Chip burning machine capable of self-checking and burning system

Abstract

The utility model discloses a self-checking chip burning machine and a burning system, the self-checking chip burning machine comprises a burning substrate, a three-axis driving assembly, a burning unit and a pick-up unit, the three-axis driving assembly and the burning unit are respectively arranged on the upper surface of the burning substrate, the pick-up unit is arranged on the three-axis driving assembly, a substrate is arranged on the outer side of the burning substrate, and the three-axis driving assembly and the burning unit are arranged on the outer side of the burning substrate. A testing unit and a three-axis driving unit are installed on the base plate, a horizontal carrying module is further installed on the upper surface of the base plate, and a material carrying platform deck is installed on a movable part of the horizontal carrying module. The burning system using the equipment comprises burning equipment, a material conveying mechanism is arranged on the side, away from a substrate, of a burning substrate of the burning equipment, and the material conveying mechanism is used for conveying chips loaded on a material belt to the position below a pickup unit. According to the self-checking chip burning machine and the burning system, the production efficiency can be improved, and the yield in the whole burning process can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and more particularly to a self-testing chip programmer. This utility model also relates to a programming system using this automatic testing equipment. Background Technology

[0002] Chip programming is the process of writing programs, parameters, and files into a microcontroller or ARM controller to realize the functions and effects of electronic products. The quality of the programmed chip is crucial. A search reveals that patent CN105573743B discloses a chip programming system and method, as well as an electronic device. The system includes a USB communication module, a detection output module, a UI display and alarm module, a firmware upgrade module, a storage module, a PC control software module, and a button module. These modules connect or communicate with the ARM processor to program the chip. This patent utilizes different information prompts for the user, automatically detects chip placement, and employs a coordinated hardware and software development approach to reduce programming errors caused by contact issues. However, human error, computer viruses, software mutations, and other abnormal situations can also lead to defective programmed chips, reducing the overall yield rate of the programming process. Utility Model Content

[0003] The purpose of this invention is to provide a self-testing chip programmer and programming system that can improve production efficiency and ensure a high yield rate throughout the programming process.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a self-testing chip programmer, comprising: a programming substrate, a three-axis drive assembly respectively mounted on the upper surface of the programming substrate, a programming unit, and a pickup unit mounted on the three-axis drive assembly. The pickup unit is used to transport the chip into the programming unit. A substrate is disposed on the outer side of the programming substrate. A test unit and a three-axis drive unit are respectively mounted on the substrate. At least two spaced vacuum nozzles are mounted on the Z-axis movable block of the three-axis drive unit. A horizontal transport module is also mounted on the upper surface of the substrate. The other end of the horizontal transport module, which is connected to the upper surface of the substrate, extends above the programming substrate and is connected to the programming substrate. A material transport platform is mounted on the movable part of the horizontal transport module, so that the material transport platform can move between the programming substrate and the substrate with the movable part of the horizontal transport module. The pickup unit is also used to transport the chip in the programming unit to the material transport platform. The vacuum nozzle is used to transport the chip to be tested on the material transport platform to the test unit.

[0005] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0006] The following are further improvements to the above technical solution:

[0007] 1. In the above scheme, the upper surface of the material handling platform is provided with at least two carrier slots for chip embedding.

[0008] 2. In the above scheme, there are four vacuum suction nozzles and four bearing grooves opened on the upper surface of the material conveying platform.

[0009] 3. In the above scheme, the vacuum nozzle is also used to transport the chip that has completed testing in the test unit to the material handling platform.

[0010] 4. In the above scheme, a material box is installed on the upper surface of the substrate, and the vacuum nozzle is also used to transport the chip that has completed testing in the test unit into the material box.

[0011] A programming system using a self-testing chip programmer is also provided, including the programming device, wherein a feeding mechanism is provided on the side of the programming substrate of the programming device away from the substrate, the feeding mechanism being used to transport the chip loaded on the tape to below the pickup unit.

[0012] The following are further improvements to the above technical solution:

[0013] 1. In the above scheme, one end of the material conveying mechanism overlaps and cooperates with the programming substrate.

[0014] This invention relates to a self-testing chip programmer and programming system. A substrate is disposed on the outer side of the programming substrate. A test unit and a three-axis drive unit are respectively mounted on the substrate. At least two spaced vacuum nozzles are mounted on the Z-axis movable block of the three-axis drive unit. A horizontal transport module is also mounted on the upper surface of the substrate. One end of the horizontal transport module is connected to the upper surface of the substrate, and the other end extends above and connects to the programming substrate. A material transport platform is mounted on the movable part of the horizontal transport module, allowing the platform to move between the programming substrate and the substrate. A pick-up unit is used to transport chips from the programming unit to the material transport platform. Vacuum nozzles are used to transport chips to be tested from the material transport platform to the test unit. This allows for random and automatic sampling inspection of programmed chips at any time during the programming process without stopping the programming process, improving production efficiency and ensuring a high yield rate throughout the programming process. Attached Figure Description

[0015] Appendix Figure 1 This is a schematic diagram of the self-testing chip programmer of this utility model.

[0016] Appendix Figure 2 This is a partial structural diagram of the self-testing chip programmer of this utility model;

[0017] Appendix Figure 3 This is a schematic diagram of the second partial structure of the self-testing chip programmer of this utility model;

[0018] Appendix Figure 4 This is a schematic diagram of the programming system of the chip programmer with self-testing capability according to the present invention;

[0019] Appendix Figure 5 For the appendix Figure 4 Enlarged view of point A in the structural schematic diagram shown.

[0020] In the above figures: 101, programming substrate; 102, three-axis drive assembly; 103, pickup unit; 104, programming unit; 200, material conveying mechanism; 300, material strip; 1, substrate; 2, testing unit; 3, three-axis drive unit; 31, Z-axis movable block; 4, vacuum nozzle; 5, horizontal transport module; 6, material conveying platform; 61, support groove; 7, material box. Detailed Implementation

[0021] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0022] Example 1: A self-testable chip programmer includes: a programming substrate 101, a three-axis drive assembly 102 mounted on the upper surface of the programming substrate 101, a programming unit 104, and a pickup unit 103 mounted on the three-axis drive assembly 102. The pickup unit 103 is used to transport the chip into the programming unit 104. A substrate 1 is provided on the outer side of the programming substrate 101. A test unit 2 and a three-axis drive unit 3 are mounted on the substrate 1.

[0023] From the appendix Figure 1 Appendix Figure 2 Appendix Figure 3 It is known that a vacuum nozzle 4 is installed on the Z-axis movable block 31 of the three-axis drive unit 3 at intervals. A horizontal transport module 5 is also installed on the upper surface of the substrate 1. The other end of the horizontal transport module 5, which is connected to the upper surface of the substrate 1 at one end, extends above the programming substrate 101 and is connected to the programming substrate 101. A material transport platform 6 is installed on the movable part of the horizontal transport module 5, so that the material transport platform 6 can move between the programming substrate 101 and the substrate 1 with the movable part of the horizontal transport module 5.

[0024] During the chip programming process, the chip is sampled and inspected. The picking unit 103 is used to transport the chip in the programming unit 104 to the material transport platform 6. The upper surface of the material transport platform 6 is provided with a carrier groove 61 for chip embedding. The vacuum nozzle 4 is used to transport the chip to be tested on the material transport platform 6 to the testing unit 2.

[0025] After the test is completed, the vacuum nozzle 4 transports the chip that has completed the test in the test unit 2 to the material transport platform 6. The vacuum nozzle 4 is also used to transport the chip that has completed the test in the test unit 2 to the material box 7. Both the vacuum nozzle 4 and the carrier groove 61 opened on the upper surface of the material transport platform 6 are provided with 4.

[0026] Example 2: A self-testing chip programmer includes: a programming substrate 101, a three-axis drive assembly 102 mounted on the upper surface of the programming substrate 101, a programming unit 104, and a pickup unit 103 mounted on the three-axis drive assembly 102. The pickup unit 103 is used to transport the chip into the programming unit 104. A substrate 1 is disposed on the outer side of the programming substrate 101. A test unit 2 and a three-axis drive unit 3 are respectively mounted on the substrate 1. At least two spaced vacuum nozzles 4 are mounted on the Z-axis movable block 31 of the three-axis drive unit 3. A horizontal transport module 5 is also installed on the upper surface of the substrate 1. One end of the horizontal transport module 5 is connected to the upper surface of the substrate 1, and the other end extends to the top of the programming substrate 101 and is connected to the programming substrate 101. A material transport platform 6 is installed on the movable part of the horizontal transport module 5, so that the material transport platform 6 can move between the programming substrate 101 and the substrate 1 with the movable part of the horizontal transport module 5. The pickup unit 103 is also used to transport the chip in the programming unit 104 to the material transport platform 6. The vacuum nozzle 4 is used to transport the chip to be tested on the material transport platform 6 to the test unit 2.

[0027] The upper surface of the material handling platform 6 is provided with at least two carrier slots 61 for chip embedding; the vacuum nozzle 4 and the carrier slots 61 on the upper surface of the material handling platform 6 are each provided with four slots.

[0028] The vacuum nozzle 4 is also used to transport the chip that has completed testing in the test unit 2 to the material transport platform 6; a material box 7 is installed on the upper surface of the substrate 1, and the vacuum nozzle 4 is also used to transport the chip that has completed testing in the test unit 2 to the material box 7.

[0029] Example 3: A feeding mechanism 200 can be used in conjunction with the programming substrate 101 to obtain the attached... Figure 4 The programming system shown uses a self-testing chip programmer, including the programming device and a feeding mechanism 200 disposed on the side of the programming substrate 101 of the programming device away from the substrate 1. The feeding mechanism 200 is used to transport the chip loaded on the tape 300 to below the pickup unit 103.

[0030] Under normal burning conditions:

[0031] The feeding mechanism moves the tape loaded with several chips to be programmed toward the programming substrate until the chips to be programmed are moved to a position that the pickup unit can reach with the three-axis drive assembly.

[0032] The pick-up unit sequentially transports the chips to be programmed from the tape to the programming unit for programming. After programming is completed, the pick-up unit sequentially transports the programmed chips from the programming unit to the empty tape for subsequent unloading operations.

[0033] The burning mechanisms mentioned above all fall within the existing basic scope, and the applicant's prior applications have provided specific technical solutions, which will not be repeated in this patent.

[0034] Importantly, during the chip programming process, a random inspection of the programmed chips is necessary to check the accuracy of the programmed information and prevent errors caused by human error, computer viruses, software mutations, or other factors. The specific process is as follows:

[0035] During the normal burning process, perform the following operations at regular intervals (e.g., every hour):

[0036] The horizontal transport module moves the transport platform above the programming substrate of the programming mechanism. The picking unit of the programming mechanism randomly selects the chips that have been programmed in the programming unit and transports them to the transport platform.

[0037] The horizontal transport module then moves the transport platform carrying the programmed chip to above the substrate. Next, the vacuum nozzle driven by the three-axis drive unit moves the programmed chip on the transport platform to the test unit for testing. Based on the test results, the tested chip is moved to a specific location (such as a qualified product box, an NG product box, or a discharge tray). The test unit and test process described above are all within the scope of existing technology and will not be elaborated here.

[0038] When using the aforementioned self-testing chip programmer, it can randomly and automatically inspect the programmed chips at any time during the programming process without stopping the programming process. This can improve production efficiency and ensure the yield rate throughout the programming process.

[0039] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A self-checking chip programmer, comprising: The programming substrate (101), a three-axis drive assembly (102) mounted on the upper surface of the programming substrate (101), a programming unit (104), and a pickup unit (103) mounted on the three-axis drive assembly (102), wherein the pickup unit (103) is used to transport the chip into the programming unit (104), characterized in that: a substrate (1) is provided on the outer side of the programming substrate (101), a test unit (2) and a three-axis drive unit (3) are respectively mounted on the substrate (1), and at least two spaced vacuum nozzles (4) are mounted on the Z-axis movable block (31) of the three-axis drive unit (3), and the upper surface of the substrate (1) is also equipped with A horizontal transport module (5) is provided, with one end connected to the upper surface of the substrate (1) and the other end extending above the programming substrate (101) and connected to the programming substrate (101). A material transport platform (6) is installed on the movable part of the horizontal transport module (5), so that the material transport platform (6) can move between the programming substrate (101) and the substrate (1) along with the movable part of the horizontal transport module (5). The pickup unit (103) is also used to transport the chip in the programming unit (104) to the material transport platform (6). The vacuum nozzle (4) is used to transport the chip to be tested on the material transport platform (6) to the test unit (2).

2. The self-checking chip burner according to claim 1, wherein: The upper surface of the material handling platform (6) is provided with at least two carrier slots (61) for chip embedding.

3. The self-checking chip burner according to claim 2, wherein: The vacuum nozzle (4) and the bearing groove (61) opened on the upper surface of the material conveying platform (6) are both provided with 4.

4. The self-checking chip burner of claim 1, wherein: The vacuum nozzle (4) is also used to transport the chip that has been tested in the test unit (2) to the material handling platform (6).

5. The self-checking chip burner of claim 1, wherein: A material box (7) is mounted on the upper surface of the substrate (1), and the vacuum nozzle (4) is also used to transport the chip that has been tested in the test unit (2) to the material box (7).

6. A burning system, characterized by: The chip programmer as described in any one of claims 1 to 5 is provided with a feeding mechanism (200) on the side of the programming substrate (101) away from the substrate (1), the feeding mechanism (200) being used to transport the chip loaded on the tape (300) to below the pickup unit (103).

7. The burning system according to claim 6, characterized in that: One end of the material conveying mechanism (200) is engaged with the programming substrate (101).

Images