IC chip test fixture for packaging

Abstract

The utility model discloses an IC chip test fixture for packaging, which comprises a test seat, sliding grooves symmetrically arranged in the front and back of the upper part of the test seat; a front fixing frame is slidably arranged on the front side of the upper portion of the testing seat, and removing mechanisms used for reducing follow-up manpower output are arranged in front of the inner side of the front fixing frame, the inner side of the rear fixing frame and the left side and the right side of the outer portion of the rear fixing frame. And multi-workpiece testing mechanisms for improving the chip testing efficiency are arranged above the middle part of the testing seat at equal intervals. According to the IC chip test fixture for packaging, through arrangement of the rejecting mechanism, chips which are tested to be unqualified can be automatically screened and rejected, subsequent output of screening and rejecting of the chips by manpower can be effectively reduced, meanwhile, through arrangement of the clamping mechanism, it can be guaranteed that the chips cannot generate position deviation in the test process, and the test efficiency is improved. In addition, a multi-workpiece testing mechanism is arranged, a plurality of chips can be tested at a time, and therefore the testing efficiency can be improved.

Description

Technical Field

[0001] This utility model relates to the field of IC chip testing technology, specifically to a test fixture for packaged IC chips. Background Technology

[0002] IC chips are integrated circuits formed by placing a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic substrate to form a chip. They are the core components of modern electronic devices. During the chip production process, in order to ensure product quality, test for faults in the chip, and improve manufacturing efficiency, the chip is tested. Currently, there are various IC chip testing fixtures available on the market for packaging, but some shortcomings still exist.

[0003] For example, Chinese utility model patent CN220829567U discloses a fixture for IC chip functional testing. The fixture involves first placing the IC chip between clamping plates, then activating a telescopic cylinder. The telescopic cylinder moves a toothed rod one to the right, which in turn moves a toothed rod two to the left. The connecting block between the toothed rods moves inward, which in turn moves a short rod inward. The short rod then moves the clamping plates inward, bringing the clamping plates into contact with the IC chip. This allows for convenient fixing of the IC chip, and the fixing structure is not easily damaged during use, thus preventing the inability to fix the IC chip.

[0004] Based on existing solutions and actual production processes, current chip testing fixtures can only test one chip at a time, resulting in low testing efficiency. Furthermore, after testing, defective chips cannot be quickly screened, which increases the pressure on subsequent workers for screening. Therefore, we propose an IC chip testing fixture for packaging to solve the problems mentioned above. Utility Model Content

[0005] The purpose of this invention is to provide an IC chip testing fixture for packaging, in order to solve the problems mentioned in the background art, such as the current IC chip testing fixtures for packaging, which can only test one chip at a time, resulting in low testing efficiency, and the inability to quickly screen out unqualified chips, which increases the pressure on subsequent workers for screening.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an IC chip testing fixture for packaging, comprising:

[0007] The test stand has symmetrical sliding grooves on its upper interior.

[0008] Also includes:

[0009] A front fixed frame is slidably provided on the upper front side of the test stand, and a rear fixed frame is slidably connected on the upper rear side of the test stand. Furthermore, rejection mechanisms for reducing subsequent manual labor output are provided on the inner front side of the front fixed frame, the inner side of the rear fixed frame, and the outer left and right sides.

[0010] The test fixture is equipped with a multi-workpiece test mechanism at equal intervals above the center to improve chip testing efficiency.

[0011] Preferably, the rejection mechanism provided at the front of the interior of the front fixed frame includes a push plate and a second electric telescopic rod. The push plates are arranged at equal intervals inside the front fixed frame, and the second electric telescopic rod is fixedly installed on the front side of the push plate. The front end of the second electric telescopic rod is fixedly connected to the front fixed frame.

[0012] Preferably, the rejection mechanism provided inside the rear fixing frame and on the left and right sides of the exterior includes a rotating plate, a connecting shaft, gears, a rack, and a third electric telescopic rod. The rotating plate is provided inside the rear fixing frame, and a connecting shaft is fixedly installed on the upper side of the rotating plate. Gears are symmetrically fixedly installed on the left and right sides of the exterior of the connecting shaft, and a rack is meshed with the lower part of the gears. The rear end of the rack is fixedly connected to the third electric telescopic rod, and the rear end of the third electric telescopic rod is fixedly connected to the rear fixing frame.

[0013] Preferably, the multi-workpiece testing mechanism, which is equidistantly arranged above the center of the test seat, includes a test seat and a placement plate, with the placement plate equidistantly installed above the center of the test seat.

[0014] Preferably, fixed shafts are symmetrically installed on the left and right sides of the test base, and a rear fixed bracket is slidably installed on the rear side of the outer side of the fixed shaft, and a front fixed bracket is slidably installed on the front side of the outer side of the fixed shaft. A fixed slot is slidably connected below the front fixed bracket and the rear fixed bracket, and the fixed slot is fixedly installed on the right side of the test base.

[0015] Preferably, a connecting rod is rotatably mounted on the left side of both the front and rear fixed frames, and a connecting plate is rotatably connected below the connecting rod, and a first electric telescopic rod is fixedly connected below the connecting plate.

[0016] Preferably, a collection box is provided on the rear side of the test stand.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: The IC chip testing fixture for packaging, by setting a rejection mechanism, can automatically screen and reject chips that fail the test, which can effectively reduce the output of subsequent manual screening and rejection of chips. At the same time, the clamping mechanism can ensure that the chip will not shift in position during the test, thereby improving the accuracy of chip testing. In addition, the multi-workpiece testing mechanism can test multiple chips at one time, thereby improving the testing efficiency.

[0018] 1. Equipped with placement plates, multiple placement plates are set at equal intervals above the center of the test stand, allowing multiple front fixing frames to be placed for testing at once, thus improving testing efficiency;

[0019] 2. It is equipped with a front fixing bracket and a rear fixing bracket. The front fixing bracket is set on the front side above the test stand, and the rear fixing bracket is set on the rear side above the test stand. The front fixing bracket and the rear fixing bracket can move in opposite directions to limit the position of the chip placed on the placement board, thereby improving the test accuracy.

[0020] 3. It is equipped with a push plate and a second electric telescopic rod. The push plate is set at equal intervals inside the front fixed frame. The position of the push plate corresponds one-to-one with the position of the placement plate installed above the test base. It can push and remove the unqualified chips found in the test.

[0021] 4. A rotating plate is provided. The rotating plate is installed inside the rear fixed frame. When unqualified chips are rejected, the gear can be rotated to open, so that the rejected unqualified chips can enter the collection box for unified collection. Attached Figure Description

[0022] Figure 1 This is a frontal perspective view of the structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the right-side perspective structure of this utility model;

[0024] Figure 3 This is a perspective view of the connection structure between the front fixed frame, the push plate, and the second electric telescopic rod of this utility model.

[0025] Figure 4 This is a perspective view of the connection structure of the fixed shaft, fixed groove frame, and connecting rod of this utility model;

[0026] Figure 5 This utility model Figure 4 Enlarged structural diagram at point A in the middle;

[0027] Figure 6 This is a perspective view of the connection structure of the rear fixing frame, rotating plate and connecting shaft of this utility model.

[0028] In the diagram: 1. Test stand; 2. Placement plate; 3. Front fixed frame; 4. Rear fixed frame; 5. Fixed shaft; 6. Fixed slot frame; 7. Connecting rod; 8. Connecting plate; 9. First electric telescopic rod; 10. Push plate; 11. Second electric telescopic rod; 12. Rotating plate; 13. Connecting shaft; 14. Gear; 15. Rack; 16. Third electric telescopic rod; 17. Collection box; 18. Sliding slot. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figures 1-6 This utility model provides a technical solution:

[0031] To address the problems existing in the prior art, this embodiment provides the following technical solution: an IC chip testing fixture for packaging, comprising a test base 1; a rejection mechanism located inside the front fixing frame 3, inside the rear fixing frame 4, and on both sides, which can reject and screen chips that fail the test, effectively reducing the subsequent manual output of chip screening; a clamping mechanism located on the upper front and rear sides of the test base 1, which can fix the placed chips, thereby ensuring that the chips do not move during chip testing; and a multi-workpiece testing mechanism located above the middle of the test base 1, which can clamp and fix multiple chips at once, thereby greatly improving the efficiency of chip positioning.

[0032] like Figure 2 , Figure 3 and Figure 4 As shown, by setting three placement plates 2 at equal intervals above the middle of the test base 1, the chip to be tested can be placed on the placement plate 2, and multiple chips can be placed for testing at one time, thereby improving the testing efficiency.

[0033] After the chip is placed, a front fixing bracket 3 is set on the upper front side of the test base 1, and a rear fixing bracket 4 is set on the upper rear side of the test base 1. A fixing shaft 5 is slidably connected to the lower outer side of the front fixing bracket 3 and the rear fixing bracket 4. The fixing shaft 5 is fixedly installed on the left and right sides of the outside of the test base 1. At the same time, a fixing slot bracket 6 is slidably connected to the lower part of the front fixing bracket 3 and the rear fixing bracket 4. In addition, a connecting rod 7 is rotatably connected to the right side of the outer side of the front fixing bracket 3 and the rear fixing bracket 4. A connecting plate 8 is rotatably installed below the connecting rod 7. Furthermore, a first electric telescopic bracket is installed below the connecting plate 8. The first electric telescopic rod 9 can be opened by lever 9. The output end of the first electric telescopic rod 9 can pull the connecting plate 8 downward, which can make the connecting rod 7 rotate inward. When the connecting rod 7 rotates inward, it can pull the front fixing frame 3 and the rear fixing frame 4 connected at both ends to move to the opposite position inside the sliding groove 18 opened inside the test seat 1. That is, the front fixing frame 3 and the rear fixing frame 4 can fit with the chip placed on the placement plate 2, thereby fixing the position of the chip and ensuring that the chip will not move during subsequent chip testing.

[0034] like Figure 3 , Figure 4 and Figure 5 As shown, after the chip is clamped and fixed, it can be tested by a testing machine. Once a defective chip is found, a rotating plate 12 is set inside the rear fixing frame 4. A connecting shaft 13 is fixedly installed on the top of the rotating plate 12. Gears 14 are installed on the left and right sides of the outside of the connecting shaft 13. A rack 15 is meshed and connected to the bottom of the gears 14. A third electric telescopic rod 16 is fixedly installed at the rear end of the rack 15. The third electric telescopic rod 16 can be opened. The output end of the third electric telescopic rod 16 can pull the connected rack 15 to move to the rear. That is, when the rack 15 moves, the gear 14 will rotate. At this time, the gear 14 and the connecting shaft 13 will rotate to the rear and upward.

[0035] Push plates 10 are installed at equal intervals inside the front fixing frame 3. The position of the push plates 10 corresponds to the placement plate 2 installed above the middle of the test seat 1. A second electric telescopic rod 11 is installed on the front side of the push plates 10. When the second electric telescopic rod 11 is opened, the output end of the second electric telescopic rod 11 can push the connected push plates 10 to move to the rear side, thereby pushing the unqualified chips. The unqualified chips can move to the rear side and finally enter the collection box 17 for unified collection.

[0036] The working principle of the IC chip testing fixture used for packaging is as follows: by setting multiple placement plates 2, multiple chips can be placed for testing at one time, thereby improving the testing efficiency. At the same time, after the chip is placed, its position can be limited to ensure that the chip does not move during testing. When a defective chip is found, it can be removed and collected into the collection box 17 for unified collection.

[0037] Contents not described in detail in this specification are common knowledge to those skilled in the art. All standard parts used in this invention can be purchased commercially, and irregularly shaped parts can be custom-made according to the description and drawings. The specific connection methods for each part all employ conventional methods such as bolts, rivets, and welding, which are already mature in the prior art. The machinery, parts, and equipment all use conventional models from the prior art, and the circuit connections also employ conventional connection methods from the prior art, which will not be detailed here.

[0038] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A test fixture for packaged IC chips, comprising: Test seat (1), wherein sliding grooves (18) are symmetrically provided on the upper interior; characterized in that it further includes: A front fixing frame (3) is slidably provided on the upper front side of the test seat (1), and a rear fixing frame (4) is slidably connected on the upper rear side of the test seat (1). Furthermore, a rejection mechanism for reducing subsequent manual output is provided on the inner front side of the front fixing frame (3), the inner side of the rear fixing frame (4), and the outer left and right sides. The test stand (1) is provided with a multi-workpiece test mechanism at equal intervals above the middle part to improve chip testing efficiency.

2. The IC chip test fixture for package of claim 1, wherein: The removal mechanism provided inside the front of the front fixed frame (3) includes a push plate (10) and a second electric telescopic rod (11). The push plate (10) is provided at equal intervals inside the front fixed frame (3), and the second electric telescopic rod (11) is fixedly installed on the front side of the push plate (10), and the front end of the second electric telescopic rod (11) is fixedly connected to the front fixed frame (3).

3. The IC chip test fixture for package of claim 1, wherein: The removal mechanism provided inside and on the left and right sides of the rear fixing frame (4) includes a rotating plate (12), a connecting shaft (13), a gear (14), a rack (15) and a third electric telescopic rod (16). The rotating plate (12) is provided inside the rear fixing frame (4), and the connecting shaft (13) is fixedly installed on the upper side of the rotating plate (12). The gear (14) is symmetrically fixedly installed on the left and right sides of the connecting shaft (13), and the rack (15) is meshed and connected to the lower part of the gear (14). The third electric telescopic rod (16) is fixedly connected to the rear end of the rack (15), and the rear fixing frame (4) is fixedly connected to the rear end of the third electric telescopic rod (16).

4. The IC chip test fixture for package of claim 1, wherein: The multi-workpiece testing mechanism, which is equidistantly arranged above the middle of the test seat (1), includes the test seat (1) and the placement plate (2). The placement plate (2) is installed equidistantly above the middle of the test seat (1).

5. The IC chip test fixture for package of claim 4, wherein: The test base (1) is symmetrically equipped with fixed shafts (5) on the left and right sides of the outside. A rear fixed bracket (4) is slidably installed on the rear side of the outer side of the fixed shaft (5), and a front fixed bracket (3) is slidably installed on the front side of the outer side of the fixed shaft (5). A fixed slot frame (6) is slidably connected below the front fixed bracket (3) and the rear fixed bracket (4). The fixed slot frame (6) is fixedly installed on the right side of the test base (1).

6. The IC chip test fixture for package of claim 5, wherein: A connecting rod (7) is rotatably installed on the left side of both the front fixed frame (3) and the rear fixed frame (4), and a connecting plate (8) is rotatably connected below the connecting rod (7), and a first electric telescopic rod (9) is fixedly connected below the connecting plate (8).

7. The IC chip test fixture for package of claim 5, wherein: A collection box (17) is provided on the rear side of the test stand (1).

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