Self-alignment power semiconductor chip test fixture

Abstract

The utility model discloses a self-alignment power semiconductor chip test fixture, which comprises a base and a supporting arm, the supporting arm is mounted at the top end of the base, a chip tester is mounted on the outer wall of the supporting arm, a sliding seat is arranged at the top end of the base on one side of the supporting arm, a connecting table is mounted at the top end of the sliding seat, and a clamping groove is formed in the top end of the connecting table. A rotating table is arranged at the top end of the connecting table, a first connecting arm is installed at the top end of the rotating table, a first motor is installed at the top end of the first connecting arm, and a first chuck is installed at the output end of the first motor. According to the utility model, convenient centering clamping and fixing of the power semiconductor chips are realized, overturning adjustment is facilitated to test multiple groups of power semiconductor chips, rotary multi-position testing of the power semiconductor chips is facilitated, transverse movement, adjustment and replacement of the test chips are facilitated, and the test efficiency is improved. And the test efficiency of the test fixture is improved.

Description

Technical Field

[0001] This utility model relates to the field of test fixture technology, specifically a self-aligned power semiconductor chip test fixture. Background Technology

[0002] Power semiconductors are the core of power conversion and circuit control in electronic devices, and are widely used in various industries such as new energy vehicles, industrial control, and rail transportation. By regulating current and voltage, they realize the form conversion and transmission distribution of electrical energy in the system. They mainly play the roles of power conversion, power amplification, power switching, line protection, inversion (DC to AC) and rectification (AC to DC). Power semiconductor devices or modules are the heart of motor controllers, used to convert the DC power output from the power battery into the three-phase AC power required to drive the motor. In motor controllers, power semiconductor devices or modules account for about 37% of the total cost and are one of the core components.

[0003] For example, the self-aligned power semiconductor chip test fixture disclosed in the authorization announcement number CN206208930U mainly solves the problems of cumbersome testing operations, low efficiency, easy deviation of chip test data, and scratches and damage to the chip appearance. The upper fixture is composed of a cathode plate, a positioning spring, a guide sleeve, a cathode pressure block, a cathode sampling probe, and a center gate sampling probe. The upper ends of the positioning spring and the cathode pressure block are fixed on the cathode plate, and the lower ends are located in the guide sleeve and fixedly connected to the guide sleeve. The cathode sampling probe and the center gate sampling probe are installed on the cathode pressure block. The lower fixture is composed of a chip support plate and an anode sampling probe. The chip support plate and the guide sleeve are provided with matching chip positioning grooves and positioning bosses.

[0004] While it achieves the advantages of convenient chip alignment and replacement, low additional voltage drop, simple testing operation, and high efficiency, it does not solve the problems that existing test fixtures are not conducive to convenient centering and clamping of power semiconductor chips, not conducive to flip-type adjustment testing, not conducive to rotating multi-position testing of power semiconductor chips, and not conducive to lateral movement adjustment and replacement of test chips, which greatly affects the testing efficiency of the test fixture. Utility Model Content

[0005] The purpose of this utility model is to provide a self-aligned power semiconductor chip test fixture to solve the problems mentioned in the background art, such as the inconvenience of convenient centering and clamping of power semiconductor chips, the inconvenience of flip-type adjustment testing, the inconvenience of rotating multi-position testing of power semiconductor chips, and the inconvenience of lateral movement to adjust and replace test chips, which affect the efficiency of the test fixture.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a self-aligned power semiconductor chip test fixture, comprising a base and a support arm. The support arm is mounted on the top of the base, and a chip tester is mounted on the outer wall of the support arm. A sliding seat is provided on the top of the base on one side of the support arm. A connecting platform is mounted on the top of the sliding seat. A rotating platform is provided on the top of the connecting platform. A first connecting arm is mounted on the top of the rotating platform. A first motor is mounted on the top of the first connecting arm. A first chuck is mounted on the output end of the first motor. A second connecting arm is mounted on the top of the rotating platform on one side of the first connecting arm. A connecting shaft is mounted on the top of the second connecting arm. A second chuck is mounted on the outer wall of the connecting shaft. A flipping platform is installed between the first chuck and the second chuck. Multiple sets of clamping frames with equal spacing are mounted on the top of the flipping platform. Three sets of first electric push rods with equal spacing are mounted on the outer wall of each clamping frame.

[0007] Preferably, the output end of the first electric push rod is equipped with a telescopic rod, and the telescopic rod extends into the interior of the clamping frame. The end of the telescopic rod away from the first electric push rod is equipped with a connecting sleeve, and the interior of the connecting sleeve is equipped with a support roller.

[0008] Preferably, a support plate is movably mounted on the top of the connecting platform, a driven wheel is fitted on the top of the support plate, a connecting frame is mounted on the top of the driven wheel, and the connecting frame is connected to the rotating platform.

[0009] Preferably, a second motor is installed at the top of the base below the sliding seat, and a threaded rod is provided at the top of the base on one side of the second motor, and the output end of the second motor is connected to the threaded rod.

[0010] Preferably, a threaded block is mounted on the surface of the threaded rod, and the threaded rod is threadedly connected to the threaded block, and the threaded block is fixedly connected to the sliding seat.

[0011] Preferably, slide rails are symmetrically installed on the top of the base on one side of the second motor, and sliding sleeves are symmetrically installed on the bottom of the sliding seats above the slide rails, and the slide rails are slidably connected to the sliding sleeves.

[0012] Preferably, a third motor is installed at the bottom of the connecting platform and extends to the top of the connecting platform. A drive wheel is installed at the output end of the third motor on one side of the support plate. A synchronous belt is fitted on the surface of the drive wheel and extends to the surface of the driven wheel.

[0013] Preferably, a control panel is installed on the outer wall of the base, and the output terminal of the control panel is electrically connected to the input terminals of the chip tester, the first electric push rod, the first motor, the second motor, and the third motor.

[0014] Compared with the prior art, the beneficial effects of this utility model are: the test fixture not only realizes convenient centering clamping and fixing of power semiconductor chips, facilitates flip-type adjustment for testing multiple groups of power semiconductor chips, facilitates rotational multi-position testing of power semiconductor chips, but also facilitates lateral movement adjustment and replacement of test chips, thus improving the efficiency of the test fixture test.

[0015] (1) The telescopic rod is driven to move by the first electric push rod, the connecting sleeve is driven to move by the telescopic rod, and the support roller is driven to move by the connecting sleeve. The three sets of support rollers clamp and fix the power semiconductor chip in a centered manner. The chip tester tests the power semiconductor chip. The first motor drives the first chuck to rotate, and the first chuck and the second chuck drive the flip table to flip, so that the flip table can drive multiple sets of clamping frames to flip, so that the clamping frames can drive the power semiconductor chip to perform flip-type adjustment test. This realizes the convenient centered clamping and fixing of the power semiconductor chip by the test fixture, facilitates the flip-type adjustment test of multiple sets of power semiconductor chips, and improves the convenience of the test fixture test.

[0016] (2) The third motor drives the drive wheel to rotate, and the drive wheel drives the synchronous belt to move. Under the support of the support plate, the synchronous belt drives the driven wheel to rotate, the driven wheel drives the connecting frame to rotate, the connecting frame drives the rotating table to rotate, the rotating table drives the flipping table to rotate, and the flipping table drives the clamping frame to rotate, so as to facilitate the clamping frame to carry the power semiconductor chip for circumferential rotation test. After the test is completed, the second motor drives the threaded rod to rotate, the threaded block moves on the surface of the threaded rod, the threaded block drives the sliding seat to move laterally, the sliding seat drives the connecting table to move laterally, the connecting table drives the rotating table to move laterally, the rotating table drives the flipping table to move laterally, and the flipping table drives the clamping frame to move laterally, so as to facilitate the clamping frame to be removed from the bottom of the chip tester, so as to facilitate the replacement of the next set of power semiconductor chips for testing. This realizes the convenient circumferential rotation test of the test fixture, facilitates multi-position testing of power semiconductor chips, facilitates lateral movement adjustment and replacement of test chips, and improves the efficiency of the test fixture test. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a three-dimensional structural diagram of the rotating platform of this utility model;

[0019] Figure 3 This is a front view structural diagram of the present utility model;

[0020] Figure 4 This is a schematic diagram of the rear cross-sectional structure of the base of this utility model;

[0021] Figure 5 For the present utility model Figure 4 Enlarged structural diagram at point A in the middle;

[0022] Figure 6 This is a three-dimensional magnified structural diagram of the clamping frame of this utility model;

[0023] Figure 7 This is a three-dimensional magnified structural diagram of the connecting platform of this utility model.

[0024] In the diagram: 1. Base; 2. Support arm; 3. Chip tester; 4. Sliding seat; 5. Connecting platform; 6. Support plate; 7. Rotating table; 8. Tilting table; 9. Clamping frame; 10. First connecting arm; 11. Second connecting arm; 12. First electric push rod; 13. Telescopic rod; 14. Connecting sleeve; 15. Support roller; 16. First motor; 17. First chuck; 18. Connecting shaft; 19. Second chuck; 20. Second motor; 21. Threaded rod; 22. Threaded block; 23. Third motor; 24. Driving wheel; 25. Driven wheel; 26. Connecting frame; 27. Synchronous belt; 28. Slide rail; 29. ​​Sliding sleeve; 30. Control panel. Detailed Implementation

[0025] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0026] Please see Figure 1-7This utility model provides an embodiment of a self-aligned power semiconductor chip test fixture, comprising a base 1 and a support arm 2. The support arm 2 is mounted on the top of the base 1, and a chip tester 3 is mounted on the outer wall of the support arm 2. A sliding seat 4 is provided on the top of the base 1 on one side of the support arm 2. A connecting platform 5 is mounted on the top of the sliding seat 4. A rotating platform 7 is provided on the top of the connecting platform 5. A first connecting arm 10 is mounted on the top of the rotating platform 7. A first motor 16 is mounted on the top of the first connecting arm 10, which provides power output. A first chuck 17 is mounted on the output end of the first motor 16. A second connecting arm 11 is mounted on the top of the rotating platform 7 on one side of the first connecting arm 10. A connecting shaft 18 is installed at the top of the connecting arm 11. A second chuck 19 is installed on the outer wall of the connecting shaft 18. The second chuck 19 is movably connected to the connecting shaft 18. A tilting table 8 is installed between the first chuck 17 and the second chuck 19. Multiple sets of clamping frames 9 with equal spacing are installed at the top of the tilting table 8. Three sets of first electric push rods 12 with equal spacing are installed on the outer wall of each clamping frame 9. The first electric push rods 12 serve as power output. A telescopic rod 13 is installed at the output end of each first electric push rod 12. The telescopic rods 13 extend into the interior of the clamping frame 9. A connecting sleeve 14 is installed at the end of the telescopic rod 13 away from the first electric push rod 12. A support roller 15 is installed inside the connecting sleeve 14.

[0027] In use, multiple sets of power semiconductor chips are placed inside multiple sets of clamping frames 9. The first electric push rod 12 is activated via the control panel 30. Supported by the clamping frames 9, the first electric push rod 12 drives the telescopic rod 13 to move. The telescopic rod 13 moves the connecting sleeve 14, which in turn moves the support rollers 15. The three sets of support rollers 15 clamp and fix the power semiconductor chips in a centered manner. The chip tester 3 is activated via the control panel 30 to test the power semiconductor chips. The first motor 16 is activated via the control panel 30, and the first connecting arm 1... With the support of 0, the first motor 16 drives the first chuck 17 to rotate. With the support of the second connecting arm 11, and with the cooperation of the connecting shaft 18 and the second chuck 19, the first chuck 17 and the second chuck 19 drive the flip table 8 to flip, so that the flip table 8 can drive multiple sets of clamping frames 9 to flip, so that the clamping frames 9 can drive the power semiconductor chip to flip and adjust to test the power semiconductor chip on the other side. This realizes the convenient centering clamping and fixing of the power semiconductor chip by the test fixture, facilitates the flip adjustment to test multiple sets of power semiconductor chips, and improves the convenience of the test fixture.

[0028] A support plate 6 is movably mounted on the top of the connecting platform 5. A driven wheel 25 is fitted on the top of the support plate 6. A connecting frame 26 is mounted on the top of the driven wheel 25 and is connected to the rotating platform 7. A second motor 20 is mounted on the top of the base 1 below the sliding seat 4. The second motor 20 provides power output. A threaded rod 21 is provided on the top of the base 1 on one side of the second motor 20, and the output end of the second motor 20 is connected to the threaded rod 21. A threaded block 22 is mounted on the surface of the threaded rod 21, and the threaded rod 21 and the threaded block 22 are threadedly connected. The threaded block 22 is fixedly connected to the sliding seat 4. Slide rails 28 are symmetrically mounted on the top of the base 1 on one side of the second motor 20. Sliding sleeves 29 are symmetrically installed at the bottom of the sliding seats 4 above the rail 28, and the rail 28 is slidably connected to the sliding sleeves 29. A third motor 23 is installed at the bottom of the connecting platform 5. The third motor 23 plays the role of power output, and the third motor 23 extends to the top of the connecting platform 5. A drive wheel 24 is installed at the output end of the third motor 23 on one side of the support plate 6. A synchronous belt 27 is fitted on the surface of the drive wheel 24, and the synchronous belt 27 extends to the surface of the driven wheel 25. A control panel 30 is installed on the outer wall of the base 1. The output end of the control panel 30 is electrically connected to the input end of the chip tester 3, the first electric push rod 12, the first motor 16, the second motor 20, and the third motor 23.

[0029] In use, the third motor 23 is activated via the control panel 30. Supported by the connecting platform 5, the third motor 23 drives the drive wheel 24 to rotate, which in turn drives the synchronous belt 27 to move. Supported by the movable support plate 6, the synchronous belt 27 drives the driven wheel 25 to rotate, which in turn drives the connecting frame 26 to rotate. The connecting frame 26 then drives the rotating table 7 to rotate, which in turn drives the tilting table 8 to rotate. The tilting table 8 then drives the clamping frame 9 to rotate, facilitating the clamping frame 9 to perform circumferential rotation testing of the power semiconductor chip. After the test is completed, the second motor 20 is activated via the control panel 30. Supported by the base 1, the second motor 20 drives the threaded rod 21 to rotate. Under the threaded support of threaded block 21 and threaded block 22, threaded block 22 moves on the surface of threaded rod 21. Under the sliding support of sliding sleeve 29 and slide rail 28, threaded block 22 drives sliding seat 4 to move laterally, sliding seat 4 drives connecting platform 5 to move laterally, connecting platform 5 drives rotating platform 7 to move laterally, rotating platform 7 drives flipping platform 8 to move laterally, and flipping platform 8 drives clamping frame 9 to move laterally. This facilitates the removal of clamping frame 9 from the bottom of chip tester 3, making it easier to replace the next set of power semiconductor chips for testing. This realizes convenient circumferential rotation testing of the test fixture, facilitates multi-position testing of power semiconductor chips, facilitates lateral movement adjustment and replacement of test chips, and improves the testing efficiency of the test fixture.

[0030] Working principle: In use, with an external power supply, multiple sets of power semiconductor chips are first placed inside multiple sets of clamping frames 9. The first electric push rod 12 drives the telescopic rod 13 to move, which in turn drives the connecting sleeve 14 to move. The connecting sleeve 14 then drives the support rollers 15 to move. The three sets of support rollers 15 clamp and fix the power semiconductor chips in a centered manner. The chip tester 3 tests the power semiconductor chips. The first motor 16 drives the first chuck 17 to rotate, which in turn drives the tilting table 8 to rotate, facilitating the tilting table 8 to rotate the multiple sets of clamping frames 9. The third motor 23 drives the drive wheel 24 to rotate, which in turn drives the synchronous belt 27 to move. The synchronous belt 27 then drives the driven wheel 25 to rotate. Driven wheel 25 drives connecting frame 26 to rotate, connecting frame 26 drives rotating table 7 to rotate, rotating table 7 drives flipping table 8 to rotate, flipping table 8 drives clamping frame 9 to rotate, so as to facilitate clamping frame 9 to carry power semiconductor chip for circumferential rotation test. Second motor 20 drives threaded rod 21 to rotate, threaded block 22 moves on the surface of threaded rod 21, threaded block 22 drives sliding seat 4 to move laterally, sliding seat 4 drives connecting table 5 to move laterally, connecting table 5 drives rotating table 7 to move laterally, rotating table 7 drives flipping table 8 to move laterally, flipping table 8 drives clamping frame 9 to move laterally, so as to facilitate clamping frame 9 to be removed from the bottom of chip tester 3, so as to facilitate the replacement of the next set of power semiconductor chips for testing, thus completing the use of test fixture.

[0031] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A self-aligning power semiconductor chip test fixture comprising a base (1) and a support arm (2), characterized in that: A support arm (2) is installed at the top of the base (1). A chip tester (3) is installed on the outer wall of the support arm (2). A sliding seat (4) is provided at the top of the base (1) on one side of the support arm (2). A connecting platform (5) is installed at the top of the sliding seat (4). A rotating platform (7) is provided at the top of the connecting platform (5). A first connecting arm (10) is installed at the top of the rotating platform (7). A first motor (16) is installed at the top of the first connecting arm (10). A second connecting arm (16) is installed at the output end of the first motor (16). A chuck (17) is provided. A second connecting arm (11) is installed on the top of a rotating platform (7) on one side of the first connecting arm (10). A connecting shaft (18) is installed on the top of the second connecting arm (11). A second chuck (19) is installed on the outer wall of the connecting shaft (18). A flipping platform (8) is installed between the first chuck (17) and the second chuck (19). A multi-set clamping frame (9) with equal spacing is installed on the top of the flipping platform (8). Three sets of first electric push rods (12) with equal spacing are installed on the outer wall of each clamping frame (9).

2. A self-aligned power semiconductor chip test fixture according to claim 1, wherein: The output end of the first electric push rod (12) is equipped with a telescopic rod (13), and the telescopic rod (13) extends into the interior of the clamping frame (9). The end of the telescopic rod (13) away from the first electric push rod (12) is equipped with a connecting sleeve (14), and the interior of the connecting sleeve (14) is equipped with a support roller (15).

3. A self-aligned power semiconductor chip test fixture as claimed in claim 1, wherein: A support plate (6) is movably mounted on the top of the connecting platform (5). A driven wheel (25) is fitted on the top of the support plate (6). A connecting frame (26) is mounted on the top of the driven wheel (25), and the connecting frame (26) is connected to the rotating platform (7).

4. The self-aligned power semiconductor chip test fixture of claim 1, wherein: A second motor (20) is installed on the top of the base (1) below the sliding seat (4). A threaded rod (21) is provided on the top of the base (1) on one side of the second motor (20), and the output end of the second motor (20) is connected to the threaded rod (21).

5. A self-aligned power semiconductor chip test fixture according to claim 4, characterized in that: The threaded rod (21) has a threaded block (22) installed on its surface, and the threaded rod (21) is threadedly connected to the threaded block (22), and the threaded block (22) is fixedly connected to the sliding seat (4).

6. A self-aligned power semiconductor chip test fixture as claimed in claim 4, wherein: The second motor (20) has a slide rail (28) symmetrically installed on the top of the base (1) on one side. The slide seat (4) above the slide rail (28) is symmetrically installed with a slide sleeve (29) at the bottom. The slide rail (28) is slidably connected to the slide sleeve (29).

7. The self-aligned power semiconductor chip test fixture of claim 3, wherein: The bottom end of the connecting platform (5) is equipped with a third motor (23), and the third motor (23) extends to the top of the connecting platform (5). The output end of the third motor (23) on one side of the support plate (6) is equipped with a drive wheel (24). The surface of the drive wheel (24) is fitted with a synchronous belt (27), and the synchronous belt (27) extends to the surface of the driven wheel (25).

8. A self-aligned power semiconductor chip test fixture according to claim 7, wherein: The outer wall of the base (1) is provided with a control panel (30), and the output end of the control panel (30) is electrically connected with the input end of the chip tester (3), the first electric push rod (12), the first motor (16), the second motor (20) and the third motor (23).

Images