Image sensor focusing device and camera module

Abstract

The utility model relates to the field of image sensor driving, and provides an image sensor focusing device and a camera module, the focusing device comprises an upper cover, an upper spring, a magnet, a coil, a carrier and a circuit board; the inner side of the upper cover is connected with a magnet; the carrier is positioned inside the upper cover; the carrier is connected with the coil; when the coil is loaded with current, the coil is used for driving the carrier to move along the optical axis; the first end of the upper spring is connected with the upper cover; the second end of the upper spring is connected with the carrier; the upper spring is used for providing buffering and automatic resetting for the carrier; the circuit board is provided with a fixed part, a deformation part and a movable part; the fixing part is fixedly connected with the upper cover; the inner end of the fixed part is connected with the deformation part; the inner end of the deformation part is connected with the moving part; the top end of the moving part is fixedly connected with the bottom end of the carrier; the coil, the moving part, the deformation part and the fixed part are electrically connected in sequence; and the deformation part is used for providing buffering and automatic resetting for the moving part. The focusing device is used for reducing the weight of a carrier load, so that the closed-loop control of focusing is easier to achieve balance.

Description

Technical Field

[0001] This utility model relates to the field of image sensor driving, and in particular to an image sensor focusing device and a camera module. Background Technology

[0002] In related technologies, the size and structural complexity of built-in camera modules in smart terminals are increasing, and the weight of their lens assemblies is also growing. When driving the lens assembly to move for focusing, the heavier lens assembly increases the load on the voice coil motor, leading to increased power consumption in the smart terminal. The greater the weight of the lens assembly, the greater its inertia, making it more difficult to achieve a balanced focus, increasing reliability risks and significantly degrading image quality. Therefore, there is an urgent need for an image sensor focusing device and camera module to address these issues. Utility Model Content

[0003] The purpose of this invention is to provide an image sensor focusing device and a camera module, which reduces the weight of the carrier load so that focusing control can be more easily balanced.

[0004] In a first aspect, this utility model provides an image sensor focusing device, comprising: an upper cover, an upper spring, a magnet, a coil, a carrier, and a circuit board; the magnet is connected to the inner side of the upper cover; the carrier is located inside the upper cover; the carrier is connected to the coil; when the coil is loaded with current, it drives the carrier to move along the optical axis; the first end of the upper spring is connected to the upper cover; the second end of the upper spring is connected to the carrier; the first end and the second end of the upper spring are positioned opposite each other; the upper spring provides buffering and automatic reset for the carrier; the circuit board has a fixed part, a deformable part, and a movable part; the fixed part is fixedly connected to the upper cover; the inner end of the fixed part is connected to the deformable part; the inner end of the deformable part is connected to the movable part; an image sensor is disposed at the center of the movable part; the light-receiving surface of the image sensor is perpendicular to the optical axis; the movable part is fixedly connected to the carrier; the coil, the movable part, the deformable part, and the fixed part are electrically connected in sequence; the deformable part provides buffering and automatic reset for the movable part.

[0005] Optionally, a gasket is connected to the side of the fixing part away from the carrier; a buffer space is provided inside the gasket; the buffer space is used to accommodate the deformable part and the moving part after they have moved along the optical axis.

[0006] Optionally, the carrier has an embedded metal conductive component, and the coil is electrically connected to the circuit board through the metal conductive component.

[0007] Optionally, the top cover includes a plastic part and a magnetic metal sheet; the magnetic metal sheet is embedded inside the plastic part to shield the magnetic field on both the inside and outside of the top cover.

[0008] Optionally, the bottom end of the magnetic metal sheet has a soldering foot; the soldering foot is connected to a substrate; the substrate is located on the bottom side of the pad.

[0009] Optionally, the carrier has protrusions at both its top and bottom ends; the top end of the protrusion at the top end of the carrier is higher than the top end of the upper spring, for buffering the impact of the carrier on the upper cover; the bottom end of the protrusion at the bottom end of the carrier is lower than the bottom end of the moving part, for buffering the impact of the carrier on the substrate.

[0010] Optionally, the carrier is arranged in a rectangular frame shape; the protrusions are distributed at the four corners of the carrier; the protrusions are fixedly connected to the upper spring.

[0011] Optionally, the upper springs connected to the diagonally distributed bosses at the four corners of the carrier are arranged in a centrally symmetrical or axially symmetrical manner to balance the force exerted by the upper springs on the carrier.

[0012] Optionally, the moving part is electrically connected to a control chip, and the control chip is electrically connected to a displacement sensor and the coil; the displacement sensor is used to acquire the position data of the carrier; the control chip is used to control the current on the coil based on the position data, so that the position of the carrier is subject to open-loop control.

[0013] Optionally, the coil is electrically connected to a Hall chip, which is used to acquire the position data of the carrier; the Hall chip has a built-in control algorithm for controlling the current on the coil based on the position data, so that the position of the carrier is subject to closed-loop control.

[0014] Optionally, the control chip is located on the bottom side of the coil; a gap is provided between the control chip and the coil to prevent the coil from being squeezed.

[0015] Optionally, the moving part is configured as a rigid circuit board; the deformable part is configured as a metal elastic arm.

[0016] Optionally, the fixing part is configured as a flexible circuit board; the flexible circuit board includes an insulating layer and a conductive layer that are fixedly connected; the metal elastic arm is made of the conductive layer; the insulating layer is used to provide support for the moving part.

[0017] Optionally, the fixing part is a rigid circuit board; the side end face of the upper cover is provided with an inner groove extending in a horizontal direction, the horizontal direction being perpendicular to the optical axis direction; the rigid circuit board is inserted into the inner side of the upper cover along the inner groove, and the bottom side of the inner groove is provided with a buffer space for accommodating the deformable part and the moving part.

[0018] Secondly, the present invention provides a camera module, including an image sensor focusing device as described in any one of the first aspects, and further including an image stabilization device; the image stabilization device includes a movable frame connected to the outside of the focusing device; a base is provided on the outside of the movable frame; an image stabilization drive assembly is provided between the base and the movable frame for driving the movable frame and the focusing device to move in a horizontal direction; the horizontal direction is perpendicular to the optical axis direction.

[0019] The beneficial effects of this utility model are as follows: by fixing the top end of the moving part to the bottom end of the carrier, the weight of the carrier load is reduced; by using the deformable part and the upper spring together to provide buffering and automatic reset for the carrier and the moving part, the energy consumption required to drive the carrier to focus is saved, the control of focus is easier to achieve balance, and it is also conducive to improving the shooting effect. Attached Figure Description

[0020] Figure 1 An exploded view of an image sensor focusing device provided by this utility model;

[0021] Figure 2 A schematic diagram of the installation structure of the top cover provided by this utility model;

[0022] Figure 3 A schematic diagram of the welding structure between the movable part and the pin provided by this utility model;

[0023] Figure 4 A schematic diagram of the distribution of protrusions at the top of a carrier provided by this utility model;

[0024] Figure 5 A schematic diagram showing the distribution of protrusions at the bottom of a carrier provided by this utility model;

[0025] Figure 6 A cross-sectional view of the layout of the assembled focusing device provided by this utility model;

[0026] Figure 7 A structural block diagram of a camera module provided by this utility model.

[0027] Explanation of the reference numerals in the figure:

[0028] 1. Top cover; 2. Carrier; 3. Circuit board; 4. Magnet; 5. Coil; 6. Upper spring; 7. Image sensor; 8. Gasket; 9. Substrate;

[0029] 11. Top face; 12. Side face; 13. Welding foot; 21. Boss; 22. Pin; 31. Fixing part; 32. Deformable part; 33. Moving part;

[0030] 61. First end; 62. Second end; 63. First spring; 64. Second spring; 71. Control chip; 72. Displacement sensor; 81. Buffer space;

[0031] 100. Focusing device; 200. Base; 210. Image stabilization drive assembly; 220. Moving frame. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0033] In response to the problems existing in the current technology, such as Figure 1As shown, the present invention provides a first embodiment of an image sensor focusing device, comprising: an upper cover 1, an upper spring 6, a magnet 4, a coil 5, a carrier 2, and a circuit board 3; the magnet 4 is connected to the inner side of the upper cover 1; the carrier 2 is located inside the upper cover 1; the carrier 2 is connected to the coil 5; when a current is applied to the coil 5, it drives the carrier 2 to move along the optical axis; the first end 61 of the upper spring 6 is connected to the upper cover 1; the second end 62 of the upper spring 6 is connected to the carrier 2; the first end 61 and the second end 62 of the upper spring 6 are positioned opposite each other; the upper spring 6 is used to focus the carrier 2. The circuit board 3 provides buffering and automatic reset; it has a fixed part 31, a deformable part 32, and a movable part 33; the fixed part 31 is fixedly connected to the upper cover 1; the inner end of the fixed part 31 is connected to the deformable part 32; the inner end of the deformable part 32 is connected to the movable part 33; an image sensor 7 is provided at the center of the movable part 33; the light-receiving surface of the image sensor 7 is perpendicular to the optical axis; the movable part 33 is fixedly connected to the carrier 2; the coil 5, the movable part 33, the deformable part 32, and the fixed part 31 are electrically connected in sequence; the deformable part 32 is used to provide buffering and automatic reset for the movable part 33.

[0034] like Figure 2 As shown, in some specific embodiments, the upper cover 1 is disposed on the top side of the carrier 2; the upper cover 1 has a top surface 11 and a side surface 12 inside; a first gap is provided between the carrier 2 and the top surface 11, and a second gap is provided between the carrier 2 and the side surface 12. The first gap is used to provide space for the carrier 2 to move towards the top surface 11 along the optical axis; the second gap is used to avoid friction between the carrier 2 and the side surface 12.

[0035] In other specific embodiments, the first end 61 of the upper spring 6 is fixedly connected to the top surface 11.

[0036] In some specific embodiments, the optical axis direction is the Z direction or the reverse Z direction; the light-receiving surface of the image sensor 7 extends along the X and Y directions. The Z, X, and Y directions are perpendicular to each other.

[0037] In some specific embodiments, the end closer to the end point in the Z direction is the top end, and the end closer to the start point in the Z direction is the bottom end; the top end of the moving part 33 is fixedly connected to the bottom end of the carrier 2.

[0038] It is worth noting that in this embodiment, the top end of the moving part 33 is fixedly connected to the bottom end of the carrier 2, which reduces the weight of the carrier 2. The deformable part 32 and the upper spring 6 together provide buffering and automatic reset for the carrier 2 and the moving part 33, saving the energy required to drive the carrier 2 to focus. The control of focus is easier to achieve balance, and it is also beneficial to improve the shooting effect.

[0039] In some embodiments, a pad 8 is connected to the bottom side of the fixing part 31; a buffer space 81 is provided in the pad 8; the buffer space 81 is used to accommodate the deformable part 32 and the moving part 33 after they have moved along the optical axis.

[0040] In some specific embodiments, both the gasket 8 and the fixing part 31 are configured as rectangular frames; both the rectangular frame-shaped gasket 8 and the fixing part 31 have inner and outer contours.

[0041] In other specific embodiments, the inner contour of the fixing part 31 is located within the inner contour of the gasket 8. Or, the inner contour of the fixing part 31 coincides with the inner contour of the gasket 8. This design can prevent the movement of the deformable part 32 from being restricted.

[0042] In some embodiments, the carrier 2 has an embedded metal conductive element (not shown in the figure), and the coil 5 is electrically connected to the circuit board 3 through the metal conductive element.

[0043] Specifically, the top end of the metal conductive component is electrically connected to the coil 5; the bottom end of the metal conductive component is electrically connected to the moving part 33.

[0044] like Figure 3 As shown, in some specific embodiments, the bottom end of the metal conductive component is configured as a pin 22; the pin 22 is welded to the moving part 33. It is worth noting that the number of pins 22 is N, where N is a positive integer.

[0045] In some embodiments, the top cover 1 includes a plastic part and a magnetic metal sheet; the magnetic metal sheet is embedded inside the plastic part to shield the magnetic fields on the inner and outer sides of the top cover 1 and enhance the magnetic field strength generated by the magnet 4.

[0046] In some specific embodiments, the magnetic metal sheet is a steel sheet. The steel sheet also serves to enhance the strength of the upper cover 1.

[0047] In some embodiments, the bottom end of the magnetic metal sheet has a soldering foot 13; the soldering foot 13 is connected to a substrate 9; the substrate 9 is located on the bottom side of the pad 8.

[0048] Please refer to Figure 1 and Figure 2In some specific embodiments, a plurality of the welding feet 13 are distributed on the bottom side of the side end face 12; the welding feet 13 are used to weld the substrate 9 or the gasket 8.

[0049] In other specific embodiments, the welding foot 13 is fixedly connected to or integrally formed with the magnetic metal sheet.

[0050] like Figure 4 and Figure 5 As shown, in some embodiments, both the top and bottom ends of the carrier 2 are provided with protrusions 21; the top end of the protrusion 21 at the top end of the carrier 2 is higher than the top end of the upper spring 6; it is used to buffer the impact of the carrier 2 on the upper cover 1; the bottom end of the protrusion 21 at the bottom end of the carrier 2 is lower than the bottom end of the moving part 33; it is used to buffer the impact of the carrier 2 on the substrate 9.

[0051] In some specific embodiments, a first damping rubber block (not shown in the figure) is further provided between the boss 21 at the top of the carrier 2 and the top surface 11. For example, the first damping rubber block is fixedly connected to the boss 21 at the top of the carrier 2 and the top surface 11. In another example, the first damping rubber block is fixedly connected to the boss 21 at the top of the carrier 2 and abuts against the top surface 11 when the carrier 2 moves along the optical axis. In yet another example, the first damping rubber block is fixedly connected to the top surface 11 and abuts against the boss 21 at the top of the carrier 2 when the carrier 2 moves along the optical axis.

[0052] Please refer to Figure 5 As shown, it is worth noting that the protrusion 21 located at the bottom end of the carrier 2 is situated between the fixed part 31 and the moving part 33. The protrusion 21 at the bottom end of the carrier 2 does not contact the fixed part 31 to prevent friction between the carrier 2 and the fixed part 31. The protrusion 21 at the bottom end of the carrier 2 is partially located within the buffer space 81.

[0053] In some specific embodiments, a second damping block (not shown) is further provided between the boss 21 at the bottom end of the carrier 2 and the substrate 9. Exemplarily, the second damping block is fixedly connected to the boss 21 at the bottom end of the carrier 2 and the substrate 9. In another example, the second damping block is fixedly connected to the boss 21 at the bottom end of the carrier 2 and abuts against the substrate 9 when the carrier 2 moves along the optical axis. In yet another example, the second damping block is fixedly connected to the substrate 9 and abuts against the boss 21 at the bottom end of the carrier 2 when the carrier 2 moves along the optical axis.

[0054] In some embodiments, the carrier 2 is arranged in a rectangular frame shape; the protrusions 21 are distributed at the four corners of the carrier 2; the protrusions 21 are fixedly connected to the upper spring 6.

[0055] In some specific embodiments, the boss 21 located at the top of the carrier 2 is fixedly connected to the second end 62 of the upper spring 6.

[0056] In some embodiments, the upper springs 6 connected to the diagonally distributed bosses 21 at the four corners of the carrier 2 are arranged in a centrally symmetrical or axially symmetrical manner so that the force exerted by the upper springs 6 on the carrier 2 is balanced.

[0057] Please refer to Figure 2 As shown, in some specific embodiments, the upper spring 6 includes a first spring 63 and a second spring 64; the first spring 63 and the second spring 64 are centrally symmetrical about the center point of the carrier 2.

[0058] In other specific embodiments, the first spring 63 and the second spring 64 are arranged axially symmetrically about the optical axis of the carrier 2. The optical axis passes through the center point of the carrier 2 and is parallel to the direction of the optical axis.

[0059] In some specific embodiments, the upper spring 6 further includes a third spring and a fourth spring; the third spring and the fourth spring are arranged in a centrally symmetrical manner about the center point of the carrier 2.

[0060] In some specific embodiments, the third spring and the fourth spring are arranged symmetrically about the optical axis of the carrier 2. The optical axis passes through the center point of the carrier 2 and is parallel to the direction of the optical axis.

[0061] It is worth noting that in this embodiment, the upper springs 6, which are arranged diagonally, are centrally symmetrical or axially symmetrical, so that the carrier 2 always maintains a horizontal force balance before and after movement, without the need for additional anti-torsion and guiding components, which helps to further reduce the weight of the carrier 2.

[0062] In some embodiments, the moving part 33 is electrically connected to a control chip 71; the control chip 71 is electrically connected to a displacement sensor 72 and the coil 5; the displacement sensor 72 is used to acquire position data of the carrier 2; the control chip 71 is used to control the current on the coil 5 based on the position data so that the position of the carrier 2 is subject to open-loop control.

[0063] In some specific embodiments, the displacement sensor 72 has four pins, wherein pins V+ and V- are used to power the displacement sensor 72, and pins SDA- and SCL+ are used to acquire the position data of the carrier 2.

[0064] In other specific embodiments, the magnet 4 and the coil 5 are arranged in a one-to-one correspondence.

[0065] In some other specific embodiments, the magnet 4 is fixed to the top surface 11. The coil 5 is located on the bottom side of the magnet 4.

[0066] In some specific embodiments, the control chip 71 is used to control the absolute value of the current on the coil 5 to decrease when the height of the carrier 2 exceeds a preset range.

[0067] Please refer to Figure 4 As shown, in some embodiments, the control chip 71 is located on the bottom side of the coil 5; a gap is provided between the control chip 71 and the coil 5 to prevent the coil 5 from being squeezed.

[0068] In other embodiments, the coil is electrically connected to a Hall chip (not shown in the figure), which is used to acquire the position data of the carrier 2; the Hall chip has a built-in control algorithm for controlling the current on the coil 5 based on the position data, so that the position of the carrier 2 is subject to closed-loop control.

[0069] In some specific embodiments, the Hall chip has 6 pins, wherein pins V+ and V- are used to power the Hall chip, pins SDA- and SCL+ are used to acquire the position data of the carrier 2, and pins OUT1 and OUT2 are used to control the current on the coil 5 based on the position data so that the position of the carrier 2 is subject to closed-loop control.

[0070] In some examples, the control chip 71 is integrated within the Hall chip.

[0071] In some embodiments, the movable part 33 is configured as a rigid circuit board; the deformable part 32 is configured as a metal elastic arm.

[0072] In some specific embodiments, the rigid circuit board is used to provide stable support for the image sensor 7. The deformable portion 32 is configured as a copper wire to provide elasticity and electrical connection between the moving portion 33 and the fixed portion 31.

[0073] In some embodiments, the fixing part 31 is configured as a flexible circuit board; the flexible circuit board includes an insulating layer (not shown) and a conductive layer (not shown); the metal elastic arm is made of the conductive layer; the insulating layer is used to provide support for the moving part 33.

[0074] In other specific embodiments, the metal elastic arm is made of a rigid circuit board with the insulating layer removed.

[0075] In some embodiments, the fixing part 31 is a rigid circuit board; the side end face 12 of the upper cover 1 is provided with an inner groove (not shown in the figure) extending in a horizontal direction, the horizontal direction being perpendicular to the optical axis direction; the rigid circuit board is inserted into the inner side of the upper cover 1 along the inner groove, and the bottom side of the inner groove is provided with a buffer space 81 for accommodating the deformable part 32 and the moving part 33.

[0076] In some specific embodiments, the inner groove is provided on the side end face 12; a gap is provided between the inner groove and the welding foot 13 to provide the buffer space 81.

[0077] In some embodiments, the layout cross-sectional view of the assembled focusing device is as follows: Figure 6 As shown; when no current is applied to the coil 5, the first end 61 is higher than the second end 62, and the fixed part 31 is lower than the moving part 33; the carrier 2 and the moving part 33 are suspended at the center of the upper cover 1 under the combined action of the upper spring 6 and the deformable part 32.

[0078] like Figure 7 As shown, the second embodiment provides a camera module, including the image sensor focusing device 100 as described in any of the above embodiments, and further including an image stabilization device; the image stabilization device includes a movable frame 220 connected to the outside of the focusing device 100; a base 200 is provided on the outside of the movable frame 220; an image stabilization drive assembly 210 is provided between the base 200 and the movable frame 220 for driving the movable frame 220 and the focusing device 100 to move in a horizontal direction; the horizontal direction is perpendicular to the optical axis direction.

[0079] In some specific embodiments, the camera module further includes a lens (not shown); the lens is located on the top side of the carrier 2 and is used to focus light onto the image sensor 7. In some examples, the lens is fixed to the upper cover 1. In other examples, the lens is fixed to the image stabilization device.

[0080] In other specific embodiments, the image sensor 7 is configured as a charge-coupled device or a complementary metal-oxide-semiconductor (CMOS) device.

[0081] In some examples, the image stabilization drive assembly 210 includes an image stabilization magnet and an image stabilization coil. In other examples, the image stabilization drive assembly 210 includes a shape memory alloy wire.

[0082] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. An image sensor focusing device, characterized by, include: Top cover, top spring, magnet, coil, carrier, and circuit board; The magnet is connected to the inside of the upper cover; the carrier is located inside the upper cover; the carrier is connected to the coil; when the coil is loaded with current, it is used to drive the carrier to move along the optical axis. The first end of the upper spring is connected to the upper cover; the second end of the upper spring is connected to the carrier; the first end and the second end of the upper spring are positioned opposite each other; the upper spring is used to provide cushioning and automatic reset for the carrier; The circuit board has a fixed part, a deformable part, and a movable part; the fixed part is fixedly connected to the upper cover; the inner end of the fixed part is connected to the deformable part; the inner end of the deformable part is connected to the movable part; an image sensor is provided at the center of the movable part; the light-receiving surface of the image sensor is perpendicular to the optical axis. The movable part is fixedly connected to the carrier; the coil, the movable part, the deformable part, and the fixed part are electrically connected in sequence. The deformable part is used to provide buffering and automatic reset for the moving part.

2. The focusing device of claim 1, wherein A gasket is connected to the side of the fixed part away from the carrier; a buffer space is provided inside the gasket; the buffer space is used to accommodate the deformable part and the moving part after they move along the optical axis.

3. The focusing device of claim 1, wherein The carrier has an embedded metal conductive component, and the coil is electrically connected to the circuit board through the metal conductive component.

4. The focusing device of claim 2, wherein The top cover includes a plastic part and a magnetic metal sheet; the magnetic metal sheet is embedded inside the plastic part to shield the magnetic fields on both the inside and outside of the top cover.

5. The focusing device of claim 4, wherein The magnetic metal sheet has a soldering lead extending from its bottom end; the soldering lead is connected to a substrate; the substrate is located on the bottom side of the pad.

6. The focusing device of claim 5, wherein Both the top and bottom ends of the carrier are provided with protrusions; The top of the boss located at the top of the carrier is higher than the top of the upper spring; it is used to buffer the impact of the carrier on the upper cover. The bottom end of the boss located at the bottom end of the carrier is lower than the bottom end of the moving part; it is used to buffer the impact of the carrier on the substrate.

7. The focusing device of claim 6, wherein The carrier is arranged in a rectangular frame shape; the protrusions are distributed at the four corners of the carrier; the protrusions are fixedly connected to the upper spring.

8. The focusing device according to claim 1 or 7, wherein The upper springs connected to the diagonally distributed bosses at the four corners of the carrier are arranged in a centrally symmetrical or axially symmetrical manner so that the force exerted by the upper springs on the carrier is balanced.

9. The focusing device of claim 1, wherein, The moving part is electrically connected to a control chip, and the control chip is electrically connected to a displacement sensor and the coil; the displacement sensor is used to acquire the position data of the carrier; the control chip is used to control the current on the coil based on the position data, so that the position of the carrier is subject to open-loop control.

10. The focusing device of claim 1, wherein, The coil is electrically connected to a Hall chip, which is used to acquire the position data of the carrier. The Hall chip has a built-in control algorithm for controlling the current on the coil based on the position data, so that the position of the carrier is subject to closed-loop control.

11. The focusing device of claim 9, wherein, The control chip is located on the bottom side of the coil; there is a gap between the control chip and the coil to prevent the coil from being squeezed.

12. The focusing device of claim 1, wherein, The moving part is configured as a rigid circuit board; the deformable part is configured as a metal elastic arm.

13. The focusing device of claim 12, wherein, The fixing part is configured as a flexible circuit board; the flexible circuit board includes an insulating layer and a conductive layer that are fixedly connected; the metal elastic arm is made of the conductive layer; the insulating layer is used to provide support for the moving part.

14. The focusing device according to claim 1 or 12, wherein The fixing part is a rigid circuit board; the side end face of the upper cover is provided with an inner groove extending in a horizontal direction, the horizontal direction being perpendicular to the optical axis direction; the rigid circuit board is inserted into the inner side of the upper cover along the inner groove, and the bottom side of the inner groove is provided with a buffer space for accommodating the deformable part and the moving part.

15. A camera module comprising the image sensor focusing device of any one of claims 1-14, wherein, It also includes image stabilization; The image stabilization device includes a movable frame connected to the outside of the focusing device; a base is provided on the outside of the movable frame; an image stabilization drive assembly is provided between the base and the movable frame for driving the movable frame and the focusing device to move in a horizontal direction; the horizontal direction is perpendicular to the optical axis.

Images