Distance measuring sensor and electronic equipment

Abstract

The utility model discloses a distance measuring sensor and electronic equipment, and belongs to the technical field of sensors. The distance measuring sensor comprises a light sensing part, the light sensing part is provided with a first side and a second side which are oppositely arranged, and the first side of the light sensing part is provided with a groove; the light emitting part is embedded in the groove; the conductive column is arranged on the second side of the light sensing part, the light sensing part and the light emitting part are both electrically connected with the conductive column, and the conductive column is used for electrically connecting the distance measuring sensor to an external circuit.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, specifically to a ranging sensor and electronic device. Background Technology

[0002] Distance sensors include, but are not limited to, optical distance sensors. An optical distance sensor is a device that uses optical principles to measure the distance between itself and a target object.

[0003] In related technologies, optical distance sensors include a circuit board and a light-emitting element and a photosensitive element connected to the same side of the circuit board. Light emitted by the light-emitting element is reflected back to the photosensitive element after encountering a target object, thereby determining the distance to the target object. To avoid light interference, a light-blocking shield needs to be placed between the light-emitting element and the photosensitive element.

[0004] However, the above configuration results in a large size for the optical distance sensor, which occupies a large space within the electronic device, hindering the miniaturization of the electronic device. Utility Model Content

[0005] This utility model discloses a ranging sensor and electronic device to solve, or at least partially solve, the problem in the prior art that the ranging sensor is large in size and occupies a large space in the electronic device, which is not conducive to the miniaturization of the electronic device.

[0006] To solve the above-mentioned technical problems, this utility model is implemented as follows:

[0007] In a first aspect, this utility model discloses a ranging sensor, which includes a photosensitive element having a first side and a second side disposed opposite to each other, and a groove provided on the first side of the photosensitive element; a light-emitting element embedded in the groove; and a conductive post disposed on the second side of the photosensitive element. Both the photosensitive element and the light-emitting element are electrically connected to the conductive post, and the conductive post is used to electrically connect the ranging sensor to an external circuit.

[0008] Secondly, this utility model discloses an electronic device, which includes an electronic device body and the ranging sensor described in the first aspect, wherein the ranging sensor is connected to the electronic device body.

[0009] This utility model discloses a ranging sensor and an electronic device. The ranging sensor includes a photosensitive element having a first side and a second side disposed opposite to each other, and a groove provided on the first side of the photosensitive element; a light-emitting element embedded in the groove; and a conductive post disposed on the second side of the photosensitive element. The photosensitive element and the light-emitting element are electrically connected to the conductive post, and the conductive post is used to electrically connect the ranging sensor to an external circuit.

[0010] In this invention, a groove is provided on the first side of the photosensitive element, and a light-emitting element is embedded in the groove. A conductive post is provided on the second side of the photosensitive element, and the conductive post is electrically connected to the photosensitive element and the light-emitting element. The distance sensor is electrically connected to an external circuit through the conductive post. This reduces the size of the distance sensor, improves its integration, reduces the space occupied by the distance sensor within the electronic device, and enhances the space utilization of the electronic device, thereby contributing to the miniaturization of the electronic device. Attached Figure Description

[0011] Figure 1 This is a schematic diagram showing the structure of the ranging sensor described in this embodiment of the present invention;

[0012] Figure 2 This is a schematic diagram showing the structure of the ranging sensor according to another embodiment of the present invention;

[0013] Figure 3 This is a schematic diagram illustrating the use of the ranging sensor described in this embodiment of the present invention;

[0014] Figure 4 This diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the invention. Figure 1 ;

[0015] Figure 5 This diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the invention. Figure 2 ;

[0016] Figure 6 This diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the invention. Figure 3 ;

[0017] Figure 7 This diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the invention. Figure 4 ;

[0018] Figure 8 This diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the invention. Figure 5 ;

[0019] Figure 9 This diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the invention. Figure 6 .

[0020] Figure label:

[0021] 10: Photosensitive element; 11: Groove; 12: First through hole; 13: Third through hole; 14: Fourth through hole;

[0022] 20: Light-emitting element; 21: Second through hole;

[0023] 30: Conductive pillar;

[0024] 40: First encapsulation layer; 41: First light-transmitting portion; 42: Second light-transmitting portion; 43: First redistribution layer; 44: Fourth redistribution layer;

[0025] 50: Second encapsulation layer; 51: Second redistribution layer;

[0026] 60: First electrical connection;

[0027] 70: Third encapsulation layer; 71: Third redistribution layer;

[0028] 90: Second electrical connection;

[0029] 100: Third electrical connection;

[0030] 110: Fourth electrical connection;

[0031] 120: Filler. Detailed Implementation

[0032] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0033] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0034] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0035] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0036] Reference Figure 1 The diagram shows a schematic representation of the distance measuring sensor described in an embodiment of this utility model; refer to... Figure 2 The diagram shows a structural schematic of the ranging sensor described in another embodiment of the present invention.

[0037] like Figure 1 and Figure 2 As shown in the figure, this utility model embodiment discloses a ranging sensor, which includes a photosensitive element 10, having a first side and a second side disposed opposite to each other, and a groove 11 provided on the first side of the photosensitive element 10; a light-emitting element 20, which is embedded in the groove 11; and a conductive post 30, which is disposed on the second side of the photosensitive element 10. Both the photosensitive element 10 and the light-emitting element 20 are electrically connected to the conductive post 30, which is used to electrically connect the ranging sensor to an external circuit.

[0038] This utility model discloses a ranging sensor, specifically an optical distance sensor. An optical distance sensor is a device that can measure the distance between a nearby object and the sensor using electromagnetic radiation without any physical contact; it is widely used in mobile electronic devices.

[0039] like Figure 3 As shown, an optical distance sensor includes a light-emitting element and a photosensitive element. The light-emitting element emits light, which is reflected by an object and then back to the photosensitive element. By measuring the time difference between the light's journey from the light-emitting element to its return to the photosensitive element after reflection, the distance between the sensor and the object can be calculated. Alternatively, based on geometric trigonometric relationships, the distance between the sensor and the object can be calculated using the positional relationships between the light-emitting element, the object, and the photosensitive element. The specific principles of how optical distance sensors calculate the distance between the sensor and the object will not be elaborated upon here; in practical applications, technicians can choose the appropriate method based on their needs. Since optical distance sensors are commonly used in mobile electronic devices, miniaturization of these devices is crucial for improving the user experience. Therefore, reducing the size of the optical distance sensor also has a significant impact on the miniaturization design of mobile electronic devices.

[0040] It should be noted that the mobile electronic devices in the embodiments of this utility model include, but are not limited to, mobile phones, personal digital assistants, tablet computers, laptop computers, etc.

[0041] The following description will use a mobile electronic device, such as a mobile phone, as an example to illustrate the distance sensor disclosed in the embodiments of this utility model.

[0042] like Figure 1 and Figure 2 As shown in the figure, this utility model embodiment discloses a distance measuring sensor, which includes a photosensitive element 10. The photosensitive element 10 is used to receive light signals reflected by an object and convert the light signals into electrical signals to realize distance measurement.

[0043] For example, the photosensitive element 10 can be one of a photodiode (PD), an avalanche photodiode (APD), or a phototransistor. Of course, the above are only individual examples of specific types of photosensitive elements 10 and are not intended to limit the present invention.

[0044] like Figure 1 and Figure 2 As shown, along the thickness direction of the photosensitive element 10, the photosensitive element 10 has a first side and a second side disposed opposite to each other. The first side of the photosensitive element 10 has a groove 11, within which a light-emitting element 20 is embedded. The light-emitting element 20 emits a light signal, which reaches an object and, after reflection, reaches the photosensitive element 10. The photosensitive element 10 receives the light signal reflected from the object and converts it into an electrical signal to achieve distance measurement.

[0045] For example, the light-emitting element 20 can be one of a light-emitting diode (LED), a laser diode (LD), a vertical-cavity surface-emitting laser, or an organic light-emitting diode (OLED). Of course, the above are merely individual examples of specific types of light-emitting elements 20 and are not intended to limit the present invention. In practical applications, those skilled in the art can select suitable components as the light-emitting element 20 as needed.

[0046] The second side of the photosensitive element 10 is provided with a conductive post 30, which is electrically connected to the photosensitive element 10 and the light-emitting element 20, so as to electrically connect the ranging sensor to the external circuit through the conductive post 30.

[0047] It should be noted that the conductive post 30 in this embodiment of the invention is conductive. For example, the conductive post 30 can be a copper post or an aluminum post. In this embodiment of the invention, there are no excessive restrictions on the specific material of the conductive post 30; in practical applications, those skilled in the art can choose according to their needs.

[0048] In this embodiment of the invention, a groove 11 is provided on the first side of the photosensitive element 10, and the light-emitting element 20 is embedded in the groove 11. A conductive post 30 is provided on the second side of the photosensitive element 10, and the conductive post 30 is electrically connected to the photosensitive element 10 and the light-emitting element 20. The ranging sensor is electrically connected to an external circuit through the conductive post 30. This reduces the size of the ranging sensor, improves its integration, reduces the space occupied by the ranging sensor within the electronic device, and enhances the space utilization of the electronic device, thereby contributing to the miniaturization of the electronic device.

[0049] In some embodiments, such as Figure 1 and Figure 2 As shown, the ranging sensor also includes a first encapsulation layer 40, which is stacked on the first side of the photosensitive element 10. A first light-transmitting part 41 and a second light-transmitting part 42 are disposed at intervals within the first encapsulation layer 40. The first light-transmitting part 41 is disposed opposite to the light-emitting element 20, and the second light-transmitting part 42 is disposed opposite to at least a portion of the photosensitive element 10.

[0050] like Figure 1 and Figure 2 As shown, a first encapsulation layer 40 is stacked on the first side of the photosensitive element 10. The first encapsulation layer 40 is stacked on the first side of the photosensitive element 10 to improve the mechanical strength and reliability of the ranging sensor.

[0051] It should be noted that the first encapsulation layer 40 in this embodiment of the present invention is a polymer material layer. For example, the first encapsulation layer 40 can be a polyimide (PI) layer. Polyimide is a high-performance polymer with excellent high-temperature resistance, mechanical strength, and chemical stability.

[0052] Of course, the first encapsulation layer 40 can also be an aromatic polyamide layer, a modified epoxy resin layer, etc. In this embodiment of the invention, no restrictions are placed on the specific material of the first encapsulation layer 40; in practical applications, those skilled in the art can choose according to their needs.

[0053] like Figure 1 and Figure 2 As shown, two through holes are spaced apart within the first encapsulation layer 40. One through hole is positioned opposite to the light-emitting element 20, and a first light-transmitting portion 41 is embedded within this through hole. The other through hole is positioned opposite to the signal receiving point of the photosensitive element 40, and a second light-transmitting portion 42 is embedded within this through hole. In other words, both the first light-transmitting portion 41 and the second light-transmitting portion 42 are made of light-transmitting material, allowing light to pass through.

[0054] For example, the first light-transmitting portion 41 and the second light-transmitting portion 42 can be made of polycarbonate (PC), and the first light-transmitting portion 41 and the second light-transmitting portion 42 can be made of plexiglass. In this embodiment of the present invention, there are no excessive restrictions on the specific materials of the first light-transmitting portion 41 and the second light-transmitting portion 42. In practical applications, those skilled in the art can choose according to their needs.

[0055] In this embodiment of the invention, a first encapsulation layer 40 is stacked on the first side of the photosensitive element 10 to encapsulate the ranging sensor, thereby improving the mechanical strength and reliability of the ranging sensor. A first light-transmitting portion 41 and a second light-transmitting portion 42 are spaced apart within the first encapsulation layer 40. The first light-transmitting portion 41 is disposed opposite to the light-emitting element 20, and the second light-transmitting portion 42 is disposed opposite to at least a portion of the photosensitive element 10. This allows the light signal emitted by the light-emitting element 20 to pass through the first light-transmitting portion 41 to reach the object, and then, after reflection from the object, pass through the second light-transmitting portion 42 to reach the photosensitive element 10, thereby measuring the distance between the ranging sensor and the object.

[0056] In some embodiments, such as Figure 1 As shown, a first encapsulation layer 40 contains a first rewiring layer 43, which is electrically connected to the photosensitive element 10 and the light-emitting element 20. The ranging sensor also includes a second encapsulation layer 50, which is stacked on the second side of the photosensitive element 10. A second rewiring layer 51 is disposed within the second encapsulation layer 50 and is electrically connected to the first rewiring layer 43. A conductive post 30 is disposed on the side of the second encapsulation layer 50 away from the photosensitive element 10 and is electrically connected to the second rewiring layer 51.

[0057] like Figure 1 As shown, a second encapsulation layer 50 is stacked on the second side of the photosensitive element 10. The second encapsulation layer 50 is stacked on the second side of the photosensitive element 10 to improve the mechanical strength and reliability of the ranging sensor.

[0058] It should be noted that the second encapsulation layer 50 in this embodiment of the present invention is a polymer material layer. For example, the second encapsulation layer 50 can be a polyimide (PI) layer. Polyimide is a high-performance polymer with excellent high-temperature resistance, mechanical strength, and chemical stability.

[0059] Of course, the second encapsulation layer 50 can also be an aromatic polyamide layer, a modified epoxy resin layer, etc. In this embodiment of the invention, no restrictions are placed on the specific material of the second encapsulation layer 50; in practical applications, those skilled in the art can choose according to their needs.

[0060] like Figure 1As shown, a first rewiring layer 43 is disposed within the first encapsulation layer 40, and the first rewiring layer 43 is electrically connected to the photosensitive element 10 and the light-emitting element 20. A second rewiring layer 51 is disposed within the second encapsulation layer 50, and the second rewiring layer 51 is electrically connected to the first rewiring layer 43. A conductive post 30 is disposed on the side of the second encapsulation layer 50 away from the photosensitive element 10, and the conductive post 30 is electrically connected to the second rewiring layer 51, thereby electrically connecting the photosensitive element 10 and the light-emitting element 20 to an external circuit through the conductive post 30.

[0061] In this embodiment of the invention, the photosensitive element 10 and the light-emitting element 20 are electrically connected to the conductive post 30 through the first wiring layer 43 and the second wiring layer 51, and the ranging sensor is electrically connected to the external circuit through the conductive post 30. This not only reduces the size of the ranging sensor, improves the module integration, and saves space on the outer layer of the substrate, but also enhances the mechanical strength of the ranging sensor. Furthermore, the above-mentioned configuration can also reduce the distance between the electrical connections of the various components of the ranging sensor, improve the signal transmission speed, reduce signal crosstalk, reduce noise and electromagnetic interference, and improve the electrical performance of the ranging sensor.

[0062] In some embodiments, such as Figure 1 As shown, a first through hole 12 is provided in the photosensitive element 10; a first electrical connector 60 is provided at least partially in the first through hole 12, and the first electrical connector 60 is electrically connected between the first rewiring layer 43 and the second rewiring layer 51.

[0063] like Figure 1 As shown in the embodiment of this utility model, a first through hole 12 is provided in the photosensitive element 10. Exemplarily, the first through hole 12 and the groove 11 are spaced apart and adjacent to each other. A first electrical connector 60 is provided in the first through hole 12, and the first rewiring layer 43 and the second rewiring layer 51 are electrically connected through the first electrical connector 60 to conduct electricity between the first rewiring layer 43 and the second rewiring layer 51.

[0064] It should be noted that the first electrical connector 60 in this embodiment of the present invention is conductive. For example, the first electrical connector 60 can be a copper rod, which fills the first through hole 12, and one end of the copper rod is electrically connected to the first rewiring layer 43, and the other end of the copper rod is electrically connected to the second rewiring layer 51, so as to conduct electricity between the first rewiring layer 43 and the second rewiring layer 51.

[0065] Of course, the first electrical connector 60 in this embodiment of the present invention can also be made of other materials. No further restrictions are imposed on this.

[0066] In another embodiment of this utility model, such as Figure 2As shown, the ranging sensor also includes a third encapsulation layer 70, which is stacked between the bottom wall of the groove 11 and the light-emitting element 20. A third wiring layer 71 is provided inside the third encapsulation layer 70, and the third wiring layer 71 is electrically connected to the light-emitting element 20. The second wiring layer 51 is electrically connected to the third wiring layer 71.

[0067] like Figure 2 As shown, a third encapsulation layer 70 is disposed between the bottom wall of the groove 11 and the light-emitting element 20, and a third rewiring layer 71 is disposed within the third encapsulation layer 70. The third encapsulation layer 70 is disposed between the bottom wall of the groove 11 and the light-emitting element 20 to improve the mechanical strength and reliability of the ranging sensor. Furthermore, the third encapsulation layer 70 can be used to fix the third rewiring layer 71.

[0068] like Figure 2 As shown, a second encapsulation layer 50 is stacked on the second side of the photosensitive element 10, and a second redistribution layer 51 is disposed within the second encapsulation layer 50. Stacking the second encapsulation layer 50 on the second side of the photosensitive element 10 improves the mechanical strength and reliability of the ranging sensor. Furthermore, the second encapsulation layer 50 can be used to fix the second redistribution layer 51.

[0069] It should be noted that the third encapsulation layer 70 and the second encapsulation layer 50 in this embodiment of the present invention are both polymer material layers. Exemplarily, the third encapsulation layer 70 and the second encapsulation layer 50 can be polyimide (PI) layers. Polyimide is a high-performance polymer with excellent high-temperature resistance, mechanical strength, and chemical stability. Of course, the third encapsulation layer 70 and the second encapsulation layer 50 can also be aromatic polyamide layers, modified epoxy resin layers, etc. In this embodiment of the present invention, no excessive restrictions are placed on the specific materials of the third encapsulation layer 70 and the second encapsulation layer 50; in practical applications, those skilled in the art can choose according to their needs.

[0070] like Figure 2 As shown, a second wiring layer 51 is disposed within the second encapsulation layer 50. The second wiring layer 51 is electrically connected to the third wiring layer 71, and the third wiring layer 71 is electrically connected to the light-emitting element 20. A conductive post 30 is disposed on the side of the second encapsulation layer 50 away from the photosensitive element 10, and the conductive post 30 is electrically connected to the second wiring layer 51. In other words, the conductive post 30 is electrically connected to the second wiring layer 51, the second wiring layer 51 is electrically connected to the third wiring layer 71, and the third wiring layer 71 is electrically connected to the light-emitting element 20. Thus, the light-emitting element 20 is electrically connected to the conductive post 30 through the third wiring layer 71 and the second wiring layer 51, thereby connecting the light-emitting element 20 to the external circuitry.

[0071] In this embodiment of the invention, the light-emitting element 20 is electrically connected to the conductive post 30 via the third wiring layer 71 and the second wiring layer 51, and the light-emitting element 20 is electrically connected to the external circuit via the conductive post 30. This not only reduces the size of the ranging sensor and improves the integration of the ranging sensor module, saving space on the outer layer of the substrate, but also enhances the mechanical strength of the ranging sensor. Furthermore, the above-mentioned configuration can also reduce the distance between the electrical connections between the various components of the ranging sensor, improve the signal transmission speed, reduce signal crosstalk, reduce noise and electromagnetic interference, and improve the electrical performance of the ranging sensor.

[0072] In some embodiments, such as Figure 2 As shown, a second through hole 21 is provided in the light-emitting element 20, and a second electrical connector 90 is provided in the second through hole 21. The second electrical connector 90 is electrically connected between the light-emitting element 20 and the third wiring layer 71. A third through hole 13 is provided in the photosensitive element 10. The third through hole 13 is disposed opposite to a portion of the groove 11. A third electrical connector 100 is provided in the third through hole 13. The third electrical connector 100 is electrically connected between the third wiring layer 71 and the second wiring layer 51.

[0073] like Figure 2 As shown in this embodiment of the present invention, a second through hole 21 is provided in the light-emitting element 20, and a second electrical connector 90 is provided in the second through hole 21. The light-emitting element 20 is electrically connected to the third wiring layer 71 through the second electrical connector 90 to conduct electricity between the light-emitting element 20 and the third wiring layer 71. A third through hole 13 is provided in the photosensitive element 10, and the third through hole 13 is disposed opposite to a portion of the groove 11. A third electrical connector 100 is provided in the third through hole 13. The third electrical connector 100 is electrically connected to the third wiring layer 71 and the second wiring layer 51 to conduct electricity between the third wiring layer 71 and the second wiring layer 51.

[0074] It should be noted that both the second electrical connector 90 and the third electrical connector 100 in this embodiment of the present invention are conductive. For example, the second electrical connector 90 is a copper rod that fills the second through hole 21, with one end electrically connected to the light-emitting element 20 and the other end electrically connected to the third wiring layer 71. The third electrical connector 100 can also be a copper rod that fills the third through hole 13, with one end electrically connected to the third wiring layer 71 and the other end electrically connected to the second wiring layer 51.

[0075] Of course, in this embodiment of the utility model, there are no excessive restrictions on the specific materials of the second electrical connector 90 and the third electrical connector 100. In actual applications, technicians can choose according to their needs.

[0076] In some embodiments, such as Figure 2As shown, a fourth wiring layer 44 is provided in the first encapsulation layer 40, and the fourth wiring layer 44 is electrically connected to the photosensitive element 10; a fourth through hole 14 is provided in the photosensitive element 10, and a fourth electrical connector 110 is provided in the fourth through hole 14, and the fourth electrical connector 110 is electrically connected between the fourth wiring layer 44 and the second wiring layer 51.

[0077] like Figure 2 As shown in this embodiment of the present invention, a fourth through hole 14 is provided in the photosensitive element 10. Exemplarily, the fourth through hole 14 and the groove 11 are spaced apart, and arranged sequentially. A fourth electrical connector 110 is provided in the fourth through hole 14, connecting the second wiring layer 51 and the fourth wiring layer 44 to conduct electricity. That is, the conductive post 30 is electrically connected to the second wiring layer 51, the second wiring layer 51 is electrically connected to the fourth electrical connector 110, the fourth electrical connector 110 is electrically connected to the fourth wiring layer 44, and the fourth wiring layer 44 is electrically connected to the photosensitive element 10, thereby connecting the photosensitive element 10 to the external circuit.

[0078] It should be noted that the fourth electrical connector 110 in this embodiment of the present invention is conductive. Exemplarily, the fourth electrical connector 110 can be a copper rod, which fills the fourth through hole 14, with one end electrically connected to the fourth rewiring layer 44 and the other end electrically connected to the second rewiring layer 51, thereby connecting the fourth rewiring layer 44 and the second rewiring layer 51. Of course, the fourth electrical connector 110 in this embodiment of the present invention can also be made of other materials. No further limitations are imposed in this regard.

[0079] In some embodiments, such as Figure 1 and Figure 2 As shown, along the height direction of the ranging sensor, the height of the light-emitting element 20 is lower than the height of the photosensitive element 10.

[0080] like Figure 1 and Figure 2 As shown, along the height direction of the ranging sensor, the height of the light-emitting element 20 is set lower than the height of the photosensitive element 10. Here, "the height of the light-emitting element 20 is lower than the height of the photosensitive element 10" means that the part of the light-emitting element 20 that emits light signals is lower than the part of the photosensitive element 10 that receives light signals.

[0081] In this embodiment of the invention, the height of the light-emitting element 20 is set to be lower than the height of the photosensitive element 10 along the height direction of the ranging sensor, so as to avoid crosstalk between the light signal emitted by the light-emitting element 20 and the light signal received by the photosensitive element 10, which would affect the reliability of the ranging sensor.

[0082] In some embodiments, such as Figure 1 and Figure 2As shown, the ranging sensor also includes a filler 120, which fills the space between the side wall of the light-emitting element 20 and the inner wall of the groove 11.

[0083] like Figure 1 and Figure 2 As shown, there is a gap between the side wall of the light-emitting element 20 and the inner wall of the groove 11. A filler 120 is provided in the gap to fill the gap between the side wall of the light-emitting element 20 and the inner wall of the groove 11, thereby fixing the light-emitting element 20 so that the light-emitting element 20 can be more reliably set in the groove 11.

[0084] It should be noted that the filling material used in the filler 120 in this embodiment of the present invention includes, but is not limited to, polyethylene, polypropylene, etc.

[0085] Reference Figure 4 The diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the present invention. Figure 1 ;reference Figure 5 The diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the present invention. Figure 2 ;reference Figure 6 The diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the present invention. Figure 3 ;reference Figure 7 The diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the present invention. Figure 4 ;reference Figure 8 The diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the present invention. Figure 5 ;reference Figure 9 The diagram illustrates the fabrication process of the ranging sensor described in this embodiment of the present invention. Figure 6 .

[0086] The following will refer to Figures 4 to 9 As shown, the method for preparing the ranging sensor disclosed in the embodiments of this utility model will be described in detail.

[0087] like Figure 4 As shown, a TVI (Through Silicon Via) is formed on the photosensitive element 10. TVI is one of the most advanced technologies in the semiconductor manufacturing industry. TVI is achieved by creating vertical through-holes between chips and wafers, and then filling them with conductive materials such as copper or tungsten to achieve vertical electrical connection.

[0088] like Figure 5 As shown, a groove 11 is formed on the photosensitive element 10 by etching. The groove 11 can be spaced apart from the TVI through-silicon via, or the groove 11 can be adjacent to the TVI through-silicon via.

[0089] like Figure 6 As shown, the light-emitting element 20 is placed in the groove 11, and the space between the side wall of the light-emitting element 20 and the inner wall of the groove 11 is filled with filler material to form a filler 120, which fixes the light-emitting element 20.

[0090] like Figure 7 As shown, a first encapsulation layer 40 is stacked on the first side of the photosensitive element 10 using RDL (Redistribution Layer) technology. A first redistribution layer 43 is provided in the first encapsulation layer 40. The light-emitting element 20 is electrically connected to the photosensitive element 10 through the first redistribution layer 43, and the photosensitive element 10 is electrically connected to the TVI through-silicon via.

[0091] like Figure 8 As shown, using RDL technology, a second encapsulation layer 50 is stacked on the second side of the photosensitive element 10. A second rewiring layer 51 is provided inside the second encapsulation layer 50. The TVI through-silicon vias are electrically connected to the conductive pillars 30 through the second rewiring layer 51. The conductive pillars 30 can be electrically connected to an external circuit, thereby connecting the ranging sensor to the external circuit.

[0092] like Figure 9 As shown, the portions of the first encapsulation layer 40 opposite to the light-emitting element 20, and the portions of the first encapsulation layer 40 opposite to the portion of the photosensitive element 10 that receives light signals, are removed. Then, a transparent material that allows light to pass through is filled into the removed portions, forming a first light-transmitting portion 41 and a second light-transmitting portion 42.

[0093] An electronic device is also disclosed in the utility model embodiment. The electronic device includes an electronic device body and a ranging sensor as described in the above embodiment, wherein the ranging sensor is connected to the electronic device body.

[0094] It should be noted that the structure of the ranging sensor included in the electronic device disclosed in this embodiment is the same as that of the ranging sensor described in the above embodiments, and its beneficial effects are also similar. Therefore, further details will not be repeated here.

[0095] The mobile electronic devices in this embodiment include, but are not limited to, mobile phones, personal digital assistants, tablet computers, and laptop computers.

[0096] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0097] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A ranging sensor, characterized by, include: A photosensitive element (10) has a first side and a second side disposed opposite to each other, and a groove (11) is provided on the first side of the photosensitive element (10); A light-emitting element (20) is embedded in the groove (11); A conductive post (30) is disposed on the second side of the photosensitive element (10). The photosensitive element (10) and the light-emitting element (20) are both electrically connected to the conductive post (30). The conductive post (30) is used to electrically connect the ranging sensor to an external circuit.

2. The ranging sensor of claim 1, wherein, The ranging sensor also includes: A first encapsulation layer (40) is stacked on the first side of the photosensitive element (10); The first encapsulation layer (40) is provided with a first light-transmitting part (41) and a second light-transmitting part (42) at intervals. The first light-transmitting part (41) is disposed opposite to the light-emitting element (20), and the second light-transmitting part (42) is disposed opposite to at least a part of the photosensitive element (10).

3. The ranging sensor of claim 2, wherein, The first encapsulation layer (40) is provided with a first super-wiring layer (43), which electrically connects the photosensitive element (10) and the light-emitting element (20). The ranging sensor further includes a second encapsulation layer (50), which is stacked on the second side of the photosensitive element (10). A second rewiring layer (51) is provided inside the second encapsulation layer (50), and the second rewiring layer (51) is electrically connected to the first rewiring layer (43). The conductive post (30) is disposed on the side of the second encapsulation layer (50) away from the photosensitive element (10), and the conductive post (30) is electrically connected to the second redistribution layer (51).

4. The ranging sensor of claim 3, wherein, The photosensitive element (10) is provided with a first through hole (12); A first electrical connector (60) is at least partially disposed within the first through hole (12) and is electrically connected between the first redistribution layer (43) and the second redistribution layer (51).

5. The ranging sensor of claim 3, wherein, The ranging sensor also includes: A third encapsulation layer (70) is stacked between the bottom wall of the groove (11) and the light-emitting element (20). A third wiring layer (71) is provided inside the third encapsulation layer (70), and the third wiring layer (71) is electrically connected to the light-emitting element (20). The second wiring layer (51) is electrically connected to the third wiring layer (71).

6. The ranging sensor of claim 5, wherein, The light-emitting element (20) is provided with a second through hole (21), and a second electrical connector (90) is provided in the second through hole (21). The second electrical connector (90) is electrically connected between the light-emitting element (20) and the third wiring layer (71). The photosensitive element (10) is provided with a third through hole (13), which is disposed opposite to a portion of the groove (11). A third electrical connector (100) is provided in the third through hole (13), which is electrically connected between the third wiring layer (71) and the second wiring layer (51).

7. The ranging sensor of claim 6, wherein, A fourth wiring layer (44) is provided in the first encapsulation layer (40), and the fourth wiring layer (44) is electrically connected to the photosensitive element (10); The photosensitive element (10) is provided with a fourth through hole (14), and a fourth electrical connector (110) is provided in the fourth through hole (14). The fourth electrical connector (110) is electrically connected between the fourth redistribution layer (44) and the second redistribution layer (51).

8. The ranging sensor according to any one of claims 1 to 7, characterized in that, Along the height direction of the ranging sensor, the height of the light-emitting element (20) is lower than the height of the photosensitive element (10).

9. The ranging sensor according to any one of claims 1 to 7, characterized in that, The ranging sensor also includes a filler (120) that fills the space between the sidewall of the light-emitting element (20) and the inner wall of the groove (11).

10. An electronic device, comprising: It includes an electronic device body and a ranging sensor according to any one of claims 1-9, wherein the ranging sensor is connected to the electronic device body.

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