PCB gold immersion device

Abstract

The utility model relates to the technical field of circuit board gold immersion processing, in particular to a PCB gold immersion device which comprises a gold immersion box, a storage rack, supporting legs, a transmission assembly, a mounting frame, a conveying pipe and the like. A storage rack is arranged in the immersion gold box, one side of the immersion gold box is provided with supporting legs, the tops of the supporting legs are fixedly connected with a transmission assembly, the top of the transmission assembly is fixedly connected with a mounting frame, the immersion gold box is provided with a through hole corresponding to the mounting frame, the interior of the mounting frame is fixedly connected with a conveying pipe, and the conveying pipe is provided with a spray head. According to the utility model, after the gold immersion processing of the PCB is completed, the automatic washing of the PCB is realized through the mutual cooperation of the spray header, the electric push rod, the transmission assembly and other parts, the surface residues and redundant solution are effectively removed, the processing quality of the PCB is ensured, and a good foundation is provided for the subsequent processing work.

Description

Technical Field

[0001] This utility model relates to the field of immersion gold treatment technology for circuit boards, and in particular to an immersion gold treatment device for PCB circuit boards. Background Technology

[0002] Immersion gold plating is a widely used electroless nickel plating technique for surface treatment of printed circuit boards. The process begins by electrolessly plating nickel onto copper pads to form a uniform, dense nickel layer that serves as both a barrier and conductive layer. Subsequently, a thin layer of gold is deposited on the nickel surface through a displacement reaction to enhance the pads' oxidation resistance, conductivity, and solderability. Immersion gold plating offers advantages such as a smooth surface, long shelf life, and suitability for high-density and fine-pitch component soldering. It is commonly used in the manufacture of PCBs for high-end electronic products to ensure the reliability and stability of circuit connections.

[0003] After the immersion gold process is completed on the PCB circuit board, some solutions and impurities will remain on the surface of the PCB circuit board. If they are not cleaned in time, they will affect the subsequent processing procedures and product quality. Therefore, it is necessary to rely on workers to move to a specific location for cleaning, or even to manually clean it. This working method increases the difficulty of the workers' work and seriously affects the work efficiency.

[0004] Therefore, it is necessary to design a device for immersion gold plating on PCB circuit boards. Utility Model Content

[0005] To overcome the shortcomings of traditional cleaning methods that require additional equipment after immersion gold processing on PCB circuit boards, which increases the difficulty of workers' work and seriously affects work efficiency, the technical problem to be solved is: to provide an immersion gold device for PCB circuit boards.

[0006] The technical solution of this utility model is: a PCB circuit board immersion gold device, including an immersion gold box, a shelf, a support foot, a transmission component, a mounting frame, a delivery pipe, a spray head, a liquid storage frame, and a water pump. The shelf is provided inside the immersion gold box, and a support foot is provided on one side of the immersion gold box. The transmission component is fixedly connected to the top of the support foot, and the mounting frame is fixedly connected to the top of the transmission component. A through hole is provided in the immersion gold box corresponding to the mounting frame. The delivery pipe is fixedly connected inside the mounting frame, and a spray head is provided on the delivery pipe. The liquid storage frame is fixedly connected to the bottom of the transmission component, and a water pump is installed on the liquid storage frame. The output end and input end of the water pump are connected to the delivery pipe and the liquid storage frame respectively through connecting pipes.

[0007] Furthermore, a lead screw is rotatably connected inside the gold-plated box, and the lead screw is threadedly connected to the shelf. A motor is installed on the top of the gold-plated box, and the output shaft of the motor is connected to the lead screw.

[0008] Furthermore, a guide rod is fixedly connected inside the gold box, and the guide rod is slidably connected to the shelf.

[0009] Furthermore, an extension plate is fixedly connected to the through hole of the gold-plated box.

[0010] Furthermore, an electric push rod is provided on the top of both the gold-plating box and the mounting frame. The movable rod of the electric push rod is fixedly connected to a push plate, and the push plate and the through hole of the gold-plating box are on the same horizontal line.

[0011] Furthermore, multiple conveying pipes are evenly distributed inside the installation frame, and each conveying pipe is connected to the others, with multiple spray heads distributed on each conveying pipe.

[0012] The beneficial effects of this utility model are: 1. After the PCB circuit board has completed the immersion gold processing, this utility model realizes the automatic rinsing of the PCB circuit board through the cooperation of components such as spray head, electric push rod and transmission assembly, which effectively removes surface residues and excess solution, ensures the processing quality of the PCB circuit board, and provides a good foundation for subsequent processing work.

[0013] 2. The clean water after rinsing the PCB circuit board can fall back into the storage box, realizing the recycling and utilization of clean water, reducing production costs, and meeting environmental protection requirements. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0015] Figure 2 This is a three-dimensional structural diagram of the gold-plated box, motor, guide rod, and shelf of this utility model.

[0016] Figure 3 This is a three-dimensional structural diagram of the electric push rod and push plate of this utility model.

[0017] Figure 4 This is a three-dimensional structural diagram of the delivery pipe, spray head, liquid storage frame, and water pump of this utility model.

[0018] In the attached diagram, the following are the reference numerals: 1-Immersion gold box, 2-lead screw, 3-motor, 4-guide rod, 5-shelf, 6-extension plate, 7-support foot, 8-transmission assembly, 9-mounting frame, 10-transmission pipe, 101-spray head, 11-liquid storage frame, 12-water pump, 13-electric push rod, 14-push plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example: A PCB circuit board immersion gold device, such as Figures 1-4 As shown, the device includes a gold-plating tank 1, a shelf 5, a support leg 7, a transmission component 8, a mounting frame 9, a delivery pipe 10, a spray head 101, a liquid storage frame 11, and a water pump 12. The shelf 5 is installed inside the gold-plating tank 1. The support leg 7 is located on one side of the gold-plating tank 1. The transmission component 8 is fixedly connected to the top of the support leg 7. The mounting frame 9 is fixedly connected to the top of the transmission component 8. The gold-plating tank 1 has a through hole corresponding to the mounting frame 9. The delivery pipe 10 is fixedly connected inside the mounting frame 9. The spray head 101 is installed on the delivery pipe 10. The liquid storage frame 11 is fixedly connected to the bottom of the transmission component 8. The water pump 12 is installed on the liquid storage frame 11. The output end and input end of the water pump 12 are connected to the delivery pipe 10 and the liquid storage frame 11 respectively through connecting pipes. Multiple delivery pipes 10 are evenly distributed inside the mounting frame 9. The delivery pipes 10 are interconnected, and multiple spray heads 101 are distributed on each delivery pipe 10.

[0021] like Figures 1-3 As shown, a lead screw 2 is rotatably connected inside the gold-plated box 1. The lead screw 2 is threadedly connected to the shelf 5. A motor 3 is installed on the top of the gold-plated box 1. The output shaft of the motor 3 is connected to the lead screw 2. When the motor 3 is started, the motor 3 drives the output shaft to rotate. The motor 3 drives the lead screw 2 to rotate through the output shaft. During the rotation, the lead screw 2 drives the shelf 5 to move downward, so that the shelf 5 enters the gold-plated box 1.

[0022] like Figures 2-3 As shown, a guide rod 4 is fixedly connected inside the gold-plated box 1. The guide rod 4 is slidably connected to the shelf 5. The guide rod 4 can provide limit and guidance during the movement of the shelf 5, thereby ensuring that the shelf 5 can move stably and preventing the PCB circuit board on the shelf 5 from being bumped during the movement, thus ensuring the quality of the PCB circuit board.

[0023] like Figure 2 As shown, an extension plate 6 is fixedly connected to the through hole of the gold-plated box 1. The extension plate 6 can provide guidance for the PCB circuit board when the push plate 14 pushes it, so that the PCB circuit board can move stably onto the transmission component 8, thereby ensuring the smooth progress of subsequent work.

[0024] like Figures 2-3 As shown, an electric push rod 13 is provided on the top of both the gold immersion box 1 and the mounting frame 9. The movable rod of the electric push rod 13 is fixedly connected to a push plate 14. The push plate 14 and the through hole of the gold immersion box 1 are on the same horizontal line. When the electric push rod 13 is activated, the movable rod of the electric push rod 13 retracts inward, causing the electric push rod to drive the push plate 14 to move towards the transmission component 8.

[0025] This device is used in the immersion gold process of PCB circuit boards. During use, sufficient immersion gold solution is poured into the immersion gold tank 1. The PCB circuit board is then placed on the shelf 5. Motor 3 is then started, driving the output shaft to rotate. Motor 3, through the output shaft, drives the lead screw 2 to rotate. During rotation, the lead screw 2 moves the shelf 5 downwards, immersing the PCB circuit board in the immersion gold solution. After the PCB circuit board completes the surface immersion gold treatment, motor 3 drives the lead screw 2 in reverse, causing it to move the shelf 5 upwards. This moves the PCB circuit board towards the through-hole of the immersion gold tank 1 until the PCB circuit board, the through-hole, and the push plate 14 are on the same horizontal line. Then, the electric push rod 13 is activated, and its movable rod retracts inwards, causing... The electric push rod 13 drives the PCB circuit board to move towards the transfer assembly 8 via the drive push plate 14. At the same time, during the movement of the PCB circuit board, the transfer assembly 8 and the water pump 12 are started. The water pump 12 draws clean water from the liquid storage box 11 through the connecting pipe and delivers it to the delivery pipe 10. Then, the clean water in the delivery pipe 10 is sprayed onto the transfer assembly 8 through the spray head 101. After the PCB circuit board moves onto the transfer assembly 8, it can move away from the immersion gold tank 1 and be rinsed by the clean water sprayed by the spray head 101, thereby removing the residue and excess solution on the surface of the PCB circuit board, thus ensuring the processing quality of the PCB circuit board and facilitating the smooth progress of subsequent processing. At the same time, the clean water after rinsing the PCB circuit board can fall back into the liquid storage box 11 for recycling and reuse. The work is then completed.

[0026] The above embodiments are provided for those skilled in the art to implement or use the present invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the claims.

Claims

1. A PCB gold plating device, comprising a gold plating box (1) and a storage rack (5), the gold plating box (1) is internally provided with the storage rack (5), characterized in that: It also includes a support foot (7), a transmission component (8), a mounting frame (9), a delivery pipe (10), a spray head (101), a liquid storage frame (11), and a water pump (12). The support foot (7) is located on one side of the gold immersion box (1). The transmission component (8) is fixedly connected to the top of the support foot (7). The mounting frame (9) is fixedly connected to the top of the transmission component (8). The gold immersion box (1) has a through hole corresponding to the mounting frame (9). The delivery pipe (10) is fixedly connected inside the mounting frame (9). The spray head (101) is installed on the delivery pipe (10). The liquid storage frame (11) is fixedly connected to the bottom of the transmission component (8). The water pump (12) is installed on the liquid storage frame (11). The output end and input end of the water pump (12) are connected to the delivery pipe (10) and the liquid storage frame (11) respectively through connecting pipes.

2. The PCB gold immersion apparatus according to claim 1, wherein: The gold box (1) is internally connected to a lead screw (2), which is threaded to the shelf (5). A motor (3) is installed on the top of the gold box (1), and the output shaft of the motor (3) is connected to the lead screw (2).

3. A PCB gold immersion apparatus as claimed in claim 2, wherein: The gold box (1) is fixedly connected to a guide rod (4), which is slidably connected to the shelf (5).

4. The PCB gold immersion apparatus according to claim 3, wherein: An extension plate (6) is fixedly connected to the through hole of the gold box (1).

5. A PCB gold immersion apparatus as claimed in claim 4, wherein: An electric push rod (13) is provided on the top of the gold immersion box (1) and the mounting frame (9). The movable rod of the electric push rod (13) is fixedly connected to the push plate (14). The push plate (14) and the through hole of the gold immersion box (1) are located on the same horizontal line.

6. A PCB gold immersion apparatus as claimed in claim 5, wherein: The mounting frame (9) has multiple conveying pipes (10) evenly spaced inside, each conveying pipe (10) is interconnected, and each conveying pipe (10) has multiple spray heads (101).

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