Integrated ceramic refrigeration assembly and refrigeration water tank

Abstract

The utility model relates to the technical field of semiconductors, in particular to an integrated ceramic refrigeration assembly. Comprising a semiconductor assembly, a first base layer and a cold conduction piece, the first base layer is arranged at the hot end of the semiconductor assembly, the cold conduction piece comprises a connecting part and a plurality of refrigeration fins arranged on the connecting part, and the cold conduction piece is connected with the cold end of the semiconductor assembly through the connecting part; the connecting part and the refrigerating fins are all integrally made of ceramic materials. And the ceramic cold conduction piece is used, so that the influence of an aluminum piece in water on the water quality is avoided, and a healthy environment is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to an integrated ceramic refrigeration component and a refrigeration water tank. Background Technology

[0002] A thermoelectric cooler is a highly efficient cooling component. It typically integrates thermocouples and other devices onto an aluminum substrate, utilizing the thermoelectric effect to generate a temperature difference under the influence of current, achieving efficient cooling and heat dissipation for microelectronic devices. Aluminum substrate coolers can stably lower the device temperature, ensuring optimal operation and thus improving performance, reliability, and extending lifespan. In applications, the cold end of the thermoelectric cooler is connected to an aluminum heat-conducting plate to transfer cooling. This plate is typically inserted directly into a water tank. In applications such as water purifiers, the water in the tank is directly cooled to achieve a cooling effect. However, prolonged immersion of the aluminum heat-conducting plate in water increases the aluminum ion concentration over time and can also lead to scale buildup, negatively impacting the water environment and potentially affecting the health of drinkers. Utility Model Content

[0003] The purpose of this invention is to provide an integrated ceramic refrigeration component that uses ceramic heat-conducting elements, thus avoiding the impact on water quality caused by aluminum components and ensuring a healthy environment.

[0004] To achieve the above objectives, the present invention adopts the following solution:

[0005] An integrated ceramic refrigeration component includes a semiconductor component, a first base layer, and a cooling conductor. The first base layer is disposed on the hot end of the semiconductor component. The cooling conductor includes a connecting portion and a plurality of cooling fins disposed on the connecting portion. The cooling conductor is connected to the cold end of the semiconductor component through the connecting portion. The connecting portion and the cooling fins are both integrally made of ceramic material.

[0006] In the integrated ceramic refrigeration component described above, the first base layer is made of ceramic or aluminum material.

[0007] In the integrated ceramic cooling component described above, the first base layer is attached to the semiconductor component.

[0008] As described above, in an integrated ceramic refrigeration assembly, the refrigeration fins include multiple fins, one end of the connecting portion connected to the semiconductor assembly is flat, and the multiple refrigeration fins are disposed at the other end of the connecting portion and extend outward.

[0009] As described above, in an integrated ceramic refrigeration component, a single refrigeration fin is arranged vertically, and multiple refrigeration fins are arranged at equal intervals.

[0010] As described above, in an integrated ceramic refrigeration component, the two sides of the connecting portion are provided with outwardly extending connecting wings, and the connecting wings are provided with a docking structure.

[0011] In the integrated ceramic refrigeration assembly described above, the connecting portion protrudes from the connecting wings on both sides.

[0012] As described above, the integrated ceramic refrigeration component also has a vertically positioned positioning groove on the connecting side wing.

[0013] In the integrated ceramic refrigeration assembly described above, the semiconductor assembly is bonded and connected to the connecting portion.

[0014] This utility model also provides a cooling water tank, including a water tank, the aforementioned integrated ceramic cooling component of the water tank, the cooling fins of the cooling conductor extending into the water tank, and a heat dissipation component provided on the first base layer.

[0015] In summary, the advantages of this utility model over the prior art are:

[0016] This invention provides an integrated ceramic refrigeration component that changes the structure of the traditional semiconductor refrigeration chip with a double-sided base layer. It is equivalent to replacing the base layer of the cold end with a heat-conducting component, so that the cooling energy is directly transferred to the heat-conducting component, which helps to improve efficiency. Moreover, the heat-conducting component is made of ceramic material in one piece, and its refrigeration fins can be directly applied to water. While conducting cooling, it reduces the pollution of water quality caused by the use of metal materials, thereby reducing water pollution problems and ensuring a healthy environment. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of an integrated ceramic refrigeration component according to the present invention;

[0019] Figure 2 An exploded view of a ceramic refrigeration component;

[0020] Figure 3 This is a half-sectional view of a ceramic refrigeration component;

[0021] Figure 4 This is a schematic diagram of a water tank;

[0022] Figure 5 This is an exploded view of the water tank;

[0023] Figure 6 This is a schematic diagram of the internal structure of the water tank. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] like Figures 1 to 6 As shown, this utility model provides an integrated ceramic refrigeration component, including a semiconductor component 1, a first base layer 2, and a cooling conductor 3. The first base layer 2 is disposed on the hot end of the semiconductor component 1. The cooling conductor 3 includes a connecting portion 31 and a plurality of cooling fins 32 disposed on the connecting portion 31. The cooling conductor 3 is connected to the cold end of the semiconductor component 1 through the connecting portion 31. Both the connecting portion 31 and the cooling fins 32 are integrally made of ceramic material. This changes the structure of the traditional double-sided base layer of the semiconductor refrigeration chip, which is equivalent to replacing the base layer of the cold end with a cooling conductor, allowing the cooling energy to be directly transferred to the cooling conductor, which is beneficial to improving efficiency. Moreover, since the cooling conductor is integrally made of ceramic material, its cooling fins can be directly applied to water, reducing the pollution of water quality caused by the use of metal materials while conducting cooling, thereby reducing water pollution problems and ensuring a healthy environment.

[0026] In this invention, the first base layer 2 can be made of aluminum. The first base layer 2 made of aluminum has excellent thermal conductivity, which can quickly conduct heat from the circuit layer to the external environment, effectively preventing overheating of electronic components. Secondly, aluminum has a low density, making it lighter.

[0027] Of course, the first base layer 2 in this solution can also be made of ceramic material. Using a ceramic substrate can achieve the function of rapid heat dissipation of the cooling chip. The advantages of ceramic plates also retain the characteristics of the material, and unlike traditional PCBs that require an insulating dielectric as an insulating layer, ceramic itself is the insulating layer. It also has high frequency and low dielectric constant, and its manufacturing process is easier in terms of lightness, thinness, and miniaturization. Ceramic materials have advantages such as high thermal conductivity, good chemical stability, thermal stability, and high melting point.

[0028] In this scheme, the semiconductor component 1 includes a plurality of staggered P-type semiconductors and N-type semiconductors, and the copper foil, the first copper foil, and the second copper foil are arranged in a "bow" shape. One end of the P-type semiconductor is connected to one end of the copper foil, and the other end of the P-type semiconductor is connected to one end of the first copper foil or one end of the second copper foil. One end of the N-type semiconductor is connected to the other end of the copper foil, and the other end of the N-type semiconductor is connected to the other end of the first copper foil or the other end of the second copper foil. The copper foil and the first copper foil are connected through the P-type semiconductor and the N-type semiconductor, or the copper foil and the second copper foil are connected through the P-type semiconductor and the N-type semiconductor.

[0029] When one end of a P-type semiconductor is connected to a copper foil, and the other end of the P-type semiconductor is connected to one end of a first copper foil, the other end of the first copper foil is connected to an N-type semiconductor, and the other end of the N-type semiconductor is connected to one end of an adjacent copper foil, the charge carriers belong to different energy levels in different materials. The N-type semiconductor is larger than a metallic conductor, which is larger than a P-type semiconductor. When electrons move from a higher energy level to a lower energy level, excess heat is released; conversely, heat needs to be absorbed from the outside for cooling. When electricity is applied, electrons flow from the copper foil to the P-type semiconductor. The movement of electrons from a higher energy level to a lower energy level releases heat, meaning heat is released at one end of the copper foil. Electrons continue to move from the P-type semiconductor... Electrons flow from the semiconductor to one end of the first copper foil, moving from a low energy level to a high energy level. This means the end of the first copper foil connected to the P-type semiconductor absorbs heat, achieving a cooling effect. Electrons then flow from the first copper foil to the N-type semiconductor, moving from a low energy level to a high energy level. Again, this end absorbs heat, achieving a cooling effect. Finally, electrons flow from the N-type semiconductor to the adjacent copper foil, moving from a high energy level to a low energy level. This causes the copper foil to continue releasing heat, resulting in heat release on one side of the first copper foil assembly, which is then dissipated to the external environment through the first substrate, while the second copper foil assembly experiences cooling. Similarly, the connection principle between the copper foil and the second copper foil is the same as that between the copper foil and the first copper foil.

[0030] Preferably, in this solution, the first base layer 2 is attached to the semiconductor component 1. This connection method eliminates the need for additional mounting slots to fix the copper foil components, effectively solving the problem that, during substrate manufacturing, mounting slots are typically created on the base layer to fix the circuit layer. However, this method is particularly inconvenient and difficult to operate, especially when the substrate is small, as accurately creating mounting slots is challenging, leading to low production efficiency and low yield.

[0031] Specifically, in one of the optional embodiments of the utility model, the semiconductor component 1 and the first base layer 2 can be tightly bonded together by high temperature and pressure. Alternatively, the semiconductor component 1 and the first base layer 2 can be tightly bonded together by welding.

[0032] In addition, in this embodiment of the invention, the first base layer 2 can be a single-layer board, a double-layer board, or a multi-layer board. Furthermore, since it is made of aluminum substrate, an insulating layer can be added between the first base layer 2 and the semiconductor component.

[0033] In this embodiment of the invention, a ceramic cooling element is used, which directly serves as the base layer of the cold end of the semiconductor component 1 and also as a conductor of cold energy. Its simple structure greatly improves cooling efficiency. Specifically, the cooling fins 32 include multiple fins. The end of the connecting portion 31 connected to the semiconductor component 1 is planar, and the multiple cooling fins 32 are located at the other end of the connecting portion 31 and extend outwards. Furthermore, each cooling fin 32 is vertically arranged, and the multiple cooling fins 32 are arranged at equal intervals. This effectively integrates the traditional fins and base layer into one unit, and by using ceramic material, its insulation eliminates the need for an additional insulating layer, thus avoiding the pollution problem caused by the decomposition of metal ions from long-term immersion of the cooling fins 32 in water.

[0034] In this embodiment of the present invention, for ease of installation, connecting wings 33 extending outward are provided on both sides of the connecting portion 31, and the connecting wings 33 are provided with a mating structure 330. Preferably, the connecting wings 33 are also integrally formed with the connecting portion 31 using ceramic material, resulting in a simple overall structure and convenient installation and use. Of course, as described above, the semiconductor component 1 is bonded to the connecting portion 31. This also eliminates the need for additional mounting grooves for fixing the copper foil component, effectively solving the problem of low production efficiency and low yield caused by the usual practice of creating mounting grooves on the connecting portion to fix the circuit layer during the manufacturing process of cooling components.

[0035] In addition, for ease of installation, the connecting portion 31 protrudes from the connecting wings 33 on both sides. That is, the connecting portion 31 forms a raised positioning step to facilitate direct mating and connection with the semiconductor component.

[0036] Furthermore, in this embodiment of the invention, the connecting wing 33 is also provided with a vertically arranged positioning groove 331, which provides an additional alignment structure during installation, resulting in higher installation accuracy and greater convenience. Specifically, the mating structure 330 on the connecting wing 33 of this solution is a connecting hole, and the positioning groove 331 is arranged vertically and passes through multiple connecting holes.

[0037] This utility model also provides a cooling water tank, including a water tank 9, on which the integrated ceramic cooling component is provided. The cooling fins 32 of the cooling conductor 3 extend into the water tank 9, and a heat dissipation component 8 is provided on the first base layer 2. The water tank using this product can be used in water purifiers or in the condensation device of dehumidifiers.

[0038] like Figures 4 to 6As shown, this utility model provides an integrated ceramic refrigeration component, which changes the structure of the traditional semiconductor refrigeration chip with double-sided base layer. It is equivalent to replacing the base layer of the cold end with a heat-conducting component, so that the cold energy is directly transferred to the heat-conducting component, which is conducive to improving efficiency. Moreover, the heat-conducting component is made of ceramic material in one piece, and its refrigeration fins can be directly applied to water. While conducting cold, it reduces the pollution of water quality caused by the use of metal materials, thereby reducing water pollution problems and ensuring a healthy environment.

[0039] The foregoing has shown and described the basic principles and main features of this utility model, as well as its advantages. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An integrated ceramic refrigeration assembly, characterized by, The device includes a semiconductor component (1), a first base layer (2), and a cooling element (3). The first base layer (2) is disposed on the hot end of the semiconductor component (1). The cooling element (3) includes a connecting part (31) and a plurality of cooling fins (32) disposed on the connecting part (31). The cooling element (3) is connected to the cold end of the semiconductor component (1) through the connecting part (31). The connecting part (31) and the cooling fins (32) are both integrally made of ceramic material.

2. An integrated ceramic refrigeration assembly according to claim 1, wherein, The first base layer (2) is made of ceramic or aluminum.

3. An integrated ceramic refrigeration assembly according to claim 2, wherein, The first substrate (2) is attached to the semiconductor component (1).

4. An integrated ceramic refrigeration assembly according to claim 3, wherein, The cooling fins (32) include multiple fins. One end of the connecting part (31) connected to the semiconductor component (1) is a plane, and the multiple cooling fins (32) are disposed at the other end of the connecting part (31) and extend outward.

5. An integrated ceramic refrigeration assembly according to claim 4, wherein, The cooling fins (32) described in a single piece are arranged vertically, and the cooling fins (32) described in multiple pieces are arranged at equal intervals.

6. A unitary ceramic refrigeration assembly according to claim 4 or 5, wherein, The connecting part (31) is also provided with outwardly extending connecting wings (33) on both sides, and the connecting wings (33) are provided with docking structures (330).

7. An integrated ceramic refrigeration assembly according to claim 6, wherein, The connecting part (31) protrudes from the connecting wings (33) on both sides.

8. An integrated ceramic refrigeration assembly according to claim 7, wherein, The connecting wing (33) is also provided with a vertically arranged positioning groove (331).

9. The integrated ceramic refrigeration component according to claim 8, characterized in that, The semiconductor component (1) is attached to the connecting part (31).

10. A chilled water tank, characterized by, Includes a water tank (9), on which is provided an integrated ceramic refrigeration component as described in any one of claims 1-9, wherein the refrigeration fins (32) of the cooling conductor (3) extend into the water tank (9), and a heat dissipation component (8) is provided on the first base layer (2).

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