Integrated circuit testing device with adjustable spacing
By designing an integrated circuit testing device with adjustable spacing, the adaptability problem of testing devices caused by differences in package size in existing technologies has been solved, achieving efficient and low-cost integrated circuit testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHINESE AERONAUTICAL RADIO ELECTRONICS RES INST
- Filing Date
- 2025-03-21
- Publication Date
- 2026-04-17
AI Technical Summary
Existing integrated circuit testing equipment requires customized non-standard testing equipment for components with different package sizes, resulting in long cycle times, high costs, and difficulty in adapting to small-batch, multi-variety production.
An integrated circuit testing device with adjustable spacing was designed. By setting metal pins and pressure strips on the lower and upper cover plates, combined with a telescopic structure, a reliable connection and spacing adjustment of integrated circuit pins can be achieved, adapting to the testing needs of different models and sizes.
It achieves a stable connection between integrated circuits and testing equipment, improves testing efficiency and versatility, reduces design and manufacturing costs, and is adaptable to the testing of different types of integrated circuits.
Smart Images
Figure CN224137404U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of integrated circuit testing technology, specifically to an integrated circuit testing device with adjustable spacing. Background Technology
[0002] Integrated circuit testing is a necessary means to control and determine its quality and reliability. When testing integrated circuits, it is necessary to connect the integrated circuits to the testing equipment through a testing device to realize the testing of integrated circuits.
[0003] With the development of semiconductor packaging technology, the types of integrated circuit package sizes are constantly increasing. For integrated circuits with standard package sizes, standard testing fixtures can be used for testing. However, for components whose package sizes differ from standard packages, custom-made non-standard testing equipment is often required. The disadvantage is that the package dimensions in all dimensions must perfectly match the integrated circuit under test. If there is even a slight change in the integrated circuit package size, the testing equipment cannot be used. Furthermore, the customization cycle for dedicated component testing fixtures is long and expensive, especially in small-batch, multi-variety production models, which brings significant management and time costs. Utility Model Content
[0004] The purpose of this invention is to provide an integrated circuit testing device with adjustable spacing to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: an integrated circuit testing device with adjustable spacing, comprising a lower cover plate body and an upper cover plate body disposed above the lower cover plate body.
[0006] The lower cover plate body includes a first lower cover plate, a second lower cover plate, a first telescopic insert, and metal pins. The first telescopic insert is fixed to the second lower cover plate and inserted into the first lower cover plate. Connecting grooves and protrusions are respectively provided on the opposite sides of the first and second lower cover plates. Metal pins are provided on the top of both the first and second lower cover plates. By inserting the first telescopic insert into the first lower cover plate, the first and second lower cover plates can be extended and retracted, thereby adjusting the spacing between the metal pins on the first and second lower cover plates. The metal pins are used for mating with the pins of integrated circuits.
[0007] The main body of the upper cover plate includes a first upper cover plate, a second upper cover plate, a second telescopic insert, and pressure strips. The second telescopic insert is fixed to the second upper cover plate and inserted into the first upper cover plate. A pivot and a cover plate locking assembly are respectively provided on opposite sides of the first and second upper cover plates. The pivot is hinged in a connecting groove. Pressure strips are provided below both the first and second upper cover plates. The pressure strips are used to press the pins of the integrated circuit onto the metal pins. The insertion of the second telescopic insert into the first upper cover plate allows for telescopic movement between the first and second upper cover plates, adjusting the length of the main body of the upper cover plate and changing the distance between the pressure strips on the first and second upper cover plates to accommodate the metal pins.
[0008] As a preferred embodiment of this utility model, both the first upper cover plate and the first lower cover plate are provided with locking bolts. The locking bolts abut against the second telescopic insert to fix the first upper cover plate and the second upper cover plate, thereby fixing the length of the upper cover plate body by means of the locking bolts.
[0009] In a preferred embodiment of this invention, the cover plate locking assembly includes a buckle plate and a spring. The buckle plate is connected to the second upper cover plate via the spring, and the buckle plate is engaged with the protrusion to fix the upper cover plate body and the lower cover plate body together. This achieves the goal of fixing the upper cover plate body and the lower cover plate body together. By removing the buckle plate from the protrusion, the upper cover plate body can be flipped open.
[0010] As a preferred embodiment of this utility model, the metal pins on the first lower cover plate and the metal pins on the second lower cover plate correspond to the pressure strips on the first upper cover plate and the second upper cover plate, respectively, so that the pressure strips on the first upper cover plate and the second upper cover plate can press the integrated circuit components placed on the metal pins on the first lower cover plate and the second lower cover plate.
[0011] As a preferred embodiment of this invention, the metal pin is provided with a wire, which is used to lead out and connect to the test equipment.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] This invention ensures a reliable connection between integrated circuit pins and metal pins by setting metal pins and pressure strips on the lower cover plate body and the upper cover plate body respectively, which can meet the connection of integrated circuit leads to external test equipment and realize the effective transmission of electrical signals.
[0014] The telescopic structure of the upper and lower cover plates ensures the structural stability of this universal testing device. Furthermore, the spacing can be adjusted according to the actual size of the integrated circuit during testing, meeting the testing requirements of integrated circuits of different sizes and models. Its high versatility and high testing efficiency effectively reduce design and manufacturing costs, achieve accurate and efficient testing, and facilitate widespread application. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0016] In the diagram: 1. Lower cover plate body; 101. First lower cover plate; 1011. Connecting groove; 102. Second lower cover plate; 1021. Protrusion; 103. First telescopic insert; 104. Metal pin; 1041. Wire; 2. Upper cover plate body; 201. First upper cover plate; 2011. Rotating shaft; 202. Second upper cover plate; 203. Second telescopic insert; 204. Pressure strip; 3. Locking bolt; 4. Cover plate locking assembly; 401. Buckle plate; 402. Spring. Detailed Implementation
[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0018] In the description of this utility model, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0019] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0020] Please see Figure 1 This utility model provides a technical solution: an integrated circuit testing device with adjustable spacing, including a lower cover plate body 1 and an upper cover plate body 2 disposed above the lower cover plate body 1.
[0021] Furthermore, the lower cover plate body 1 includes a first lower cover plate 101, a second lower cover plate 102, a first telescopic insert 103, and metal pins 104. The first telescopic insert 103 is fixed to the second lower cover plate 102 and inserted into the first lower cover plate 101. Connecting grooves 1011 and protrusions 1021 are respectively provided on the opposite sides of the first lower cover plate 101 and the second lower cover plate 102. Metal pins 104 are provided on the top of both the first lower cover plate 101 and the second lower cover plate 102. By inserting the first telescopic insert 103 into the first lower cover plate 101, the first lower cover plate 101 and the second lower cover plate 102 can be telescopically extended, thereby adjusting the spacing between the metal pins 104 on the first lower cover plate 101 and the second lower cover plate 102. The metal pins 104 are used for mating with the pins of integrated circuits.
[0022] Furthermore, the upper cover plate body 2 includes a first upper cover plate 201, a second upper cover plate 202, a second telescopic insert 203, and a pressure strip 204. The second telescopic insert 203 is fixed on the second upper cover plate 202 and inserted into the first upper cover plate 201. The opposite sides of the first upper cover plate 201 and the second upper cover plate 202 are respectively provided with a rotating shaft 2011 and a cover plate locking assembly 4. The rotating shaft 2011 is hinged in the connecting groove 1011. Pressure strips 204 are provided below the first upper cover plate 201 and the second upper cover plate 202. The pressure strip 204 is used to press the pins of the integrated circuit onto the metal pin 104, and the second telescopic plug 203 is inserted into the first upper cover plate 201, which can realize the telescopic movement between the first upper cover plate 201 and the second upper cover plate 202, adjust the length of the upper cover plate body 2, and change the distance between the pressure strips 204 on the first upper cover plate 201 and the second upper cover plate 202 to match the metal pin 104.
[0023] Furthermore, the first upper cover plate 201 and the first lower cover plate 101 are provided with locking bolts 3. The locking bolts 3 abut against the second telescopic insert 203 to fix the first upper cover plate 201 and the second upper cover plate 202, thereby fixing the length of the upper cover plate body 2 by means of the locking bolts 3. The locking bolts 3 in the first lower cover plate 101 are not shown in the figure.
[0024] Furthermore, the cover plate locking assembly 4 includes a buckle plate 401 and a spring 402. The buckle plate 401 is connected to the second upper cover plate 202 via the spring 402. The buckle plate 401 is engaged with the protrusion 1021 to fix the upper cover plate body 2 and the lower cover plate body 1 together. This achieves the goal of fixing the upper cover plate body 2 and the lower cover plate body 1 together. By removing the buckle plate 401 from the protrusion 1021, the upper cover plate body 2 can be flipped open.
[0025] Furthermore, the metal pins 104 on the first lower cover plate 101 and the metal pins 104 on the second lower cover plate 102 correspond to the pressure strips 204 on the first upper cover plate 201 and the pressure strips 204 on the second upper cover plate 202, respectively, so that the pressure strips 204 on the first upper cover plate 201 and the second upper cover plate 202 can press the integrated circuit components placed on the metal pins 104 on the first lower cover plate 101 and the second lower cover plate 102.
[0026] Furthermore, a wire 1041 is provided on the metal pin 104, and the wire 1041 is used to lead out and connect to the test equipment.
[0027] In summary, when performing integrated circuit testing, this device first measures the size of the integrated circuit. Based on the measurement results, it adjusts the lengths of the upper cover plate 2 and the lower cover plate 1. Specifically, it pulls the first lower cover plate 101, causing the first telescopic member to extend and retract within the second lower cover plate 102, thereby adjusting the spacing between the metal pins 104 on the first lower cover plate 101 and the second lower cover plate 102. This increases the spacing of the integrated circuit pin placement area until it matches the size of the integrated circuit. Then, it pulls the first upper cover plate 201, causing the second telescopic member to extend and retract within the second upper cover plate 202, changing the spacing of the pressure strips 204 to correspond with the metal pins 104. After adjustment, it tightens the locking bolts 3 to achieve matching between the testing device and the integrated circuit size.
[0028] When the integrated circuit is installed on the test device, the buckle plate 401 is removed from the protrusion 1021 by the action of the spring 402. Then the upper cover plate body 2 is opened, the device pins are connected to the metal pins 104, the upper cover plate body 2 is pressed, and the upper cover plate body 2 and the lower cover plate body 1 are fastened by the buckle plate 401. Under the pressure of the pressure strip 204, the device pins maintain a reliable connection with the metal pins 104 and are led out to the test equipment through the wire 1041.
[0029] It is worth noting that the entire device is controlled by a master control button. Since the device matched with the control button is a common device and belongs to existing mature technology, its electrical connection relationship and specific circuit structure will not be described in detail here.
[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A pitch adjustable integrated circuit testing apparatus characterized by comprising: It includes a lower cover plate body (1) and an upper cover plate body (2) disposed above the lower cover plate body (1); The lower cover body (1) includes a first lower cover (101), a second lower cover (102), a first telescopic plug (103), and metal pins (104). The first telescopic plug (103) is fixed on the second lower cover (102) and inserted into the first lower cover (101). The opposite sides of the first lower cover (101) and the second lower cover (102) are respectively provided with a connecting groove (1011) and a protrusion (1021). Metal pins (104) are provided on the top of both the first lower cover (101) and the second lower cover (102). The main body (2) of the upper cover plate includes a first upper cover plate (201), a second upper cover plate (202), a second telescopic insert (203) and a pressure strip (204). The second telescopic insert (203) is fixed on the second upper cover plate (202) and inserted into the first upper cover plate (201). The opposite sides of the first upper cover plate (201) and the second upper cover plate (202) are respectively provided with a rotating shaft (2011) and a cover plate locking assembly (4). The rotating shaft (2011) is hinged in the connecting groove (1011). Pressure strips (204) are provided below the first upper cover plate (201) and the second upper cover plate (202).
2. The pitch adjustable integrated circuit testing device according to claim 1, wherein: Locking bolts (3) are provided on both the first upper cover plate (201) and the first lower cover plate (101). The locking bolts (3) abut against the second telescopic insert (203) to fix the first upper cover plate (201) and the second upper cover plate (202).
3. The pitch adjustable integrated circuit testing device according to claim 1, wherein: The cover plate locking assembly (4) includes a buckle plate (401) and a spring (402). The buckle plate (401) is connected to the second upper cover plate (202) through the spring (402). The buckle plate (401) is engaged on the protrusion (1021) to fix the upper cover plate body (2) and the lower cover plate body (1).
4. The pitch adjustable integrated circuit testing device according to claim 1, wherein: The metal pins (104) on the first lower cover plate (101) and the metal pins (104) on the second lower cover plate (102) correspond to the pressure strips (204) on the first upper cover plate (201) and the pressure strips (204) on the second upper cover plate (202), respectively.
5. The pitch adjustable integrated circuit testing device according to claim 1, wherein: A wire (1041) is provided on the metal pin (104).