Remote excitation fluorescent ceramic type white light LD device with heat dissipation function

Abstract

The utility model discloses a remote excitation fluorescent ceramic type white light LD device with a heat dissipation function, which relates to the technical field of solid state lighting and comprises a heat dissipation fin cylinder, a heat dissipation assembly is arranged in the heat dissipation fin cylinder, an LD excitation source is arranged at one end of the heat dissipation assembly, and a fluorescent ceramic sheet matched with the LD excitation source is arranged at the other end of the heat dissipation assembly. A heat dissipation cover plate is arranged at one end of the heat dissipation fin cylinder, a focusing lens matched with an LD excitation source is arranged on the heat dissipation cover plate, a lower end mounting cover plate is arranged at the other end of the heat dissipation fin cylinder, and the heat dissipation fin cylinder is connected with a heat dissipation fan assembly through the lower end mounting cover plate. The LD excitation source and the fluorescent ceramic chip are arranged in a vertically separated mode, an independent heat dissipation path is constructed, the heat dissipation assembly is installed in the heat dissipation fin cylinder, the heat dissipation assembly is matched with the heat dissipation fin cylinder to form a heat dissipation channel, high temperature of the device is prevented, the service life of the device is prolonged, and the device is more competitive and reliable in a high-power illumination application scene. And the risk of device performance degradation and damage caused by heat accumulation is reduced.

Description

Technical Field

[0001] This utility model relates to the field of solid-state lighting technology, and in particular to a remotely excitation fluorescent ceramic white light LD device with heat dissipation function. Background Technology

[0002] In recent years, white light illumination technology using high-power laser diodes (LDs) to excite fluorescent conversion materials has developed rapidly, showing great potential in special lighting, automotive headlights, and projection displays due to its advantages such as high brightness and small size. This technology typically uses an LD chip to directly excite fluorescent materials (such as fluorescent ceramic sheets) to produce white light. However, high-power laser irradiation simultaneously generates two concentrated heat sources: the LD chip itself and the photothermal conversion heat of the fluorescent material. In existing technologies, the LD chip and fluorescent material are often integrated in a close-fitting manner. This design results in a highly coupled and superimposed state of heat from the two heat sources, leading to the following core problems: First, the heat accumulation effect is aggravated: the close thermal coupling of the two heat sources significantly increases the local temperature. Furthermore, the temperature rise of the LD chip reduces the electro-optical conversion efficiency (thermal decay effect), and when the temperature of the fluorescent ceramic exceeds a critical value (usually >150 ℃), severe thermal quenching occurs, causing a sharp drop in luminous efficiency and color coordinate drift. On the other hand, traditional structures rely on a single heat sink or heat sink to conduct heat from both the LD and the fluorescent ceramic simultaneously. The heat dissipation efficiency is limited by the properties of the thermal interface material, making it difficult to meet the independent temperature control requirements of the two heat sources. More seriously, when the operating temperature of the LD excitation source and the fluorescent ceramic exceeds the critical threshold, a series of chain reactions will be triggered: the fluorescent material will suffer irreversible damage due to accumulated heat load, such as luminous efficiency decay, microstructural cracking, and even surface carbonization. This directly leads to serious problems such as deterioration of the spectral stability of white LD devices, decreased color rendering performance, and shortened lifespan. These technical bottlenecks caused by insufficient thermal management have become key obstacles restricting the large-scale commercial application of high-power white LD devices. Against this backdrop, developing efficient and reliable heat dissipation solutions has become an urgent need to promote the industrialization of fluorescence conversion-type white LD lighting technology.

[0003] To alleviate the heat accumulation problem in fluorescent conversion white light LD lighting devices, some researchers have tried to address the issue by improving the thermal conductivity of fluorescent materials or the thermal conductivity structure of the LD excitation source.

[0004] The literature (ADVANCED MATERIALS, 2020, 32(1).), (Optical Materials, 2021, 121: 111507.), and (Ceramics International, 2020, 46(1): 653-62.) only focuses on building a micro-nano-level thermal conductivity network inside the ceramic, and has not yet achieved directional thermal conduction between the fluorescent ceramic and the external high-efficiency heat dissipation components. This results in the fluorescent ceramic still having the risk of local thermal stress concentration and thermally induced fracture under continuous high-power excitation. In the field of heat dissipation design of excitation source (LD chip), some scholars have carried out targeted explorations around the heat dissipation requirements. For example, the literature (MICROMACHINES, 2024, 15(8).) uses orthogonal experiments combined with neural network algorithms to optimize the key structural parameters of the microchannel heat sink, thereby reducing the maximum operating temperature of the system from 52.44℃ to 41.23℃. However, this optimization scheme has the problem of complex processing technology. The literature (APPLIED THERMAL ENGINEERING, 2025, 265.) optimized structural parameters such as the evaporation section cover plate, the number of fins, and the heat pipe insertion method of the U-shaped heat pipe radiator to improve the heat dissipation efficiency and temperature uniformity of the laser pump source. Results showed that at an excitation power of 300 W, the system's highest operating temperature was 43.8 ℃, and the total thermal resistance was 0.083 ℃ / W. Although this heat pipe-based heat dissipation scheme effectively improves the heat dissipation performance of the laser pump source, potential reliability issues such as heat pipe aging, working fluid performance degradation, and internal fouling effects still need to be considered during long-term operation.

[0005] Existing technologies, such as Chinese utility model patent CN216557052U, propose a layered intelligent heat dissipation architecture. This architecture effectively regulates waste heat through a linkage between a temperature and humidity sensor, a fan, and an electric actuator. However, this solution has two limitations: firstly, the temperature control ranges in this heat dissipation design are 90-165℃ and 195-270℃, which are still too high for the laser excitation source; secondly, the heat dissipation layer relies on a combination of dual fans, dual electric actuators, and a refrigeration compressor, leading to redundancy and structural complexity in the system components. This not only increases manufacturing costs and maintenance difficulty but also restricts the overall lightweighting of the LD lamp. Utility model patent CN221379979U designs a heat dissipation device for semiconductor lasers, employing a combination of a heat sink, phase change material, heating film, and fan. When the device is under high-temperature conditions, the fan and phase change material work together to dissipate heat; at low temperatures, the heating film raises the temperature. The temperature of the entire system is controlled in real-time by a control module. However, the phase change materials used in this scheme are expensive, and the response speed for switching between low-temperature heating and high-temperature heat dissipation modes is low. The scheme also has some shortcomings, mainly the high cost of phase change materials and the need to improve the response speed for switching between low-temperature heating and high-temperature heat dissipation modes.

[0006] In summary, research on heat dissipation in white light LD devices has mainly focused on improving the thermal conductivity of the fluorescent conversion materials themselves, and related results are quite abundant. However, research on thermal management of white light LD devices with remote excitation packaging architectures remains insufficient. Utility Model Content

[0007] To address the shortcomings in the aforementioned background technology, this utility model proposes a remotely excitation fluorescent ceramic white light LD device with heat dissipation function, which solves the problem of heat accumulation in existing fluorescent conversion white light laser devices due to the dual heat sources, namely the LD excitation source and the YAG:Ce fluorescent ceramic.

[0008] The technical solution of this utility model is implemented as follows: A remote excitation fluorescent ceramic white light LD device with heat dissipation function includes a heat dissipation fin, a heat dissipation component is provided inside the heat dissipation fin, an LD excitation source is provided at one end of the heat dissipation component, a fluorescent ceramic sheet that cooperates with the LD excitation source is provided at the other end of the heat dissipation component, a heat dissipation cover plate is provided at one end of the heat dissipation fin, a focusing lens that cooperates with the LD excitation source is provided on the heat dissipation cover plate, a lower end mounting cover plate is provided at the other end of the heat dissipation fin, and a cooling fan assembly is connected to the heat dissipation fin through the lower end mounting cover plate.

[0009] More preferably, the heat dissipation assembly includes a heat dissipation tube assembly and an LD base, with a fluorescent ceramic sheet mounted on the heat dissipation tube assembly, an LD excitation source mounted on the LD base, and the heat dissipation tube assembly installed inside the heat dissipation fins and passing through the heat dissipation fins to connect with the LD base.

[0010] More preferably, the heat dissipation tube assembly includes a copper substrate, one side of which is provided with a groove for a fluorescent ceramic sheet to fit, and at least four heat dissipation copper tubes are arranged circumferentially on the other side of the copper substrate. A focusing bowl for matching the LD excitation source is also provided on the copper substrate.

[0011] More preferably, the LD base is provided with a heat dissipation copper pipe mounting hole that cooperates with the heat dissipation copper pipe and a mounting hole that cooperates with the LD excitation source. The LD base is also provided with a heat dissipation hole corresponding to the heat dissipation fins.

[0012] In a further preferred embodiment, the heat dissipation fin cylinder is provided with a plurality of ventilation slots in the inner circumferential direction, and the heat dissipation fin is also provided with a plurality of heat dissipation fins corresponding to the corresponding ventilation slots. The heat dissipation fins are provided with ventilation channels and arc-shaped grooves corresponding to the heat dissipation copper pipes.

[0013] More preferably, the axial length of the heat dissipation fins is 28~44mm, and the thickness of the heat dissipation fins is 1.0~2.5mm.

[0014] More preferably, each end of the heat dissipation fin is provided with a connecting frame, and the heat dissipation fin is connected to the corresponding heat dissipation cover plate and the lower end mounting cover plate respectively through the corresponding connecting frame.

[0015] More preferably, both the heat dissipation cover and the lower mounting cover are provided with circumferentially arranged strip-shaped ventilation holes and heat dissipation holes corresponding to the ventilation slots.

[0016] More preferably, the cooling fan assembly includes a cooling frame and several circumferentially arranged cooling fins, the cooling frame forms a ring structure connected to the cooling frame, and a cooling fan is provided on the cooling frame, the cooling fan being located within the ring structure.

[0017] The beneficial effects of this utility model are as follows:

[0018] 1. This utility model utilizes the hollow, porous stem structure of horsetail grass and features a unique biomimetic heat dissipation structure, which improves the heat dissipation efficiency compared to other high-power fluorescent conversion white light LD lighting devices. This not only ensures the stable performance of the device during operation but also extends its service life, making it more competitive and reliable in high-power lighting applications and reducing the risk of device performance degradation and damage caused by heat accumulation.

[0019] 2. This invention provides a reliable thermal management solution for high-power solid-state lighting devices through a dual-heat source decoupling design and a copper-aluminum composite thermal conductive structure. By separating the LD excitation source and the fluorescent ceramic sheet vertically, independent heat dissipation paths are constructed, realizing heat dissipation channels of "LD excitation source → copper base → copper tube → heat dissipation fins" and "fluorescent ceramic → copper substrate → copper tube → heat dissipation fins." This effectively improves heat dissipation efficiency, prevents high device temperatures, and facilitates the packaging of remotely excited fluorescent ceramic devices and the application of fluorescent ceramics.

[0020] 3. This utility model is based on the innovative design of a fluorescent ceramic white light LD heat sink with remote excitation structure. By using independent heat transfer paths for dual heat sources, optimizing the heat dissipation structure and introducing a forced convection strategy, it significantly improves the heat dissipation efficiency and thermal stability of the device, effectively alleviates the temperature accumulation problem caused by the thermal coupling effect of dual heat sources, and reduces the risk of various problems caused by heat accumulation.

[0021] 4. This invention finely optimizes the axial length and thickness of the heat dissipation fins in the heat dissipation tube. An axial length of 44mm expands the convection surface area and enhances heat dissipation efficiency; a thickness of 2.0mm significantly improves longitudinal thermal conductivity, while further increases in thickness lead to heat accumulation. Reasonable parameter control optimizes heat dissipation and ensures stable device operation.

[0022] 5. The cooling fan assembly of this utility model significantly enhances the overall heat dissipation effect. When the fan inlet volumetric flow rate is in the range of 0.00181-0.0362 m³ / s, the heat dissipation effect is significantly improved. Precise control of fan speed and flow rate optimizes heat dissipation performance, ensuring that the device operates within a safe temperature range during high-power operation, improving reliability and stability, reducing the risk of overheating failure, and extending service life. Attached Figure Description

[0023] To more clearly illustrate the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is an exploded view of the present invention;

[0025] Figure 2 This is a schematic diagram of the assembly of this utility model;

[0026] Figure 3 This is a schematic diagram of the upper heat dissipation cover plate of this utility model;

[0027] Figure 4 This is a schematic diagram of the heat dissipation pipe assembly of this utility model;

[0028] Figure 5 This is a schematic diagram of the structure of the LD base of this utility model;

[0029] Figure 6 This is a schematic diagram of the structure of the heat dissipation fins of this utility model.

[0030] In the diagram: 1. Focusing lens, 2. Heat sink cover, 3. Fluorescent ceramic sheet, 4. Copper substrate, 4-1. Groove, 5. Concentrating bowl, 6. Heat sink fins, 6-1. Connecting frame, 6-2. Ventilation slot, 7. LD excitation source, 8. LD base, 8-1. Heat sink copper pipe mounting hole, 8-2. Mounting hole, 8-3. Heat sink hole one, 9. Lower mounting cover, 10. Cooling fan assembly, 10-1. Heat sink frame, 10-2. Heat sink fins, 10-3. Cooling fan, 11. Heat sink copper pipe, 12. Heat sink fins, 12-1. Ventilation duct, 12-2. Arc-shaped groove, 13. Strip-shaped ventilation hole, 14. Heat sink hole two. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] like Figure 1As shown in Embodiment 1, a remotely excited fluorescent ceramic white light LD device with heat dissipation function includes a heat dissipation fin 6, a heat dissipation component inside the heat dissipation fin 6, an LD excitation source 7 at one end of the heat dissipation component, preferably a Nichia NUBM4C (7W) laser diode emitting 455 nm blue light, a fluorescent ceramic sheet 3 cooperating with the LD excitation source 7 at the other end of the heat dissipation component, a heat dissipation cover plate 2 at one end of the heat dissipation fin 6, a focusing lens 1 cooperating with the LD excitation source 7 on the heat dissipation cover plate 2, and a condensing lens integrated on the upper part of the heat dissipation cover plate 2 for focusing the light beam, a lower end mounting cover plate 9 at the other end of the heat dissipation fin 6, a heat dissipation cover plate 2 for encapsulating and fixing the heat dissipation tube assembly and the fluorescent ceramic sheet 3 connected to one side of the heat dissipation fin 6, a lower end mounting cover plate 9 for encapsulating and fixing the LD light source assembly and the LD base 8 connected to the other side of the heat dissipation fin 6, and a cooling fan assembly 10 connected to the heat dissipation fin 6 through the lower end mounting cover plate 9. Both the LD excitation source 7 and the fluorescent ceramic sheet 3 are mounted on the heat dissipation assembly. The LD excitation source and the fluorescent ceramic sheet 3 are arranged separately, creating independent heat dissipation paths. The heat dissipation assembly is installed inside the heat dissipation fin 6. The heat dissipation assembly and the heat dissipation fin 6 form a heat dissipation channel. With the cooperation of the heat dissipation fin 6 and the heat dissipation fan assembly 10, the heat dissipation efficiency is effectively improved, preventing the device from overheating. This is beneficial for the packaging of remotely excited fluorescent ceramic devices and the application of fluorescent ceramics. It also improves the stability of the device during operation and extends its service life, making it more competitive and reliable in high-power lighting applications. It also reduces the risk of device performance degradation and damage caused by heat accumulation.

[0033] In this embodiment, the heat dissipation assembly includes a heat dissipation pipe assembly and an LD base 8. A fluorescent ceramic sheet 3 is mounted on the heat dissipation pipe assembly, and an LD excitation source 7 is mounted on the LD base 8. The heat dissipation pipe assembly is installed inside a heat dissipation fin 6 and passes through the fin 6 to connect with the LD base 8. The heat dissipation pipe assembly and the LD base 8 work together to mount the fluorescent ceramic sheet 3 and the LD excitation source 7. This allows for the fixing of the fluorescent ceramic sheet 3 and the LD excitation source 7, while also enabling the LD excitation source 7 and the fluorescent conversion material to form an independent heat dissipation channel in conjunction with the heat dissipation fin 6. Based on a "horsetail" biomimetic heat dissipation structure design, efficient collaborative management of the two heat sources is achieved.

[0034] like Figure 1As shown in Embodiment 2, a remotely excited fluorescent ceramic white light LD device with heat dissipation function is described. The heat dissipation tube assembly includes a copper substrate 4. One side of the copper substrate 4 has a groove 4-1 for a fluorescent ceramic sheet 3 to fit into. The fluorescent ceramic sheet 3 and the copper substrate 4 are clamped and fixed between the heat dissipation cover plate 2 and the heat dissipation fin 6. At least four heat dissipation copper tubes 11 are arranged circumferentially on the other side of the copper substrate 4. The copper substrate 4 also has a focusing bowl 5 that fits into the LD excitation source 7. The focusing bowl 5 is located inside the heat dissipation copper tubes 11. The copper substrate 4 is supported by the heat dissipation fin 6. The upper part of the copper substrate 4 has a groove 4-1 with the same diameter as the fluorescent ceramic sheet 3 and a depth equal to the thickness of the fluorescent ceramic sheet 3. The groove 4-1 is used to install the fluorescent ceramic sheet 3. During operation, the fluorescent ceramic is excited and generates heat. The heat is transferred to the copper substrate 4 by thermal conduction, and then to the heat dissipation copper tubes 11. The lower part of the copper substrate 4 is machined with threaded holes, and the focusing bowl 5 is installed using screws. The heat dissipation copper pipe 11 is inserted into the heat dissipation fin 6 along the cylindrical groove 4-1. The upper part is connected to the copper substrate 4, and the lower part is connected to the LD base 8. The heat of the heat dissipation copper pipe 11 is transferred to the heat dissipation fin 6 by thermal conduction.

[0035] In this embodiment, the LD base 8 is provided with a heat dissipation copper pipe mounting hole 8-1 that mates with the heat dissipation copper pipe 11 and a mounting hole 8-2 that mates with the LD excitation source 7. The LD base 8 is also provided with a heat dissipation hole 8-3 corresponding to the heat dissipation fins 6. The LD excitation source is installed in the center of the LD base 8, and the heat from the LD excitation source is transferred to the LD base 8 by thermal conduction. The heat dissipation copper pipe 11 is installed around the circumference of the LD base 8, and the heat is then transferred to the heat dissipation copper pipe 11 by thermal conduction.

[0036] All other structures are the same as in Example 1.

[0037] like Figure 1 As shown in Embodiment 3, a remote-excited fluorescent ceramic white light LD device with heat dissipation function is described. The heat dissipation fin 6 has several ventilation slots 6-2 arranged circumferentially within its inner fin. The heat dissipation fin 10-2 also has several heat dissipation fins corresponding to the ventilation slots 6-2. Ventilation ducts are provided within the heat dissipation fins, and arc-shaped grooves 12-2 corresponding to the heat dissipation copper tubes 11 are provided on the heat dissipation fins. The axial length of the heat dissipation fins is 28~44mm, and the thickness of the heat dissipation fins is 1.0~2.5mm. Heat is transferred to the environment through forced convection heat transfer. The heat dissipation tube assembly is inserted into the heat dissipation fin 6 along the cylindrical grooves 4-1, the number of cylindrical grooves 4-1 corresponding to the number of tubes in the heat dissipation tube assembly. The heat dissipation fin 6 is connected to the heat dissipation cover plate 2 and the lower mounting cover plate 9 by bolts.

[0038] In this embodiment, both ends of the heat dissipation fin 6 are provided with connecting brackets 6-1, and the heat dissipation fin 6 is connected to the corresponding heat dissipation cover plate 2 and the lower mounting cover plate 9 respectively through the corresponding connecting brackets 6-1. The heat dissipation cover plate 2 and the lower mounting cover plate 9 are provided with circumferentially arranged strip-shaped ventilation holes 13 and heat dissipation holes 14 corresponding to the ventilation slot holes 6-2. The edge of the heat dissipation cover plate 2 is provided with ventilation holes. When forced air cooling convection heat dissipation is performed, the airflow absorbs the heat of the heat dissipation fin 10-2 and flows out smoothly from the ventilation holes of the heat dissipation cover plate 2. The lower mounting cover plate 9 is fastened to the heat dissipation fin 6 and the cooling fan assembly 10 by bolts, and the LD base 8 is clamped and fixed between the heat dissipation copper pipe 11 and the lower mounting cover plate 9.

[0039] Specifically, a dual-heat-source decoupling design is adopted: the LD excitation source and the fluorescent ceramic sheet 3 are arranged separately vertically, achieving heat source isolation through remote excitation; and an independent heat dissipation path is constructed: LD excitation source → copper base → heat dissipation copper pipe 11 → heat dissipation fins and fluorescent ceramic → copper substrate 4 → heat dissipation copper pipe 11 → heat dissipation fins. Heat is rapidly conducted through the bottom cage-like copper pipe array 11, i.e., multiple annular parallel copper pipes 11, and combined with the aluminum alloy heat dissipation fins 6, i.e., annular fins with longitudinal square grooves on the inner wall to enhance convective heat dissipation. At the same time, a forced air cooling system is integrated to improve convective heat transfer efficiency. This design excites the fluorescent ceramic through the LD chip, and uses the passive heat dissipation components inside the device and the active heat dissipation system at the bottom to dissipate heat from the LD excitation source and the fluorescent ceramic, respectively. Its independent thermal channels and shared heat sink architecture achieve efficient heat dissipation of the dual heat sources, providing a reliable thermal management solution for high-power solid-state lighting devices.

[0040] All other structures are the same as in Example 2.

[0041] like Figure 1 As shown in Example 4, a remote-excited fluorescent ceramic white light LD device with heat dissipation function is described. The heat dissipation fan assembly 10 includes a heat dissipation frame 10-1 and several circumferentially arranged heat dissipation fins 10-2. The heat dissipation frame 10-1 forms a ring structure connected to the heat dissipation fan assembly 10-2. A heat dissipation fan 10-3 is mounted on the heat dissipation frame 10-1 and is located within the ring structure. The heat dissipation fan is preferably a Thermalright TL-G12 heat dissipation fan. The Thermalright TL-G12 heat dissipation fan is installed at the bottom of the device and mainly consists of a fan housing and fan blades. Its function is to generate airflow and provide forced convection heat transfer conditions for heat dissipation of the device.

[0042] Specifically, a layered mechanical structure is adopted, with the cooling fan assembly providing active cooling. The cooling fins are designed to mimic the hollow, porous structure of a horsetail grass stem, resulting in a unique and innovative cooling fin structure. Fluorescent ceramic discs are embedded in the recessed holes on the upper surface of the heat dissipation tube assembly, and the annular array of metal tubes at its bottom is inserted into the circular grooves of the cooling fins. The LD excitation source is nested within the circular hole of the mounting base, which is connected to the upper metal tube array via an annular fan-shaped perforated base. The cooling fins 6 are designed with cooling fins, cylindrical grooves, and cooling air ducts. The axial length of the cooling fins is 44 mm, and the thickness is 2.0 mm. The cooling fins 6 are connected to the heat dissipation cover plate 2 and the lower mounting cover plate 9 by bolts. The heat dissipation tube assembly 4 is installed inside the cooling fins 6. The heat dissipation tube assembly 4 includes a fluorescent ceramic copper substrate and eight heat dissipation copper tubes. The heat dissipation copper tubes are inserted into the heat dissipation fins 6 along cylindrical grooves. The copper substrate is supported by the heat dissipation fins, and its upper part has a groove with the same diameter as the fluorescent ceramic sheet 5 and a depth equal to the thickness of the fluorescent ceramic sheet 5. This groove is used to install the fluorescent ceramic sheet 5. During operation, the fluorescent ceramic sheet 5 is excited and generates heat. The heat is transferred to the copper substrate by thermal conduction, then to the heat dissipation copper tubes, and finally to the heat dissipation fins 6, where it is cooled by forced convection. Threaded holes are machined in the lower part of the copper substrate, and a focusing bowl 5 is installed using screws to focus the beam of the LD excitation source 7. The upper part of the heat dissipation copper tubes is connected to the copper substrate, and the lower part is connected to the LD base 8. A heat dissipation cover plate 2 is connected to the upper part of the heat dissipation fins 6 to fix the heat dissipation tube assembly 5 and the fluorescent ceramic sheet 3. The fluorescent ceramic sheet 3 and the heat dissipation tube assembly 4 are clamped and fixed between the heat dissipation cover plate 2 and the heat dissipation fins 6. The heat dissipation cover 2 has ventilation holes on its edge. During forced air-cooled convection heat dissipation, the airflow absorbs the heat from the heat dissipation fins and flows smoothly out through the ventilation holes of the heat dissipation cover 2. The upper part of the heat dissipation cover 2 integrates a focusing light condenser 1 to concentrate the light beam. The lower part of the heat dissipation fin 6 is connected to a lower mounting cover 9 for fixing the LD excitation source 7 and the LD base 8. The LD base 8 has mounting holes for the LD excitation source 7 and heat dissipation copper pipes. The LD excitation source 7 is installed in the center of the LD base 8. The heat from the LD excitation source 7 is transferred to the LD base 8 by heat conduction. The heat dissipation copper pipe is installed around the circumference of the LD base 8, and the heat is then transferred to the heat dissipation copper pipe by heat conduction, and finally to the heat dissipation fin 6, where it is cooled by forced air-cooled convection. The lower mounting cover 9 has mounting holes for the LD base 8, ventilation holes, and bolt connection through holes. The lower mounting cover 9 is fastened to the heat dissipation fin 6 and the cooling fan 10 assembly by bolts. The LD base 8 is clamped and fixed between the heat dissipation pipe assembly 4 and the lower mounting cover 9. The cooling fan assembly 10 is installed at the bottom of the device and mainly consists of a fan housing and fan blades. Its function is to generate airflow and provide forced convection heat transfer conditions for the device to dissipate heat. The airflow speed is 2 m / s and the fan flow rate is 0.00362 m³ / s. 3A heat source decoupling design and a copper-aluminum composite thermal conductive structure were designed to construct a "dual heat source" heat dissipation channel, which improved heat dissipation efficiency and solved technical problems such as device instability and short lifespan caused by heat accumulation in the device.

[0043] All other structures are the same as in Example 3.

[0044] like Figures 1-3 As shown in Example 5, a remote-excited fluorescent ceramic white light LD device with heat dissipation function includes a heat dissipation fin 6. The heat dissipation fin 6 is designed with heat dissipation fins, cylindrical grooves, and heat dissipation channels. The axial length of the heat dissipation fins is 44 mm, and the thickness of the heat dissipation fins is 2.0 mm. The heat dissipation fin 6 is connected to the heat dissipation cover plate 2 and the lower mounting cover plate 9 by bolts. A heat dissipation tube assembly 4 is installed inside the heat dissipation fin 6. The heat dissipation tube assembly 4 includes a fluorescent ceramic copper substrate and four heat dissipation copper tubes, which are inserted into the heat dissipation fin 6 along the cylindrical grooves. A cooling fan assembly 10 is installed at the bottom of the device, mainly consisting of a fan housing and fan blades. Its function is to generate airflow, providing forced convection heat transfer conditions for device heat dissipation, with a wind speed of 2 m / s and a fan flow rate of 0.00362 m³ / s. 3 / s.

[0045] In this embodiment, changing the number of heat pipes in the heat pipe assembly 4 is equivalent to changing the number of "heat conduction channels." When the number of heat pipes exceeds a certain threshold, the improvement in heat dissipation effect will decrease, and the heat dissipation cost will increase. If the number of heat pipes is too small, local heat from the heat source cannot be dissipated in time, which may lead to "hot spots" and affect hardware stability. At the same time, multiple heat pipes can distribute heat more evenly. The basic number of heat pipes should be determined according to the power consumption of the heat source, aiming for sufficiency without redundancy.

[0046] All other structures are the same as in Example 4.

[0047] like Figures 1-5 As shown in Example 6, a remote-excited fluorescent ceramic white light LD device with heat dissipation function includes a heat dissipation fin 6. The heat dissipation fin 6 is designed with heat dissipation fins, cylindrical grooves, and heat dissipation channels. The axial length of the heat dissipation fins is 28 mm, and the thickness of the heat dissipation fins is 2.5 mm. The heat dissipation fin 6 is connected to the heat dissipation cover plate 2 and the lower mounting cover plate 9 by bolts. A heat dissipation tube assembly 4 is installed inside the heat dissipation fin 6. The heat dissipation tube assembly 4 includes a fluorescent ceramic copper substrate and four heat dissipation copper tubes, which are inserted into the heat dissipation fin 6 along the cylindrical grooves. A cooling fan assembly 10 is installed at the bottom of the device, mainly consisting of a fan housing and fan blades. Its function is to generate airflow, providing forced convection heat transfer conditions for device heat dissipation, with a wind speed of 3 m / s and a fan flow rate of 0.00543 m³ / s. 3 / s.

[0048] In this embodiment, the main performance parameters of the heat dissipation fin 6 are the axial length and thickness of the heat dissipation fins. When the axial length of the fins increases from 28 mm to 44 mm, the fin extension effectively alleviates the energy accumulation in the core heat source area. The increase in axial length enhances heat dissipation efficiency by expanding the convective surface area, promoting more uniform heat diffusion along the fin axis. The axial length of the heat dissipation fins is significantly positively correlated with the heat dissipation performance of the white LED device. When the thickness of the heat dissipation fins increases from 1.0 mm to 2.0 mm, the increased fin cross-sectional area significantly improves the longitudinal thermal conductivity. When the thickness increases to 2.5 mm, the maximum system temperature rebounds and the temperature gradient expands. This is because the lateral thermal resistance increases due to the reduced fin spacing, while the convective heat transfer level decreases, and heat accumulates locally at the fin root. The cooling fan assembly 10, when the inlet volumetric flow rate increases from 0.00181 m³ / s... 3 / s corresponds to a wind speed increase from 1 m / s to 0.00724 m. 3 / s corresponds to a wind speed of 4 m / s, at which point the system temperature shows a significant decreasing trend. Within the range of 0.00181-0.0362 m... 3 The heat dissipation effect is most significantly improved in the flow rate range of / s, which is better than that in the range of 0.0362-0.00724 m. 3 / s interval.

[0049] All other structures are the same as in Example 5.

[0050] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A remotely excitation fluorescent ceramic white light LD device with heat dissipation function, characterized in that: The device includes a heat dissipation fin (6), a heat dissipation assembly is provided inside the heat dissipation fin (6), an LD excitation source (7) is provided at one end of the heat dissipation assembly, a fluorescent ceramic sheet (3) that cooperates with the LD excitation source (7) is provided at the other end of the heat dissipation assembly, a heat dissipation cover plate (2) is provided at one end of the heat dissipation fin (6), a focusing lens (1) that cooperates with the LD excitation source (7) is provided on the heat dissipation cover plate (2), a lower end mounting cover plate (9) is provided at the other end of the heat dissipation fin (6), and a heat dissipation fan assembly (10) is connected to the heat dissipation fin (6) through the lower end mounting cover plate (9).

2. The white light LD device with remote excitation and heat dissipation function according to claim 1, characterized in that: The heat dissipation assembly includes a heat dissipation tube assembly and an LD base (8). A fluorescent ceramic sheet (3) is mounted on the heat dissipation tube assembly, and an LD excitation source (7) is mounted on the LD base (8). The heat dissipation tube assembly is installed inside the heat dissipation fin (6) and passes through the heat dissipation fin (6) to connect with the LD base (8).

3. The remote-excited fluorescent ceramic white light LD device with heat dissipation function according to claim 2, characterized in that: The heat dissipation tube assembly includes a copper substrate (4), one side of which is provided with a groove (4-1) for the fluorescent ceramic sheet (3) to cooperate with, and at least four heat dissipation copper tubes (11) are arranged circumferentially on the other side of the copper substrate (4).

4. The remote-excited fluorescent ceramic white light LD device with heat dissipation function according to claim 3, characterized in that: The copper substrate (4) is also provided with a focusing bowl (5) that works in conjunction with the LD excitation source (7).

5. The white light LD device with remote excitation and heat-dissipation function according to any one of claims 2-4, characterized in that: The LD base (8) is provided with a heat dissipation copper pipe mounting hole (8-1) that cooperates with the heat dissipation copper pipe (11) and a mounting hole (8-2) that cooperates with the LD excitation source (7). The LD base (8) is also provided with a heat dissipation hole (8-3) corresponding to the heat dissipation fin (6).

6. The remote-excited fluorescent ceramic white light LD device with heat dissipation function according to claim 5, characterized in that: The heat dissipation fin (6) has several ventilation slots (6-2) arranged in the inner circumferential direction. The heat dissipation fin (10-2) also has several heat dissipation fins (12) corresponding to the corresponding ventilation slots (6-2). The heat dissipation fins (12) have ventilation channels (12-1) and arc-shaped grooves (12-2) corresponding to the heat dissipation copper pipe (11) on the heat dissipation fins (12).

7. The remote-excited fluorescent ceramic white light LD device with heat dissipation function according to claim 6, characterized in that: The axial length of the heat dissipation fins (12) is 28~44mm, and the thickness of the heat dissipation fins (12) is 1.0~2.5mm.

8. The white light LD device with remote excitation and heat-dissipation function according to any one of claims 2-4, 6 and 7, characterized in that: Both ends of the heat dissipation fin (6) are provided with connecting brackets (6-1). The heat dissipation fin (6) is connected to the corresponding heat dissipation cover plate (2) and the lower end mounting cover plate (9) respectively through the corresponding connecting brackets (6-1).

9. The remote-excited fluorescent ceramic white light LD device with heat dissipation function according to claim 8, characterized in that: Both the heat dissipation cover plate (2) and the lower mounting cover plate (9) are provided with circumferentially arranged strip ventilation holes (13) and heat dissipation holes (14) corresponding to the ventilation slot holes (6-2).

10. The white light LD device with remote excitation and heat-dissipation function according to any one of claims 2-4, 6, 7, 9, wherein: The cooling fan assembly (10) includes a cooling frame (10-1) and several circumferentially arranged cooling fins (10-2). The cooling frame (10-1) forms a ring structure connected to the cooling frame (10-1). A cooling fan (10-3) is provided on the cooling frame (10-1) and is located inside the ring structure.

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