Wafer polishing device

Abstract

The utility model discloses a wafer polishing device which comprises a polishing head, a ceramic disc and a large polishing disc. The ceramic disc is arranged at the bottom of the polishing head; the large polishing disc is arranged below the ceramic disc; a first lug boss is arranged at the bottom of the ceramic plate; a wafer is arranged at the bottom of the first lug boss; a second protruding part is arranged at the top of the large polishing disc. The second protruding part is of an annular structure. The first protruding part is located above the second protruding part. The first protruding part and the second protruding part are arranged on the ceramic disc and the large polishing disc respectively, so that the edge and the center of the wafer make contact with liquid medicine more evenly, pressure distribution of all parts of the wafer is optimized, and the pressure distribution, close to the center of the ceramic disc, of the wafer is slightly higher than that of the outer edge of the wafer. Therefore, the polishing removal rate of the surface of the wafer is more uniform, and the flatness of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the technical field, and more specifically to a wafer polishing device. Background Technology

[0002] In the wafer polishing process, the ceramic disc and polishing disc are generally required to have extremely high flatness, the flatter the better. However, a flat polishing disc has some problems. The linear velocity of the outer edge of the wafer is higher, and there is sufficient replenishment of fresh polishing or abrasive fluid. However, the linear velocity of the wafer near the center is lower, and fresh polishing or abrasive fluid cannot be replenished in time. This results in uneven wafer removal rate, which in turn affects the final flatness level of the product.

[0003] Therefore, how to provide a wafer polishing apparatus that can improve wafer flatness is one of the technical problems that urgently need to be solved in this field. Utility Model Content

[0004] In view of this, the present invention provides a wafer polishing device, the purpose of which is to solve the problems existing in the prior art.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A wafer polishing apparatus includes: a polishing head, a ceramic disc, and a large polishing disc; the ceramic disc is disposed at the bottom of the polishing head; the large polishing disc is disposed below the ceramic disc; the bottom of the ceramic disc has a first protrusion; a wafer is disposed at the bottom of the first protrusion; the top of the large polishing disc has a second protrusion; the second protrusion has an annular structure; the first protrusion is located above the second protrusion.

[0007] Preferably, the lower surface of the first protrusion has a convex spherical structure.

[0008] Preferably, the wafer is bonded to the bottom of the first protrusion.

[0009] Preferably, the first protrusion and the ceramic disc are an integral structure.

[0010] Preferably, the longitudinal section of the second protrusion is an arc-shaped structure.

[0011] Preferably, the second protrusion and the polishing disc are an integral structure.

[0012] Compared with the prior art, the present invention has achieved the following technical effects: by providing a first protrusion and a second protrusion on the ceramic disc and the polishing disc respectively, the present invention can effectively solve the problems of uneven distribution of polishing or grinding fluid and uneven pressure distribution, so as to make the polishing removal rate of the wafer surface more uniform, thereby improving the flatness of the wafer. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of a wafer polishing device according to the present invention;

[0014] Figure 2 A cross-sectional view of the polished disc;

[0015] Figure 3 A top view of the polished disc;

[0016] Figure 4 This is a schematic diagram of the structure of a ceramic disc;

[0017] In the diagram: 1. Polishing head; 2. Ceramic disc; 3. Polishing disc; 4. First protrusion; 5. Wafer; 6. Second protrusion. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Example

[0020] Reference Figure 1-4 As shown, this utility model discloses a wafer polishing device, including: a polishing head 1, a ceramic disc 2, and a large polishing disc 3; the ceramic disc 2 is disposed at the bottom of the polishing head 1; the large polishing disc 3 is disposed below the ceramic disc 2; the bottom of the ceramic disc 2 is provided with a first protrusion 4; a wafer 5 is disposed near the edge of the bottom of the first protrusion 4; the top of the large polishing disc 3 is provided with a second protrusion 6; the second protrusion 6 has a ring structure; the first protrusion 4 is located above the second protrusion 6; in use, the wafer is installed at the bottom of the first protrusion 4, and the bottom of the wafer is made to contact the second protrusion 6 on the large polishing disc 3, and the ceramic disc 2 and the large polishing disc 3 are rotated simultaneously to polish the wafer.

[0021] In this embodiment, the lower surface of the first protrusion 4 is a convex spherical structure.

[0022] In this embodiment, the wafer 5 is bonded to the bottom of the first protrusion 4 with an adhesive.

[0023] In this embodiment, the first protrusion 4 and the ceramic disk 2 are integrally formed.

[0024] In this embodiment, the longitudinal section of the second protrusion 6 is an arc-shaped structure.

[0025] In this embodiment, the second protrusion 6 and the polishing disc 3 are integrally formed.

[0026] In this embodiment, the polishing head 1 is provided with a rotating shaft at the top.

[0027] In this embodiment, the height of the first protrusion 4 on the ceramic disk 2 is 0 to 30 micrometers.

[0028] In this embodiment, the diameter of the ceramic disc 2 is designed according to the different models of polishing or grinding equipment; specifically, the diameter of the ceramic disc 2 is preferably 305 mm, 360 mm or 485 mm.

[0029] In this embodiment, the protrusion height of the first protrusion 4 is related to the diameter of the ceramic disk 2, and the ratio of the protrusion height to the diameter of the ceramic disk 2 is 8E-6 to 5.5E-5.

[0030] In this embodiment, the protrusion height of the second protrusion 6 on the polishing disc 3 is 10 micrometers to 200 micrometers.

[0031] In this embodiment, the ratio of the highest point of the second protrusion 6 to the difference between the outer and inner diameters of the second protrusion 6 is 1.5E-5 to 2.6E-4.

[0032] This invention effectively solves the problems of uneven distribution of polishing or grinding fluid and uneven pressure distribution by providing a first protrusion and a second protrusion on the ceramic disc and the polishing disc respectively, making the polishing removal rate on the wafer surface more uniform, thereby improving the flatness of the wafer.

[0033] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A wafer polishing apparatus, characterized in that, include: Polishing head (1), ceramic disc (2) and polishing disc (3); the ceramic disc (2) is disposed at the bottom of the polishing head (1); the polishing disc (3) is disposed below the ceramic disc (2); the bottom of the ceramic disc (2) is provided with a first protrusion (4); the bottom of the first protrusion (4) is provided with a wafer (5); the top of the polishing disc (3) is provided with a second protrusion (6); the second protrusion (6) has a ring structure; the first protrusion (4) is located above the second protrusion (6).

2. The wafer polishing apparatus of claim 1 wherein, The lower surface of the first protrusion (4) is a convex spherical structure.

3. The wafer polishing apparatus of claim 1 wherein, The wafer (5) is bonded to the bottom of the first protrusion (4).

4. The wafer polishing apparatus of claim 1 wherein, The first protrusion (4) and the ceramic disk (2) are an integral structure.

5. The wafer polishing apparatus of claim 1 wherein, The longitudinal section of the second protrusion (6) is an arc-shaped structure.

6. The wafer polishing apparatus of claim 1 wherein, The second protrusion (6) and the polishing disc (3) are an integral structure.

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