SMT steel mesh production equipment

Abstract

The utility model discloses SMT steel mesh production equipment, which comprises a rack, a jig mechanism, a gluing and slicing mechanism, a camera mechanism and a first moving mechanism, the jig mechanism can be used for sequentially stacking a steel mesh sheet and a mesh frame with a connecting sheet, and can be used for pressing and fixing the steel mesh sheet and the mesh frame with the connecting sheet; the camera mechanism can take a picture to obtain the position of the pressed screen frame and control the first moving mechanism to work according to the position of the screen frame, so that the first moving mechanism drives the gluing and slicing mechanism to move along a first path and a second path in sequence, the gluing and slicing mechanism moving along the first path can glue an inner hole of the screen frame, and a connecting piece and a steel mesh piece are partially bonded; and the gluing and slicing mechanism moving along the second path can cut off the connecting piece part which is not glued and adhered in the inner hole of the screen frame, so that the connecting piece is provided with a rectangular hole located in the inner hole of the screen frame, and the rectangular part of the steel mesh can be exposed out of the inner hole of the screen frame through the rectangular hole. Through the structure, the labor cost invested in the production process can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of SMT stencil production technology, and in particular to an SMT stencil production equipment. Background Technology

[0002] SMT stencils are a key tool in surface mount technology, used to precisely apply solder paste to printed circuit boards (PCBs) to ensure reliable soldering of electronic components. In existing technologies, referring to... Figure 7 The production process of SMT stencils includes: 1. Manually stacking the stencil sheet S1 and the frame S3 with connecting pieces S2 in sequence (at this time, the frame S3, connecting pieces S2, and stencil sheet S1 are stacked sequentially from top to bottom); 2. Manually applying adhesive to partially bond the connecting pieces S2 and the stencil sheet S1; 3. After the adhesive has cured, manually cutting off the unbonded portions of the connecting pieces S2, exposing a rectangular portion of the stencil sheet S1 within the inner hole of the frame S3. Therefore, the above-mentioned SMT stencil production process requires high labor costs, thus affecting the production cost of SMT stencils. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an SMT stencil production equipment.

[0004] An SMT stencil production device according to an embodiment of the present invention includes a frame, a fixture mechanism, a glue application and slicing mechanism, a camera mechanism, and a first moving mechanism. The fixture mechanism, the camera mechanism, and the first moving mechanism are all disposed on the frame, the glue application and slicing mechanism is disposed on the first moving mechanism, and the camera mechanism is electrically connected to the first moving mechanism. The fixture mechanism allows for the sequential stacking of stencil sheets and frames with connecting tabs, and can press and fix the stencil sheets and frames with connecting tabs. The camera mechanism can take pictures to acquire images after pressing. The first moving mechanism is controlled according to the position of the mesh frame, so that the first moving mechanism drives the glue-applying and cutting mechanism to move sequentially along the first path and the second path. The glue-applying and cutting mechanism moving along the first path can apply glue to the inner hole of the mesh frame, so that the connecting piece and the steel mesh part are bonded together. The glue-applying and cutting mechanism moving along the second path can cut off the part of the connecting piece that is not bonded with glue in the inner hole of the mesh frame, so that the connecting piece has a rectangular hole in the inner hole of the mesh frame, so that the steel mesh can be exposed in a rectangular shape through the rectangular hole in the inner hole of the mesh frame.

[0005] An SMT stencil production equipment according to an embodiment of the present utility model has at least the following beneficial effects:

[0006] The production process of the SMT stencil production equipment of this application is as follows: 1. The camera mechanism takes pictures to obtain the position of the pressed stencil frame, and controls the first moving mechanism to work according to the position of the stencil frame, so that the first moving mechanism drives the adhesive cutting mechanism to move along the first path, wherein the adhesive cutting mechanism moving along the first path applies adhesive to the inner hole of the stencil frame to bond the connecting piece and the stencil piece; 2. Wait for the adhesive to cure; 3. The camera mechanism controls the first moving mechanism to work according to the position of the stencil frame, so that the first moving mechanism drives the adhesive cutting mechanism to move along the second path, wherein the adhesive cutting mechanism moving along the second path can cut off the part of the connecting piece that is not bonded with adhesive in the inner hole of the stencil frame, so that the connecting piece has a rectangular hole located in the inner hole of the stencil frame, so that the stencil piece can be exposed in a rectangular shape through the rectangular hole in the inner hole of the stencil frame, thereby obtaining the SMT stencil. Therefore, on the one hand, the fixture mechanism, the glue coating and slicing mechanism, the camera mechanism, and the first moving mechanism can cooperate with each other to sequentially complete the glue coating and slicing work to obtain the SMT stencil. Among them, the glue coating and slicing work does not require manual intervention, thus reducing the labor cost invested in the production of SMT stencils. On the other hand, the camera mechanism can take pictures to obtain the position of the pressed stencil frame, and can adjust the movement path of the glue coating and slicing mechanism by controlling the first moving mechanism to adapt to the production of SMT stencils of different sizes.

[0007] According to some embodiments of the present invention, the first moving mechanism is provided with an edge trimming component, and the camera mechanism can control the first moving mechanism to move the edge trimming component along a third path according to the position of the mesh frame, wherein the edge trimming component moving along the third path can remove burrs on the wall of the rectangular hole.

[0008] According to some embodiments of the present invention, the trimming assembly includes a plasma nozzle for connecting to a plasma surface treatment machine, wherein the plasma nozzle, which moves along the third path, is capable of removing burrs from the wall of the rectangular hole.

[0009] According to some embodiments of the present invention, the adhesive coating and slicing mechanism includes an adhesive coating component and a laser component. The adhesive coating component is disposed on the first moving mechanism and can apply adhesive to the inner hole of the mesh frame by moving along the first path. The laser component is disposed on the first moving mechanism and can cut off the unadhesive-bonded connecting piece portion in the inner hole of the mesh frame by moving along the second path.

[0010] According to some embodiments of the present invention, the glue application assembly includes a first driving member and a scraper head for connection with a glue supply device. The first driving member is disposed on the first moving mechanism, and the scraper head is rotatably disposed on the first moving mechanism. The bottom of the scraper head is provided with a strip-shaped glue outlet. The scraper head is connected to the first driving member. During the process of the scraper head moving along the first path to apply glue through the glue outlet, the first driving member can drive the scraper head to rotate so that the glue outlet is perpendicular to the translation direction.

[0011] According to some embodiments of the present invention, the first moving mechanism is provided with a curing module. The first moving mechanism can drive the curing module to move, so that the curing module works on the adhesive part of the connecting piece and the steel mesh, thereby accelerating the curing of the adhesive part of the connecting piece and the steel mesh.

[0012] According to some embodiments of the present invention, the first moving mechanism is provided with a shielding mechanism, wherein the shielding mechanism can shield the scraping head to prevent the curing module from curing the glue at the glue outlet.

[0013] According to some embodiments of the present invention, the frame is provided with a chassis and a second moving mechanism. The fixture mechanism, the second moving mechanism, the glue-applying and slicing mechanism, and the first moving mechanism are all located inside the chassis. The camera component of the camera mechanism is located on the top of the chassis. The fixture mechanism is connected to the second moving mechanism. The chassis is provided with an opening communicating with the outside. The second moving mechanism can drive the fixture mechanism to extend or retract into the inner cavity of the chassis through the opening.

[0014] According to some embodiments of the present invention, the fixture mechanism is provided with a detection element, wherein when the second moving mechanism drives the fixture mechanism to extend out of the inner cavity of the chassis through the opening, the detection element can detect whether there is an obstacle on the moving path of the fixture mechanism.

[0015] According to some embodiments of the present invention, the fixture mechanism includes a mounting frame, a platform, and a pressure plate assembly. The mounting frame is mounted on the machine frame, and the platform is mounted on the mounting frame. The platform allows steel mesh sheets and mesh frames with connecting pieces to be stacked sequentially. The pressure plate assembly is mounted on the mounting frame. There are two pressure plate assemblies, which are respectively located on both sides of the platform. The two pressure plate assemblies can press the corresponding sides of the mesh frame onto the platform.

[0016] According to some embodiments of the present invention, the mounting bracket is provided with a first positioning strip and a second positioning strip. The first positioning strip and the second positioning strip are arranged in an L-shape and are respectively located on one side of the platform. The mesh frame on the platform can abut against the first positioning strip and the second positioning strip for positioning. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is a structural diagram of an embodiment of the SMT stencil production equipment of this utility model;

[0019] Figure 2 for Figure 1 The diagram shows the structure of the SMT stencil production equipment after some components have been removed.

[0020] Figure 3 for Figure 2 The diagram shows the structure of the adhesive application and slicing mechanism, the first moving mechanism, and the trimming assembly.

[0021] Figure 4 for Figure 3 The diagram shows the structure of the glue applicator.

[0022] Figure 5 for Figure 3 A simplified diagram of the adhesive dispensing nozzle and translation direction as the scraper head moves along the first path;

[0023] Figure 6 for Figure 2 The structural diagram of the fixture mechanism and the second moving mechanism shown in the figure;

[0024] Figure 7 This is a structural diagram of the SMT stencil obtained after sequentially applying adhesive and slicing.

[0025] Figure 8 for Figure 3 The diagram shows the structure of the adhesive slicing mechanism, the first moving mechanism, and the trimming component of another embodiment.

[0026] Figure label:

[0027] Frame 100, chassis 110, opening 111, through hole 112, mounting hole 113, second moving mechanism 120, seventh driving component 121, transmission rod 122, eighth driving component 130;

[0028] Fixture mechanism 200, mounting bracket 210, first positioning bar 211, second positioning bar 212, platform component 220, pressure plate assembly 230, second driving component 231, pressure plate component 232, connecting part 231A;

[0029] The adhesive coating and slicing mechanism 300, adhesive coating component 310, first drive component 311, adhesive scraper head 312, adhesive outlet 312A, laser component 320, fourth drive component 321, and laser head 322 are included.

[0030] Camera mechanism 400, camera component 410;

[0031] First moving mechanism 500, first linear module 510, second linear module 520, third linear module 530;

[0032] Trimming component 610, soldering iron 611, sixth drive component 612, plasma nozzle 613, curing module 620, shielding mechanism 630, fifth drive component 631, shielding plate 632, detection component 640, third drive component 650, push block 651, and door 660.

[0033] Steel mesh S1, connecting piece S2, rectangular hole S21, mesh frame S3. Detailed Implementation

[0034] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0035] In the description of this utility model, the use of terms such as first, second, third, fourth, and fifth is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated.

[0036] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] In this utility model, unless otherwise explicitly defined, the terms "setting," "installing," and "connecting" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0038] Reference Figures 1 to 7 This utility model discloses an SMT stencil production equipment, comprising a frame 100, a fixture mechanism 200, an adhesive application and slicing mechanism 300, a camera mechanism 400, and a first moving mechanism 500. The fixture mechanism 200, camera mechanism 400, and first moving mechanism 500 are all mounted on the frame 100. The adhesive application and slicing mechanism 300 is mounted on the first moving mechanism 500. The camera mechanism 400 is electrically connected to the first moving mechanism 500. The fixture mechanism 200 allows for the sequential stacking of stencil sheets S1 and stencil frames S3 with connecting pieces S2, and can press and fix the stencil sheets S1 and stencil frames S3. The camera mechanism 400 is capable of taking pictures. The position of the compressed wire mesh frame S3 is obtained, and the first moving mechanism 500 is controlled to work according to the position of the wire mesh frame S3, so that the first moving mechanism 500 drives the glue-applying and cutting mechanism 300 to move sequentially along the first path and the second path; the glue-applying and cutting mechanism 300 moving along the first path can apply glue to the inner hole of the wire mesh frame S3, so that the connecting piece S2 and the steel wire mesh S1 are partially bonded; the glue-applying and cutting mechanism 300 moving along the second path can cut off the part of the connecting piece S2 that is not bonded with glue in the inner hole of the wire mesh frame S3, so that the connecting piece S2 has a rectangular hole S21 located in the inner hole of the wire mesh frame S3, so that the steel wire mesh S1 can be exposed in a rectangular shape in the inner hole of the wire mesh frame S3 through the rectangular hole S21.

[0039] It is understandable that the top view of the part where the connecting piece S2 and the steel mesh S1 are bonded together is a rectangular ring, and the part of the connecting piece S2 that has been cut off and not bonded with glue is a rectangular piece.

[0040] It is understandable that the steel mesh S1 and the mesh frame S3 with connecting piece S2 are stacked in sequence, that is, the mesh frame S3, the connecting piece S2 and the steel mesh S1 are stacked in sequence from top to bottom.

[0041] The production process of the SMT stencil production equipment in this application is as follows: 1. The camera mechanism 400 takes a picture to obtain the position of the pressed stencil frame S3, and controls the first moving mechanism 500 to work according to the position of the stencil frame S3, so that the first moving mechanism 500 drives the glue-applying and cutting mechanism 300 to move along the first path. The glue-applying and cutting mechanism 300, which moves along the first path, applies glue to the inner hole of the stencil frame S3 to partially bond the connecting piece S2 and the stencil sheet S1; 2. Wait for the glue to cure; 3. The camera mechanism 400 controls the first moving mechanism 500 to work according to the position of the stencil frame S3, so that the first moving mechanism 500 drives the glue-applying and cutting mechanism 300 to move along the second path. The glue-applying and cutting mechanism 300, which moves along the second path, can cut off the part of the connecting piece S2 that is not glued and bonded in the inner hole of the stencil frame S3, so that the connecting piece S2 has a rectangular hole S21 located in the inner hole of the stencil frame S3, so that the stencil sheet S1 can be exposed in a rectangular shape through the rectangular hole S21 in the inner hole of the stencil frame S3 (see details). Figure 7 As shown in the figure, this is how to obtain the SMT stencil.

[0042] With the above structure, on the one hand, the fixture mechanism 200, the glue application and slicing mechanism 300, the camera mechanism 400, and the first moving mechanism 500 can cooperate with each other to sequentially complete the glue application and slicing work to obtain the SMT stencil. The glue application and slicing work do not require manual intervention, thus reducing the labor costs invested in the production of SMT stencils. On the other hand, the camera mechanism 400 can take pictures to obtain the position of the pressed stencil frame S3, and can adjust the movement path of the glue application and slicing mechanism 300 by controlling the first moving mechanism 500 to adapt to the production of SMT stencils of different sizes.

[0043] It is understandable that the camera mechanism 400 can be configured as a microcontroller module with a CCD camera (i.e., camera component 410); the connecting piece S2 can be configured as a nylon mesh.

[0044] In this embodiment, refer to Figures 1 to 3 The first moving mechanism 500 is equipped with a trimming component 610. The camera mechanism 400 can control the first moving mechanism 500 to move the trimming component 610 along the third path according to the position of the mesh frame S3. The trimming component 610 moving along the third path can remove burrs on the wall of the rectangular hole S21.

[0045] The first moving mechanism 500 includes two first linear modules 510, a second linear module 520, and a third linear module 530.

[0046] Reference Figure 3Two first linear modules 510 are arranged side-by-side on the frame 100. The left and right ends of the second linear module 520 are respectively located on the two first linear modules 510. A third linear module 530 is located on the second linear module 520. The trimming assembly 610 and the glue-applying and slicing mechanism 300 are both located on the third linear module 530. The first linear module 510 can drive the glue-applying and slicing mechanism 300 to move in the front-back direction, the second linear module 520 can drive the glue-applying and slicing mechanism 300 to move in the left-right direction, and the third linear module 530 can drive the glue-applying and slicing mechanism 300 to move in the up-down direction. These components work together to drive the glue-applying and slicing mechanism 300 to move along a first path or a second path, and also work together to drive the trimming assembly 610 to move along a third path.

[0047] The adhesive coating and slicing mechanism 300 includes an adhesive coating component 310 and a laser component 320.

[0048] Reference Figure 3 The adhesive application component 310 is located in the third linear module 530. The adhesive application component 310, which moves along the first path, can apply adhesive to the inner hole of the mesh frame S3, so that the connecting piece S2 and the steel mesh S1 are partially bonded together. The laser mechanism 320 is located in the third linear module 530. The laser component 320, which moves along the second path, can cut off the part of the connecting piece S2 that is not bonded with adhesive in the inner hole of the mesh frame S3, so that the connecting piece S2 has a rectangular hole S21 located in the inner hole of the mesh frame S3, so that the steel mesh S1 can be exposed in a rectangular shape through the rectangular hole S21 in the inner hole of the mesh frame S3.

[0049] The adhesive application assembly 310 includes a first drive member 311 and a scraper head 312 for connection with the adhesive dispensing device.

[0050] Reference Figure 3 The first driving member 311 is disposed on the third linear module 530, and the scraper head 312 is rotatably disposed on the third linear module 530. The bottom of the scraper head 312 is provided with a strip-shaped glue outlet 312A. The scraper head 312 is connected to the first driving member 311. During the process of the scraper head 312 moving along the first path to apply glue through the glue outlet 312A, the first driving member 311 can drive the scraper head 312 to rotate so that the glue outlet 312A is perpendicular to the translation direction.

[0051] In this embodiment, the glue applicator head 312 is connected to the first driving member 311 via gear transmission, and the first driving member 311 is configured as a motor.

[0052] It is understood that the translation direction refers to the direction of the horizontal movement segment that exists during the movement along the first path. In this embodiment, the first path has four translation directions, as shown below. Figure 2 and Figure 5The translation directions are L1 from left to right, L2 from back to front, L3 from right to left, and L4 from front to back.

[0053] Reference Figure 2 and Figure 5 The process of the adhesive application assembly 310 moving along the first path to apply adhesive is as follows: 1. The first driving member 311 drives the adhesive application head 312 to rotate so that the adhesive outlet 312A is perpendicular to the translation direction L1; 2. The third linear module 530 drives the adhesive application head 312 to move down to abut against the connecting piece S2; 3. Adhesive is dispensed from the adhesive outlet 312A, and the second linear module 520 drives the adhesive application head 312 to move along the translation direction L1; 4. The third linear module 530 drives the adhesive application head 312 to move up; 5. The first driving member 311 drives the adhesive application head 312 to rotate so that the adhesive outlet 312A is perpendicular to the translation direction L2; 6. The third linear module 530 drives the adhesive application head 312 to move down to abut against the connecting piece S2; 7. Adhesive is dispensed from the adhesive outlet 312A, and the first linear module 510 drives the adhesive application head 312 to move along the translation direction L2; 8. The first linear module 530 drives the adhesive application head 312 to move down to abut against the connecting piece S2; 9. Adhesive is dispensed from the adhesive outlet 312A, and the first linear module 510 drives the adhesive application head 312 to move along the translation direction L2; 10. The second linear module 530 drives the adhesive application head 312 to move down to abut against the connecting piece S2; 11. The third linear module 530 drives the adhesive application head 312 to move down to abut against the connecting piece S2; 11. The third linear module 530 drives the adhesive application head 312 to move down to abut against the connecting piece S2; 12. The third linear module 530 drives the adhesive application head 312 to move down to abut against the connecting piece S2; 12. The third linear module The three-linear module 530 drives the applicator head 312 to move upward; 9. The first driving member 311 drives the applicator head 312 to rotate so that the dispensing port 312A is perpendicular to the translation direction L3; 10. The third linear module 530 drives the applicator head 312 to move downward until it abuts against the connecting piece S2; 11. Glue is dispensed from the dispensing port 312A, and in conjunction with the second linear module 520, the applicator head 312 moves along the translation direction L3; 12. 13. The third linear module 530 drives the scraper head 312 to move upward; 14. The first driving member 311 drives the scraper head 312 to rotate so that the glue outlet 312A is perpendicular to the translation direction L4; 15. The third linear module 530 drives the scraper head 312 to move downward until it abuts against the connecting piece S2; 16. Glue is dispensed from the glue outlet 312A, and the first linear module 510 drives the scraper head 312 to move along the translation direction L4.

[0054] It is understandable that the first path, viewed from above, is a rectangular path, as shown in the reference. Figure 5 As shown.

[0055] To accelerate the curing of the adhesive-coated connecting piece S2 and the steel mesh S1, refer to... Figure 2 and Figure 3 The second linear module 520 is equipped with a curing module 620. The first linear module 510 can drive the curing module 620 to move in the back-and-forth direction, so that the curing module 620 works on the adhesive part of the connecting piece S2 and the steel mesh S1, accelerating the curing of the adhesive part of the connecting piece S2 and the steel mesh S1. The curing module 620 is an ultraviolet lamp module.

[0056] In some embodiments, the curing module 620 may be configured as a hot air module.

[0057] In this embodiment, refer to Figure 2 and Figure 3 The third linear module 530 is equipped with a shielding mechanism 630. Specifically, the shielding mechanism 630 includes a fifth driving member 631 and a shielding plate 632. The fifth driving member 631 is located in the third linear module 530, and the shielding plate 632 is located in the fifth driving member 631. The fifth driving member 631 can drive the shielding plate 632 to rotate to shield the glue applicator head 312, thereby preventing the curing module 620 from curing the glue at the glue outlet 312A. The fifth driving member 631 is configured as a rotary cylinder or similar device.

[0058] The laser assembly 320 includes a fourth drive element 321 and a laser head 322 for connection with a laser device.

[0059] Reference Figure 3 The fourth driving component 321 is located in the third linear module 530. The fourth driving component 321 is connected to the laser head 322. The fourth driving component 321 can drive the laser head 322 to move down to a preset height, so that the laser head 322 can move along the second path to cut off the unadhesive-bonded connecting piece S2 part in the inner hole of the mesh frame S3. The fourth driving component 321 can be configured as a cylinder, hydraulic cylinder, or electric push rod, etc.

[0060] In this embodiment, the second path also has four translational directions, referring to... Figure 2 and Figure 5 These are respectively the translation direction from left to right L1, the translation direction from back to front L2, the translation direction from right to left L3, and the translation direction from front to back L4.

[0061] Reference Figure 2 and Figure 5 The process of the laser assembly 320 moving the slice along the second path is as follows: 1. The fourth driving component 321 drives the laser head 322 to move down to a preset height; 2. The laser head 322 works and, under the action of the first linear module 510 and the second linear module 520, cuts the connecting piece S2 along a rectangular path with translation directions L1, L2, L3 and L4.

[0062] It is understandable that the second path, viewed from above, is a rectangular path, which can also be referenced. Figure 5 As shown.

[0063] The trimming assembly 610 includes a soldering iron 611 and a sixth drive unit 612.

[0064] Reference Figure 3The sixth driving component 612 is located in the third linear module 530. The sixth driving component 612 is connected to a soldering iron 611. The sixth driving component 612 can drive the soldering iron 611 to move down to a preset height, allowing the soldering iron 611 to move along the third path to remove burrs from the wall of the rectangular hole S21. The sixth driving component 612 can be configured as a cylinder, hydraulic cylinder, or electric push rod, etc.

[0065] In some embodiments, refer to Figure 8 The trimming assembly 610 includes a plasma nozzle 613 and a sixth drive member 612. The plasma nozzle 613 is used to connect to a plasma surface treatment machine. The sixth drive member 612 is located in the third linear module 530. The plasma nozzle 613 is located in the sixth drive member 612, which can drive the plasma nozzle 613 to move down to a preset height, so that the plasma nozzle 613 can move along a third path to remove burrs on the wall of the rectangular hole S21. The sixth drive member 612 can be configured as a cylinder, hydraulic cylinder, or electric push rod, etc.

[0066] In this embodiment, the third path is actually a path that moves around the edge of the rectangular hole S21, and it also has four translational directions, as shown in the reference. Figure 2 and Figure 5 These are respectively the translation direction from left to right L1, the translation direction from back to front L2, the translation direction from right to left L3, and the translation direction from front to back L4.

[0067] Reference Figure 2 and Figure 5 The process of the trimming component 610 moving the slice along the third path is as follows: 1. The sixth driving component 612 drives the soldering iron 611 to move down to a preset height; 2. The soldering iron 611 works and, under the action of the first linear module 510 and the second linear module 520, removes the burrs on the wall of the rectangular hole S21 along a rectangular path with translation directions L1, L2, L3 and L4.

[0068] It is understandable that the third path, viewed from above, is a rectangular path, which can also be referenced. Figure 5 As shown.

[0069] In this embodiment, refer to Figure 1 , Figure 2 as well as Figure 6The frame 100 is provided with a housing 110 and a second moving mechanism 120. The fixture mechanism 200, the second moving mechanism 120, the glue application and slicing mechanism 300 and the first moving mechanism 500 are all located in the inner cavity of the housing 110. The camera component 410 of the camera mechanism 400 is located on the top of the housing 110. The fixture mechanism 200 is connected to the second moving mechanism 120. The housing 110 is provided with an opening 111 that communicates with the outside. The fixture mechanism 200 is slidably mounted on the frame 100 through a slider and slide rail assembly. The second moving mechanism 120 can drive the fixture mechanism 200 to extend or retract into the inner cavity of the housing 110 through the opening 111.

[0070] With the above structure, the second moving mechanism 120 can drive the fixture mechanism 200 to extend out of the inner cavity of the chassis 110 through the opening 111, so that the production personnel can take out the SMT stencil obtained by sequentially completing the glue application and slicing work, and facilitate the production personnel to sequentially stack the stencil sheet S1 and the frame S3 with connecting piece S2 on the fixture mechanism 200.

[0071] In this embodiment, refer to Figure 1 The frame 100 is provided with an eighth drive unit 130, which is connected to a door 660. The eighth drive unit 130 can drive the door 660 to move to open or close the opening 111 accordingly.

[0072] In this embodiment, refer to Figure 1 and Figure 2 The top of the chassis 110 is provided with a through hole 112 communicating with its inner cavity. The through hole 112 is used for connecting an air extraction device so that the air extraction device can work to extract air from the inner cavity of the switch chassis 110 through the through hole 112.

[0073] In this embodiment, a lighting module is provided on the top inner wall of the chassis 110, which can illuminate the interior of the chassis 100. The lighting module can be configured as a panel light or the like.

[0074] Camera component 410 is located on the top of chassis 110. For details, please refer to [reference needed]. Figure 2 The top of the chassis 100 is provided with a mounting hole 113 communicating with its inner cavity. The chassis 100 is provided with a screw and slider assembly located at the mounting hole 113. The screw and slider assembly is provided with the aforementioned camera component 410. The production personnel can adjust the screw and slider assembly to drive the camera component 410 to move and fine-tune its position at the mounting hole 113.

[0075] To avoid the danger of the jig mechanism 200 colliding with production personnel or materials during the process of the jig mechanism 200 extending out of the inner cavity of the housing 110 through the opening 111, refer to Figure 6The fixture mechanism 200 is equipped with a detection element 640. When the second moving mechanism 120 drives the fixture mechanism 200 to extend out of the inner cavity of the housing 110 through the opening 111, the detection element 640 can detect whether there is an obstacle on the moving path of the fixture mechanism 200. The detection element 640 can be set as a single-sided diffuse reflection grating detection element, etc.

[0076] The fixture mechanism 200 includes a mounting frame 210, a platform 220, and a pressure plate assembly 230.

[0077] Reference Figure 6 The mounting frame 210 is slidably mounted on the frame 100 via a slider and slide rail assembly. The mounting frame 210 is connected to the second moving mechanism 120. The platform 220 is mounted on the mounting frame 210. The platform 220 allows the steel mesh S1 and the mesh frame S3 with connecting piece S2 to be stacked sequentially. The pressure plate assembly 230 is mounted on the mounting frame 210. There are two pressure plate assemblies 230, which are respectively located on both sides of the platform 220. The two pressure plate assemblies 230 can press the corresponding sides of the mesh frame S3 onto the platform 220.

[0078] The pressure plate assembly 230 includes a second drive member 231 and a pressure plate member 232.

[0079] Reference Figure 6 The second driving component 231 is mounted on the mounting bracket 210. The second driving component 231 has a connecting part 231A. The pressure plate component 232 is rotatably connected to the connecting part 231A and rotatably connected to the output shaft of the second driving component 231. The second driving component 231 can drive its output shaft to move, thereby driving the pressure plate component 232 to rotate and press one side of the corresponding mesh frame S3 onto the platform component 220. The second driving component 231 can be configured as a cylinder, hydraulic cylinder, or electric push rod, etc.

[0080] In this embodiment, to facilitate the positioning of the wire frame S3 on the carrier 220 by production personnel, refer to... Figure 6 The mounting bracket 210 is provided with a first positioning strip 211 and a second positioning strip 212. The first positioning strip 211 and the second positioning strip 212 are arranged in an L-shape and are respectively located on one side of the platform 220. The mesh frame S3 on the platform 220 can abut against the first positioning strip 211 and the second positioning strip 212 for positioning.

[0081] To further reduce the probability of displacement of the mesh frame S3 on the stage 220 during the gluing and slicing processes, refer to Figure 6 The mounting bracket 210 is provided with a third driving member 650, which is provided with a push block 651. The third driving member 650 can drive the push block 651 to move so as to press the mesh frame S3 on the platform member 220 against the first positioning strip 211. The third driving member 650 can be configured as a cylinder, a hydraulic cylinder, or an electric push rod, etc.

[0082] In some embodiments, the third drive member 650 can drive the push block 651 to move so as to press the mesh frame S3 on the platform member 220 against the second positioning bar 212.

[0083] The second moving mechanism 120 includes a seventh driving element 121 and a transmission rod 122.

[0084] Reference Figure 6 The seventh drive component 121 is mounted on the frame 100, and the transmission rod 122 is rotatably mounted on the frame 100 and threadedly connected to the mounting bracket 210. The seventh drive component 121 is connected to the transmission rod 122 and can drive the transmission rod 122 to rotate, thereby moving the mounting bracket 210 and causing the integral fixture mechanism 200 to extend or retract into the inner cavity of the housing 110 through the opening 111. The seventh drive component 121 is configured as a motor.

[0085] Of course, this utility model is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of this utility model. All such equivalent modifications and substitutions are included within the scope defined by the claims of this application.

Claims

1. An SMT steel mesh production apparatus, characterized by: The system includes a frame (100), a fixture mechanism (200), a glue-applying and slicing mechanism (300), a camera mechanism (400), and a first moving mechanism (500). The fixture mechanism (200), the camera mechanism (400), and the first moving mechanism (500) are all located on the frame (100). The glue-applying and slicing mechanism (300) is located on the first moving mechanism (500). The camera mechanism (400) is electrically connected to the first moving mechanism (500). The fixture mechanism (200) allows steel mesh sheets (S1) and mesh frames (S3) with connecting pieces (S2) to be stacked sequentially, and can press and fix the steel mesh sheets (S1) and mesh frames (S3) with connecting pieces (S2). The camera mechanism (400) can take pictures to obtain the position of the compressed mesh frame (S3), and control the first moving mechanism (500) to work according to the position of the mesh frame (S3), so that the first moving mechanism (500) drives the glue-applying and slicing mechanism (300) to move sequentially along the first path and the second path. The adhesive-applying and slicing mechanism (300), moving along the first path, can apply adhesive to the inner hole of the wire mesh frame (S3), causing the connecting piece (S2) and the steel wire mesh (S1) to partially adhere together. The adhesive cutting mechanism (300) moving along the second path can cut off the unadhesive-bonded connecting piece (S2) in the inner hole of the wire frame (S3), so that the connecting piece (S2) has a rectangular hole (S21) in the inner hole of the wire frame (S3), so that the steel wire mesh (S1) can be exposed in a rectangular shape in the inner hole of the wire frame (S3) through the rectangular hole (S21).

2. The SMT stencil production equipment according to claim 1, characterized in that: The first moving mechanism (500) is equipped with a trimming component (610). The camera mechanism (400) can control the first moving mechanism (500) to move the trimming component (610) along a third path according to the position of the mesh frame (S3). The trimming component (610), which moves along the third path, is able to remove burrs from the wall of the rectangular hole (S21).

3. The SMT stencil production equipment according to claim 2, characterized in that: The trimming assembly (610) includes a plasma nozzle (613) for connecting to a plasma surface treatment machine, wherein, The plasma nozzle (613) moving along the third path is able to remove burrs from the wall of the rectangular hole (S21).

4. The SMT stencil production equipment according to claim 1, characterized in that: The adhesive coating and slicing mechanism (300) includes: An adhesive application assembly (310) is provided on the first moving mechanism (500). The adhesive application assembly (310) that moves along the first path is capable of applying adhesive to the inner hole of the wire frame (S3). A laser assembly (320) is disposed on the first moving mechanism (500). The laser assembly (320) that moves along the second path is capable of cutting off the portion of the unattached connecting piece (S2) in the inner hole of the frame (S3).

5. The SMT stencil production equipment according to claim 4, characterized in that: The adhesive application assembly (310) includes: A first driving element (311) is disposed on the first moving mechanism (500); A scraper head (312) for connection with a glue dispensing device is rotatably mounted on the first moving mechanism (500). The scraper head (312) has a strip-shaped glue outlet (312A) at its bottom. The scraper head (312) is connected to the first driving member (311). During the process of the glue applicator (312) moving along the first path through the glue outlet (312A) to apply glue, the first driving member (311) can drive the glue applicator (312) to rotate, so that the glue outlet (312A) is perpendicular to the translation direction.

6. The SMT stencil production equipment according to claim 5, characterized in that: The first moving mechanism (500) is provided with a curing module (620). The first moving mechanism (500) can drive the curing module (620) to move, so that the curing module (620) works on the adhesive part of the connecting piece (S2) and the steel mesh (S1) to accelerate the curing of the adhesive part of the connecting piece (S2) and the steel mesh (S1).

7. The SMT stencil production equipment according to claim 6, characterized in that: The first moving mechanism (500) is provided with a shielding mechanism (630), wherein, The shielding mechanism (630) can shield the applicator head (312) to prevent the curing module (620) from curing the adhesive at the dispensing port (312A).

8. The SMT stencil production equipment according to claim 1, characterized in that: The frame (100) is provided with a chassis (110) and a second moving mechanism (120). The fixture mechanism (200), the second moving mechanism (120), the glue-applying and slicing mechanism (300), and the first moving mechanism (500) are all located inside the chassis (110). The camera component (410) of the camera mechanism (400) is located on the top of the chassis (110). The fixture mechanism (200) is connected to the second moving mechanism (120). The chassis (110) is provided with an opening (111) communicating with the outside. The second moving mechanism (120) can drive the fixture mechanism (200) to extend or retract into the cavity of the housing (110) through the opening (111).

9. An SMT stencil production equipment according to claim 8, characterized in that: The fixture mechanism (200) is equipped with a detection component (640), wherein, When the second moving mechanism (120) drives the fixture mechanism (200) to extend out of the inner cavity of the chassis (110) through the opening (111), the detection element (640) can detect whether there is an obstacle on the moving path of the fixture mechanism (200).

10. An SMT stencil production equipment according to claim 1, characterized in that: The fixture mechanism (200) includes: Mounting bracket (210) is provided on the frame (100); A platform (220) is provided on the mounting frame (210), and the platform (220) is capable of allowing steel mesh (S1) and a mesh frame (S3) with connecting pieces (S2) to be stacked in sequence; A pressure plate assembly (230) is provided on the mounting frame (210). The pressure plate assembly (230) is configured as two and is respectively provided on both sides of the platform (220). The two pressure plate assemblies (230) can press the corresponding sides of the wire frame (S3) onto the platform (220).

11. An SMT stencil production equipment according to claim 10, characterized in that: The mounting bracket (210) is provided with a first positioning strip (211) and a second positioning strip (212). The first positioning strip (211) and the second positioning strip (212) are arranged in an L-shape and are respectively located on one side of the platform (220). The mesh frame (S3) on the platform (220) can abut against the first positioning strip (211) and the second positioning strip (212) for positioning.

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