Modular structure for semiconductor lead frame mold

Abstract

The utility model relates to the technical field of lead frames, and discloses a modular structure for a semiconductor lead frame mold, which comprises a lower mold body and an upper mold body, the outer surface of the lower mold body is provided with a clamping groove, the inner surface of the lower mold body is provided with a mold cavity, and the outer surface of the upper mold body is provided with an injection port in a penetrating manner. The lower mold body and the upper mold body are installed in an inserted mode, a fixing assembly and a circulating assembly are arranged at the other end, away from the upper mold body, of the lower mold body, the fixing assembly comprises a fixing box and a base which are fixedly installed at the other end, away from the lower mold body, of a fixing base, and a limiting base and a limiting ring are fixedly installed at the end, close to the lower mold body, of the fixing base. According to the modular structure for the semiconductor lead frame mold, through the structure and communication design of the circulating pipes, cooling liquid is efficiently circulated, the heat exchange area is increased, mold heat dissipation is effectively achieved, stable operation of the mold is guaranteed, the lifting hooks and the clamping hooks can be conveniently matched with lifting equipment, carrying of the lower mold body and the upper mold body is facilitated, and operation safety and efficiency are improved.

Description

Technical Field

[0001] This utility model relates to the field of lead frame technology, specifically a modular structure for semiconductor lead frame molds. Background Technology

[0002] As a chip carrier for integrated circuits, the lead frame is a key structural component that uses bonding materials to achieve electrical connection between the internal circuit leads of the chip and the external leads, forming an electrical circuit. It acts as a bridge connecting to external wires. Most semiconductor integrated circuits require the use of lead frames, making it an important basic material in the electronics and information industry.

[0003] Chinese Utility Model Patent Publication No. CN 221209555 U discloses a semiconductor lead frame mold. This mold allows the upper mold to move downwards, causing a toothed plate to move downwards and simultaneously moving the lower mold along a sliding groove to the right to the bottom of the upper mold for stamping. This avoids the problem of mechanical misoperation during production due to immovable upper and lower molds, which could lead to injury. It also avoids the problem of frequent manual removal and placement of the mold due to its weight, which increases labor intensity. However, this semiconductor lead frame mold lacks a modular heat exchange structure, resulting in poor heat dissipation. Furthermore, the lack of modular design makes it difficult to quickly install multiple components and molds, leading to poor overall practicality. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide a modular structure for semiconductor lead frame molds, which can effectively solve the problems in the prior art.

[0005] The technical solution adopted by this utility model is: a modular structure for semiconductor lead frame mold, including a lower mold body and an upper mold body. A slot is opened on the outer surface of the lower mold body, a mold cavity is provided on the inner surface of the lower mold body, and an injection port is opened through the outer surface of the upper mold body. The lower mold body and the upper mold body are plugged in and installed. A fixing component and a circulation component are provided at the other end of the lower mold body away from the upper mold body.

[0006] The fixing component includes a fixing seat with a fixing box and a base fixedly installed at the other end of the fixing seat away from the lower mold body, and a limiting seat and a limiting ring fixedly installed at the end of the fixing seat near the lower mold body. The limiting seat and the slot are plugged in.

[0007] The circulation assembly includes a circulation mounting frame, and a circulation pipe is provided on the inner surface of the circulation mounting frame. One end of the circulation pipe is provided with a liquid inlet, and the other end of the circulation pipe away from the liquid inlet is provided with a liquid outlet.

[0008] Preferably, the inner surface of the fixing box is provided with a through groove, which is adapted to the circulation component.

[0009] The above technical solution allows for easy installation of the circulation component through the through groove inside the fixed box. This design reduces the space occupied by the overall mold, enables quick installation of the circulation component and the fixed component, and facilitates maintenance and replacement of the circulation component.

[0010] Preferably, a locking post is fixedly installed at one end of the fixing box near the through groove, and a positioning hole is opened on the outer surface of the circulation component, and the positioning hole corresponds one-to-one with the locking post.

[0011] With the above technical solution, the locking pins on the fixing box correspond one-to-one with the positioning holes on the outer surface of the circulation component. When the circulation component is installed, the locking pins can be accurately inserted into the positioning holes, which plays a role in precise positioning and ensures the accuracy of the installation position of the circulation component.

[0012] Preferably, the circulation pipe, the outlet, and the inlet are interconnected, and the cross-section of the circulation pipe has an "S" shaped structure.

[0013] With the above technical solution, the circulation pipe, outlet and inlet are interconnected, which facilitates the flow of liquid media such as coolant in the circulation pipe. The circulation pipe has an "S" shaped structure, which increases the flow path of the liquid in the pipe and the contact area with the outside, enabling more efficient heat exchange and facilitating heat dissipation of the mold.

[0014] Preferably, a hook is fixedly installed on the outer surface of the lower mold body, and a latch is provided on the outer surface of the upper mold body, with the hook and latch located on the same vertical horizontal line.

[0015] With the above technical solution, the hooks on the outer surface of the lower mold and the latches on the outer surface of the upper mold are located on the same vertical horizontal line. During the handling, installation or disassembly of the mold, the hooks and latches can be used in conjunction with the lifting equipment to facilitate the lifting operation of the mold and facilitate the handling of the lower mold and the upper mold.

[0016] Preferably, the limiting seats and slots are provided in two identical sets, and each set of the limiting seats and slots is provided with four identical sets, and the two sets of limiting seats and slots are symmetrically distributed about the center line of the lower mold body.

[0017] Through the above technical solution, the two sets of limiting seats and slots are symmetrically distributed about the center line of the lower mold body, and there are four in each set, which enhances the stability of the connection between the lower mold body and the fixed seat. When the mold is working, it can better withstand the pressure from the upper mold body and other external forces, and it is also convenient to install the fixed components and circulation components with multiple molds, so as to realize its modular design.

[0018] Preferably, the injection port communicates with the mold cavity, and the limiting ring is adapted to the lower mold body.

[0019] With the above technical solution, the injection port is connected to the mold cavity, which facilitates the injection of liquid mold material into the mold cavity through the injection port to complete the mold forming process.

[0020] Compared with the prior art, this utility model provides a modular structure for semiconductor lead frame molds, which has the following advantages:

[0021] 1. The semiconductor lead frame mold adopts a modular structure. The through slot facilitates the installation of the circulation component, reduces space occupation, and is conducive to maintenance and replacement. The pins and positioning holes provide precise positioning and improve installation accuracy. The modular design allows the fixing component and circulation component to be easily installed with multiple molds.

[0022] 2. The semiconductor lead frame mold adopts a modular structure, and the structure and connection design of the circulation pipe enables efficient circulation of coolant, increases the heat exchange area, effectively heats up the mold, ensures stable operation of the mold, and the hooks and clamps facilitate cooperation with lifting equipment, making it easy to transport the lower and upper mold bodies, improving operational safety and efficiency. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0024] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ;

[0025] Figure 3 This is a schematic diagram of the disassembled structure of this utility model. Figure 1 ;

[0026] Figure 4 This is a schematic diagram of the disassembled structure of this utility model. Figure 2 ;

[0027] Figure 5 This is a three-dimensional structural diagram of the fixing component and the circulation component of this utility model;

[0028] Figure 6 This is a cross-sectional structural diagram of the fixing component and the circulation component of this utility model.

[0029] The components are as follows: 1. Lower mold body; 2. Hook; 3. Slot; 4. Mold cavity; 5. Upper mold body; 6. Hook; 7. Injection port; 8. Fixing component; 801. Fixing seat; 802. Fixing box; 803. Base; 804. Limiting seat; 805. Limiting ring; 806. Through groove; 807. Locking post; 9. Circulation component; 901. Circulation mounting frame; 902. Positioning hole; 903. Circulation pipe; 904. Liquid inlet; 905. Liquid outlet. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Example 1: As Figure 1-6 As shown, the present invention provides a modular structure for semiconductor lead frame molds, including a lower mold body 1 and an upper mold body 5. The outer surface of the lower mold body 1 is provided with a slot 3, the inner surface of the lower mold body 1 is provided with a mold cavity 4, and the outer surface of the upper mold body 5 is provided with an injection port 7. The lower mold body 1 and the upper mold body 5 are installed by plugging in. The other end of the lower mold body 1 away from the upper mold body 5 is provided with a fixing component 8 and a circulation component 9.

[0032] The fixing component 8 includes a fixing seat 801, on the other end away from the lower mold body 1, a fixing box 802 and a base 803 are fixedly installed, and a limiting seat 804 and a limiting ring 805 are fixedly installed on the end of the fixing seat 801 close to the lower mold body 1. The limiting seat 804 and the slot 3 are plugged into each other.

[0033] The circulation component 9 includes a circulation mounting frame 901, a circulation pipe 903 is provided on the inner surface of the circulation mounting frame 901, an inlet 904 is provided at one end of the circulation pipe 903, and an outlet 905 is provided at the other end of the circulation pipe 903 away from the inlet 904.

[0034] Specifically, a through groove 806 is provided on the inner surface of the fixing box 802. The through groove 806 is adapted to the circulation component 9. The advantage is that the through groove 806 in the fixing box 802 can facilitate the installation of the circulation component 9. This design can reduce the space occupied by the overall mold, enable the circulation component 9 and the fixing component 8 to be installed quickly, and also facilitate the maintenance and replacement of the circulation component 9.

[0035] Specifically, a locking post 807 is fixedly installed at one end of the fixing box 802 near the through groove 806, and a positioning hole 902 is opened on the outer surface of the circulation component 9. The positioning hole 902 and the locking post 807 correspond one-to-one. The advantage is that the locking post 807 on the fixing box 802 corresponds one-to-one with the positioning hole 902 on the outer surface of the circulation component 9. When the circulation component 9 is installed, the locking post 807 can be accurately inserted into the positioning hole 902, which plays a role in precise positioning and ensures the accuracy of the installation position of the circulation component 9.

[0036] Specifically, the circulation pipe 903, the outlet 905, and the inlet 904 are interconnected. The cross-section of the circulation pipe 903 has an "S" shape. The advantage is that the interconnection of the circulation pipe 903, the outlet 905, and the inlet 904 facilitates the flow of liquid media such as coolant within the circulation pipe 903. The "S" shape of the circulation pipe 903 increases the flow path of the liquid within the pipe and the contact area with the outside environment, enabling more efficient heat exchange and facilitating heat dissipation of the mold.

[0037] Example 2: Figure 2-6 As shown, this is an improvement on the previous embodiment.

[0038] Specifically, a hook 2 is fixedly installed on the outer surface of the lower mold body 1, and a hook 6 is provided on the outer surface of the upper mold body 5. The hook 2 and the hook 6 are located on the same vertical horizontal line. The advantage is that the hook 2 on the outer surface of the lower mold body 1 and the hook 6 on the outer surface of the upper mold body 5 are located on the same vertical horizontal line. During the handling, installation or disassembly of the mold, the hook 2 and the hook 6 can be used in conjunction with the lifting equipment to facilitate the lifting operation of the mold and facilitate the handling of the lower mold body 1 and the upper mold body 5.

[0039] Specifically, the limiting seat 804 and the slot 3 are provided in two identical sets, with four identical limiting seats 804 and slots 3 in each set. The two sets of limiting seats 804 and slots 3 are symmetrically distributed about the center line of the lower mold body 1. The advantage is that the two sets of limiting seats 804 and slots 3 are symmetrically distributed about the center line of the lower mold body 1, and there are four in each set, which enhances the stability of the connection between the lower mold body 1 and the fixed seat 801. When the mold is working, it can better withstand the pressure from the upper mold body 5 and other external forces. It also facilitates the installation of the fixed component 8 and the circulation component 9 with multiple molds, and can realize its modular design.

[0040] Specifically, the injection port 7 is connected to the mold cavity 4, and the limiting ring 805 is adapted to the lower mold body 1. The advantage is that the injection port 7 is connected to the mold cavity 4, which makes it easy to inject liquid mold material into the mold cavity 4 through the injection port 7 to complete the forming process of the mold.

[0041] Working principle: During use, the lower mold body 1 is inserted into the limiting seat 804 on the fixed seat 801 through the slot 3 to connect with the fixed component 8. The limiting ring 805 assists in positioning and sealing. The circulation mounting frame 901 of the circulation component 9 is installed in the fixed box 802 through the through slot 806. The locking post 807 cooperates with the positioning hole 902 for precise positioning. The lower mold body 1 and the upper mold body 5 are combined by plug-in installation. The liquid mold material flows into the mold cavity 4 of the lower mold body 1 through the injection port 7 of the upper mold body 5 to complete the molding process. Coolant and other liquid media flow into the circulation pipe 903 from the liquid inlet 904 and flow out through the liquid outlet 905. The circulation pipe 903 has an "S" shaped structure to increase the heat exchange area and realize the heat dissipation of the mold. When handling, installing or disassembling the mold, the lifting hook 2 of the lower mold body 1 and the locking hook 6 of the upper mold body 5 are used in conjunction with the lifting equipment for lifting operations.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A modular structure for a semiconductor lead frame mold comprising a lower mold body (1) and an upper mold body (5), characterized in that: The lower mold body (1) has a slot (3) on its outer surface and a mold cavity (4) on its inner surface. The upper mold body (5) has an injection port (7) through its outer surface. The lower mold body (1) and the upper mold body (5) are connected by an insertion joint. The other end of the lower mold body (1) away from the upper mold body (5) is provided with a fixing component (8) and a circulation component (9). The fixing component (8) includes a fixing seat (801) with a fixing box (802) and a base (803) fixedly installed at the other end away from the lower mold body (1). A limiting seat (804) and a limiting ring (805) are fixedly installed at the end of the fixing seat (801) close to the lower mold body (1). The limiting seat (804) and the slot (3) are plugged in. The circulation component (9) includes a circulation mounting frame (901), and a circulation pipe (903) is provided on the inner surface of the circulation mounting frame (901). One end of the circulation pipe (903) is provided with an inlet (904), and the other end of the circulation pipe (903) away from the inlet (904) is provided with an outlet (905).

2. The modular structure for semiconductor lead frame die according to claim 1, wherein: The inner surface of the fixed box (802) is provided with a through groove (806), which is adapted to the circulation component (9).

3. The modular structure for semiconductor lead frame die according to claim 1, wherein: A locking post (807) is fixedly installed at one end of the fixed box (802) near the through groove (806). A positioning hole (902) is opened on the outer surface of the circulation component (9). The positioning hole (902) and the locking post (807) are in one-to-one correspondence.

4. The modular structure for semiconductor lead frame die according to claim 1, wherein: The circulation pipe (903), the outlet (905) and the inlet (904) are interconnected, and the cross-section of the circulation pipe (903) is "S" shaped.

5. The modular structure for semiconductor lead frame die according to claim 1, wherein: A hook (2) is fixedly installed on the outer surface of the lower mold body (1), and a hook (6) is provided on the outer surface of the upper mold body (5). The hook (2) and the hook (6) are located on the same vertical horizontal line.

6. The modular structure for semiconductor lead frame die according to claim 1, wherein: The limiting seat (804) and the slot (3) are provided in two identical sets, and each set of the limiting seat (804) and the slot (3) is provided with four identical sets. The two sets of the limiting seat (804) and the slot (3) are symmetrically distributed about the center line of the lower mold body (1).

7. The modular structure for semiconductor lead frame die according to claim 1, wherein: The injection port (7) is connected to the mold cavity (4), and the limiting ring (805) is adapted to the lower mold body (1).

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