: The die bonding equipment includes the wafer assembly as described in any one of claims 1 to 9.

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