Lead frame for ultrahigh-voltage chip tantalum capacitor

Abstract

The utility model relates to the technical field of tantalum capacitor installation, in particular to a lead frame for an ultra-high voltage chip tantalum capacitor, which comprises a frame main body, a basic sealing module, an independent module and a series module, and is characterized in that the frame main body comprises a packaging substrate, and connecting guide sheets are packaged at the edges of the front side and the rear side in the packaging substrate; module installation clamping grooves are formed in the front edge and the rear edge of the upper surface of the packaging substrate, and the module installation clamping grooves cut the connecting guide piece into multiple sections. The basic sealing module is clamped in the module mounting clamping groove; the independent modules are clamped in the module mounting clamping grooves; and the series modules are clamped in the module mounting clamping grooves. According to the utility model, the independent modules and the series modules which need to be conveyed are respectively taken out according to the specific wiring mode that the ultrahigh-voltage chip tantalum capacitor needing to be installed is installed on the circuit board, and are respectively clamped in the different module installation clamping grooves on the packaging substrate according to the wiring scheme, so that the wiring mode can be freely matched according to requirements; and the method has certain universality.

Description

Technical Field

[0001] This utility model relates to the field of tantalum capacitor mounting technology, specifically a lead frame for an ultra-high voltage chip tantalum capacitor. Background Technology

[0002] Ultra-high voltage tantalum electrolytic capacitors are widely used in various high-end electronic equipment such as aerospace, aviation, electronics, weaponry, shipbuilding, communications and medical electronics due to their advantages of small size, large capacitance, good temperature characteristics, high stability and reliability. In order to ensure the high voltage current requirement, a special lead frame is usually required to connect them to the circuit board.

[0003] Currently, most ultra-high voltage chip tantalum capacitor lead frames are stamped according to the designed capacitor wiring scheme and connected to the circuit on the circuit board. Finally, they are packaged on the circuit board. This is a completely targeted design and does not have any universality. Electronic devices are diverse and their internal circuit boards generally have capacitors installed. The design, production and installation processes of wiring methods are extremely complex and inefficient. Utility Model Content

[0004] The purpose of this invention is to provide a lead frame for ultra-high voltage chip tantalum capacitors to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A lead frame for an ultra-high voltage chip tantalum capacitor includes:

[0007] The frame body includes a packaging substrate. Connecting guide pieces are encapsulated on the front and rear edges inside the packaging substrate. Module mounting slots are formed at the front and rear edges of the upper surface of the packaging substrate, and the module mounting slots cut the connecting guide pieces into multiple segments.

[0008] A basic enclosure module, wherein the basic enclosure module is snapped into the module mounting slot;

[0009] An independent module, wherein the independent module is fitted inside a module mounting slot;

[0010] A series module, wherein the series module is installed inside the module mounting slot.

[0011] Furthermore, the main body of the framework also includes:

[0012] The mounting edge is located at the bottom edge of the encapsulation substrate;

[0013] The bottom side connector is snapped onto one end of the bottom edge of the encapsulation substrate, and the bottom side connector is fixedly connected to one end of the connecting guide piece;

[0014] The upper wiring piece is snapped onto one end of the upper surface edge of the encapsulation substrate, and the upper wiring piece is fixedly connected to the other end of the connecting guide piece.

[0015] Furthermore, the main body of the framework also includes:

[0016] Bottom terminal protrusion slot, wherein the bottom terminal protrusion slot is formed at the bottom of the module mounting slot;

[0017] Upper terminal slot, wherein the upper terminal slot is formed on the edge of the opening side of the packaging substrate;

[0018] The connecting slots are located on the connecting guide plates on both sides of the module mounting slot.

[0019] Furthermore, the basic enclosed module includes:

[0020] A closed base block, which is snapped into the module mounting slot;

[0021] The protruding slot locking block is fixedly installed at the bottom of the closed base block, and the protruding slot locking block is engaged with the bottom terminal protruding slot;

[0022] A connecting slot block is fixedly installed on both sides of the closed base block, and the connecting slot block and the connecting slot are engaged with each other.

[0023] Furthermore, the independent module includes:

[0024] The No. 1 basic conductive strip is embedded inside the closed base block;

[0025] A downward-probing conductive post is fixedly installed at the bottom of the No. 1 foundation conductive strip;

[0026] Bottom wiring terminal, the bottom wiring terminal is fixedly connected to the lower end of the probe conductive post, and the bottom wiring terminal is fixedly installed at the bottom of the probe slot block;

[0027] The No. 1 upper terminal is fixedly connected to the upper surface of the No. 1 base conductive strip, and the No. 1 upper terminal is engaged with the upper terminal slot.

[0028] Furthermore, the series module includes:

[0029] The second foundation conductive strip is embedded inside the closed base block;

[0030] The No. 2 upper terminal block is fixedly connected to the upper surface of the No. 2 base conductive strip;

[0031] An electrical connection block is fixedly connected to both ends of the second base conductive strip, and the electrical connection block replaces the connection slot block and engages with the connection slot.

[0032] Compared with the prior art, the beneficial effects of this utility model are:

[0033] Based on the specific wiring method required for installing the ultra-high voltage tantalum chip capacitors on the circuit board, the independent modules and series modules that need to be fed are taken out and installed into different module mounting slots on the packaging substrate according to the wiring scheme. The series modules are directly connected to the connecting guides. The independent modules have separate bottom terminals that extend into the bottom of the packaging substrate. After assembly, the packaging substrate is installed on the upper surface of the circuit board, and the connecting guides and the bottom of the independent modules are connected to the circuit terminals on the circuit board. The pins of the ultra-high voltage tantalum chip capacitors are connected to the upper terminals of the independent modules and series modules. Any unused module mounting slots are sealed with basic sealing modules to complete the installation of the overall structure. The wiring method can be freely matched according to the requirements, which has a certain degree of versatility. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0035] Figure 2 This is a schematic diagram of the main frame of this utility model;

[0036] Figure 3 This is a schematic diagram of the basic closed module in this utility model;

[0037] Figure 4 This is a schematic diagram of an independent module in this utility model;

[0038] Figure 5 This is a schematic diagram of the series module in this utility model.

[0039] In the diagram: 1. Frame body; 101. Encapsulation substrate; 102. Mounting edge; 103. Module mounting slot; 104. Connecting guide plate; 105. Bottom side wiring piece; 106. Top side wiring piece; 107. Bottom terminal protrusion slot; 108. Top terminal slot; 109. Connecting slot; 2. Basic enclosed module; 201. Enclosed base block; 202. Protrusion slot block; 203. Connecting slot block; 3. Independent module; 301. First basic conductive strip; 302. Lower conductive post; 303. Bottom wiring terminal; 304. First upper wiring terminal; 4. Series module; 401. Second basic conductive strip; 402. Second upper wiring terminal; 403. Electrical connection block. Detailed Implementation

[0040] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0041] Please see Figure 1-5 In this embodiment of the present invention, a lead frame for an ultra-high voltage chip tantalum capacitor includes a frame body 1, a basic enclosed module 2, an independent module 3, and a series module 4. The frame body 1 includes an encapsulation substrate 101, with connecting guide pieces 104 encapsulated on the front and rear edges inside the encapsulation substrate 101. Module mounting slots 103 are formed at the front and rear edges of the upper surface of the encapsulation substrate 101, and the module mounting slots 103 cut the connecting guide pieces 104 into multiple segments. The basic enclosed module 2 is mounted inside the module mounting slot 103; the independent module 3 is mounted inside the module mounting slot 103; and the series module 4 is mounted inside the module mounting slot 103.

[0042] Specifically, depending on the specific wiring method required for installing the ultra-high voltage tantalum chip capacitors on the circuit board, the independent modules 3 and series modules 4 that need to be fed are taken out and respectively clipped into different module mounting slots 103 on the packaging substrate 101 according to the wiring scheme. The series module 4 is directly connected to the connecting guide 104. The independent module 3 has a separate bottom terminal 303 that protrudes into the bottom of the packaging substrate 101. After assembly, the packaging substrate 101 is mounted on the upper surface of the circuit board, and the connecting guide 104 and the bottom of the independent module 3 are connected to the circuit terminals on the circuit board. The pins of the ultra-high voltage tantalum chip capacitors are connected to the upper terminals of the independent module 3 and the series module 4. Any excess empty module mounting slots 103 are sealed by the basic sealing module 2 to complete the installation of the overall structure. The wiring method can be freely matched according to the requirements, which has a certain degree of versatility.

[0043] Example 1

[0044] like Figure 2-5As shown, in this embodiment, the basic enclosed module 2 includes a closed base block 201, a protruding slot locking block 202, and a connecting slot locking block 203. The closed base block 201 is snapped into the module mounting slot 103. The protruding slot locking block 202 is fixedly installed at the bottom of the closed base block 201, and the protruding slot locking block 202 is snapped into the bottom terminal protruding slot 107. The connecting slot locking block 203 is fixedly installed on both sides of the closed base block 201, and the connecting slot locking block 203 is snapped into the connecting slot 109. The independent module 3 includes a first basic conductive strip 301, a lower protruding conductive post 302, a bottom terminal block 303, and a first upper terminal block 304. The first basic conductive strip 301 is embedded inside the closed base block 201. The lower protruding conductive post 302 is fixedly installed at the bottom of the first basic conductive strip 301. The bottom terminal 303 is fixedly connected to the lower end of the downward probe conductive post 302, and the bottom terminal 303 is fixedly installed at the bottom of the probe slot block 202; the first upper terminal 304 is fixedly connected to the upper surface of the first base conductive strip 301, and the first upper terminal 304 is interlocked with the upper terminal slot 108; the series module 4 includes the second base conductive strip 401, the second upper terminal 402 and the electrical connection block 403, the second base conductive strip 401 is embedded inside the closed base block 201; the second upper terminal 402 is fixedly connected to the upper surface of the second base conductive strip 401; the electrical connection block 403 is fixedly connected to both ends of the second base conductive strip 401, and the electrical connection block 403 replaces the connection slot block 203 and interlocks with the connection slot 109.

[0045] In this embodiment, both the independent module 3 and the series module 4 are derived from the basic enclosed module 2 by modifying the wiring method. The independent module 3 replaces the protruding slot card block 202 with the bottom terminal 303 to obtain a terminal that directly contacts the circuit board, while keeping the connecting guide plate 104 in an open state, so that the ultra-high voltage chip tantalum capacitors can be directly connected to the circuit board. The series module 4 replaces the connecting slot card block 203 with the electrical connecting card block 403, and works with the second basic conductive strip 401 to move a conductive bridge connecting the two sections of the connecting guide plate 104, so that each ultra-high voltage chip tantalum capacitor can be connected in series.

[0046] Example 2

[0047] Based on Embodiment 1, in order to compensate for the fact that the connecting guide 104 in Embodiment 1 is in a state of multiple disconnections, it is difficult to connect the ultra-high voltage plate tantalum capacitor to the circuit board by relying solely on the connecting guide 104.

[0048] like Figure 1 , 2As shown in Figure 5, in this embodiment, the frame body 1 further includes a mounting edge 102, a bottom side wiring piece 105, an upper side wiring piece 106, a bottom terminal protrusion groove 107, an upper terminal slot 108, and a connecting slot 109. The mounting edge 102 is formed at the bottom edge of the encapsulation substrate 101; the bottom side wiring piece 105 is snapped onto one end of the bottom edge of the encapsulation substrate 101, and the bottom side wiring piece 105 is fixedly connected to one end of the connecting guide piece 104; the upper side wiring piece 106 is snapped onto one end of the upper surface edge of the encapsulation substrate 101, and the upper side wiring piece 106 is fixedly connected to the other end of the connecting guide piece 104; the bottom terminal protrusion groove 107 is formed at the bottom of the module mounting slot 103; the upper terminal slot 108 is formed at the edge of the opening side of the encapsulation substrate 101; and the connecting slot 109 is formed at the connecting guide pieces 104 on both sides of the module mounting slot 103.

[0049] In practice, the mounting lead frame of the overall ultra-high voltage tantalum chip capacitor is separated from the circuit board to facilitate free assembly of wiring schemes. It is interconnected with the circuit on the circuit board through the bottom wiring piece 105, the top wiring piece 106, and the circuit board. At the same time, when multiple ultra-high voltage tantalum chip capacitors need to be connected in series or completely connected to the circuit board by the connecting conductor 104, the electrical connection blocks 403 on both sides of the second base conductive strip 401 are interlocked with the connecting slot 109 to connect multiple segments of the connecting conductor 104.

[0050] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0051] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A lead frame for an ultra-high voltage chip tantalum capacitor, characterized by, include: The frame body (1) includes a packaging substrate (101). The packaging substrate (101) has connecting guides (104) encapsulated on the front and rear edges inside. The packaging substrate (101) has module mounting slots (103) starting from the front and rear edges on the upper surface of the packaging substrate (101). The module mounting slots (103) cut the connecting guides (104) into multiple segments. The basic enclosed module (2) is fitted inside the module mounting slot (103); Independent module (3), which is installed inside the module mounting slot (103); The serial module (4) is installed inside the module mounting slot (103).

2. The lead frame for an ultra-high voltage chip tantalum capacitor according to claim 1, wherein The main body of the framework (1) also includes: A mounting edge (102) is formed at the bottom edge of the encapsulation substrate (101); Bottom side connector (105), the bottom side connector (105) is snapped onto one end of the bottom edge of the encapsulation substrate (101), and the bottom side connector (105) is fixedly connected to one end of the connecting guide (104); The upper wiring piece (106) is snapped onto one end of the upper surface edge of the encapsulation substrate (101), and the upper wiring piece (106) is fixedly connected to the other end of the connecting guide piece (104).

3. The lead frame for ultra-high voltage chip tantalum capacitors according to claim 2, characterized by The main body of the framework (1) also includes: Bottom terminal protrusion groove (107) is provided at the bottom of module mounting slot (103); Upper terminal slot (108) is formed on the edge of the opening on the packaging substrate (101); A connecting slot (109) is provided at the connecting guide pieces (104) on both sides of the module mounting slot (103).

4. The lead frame for ultra-high voltage chip tantalum capacitors according to claim 3, wherein The basic closed module (2) includes: A closed base block (201) is snapped into the module mounting slot (103); The protruding slot locking block (202) is fixedly installed at the bottom of the closed base block (201), and the protruding slot locking block (202) is engaged with the bottom terminal protruding slot (107); A connecting slot block (203) is fixedly installed on both sides of the closed base block (201), and the connecting slot block (203) and the connecting slot (109) are engaged with each other.

5. The lead frame for ultra-high voltage chip tantalum capacitors according to claim 4, wherein The independent module (3) includes: The first basic conductive strip (301) is embedded inside the closed base block (201); The downward-probing conductive post (302) is fixedly installed at the bottom of the first foundation conductive strip (301); Bottom terminal (303), the bottom terminal (303) is fixedly connected to the lower end of the probing conductive post (302), and the bottom terminal (303) is fixedly installed on the bottom of the probing slot block (202); The first upper terminal (304) is fixedly connected to the upper surface of the first basic conductive strip (301), and the first upper terminal (304) is engaged with the upper terminal slot (108).

6. The lead frame for ultra-high voltage chip tantalum capacitors according to claim 5, wherein The serial module (4) includes: The second base conductive strip (401) is embedded inside the closed base block (201); The second upper terminal (402) is fixedly connected to the upper surface of the second base conductive strip (401); An electrical connection block (403) is fixedly connected to both ends of the second base conductive strip (401). The electrical connection block (403) replaces the connection slot block (203) and engages with the connection slot (109).

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