Electric connection assembly and electronic equipment

Abstract

The utility model provides an electric connection assembly and electronic equipment, the electronic equipment comprises an electric conduction and heat conduction medium, a heat dissipation module and a functional module, and the electric conduction and heat conduction medium is in contact with the heat dissipation module and the functional module so as to conduct heat generated by the functional module to the heat dissipation module; wherein a first insulation heat conduction piece is further arranged between the heat dissipation module and the function module, and the first insulation heat conduction piece is arranged on one side of the electric conduction and heat conduction medium, so that the heat dissipation module and the function module are connected in an insulation mode. The heat dissipation module and the function module can be connected in an insulating mode through the first insulating heat conduction piece, the heat dissipation module and the function module cannot be electrically conducted due to the electric conduction and heat conduction media, and therefore the problem of electromagnetic compatibility (such as radiation stray) can be solved. In addition, the first insulating heat conduction part is of an independent structure, and the position of the first insulating heat conduction part can be flexibly arranged according to the design requirements of the functional module and the heat dissipation module, so that the electronic equipment is convenient to install.

Description

Technical Field

[0001] This application relates to the field of device heat dissipation technology, and in particular to an electrical connection component and an electronic device. Background Technology

[0002] Electronic devices are widely used in all aspects of life and work. As their internal integration increases and the power of functional modules increases, heat dissipation has become a key factor restricting the improvement of their performance.

[0003] To improve heat transfer efficiency, liquid metal grease can be used to establish a physical connection between the functional modules and the heat dissipation modules of electronic devices. However, liquid metal grease contains metallic materials that are conductive. When the electronic device is running, the functional modules and the heat dissipation modules can easily become electrically connected through the liquid metal grease, causing electromagnetic compatibility issues. Among these issues, radiated stray emissions are particularly prominent and can easily reduce the reliability of the electronic device itself. Utility Model Content

[0004] This application provides an electrical connection component and an electronic device that can achieve an insulated connection between a functional module and a heat dissipation module while ensuring heat dissipation performance, thus exhibiting high reliability.

[0005] In a first aspect, an electronic device is provided, including a conductive and thermally conductive medium, a heat dissipation module, and a functional module, wherein the conductive and thermally conductive medium is disposed between the heat dissipation module and the functional module to conduct heat generated by the functional module to the heat dissipation module.

[0006] A first insulating thermally conductive component is provided between the heat dissipation module and the functional module. The first insulating thermally conductive component is disposed on the side of the conductive thermally conductive medium facing the heat dissipation module, or the first insulating thermally conductive component is driven to be disposed on the side of the conductive thermally conductive medium facing the functional module, so as to make the heat dissipation module and the functional module insulated from each other.

[0007] It should be noted that a functional module within an electronic device refers to a hardware unit composed of multiple electronic components, possessing a specific function and capable of performing that function relatively independently. These functional modules are important components of the electronic device, working together to enable the device to complete various complex tasks. For example, a functional module may be a display screen, camera, central processing unit (CPU), memory, microcontroller, flash memory, wireless communication module, wired communication module, battery management module, gravity sensor, etc. In some embodiments, each functional module is designed to perform one or a class of specific functions. For instance, a camera is specifically responsible for image capture and video recording, converting optical images into digital image signals through the collaborative work of components such as optical lenses, image sensors, and signal processing circuits. In some embodiments, for some complex functions of the electronic device, multiple functional modules need to work together to achieve the desired result. Taking smartphone internet access as an example, the communication module needs to establish a network connection, the CPU needs to process data and parse protocols, the display screen needs to present web page content, and the memory needs to cache relevant data. Multiple functional modules each play their respective roles, working together to complete the complex function of internet access.

[0008] It should be noted that functional modules typically generate heat when powered on. When current flows through the electronic components within the functional module, the resistance of these components causes the current to do work and convert into heat energy. Even wires with low resistance will generate heat when current flows through them, and this heat accumulates as the current increases and the time passes. Furthermore, functional modules may contain semiconductor components. During data processing, signal transmission, and logic operations, complex electron migration and charge transfer processes occur within these semiconductor components. During these processes, electrons collide with the crystal lattice, causing some electrical energy to be converted into heat energy. Moreover, the higher the operating frequency of the semiconductor components and the larger the amount of data processed, the more heat is generated. For example, when a central processing unit (CPU) performs high-intensity computational tasks, its internal transistors rapidly turn on and off, with a large number of electrons flowing within, generating significant heat and causing the CPU temperature to rise. In summary, functional modules generate a certain amount of heat during operation.

[0009] It should be noted that conductive and thermally conductive media are a type of material that can efficiently transfer heat. They usually have a certain degree of electrical conductivity. In some embodiments, the material of the conductive and thermally conductive media can be metal, carbon, etc., while in other embodiments, the conductive and thermally conductive media can be a mixture of metal and polymer, or a mixture of carbon material and polymer.

[0010] It should be noted that the conductive and thermally conductive medium is disposed between the heat dissipation module and the functional module. When the first insulating thermally conductive component is disposed between the conductive and thermally conductive medium and the heat dissipation module, the conductive and thermally conductive medium and the heat dissipation module are indirectly in contact. When the first insulating thermally conductive component is disposed between the conductive and thermally conductive medium and the functional module, the conductive and thermally conductive medium and the functional module are also indirectly in contact. Regardless of whether the conductive and thermally conductive medium is in direct or indirect contact with the functional module and the heat dissipation module, the heat generated by the functional module can be transferred to the heat dissipation module through the conductive and thermally conductive medium, thereby achieving heat dissipation for the functional module.

[0011] It should be noted that common forms of heat dissipation modules include air-cooled modules, water-cooled modules, heat pipe modules, vapor chamber modules, liquid-cooled plate modules, and natural cooling modules. Air-cooled modules typically consist of a cooling fan, heat sink fins, and a heatsink base. The fan generates airflow, which carries heat away from the heat sink fins. Water-cooled modules generally include a water block, water pump, reservoir, radiator, and cooling fan. The water block contacts the heat-generating components, transferring heat to the circulating coolant. Driven by the pump, the coolant flows through the radiator, where the cooling fan dissipates heat, allowing the coolant to cool before returning to the water block, thus completing the cycle. The heat pipe cooling module consists of heat pipes, heat dissipation fins, and a heat dissipation base. The working fluid inside the heat pipe absorbs heat in the evaporation section and evaporates into a gaseous state. Under the pressure difference within the heat pipe, the gaseous working fluid flows to the condensation section, releases heat, and re-condenses into a liquid state. The liquid working fluid then flows back to the evaporation section through structures such as a wick, thus achieving efficient heat transfer. Finally, the heat is dissipated into the air by the heat dissipation fins. The vapor chamber cooling module mainly consists of a vapor chamber. In some embodiments, the vapor chamber may be used in conjunction with a cooling fan or heat dissipation fins. The vapor chamber contains a vacuum chamber with a special thermally conductive medium and capillary structures. When one side of the vapor chamber is heated, the thermally conductive medium evaporates to form vapor. The vapor rapidly diffuses into a lower-temperature area within the vacuum chamber and condenses into a liquid. The liquid flows back to the heated area through the capillary structures, continuing to evaporate and dissipate heat, thereby achieving rapid and uniform heat dissipation. Liquid-cooled plate heat dissipation modules include liquid-cooled plates, coolant circulation systems, etc. Coolant flows within the liquid-cooled plates, absorbing heat, and then the heat is carried to external heat dissipation devices through the circulation system. Natural heat dissipation modules mainly rely on the equipment's own casing or heat sink structure. They utilize heat conduction to transfer heat from inside the equipment to the casing or heat sink, and then dissipate the heat to the surrounding environment through natural convection and thermal radiation. The appropriate type of heat dissipation module can be selected according to the type of functional module to ensure effective heat dissipation and allow the functional module to operate at a suitable temperature.

[0012] It should be noted that the first insulating thermally conductive element is a material used to achieve both insulation and thermal conductivity. It is typically based on a polymer matrix, such as silicone rubber or polyimide. These materials possess good insulation properties, flexibility, and chemical stability, providing the essential physical and chemical characteristics for the insulating thermally conductive element and ensuring stable performance under different environmental conditions. Furthermore, to impart good thermal conductivity, thermally conductive materials can be incorporated into the base material to improve the overall thermal conductivity of the first insulating thermally conductive element. In some embodiments, the first insulating thermally conductive element may be in sheet form.

[0013] It should be noted that the first insulating thermally conductive element is disposed on one side of the conductive thermally conductive medium, and the first insulating thermally conductive element is used to insulate the connection between the heat dissipation module and the functional module. In some embodiments, the first insulating thermally conductive element may be disposed between the conductive thermally conductive medium and the functional module. In other embodiments, the first insulating thermally conductive element may be disposed between the conductive thermally conductive medium and the heat dissipation module.

[0014] It should be noted that an adhesive layer can be provided on one side of the first insulating thermally conductive component. When the first insulating thermally conductive component is disposed between the conductive thermally conductive medium and the functional module, the adhesive layer of the first insulating thermally conductive component can be bonded to the functional module. When the first insulating thermally conductive component is disposed between the conductive thermally conductive medium and the heat dissipation module, the adhesive layer of the first insulating thermally conductive component can be bonded to the heat dissipation module, so as to reduce the positional displacement of the first insulating thermally conductive component.

[0015] The electronic device in this embodiment of the application has a conductive and thermally conductive medium placed between the functional module and the heat dissipation module. This allows the heat generated by the functional module to be transferred to the heat dissipation module in a timely manner, reducing heat accumulation within the functional module and ensuring the overall performance of the electronic device. A first insulating thermally conductive component is placed between the functional module and the heat dissipation module. This component provides an insulated connection between the two modules, preventing electrical conduction due to the conductive and thermally conductive medium. This reduces electromagnetic compatibility issues (such as spurious radiation), thereby improving the overall performance and reliability of the electronic device. Furthermore, the first insulating thermally conductive component is an independent structure, and its position can be flexibly set according to the design requirements of the functional module and the heat dissipation module. The first insulating thermally conductive component can be placed between the conductive and thermally conductive medium and the functional module, or between the conductive and thermally conductive medium and the heat dissipation module, to facilitate the installation of the electronic device.

[0016] In one possible implementation, the first insulating thermally conductive element includes a first insulating layer and a first thermally conductive layer stacked on one side of the first insulating layer;

[0017] The first insulating layer is disposed between the first thermally conductive layer and the conductive and thermally conductive medium, or the first thermally conductive layer is disposed between the first insulating layer and the conductive and thermally conductive medium.

[0018] It should be noted that the first insulating layer is made of insulating material, and the first thermally conductive layer can also be made of insulating material. In this case, the first thermally conductive layer does not have electrical conductivity. Alternatively, the first thermally conductive layer can also be made of conductive material, in which case the first thermally conductive layer has electrical conductivity.

[0019] A first insulating and heat-conducting component is composed of a first insulating layer and a first thermally conductive layer stacked together. The first insulating layer serves as an insulator, achieving an insulated connection between the functional module and the heat dissipation module. The first thermally conductive layer enhances the thermal conductivity of the first insulating and heat-conducting component, ensuring that the heat generated by the functional module can be quickly transferred to the heat dissipation module. Furthermore, the layered first insulating layer has a large area, thereby ensuring insulation between the functional module and the heat dissipation module, reducing the possibility of electrical conduction between them, and thus helping to ensure the performance of the electronic device.

[0020] In some embodiments, when the first insulating thermally conductive element is disposed between the functional module and the conductive thermally conductive medium, the first thermally conductive layer can be disposed between the first insulating layer and the conductive thermally conductive medium. That is, the first insulating layer can be connected to the functional module, and the first insulating layer can insulate the functional module from the first thermally conductive layer. In this way, the first insulating layer can block the current flowing from the functional module to the first thermally conductive layer, which can reduce the interference current flowing out of the functional module and help improve the stability and reliability of the electronic device.

[0021] In one possible implementation, the first thermally conductive layer includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

[0022] It should be noted that in some embodiments, the first thermally conductive layer can be a single-layer structure, which can be a graphite layer, a boron nitride layer, or a metal layer. In other embodiments, the first thermally conductive layer can be a multi-layer structure. For example, it can include two graphite layers, two metal layers, or a graphite layer and a boron nitride layer, or a boron nitride layer and a metal layer, or a graphite layer and a metal layer, or a graphite layer, a boron nitride layer, and a metal layer. The number of layers in the first thermally conductive layer can be two, three, four, five, or even more. In some embodiments, when the first thermally conductive layer has multiple layers, the first insulating layer can be sandwiched between two first thermally conductive layers, or it can be not sandwiched between the first thermally conductive layers.

[0023] The graphite layer, boron nitride layer, and metal layer have strong thermal conductivity. The first thermally conductive layer formed by at least one of the graphite layer, boron nitride layer, and metal layer has high thermal conductivity. In this way, the overall thermal conductivity of the first insulating thermally conductive component can be improved, so that the heat generated by the functional module can be quickly transferred to the heat dissipation module.

[0024] In one possible implementation, the first insulating layer comprises at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

[0025] It should be noted that in some embodiments, the first insulating layer may be a single-layer structure, which may be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer. In other embodiments, the first insulating layer may be a multi-layer structure. For example, it may include two polyethylene terephthalate layers, or a polyethylene terephthalate layer and a polyethylene layer, or a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer. The number of layers in the first insulating layer may be two, three, four, five, or even more. In some embodiments, when the first insulating layer is multi-layered, the first thermally conductive layer may be sandwiched between two first insulating layers, or it may not be sandwiched between the first insulating layers.

[0026] The polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer have relatively low density and light weight, so they will not add extra or excessive weight to the electronic device. In addition, the polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer have good flexibility, which allows the first insulating and heat-conducting component to withstand external forces such as bending and stretching to a certain extent, thereby facilitating the assembly of the electronic device.

[0027] In some embodiments, the overall thickness of the first insulating heat-conducting element 22 is 0.1mm to 0.15mm. For example, the overall thickness of the first insulating heat-conducting element can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, or 0.15mm.

[0028] Setting the overall thickness of the first insulating heat-conducting component to not less than 0.1 mm can give it a certain strength, reducing the risk of breakage. Setting the overall thickness of the first insulating heat-conducting component to not more than 0.15 mm can reduce the space it occupies inside the electronic device, thus reducing its impact on the overall size of the electronic device and helping to achieve a thinner and smaller design.

[0029] In one possible implementation, the first insulating thermally conductive element is disposed on the side of the conductive thermally conductive medium facing the functional module, and the side of the conductive thermally conductive medium facing the heat dissipation module is provided with a second insulating thermally conductive element, so that the conductive thermally conductive medium and the heat dissipation module are insulated from each other.

[0030] It should be noted that the second insulating thermally conductive element is a material used to achieve both insulation and thermal conductivity. It is typically based on a polymer matrix, such as silicone rubber or polyimide. These materials possess good insulation properties, flexibility, and chemical stability, providing the essential physical and chemical characteristics for the insulating thermally conductive element and ensuring stable performance under various environmental conditions. Furthermore, to impart good thermal conductivity, thermally conductive materials can be incorporated into the base material to enhance the overall thermal conductivity of the first insulating thermally conductive element. Moreover, the structure and materials of the second insulating thermally conductive element can be the same as or different from those of the first insulating thermally conductive element. In some embodiments, the second insulating thermally conductive element can be in the form of a sheet.

[0031] A first insulating thermally conductive component is disposed on the side of the conductive thermally conductive medium facing the functional module, and a second insulating thermally conductive component is disposed on the side of the conductive thermally conductive medium facing the heat dissipation module. The first and second insulating thermally conductive components respectively insulate the conductive thermally conductive medium from the functional module and the heat dissipation module. This further ensures the insulating connection between the functional module and the heat dissipation module, reducing the possibility of current flowing from the functional module into the heat dissipation module, thereby ensuring the reliability of the electronic device. Furthermore, if one of the first and second insulating thermally conductive components is damaged, the other insulating thermally conductive component can still provide insulation, thus ensuring the insulating connection between the functional module and the heat dissipation module, further improving the reliability of the electronic device.

[0032] In one possible implementation, the second insulating heat-conducting element includes a second insulating layer and a second heat-conducting layer disposed on one side of the second insulating layer;

[0033] The second insulating layer is disposed between the second thermally conductive layer and the conductive and thermally conductive medium, or the second thermally conductive layer is disposed between the second insulating layer and the conductive and thermally conductive medium.

[0034] It should be noted that the second insulating layer is made of insulating material, and the second thermally conductive layer can also be made of insulating material. In this case, the second thermally conductive layer does not have electrical conductivity. Alternatively, the second thermally conductive layer can also be made of conductive material, in which case the second thermally conductive layer has electrical conductivity.

[0035] The second insulating and thermally conductive component is composed of a layered second insulating layer and a second thermally conductive layer. The second insulating layer serves as an insulator, ensuring an insulated connection between the functional module and the heat dissipation module. The second thermally conductive layer enhances the thermal conductivity of the second insulating and thermally conductive component, ensuring that heat generated by the functional module can be quickly transferred to the heat dissipation module. Furthermore, the layered second insulating layer has a large area, thus ensuring insulation between the conductive and thermally conductive medium and the heat dissipation module, reducing the possibility of electrical conduction between the functional module and the heat dissipation module, thereby helping to ensure the performance of the electronic device.

[0036] In some embodiments, the second thermally conductive layer can be disposed on the side of the second insulating layer away from the conductive and thermally conductive medium. That is, the second insulating layer is connected to the conductive and thermally conductive medium, and the second thermally conductive layer is connected to the heat dissipation module. If the conductive and thermally conductive medium is accidentally connected to the functional module, the second insulating layer can block the current from flowing to the second thermally conductive layer, which can reduce the flow range of interference current and help improve the stability and reliability of electronic devices.

[0037] In one possible implementation, the second thermally conductive layer includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

[0038] It should be noted that in some embodiments, the second thermally conductive layer can be a single-layer structure, which can be a graphite layer, a boron nitride layer, or a metal layer. In other embodiments, the second thermally conductive layer can be a multi-layer structure. For example, it can include two graphite layers, two metal layers, or a graphite layer and a boron nitride layer, or a boron nitride layer and a metal layer, or a graphite layer and a metal layer, or a graphite layer, a boron nitride layer, and a metal layer. The number of layers in the second thermally conductive layer can be two, three, four, five, or even more. In some embodiments, when the second thermally conductive layer has multiple layers, the second insulating layer can be sandwiched between two second thermally conductive layers, or it can be not sandwiched between the second thermally conductive layers.

[0039] The graphite layer, boron nitride layer, and metal layer have strong thermal conductivity. The second thermally conductive layer formed by at least one of the graphite layer, boron nitride layer, and metal layer has high thermal conductivity. In this way, the overall thermal conductivity of the second insulating thermally conductive component can be improved, so that the heat generated by the functional module can be quickly transferred to the heat dissipation module.

[0040] In one possible implementation, the second insulating layer comprises at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

[0041] It should be noted that in some embodiments, the second insulating layer can be a single-layer structure, which can be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer. In other embodiments, the second insulating layer can be a multi-layer structure. For example, it can include two polyethylene terephthalate layers, or a polyethylene terephthalate layer and a polyethylene layer, or a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer. The number of layers in the second insulating layer can be two, three, four, five, or even more. In some embodiments, when the second insulating layer is multi-layered, the second thermally conductive layer can be sandwiched between two second insulating layers, or it can be not sandwiched between the second insulating layers.

[0042] The polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer have relatively low density and light weight, so they will not add extra or excessive weight to the electronic device. In addition, the polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer have good flexibility, which allows the second insulating heat-conducting component to withstand external forces such as bending and stretching to a certain extent, thus facilitating the assembly of the electronic device.

[0043] In some embodiments, the overall thickness of the second insulating heat-conducting element is 0.1mm to 0.15mm. For example, the overall thickness of the second insulating heat-conducting element can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, or 0.15mm.

[0044] Setting the overall thickness of the second insulating heat-conducting component to not less than 0.1 mm can give it a certain strength, reducing the risk of breakage. Setting the overall thickness of the second insulating heat-conducting component to not more than 0.15 mm can reduce the space it occupies inside the electronic device, thus reducing its impact on the overall size of the electronic device and helping to achieve a thinner and smaller design.

[0045] It should be noted that in some embodiments, the size, structure and material of the first insulating heat-conducting element and the second insulating heat-conducting element may be the same, while in other embodiments, the size, structure and material of the first insulating heat-conducting element and the second insulating heat-conducting element may be different.

[0046] The installation methods of the first and second insulating thermally conductive components can be varied. For example, in some embodiments, both the first and second thermally conductive layers of the first and second insulating thermally conductive components can be bonded to a conductive and thermally conductive medium. In this case, the first insulating layer of the first insulating thermally conductive component is bonded to the functional module, and the second insulating layer of the second insulating thermally conductive component is bonded to the heat dissipation module. In some embodiments, the first and first insulating layers of the first insulating thermally conductive component can be bonded to the conductive and thermally conductive medium and the functional module, respectively, and the second and second insulating layers of the second insulating thermally conductive component can be bonded to the heat dissipation module and the conductive and thermally conductive medium, respectively. In some embodiments, the first and first insulating layers of the first insulating thermally conductive component can be bonded to the functional module and the conductive and thermally conductive medium, respectively, and the second and second insulating layers of the second insulating thermally conductive component can be bonded to the heat dissipation module and the conductive and thermally conductive medium, respectively. In some embodiments, the first thermally conductive layer and the first insulating layer of the first insulating thermally conductive element can be bonded to the functional module and the conductive and thermally conductive medium, respectively, and the second thermally conductive layer and the second insulating layer of the second insulating thermally conductive element can be bonded to the conductive and thermally conductive medium and the heat dissipation module, respectively. In some other embodiments, the first insulating thermally conductive element and the second insulating thermally conductive element can also be installed in the electronic device in other forms.

[0047] In one possible implementation, the conductive and thermally conductive medium comprises a colloid, wherein at least one of liquid metal, metal particles, and carbon particles is disposed within the colloid; or,

[0048] The conductive and thermally conductive medium is liquid metal.

[0049] It should be noted that there are many types of colloids. For example, colloids can be inorganic colloids, organic colloids, composite colloids, etc.

[0050] It should be noted that liquid metals generally refer to metals or alloys with melting points below room temperature (25°C) or that remain liquid within a certain temperature range. Common liquid metals include mercury, gallium-based alloys (such as gallium-indium alloys, gallium-indium-tin alloys, etc.), and sodium-potassium alloys.

[0051] It should be noted that metal particles refer to tiny particles of a metallic material that have electrical conductivity. For example, metal particles can be silver particles, gold particles, copper particles, nickel particles, etc.

[0052] It should be noted that carbon particles are tiny particulate substances composed of carbon elements. The main types of carbon particles include carbon black particles, activated carbon particles, carbon nanotubes, and graphene. Carbon particles exhibit various morphologies, commonly including spherical, sheet-like, and fibrous shapes. For example, carbon black particles are typically spherical, composed of multiple nanoscale carbon crystallites aggregated together; graphene can be considered a special type of sheet-like carbon particle, composed of a single layer of carbon atoms; and carbon nanotubes exhibit a fibrous shape with a high aspect ratio.

[0053] It should be noted that the colloid of the conductive and thermally conductive medium may contain only one of the following: liquid metal, metal particles, and carbon particles; or any two of the following: liquid metal, metal particles, and carbon particles; or simultaneously: liquid metal, metal particles, and carbon particles.

[0054] The colloid has a certain adhesive ability, which allows it to form a stable heat conduction channel with the functional module and the heat dissipation module. This ensures that the heat generated by the functional module can be continuously transferred to the heat dissipation module. By setting at least one of liquid metal, metal particles, and carbon particles in the colloid of the conductive and thermally conductive medium, the overall thermal conductivity of the conductive and thermally conductive medium can be improved. In this way, the heat generated by the functional module can be quickly transferred to the heat dissipation module, realizing rapid heat dissipation of the functional module.

[0055] When the conductive and thermally conductive medium includes a colloid, it can adhere to both the heat dissipation module and the functional module. When a second insulating thermally conductive element is provided on the side of the conductive and thermally conductive medium facing the heat dissipation module, it can adhere to the second insulating thermally conductive element. When a first insulating thermally conductive element is provided on the side of the conductive and thermally conductive medium facing the heat dissipation module, it can adhere to the first insulating thermally conductive element. It is understandable that colloids have weak fluidity, meaning the flow resistance of the conductive and thermally conductive medium is relatively high. When the conductive and thermally conductive medium is placed between the functional module and the heat dissipation module, it is difficult for it to flow beyond the gap between the functional module and the heat dissipation module using its own fluidity.

[0056] In other embodiments, the conductive and thermally conductive medium can be liquid metal. Common liquid metals include mercury, gallium-based alloys (such as gallium-indium alloy, gallium-indium-tin alloy, etc.), sodium-potassium alloy, etc. Directly using liquid metal as the conductive and thermally conductive medium can maximize its thermal conductivity, thereby enabling the heat generated by the functional module to be continuously transferred to the heat dissipation module. In addition, liquid metal has a certain degree of fluidity, which allows it to change its shape to fill the gap between the functional module and the heat dissipation module, so that it can make stable contact with the functional module and the heat dissipation module, forming a stable heat conduction channel.

[0057] In one possible implementation, the liquid metal includes gallium-based alloys and / or sodium-potassium alloys; that is, the liquid metal can be a gallium-based alloy, a sodium-potassium alloy, or a mixture of gallium-based alloys and sodium-potassium alloys.

[0058] Gallium-based alloys and sodium-potassium alloys can remain liquid at room temperature (25°C), which allows the conductive and thermally conductive medium to form good contact with the functional module and the heat dissipation module, so that the heat generated by the functional module can be quickly transferred to the heat dissipation module.

[0059] It should be noted that when the conductive and thermally conductive medium is liquid metal, it can adhere to both the heat dissipation module and the functional module. When a second insulating thermally conductive element is provided on the side of the conductive and thermally conductive medium facing the heat dissipation module, the medium can adhere to that element. Similarly, when a first insulating thermally conductive element is provided on the side of the conductive and thermally conductive medium facing the heat dissipation module, the medium can adhere to that element. It is understandable that liquid metal has relatively weak fluidity, meaning the flow resistance of the conductive and thermally conductive medium is relatively high. When the conductive and thermally conductive medium is positioned between the functional module and the heat dissipation module, it is difficult for it to flow beyond the gap between them using its own fluidity.

[0060] In one possible implementation, the electronic device further includes an insulating limiting portion surrounding the conductive and thermally conductive medium, and the ends of the insulating limiting portion are in contact with the functional module and the heat dissipation module, respectively, so that the conductive and thermally conductive medium is located in the central empty area of ​​the insulating limiting portion.

[0061] It should be noted that when the conductive and thermally conductive medium is squeezed by the heat dissipation module and the functional module, the conductive and thermally conductive medium can flow to both sides. If the conductive and thermally conductive medium flows to near the insulating limit part, the inner side of the insulating limit part can abut against the edge of the conductive and thermally conductive medium, so that the conductive and thermally conductive medium can always be located in the central empty area of ​​the insulating limit part.

[0062] The ends of the insulating limiting part are connected to the functional module and the heat dissipation module respectively, and the insulating limiting part surrounds the periphery of the conductive and thermally conductive medium. In this way, the inner surface of the insulating limiting part can restrict the flow of the conductive and thermally conductive medium, thereby reducing the probability of the conductive and thermally conductive medium flowing out of the central empty area of ​​the insulating limiting part and reducing the probability of the conductive and thermally conductive medium coming into contact with other electronic components in the electronic device, thus ensuring the stability of the electronic device.

[0063] In some embodiments, the insulating limiting part can be integrated into the functional module. After the functional module and the heat dissipation module are assembled, the end of the insulating limiting part that is away from the functional module can contact the heat dissipation module. In other embodiments, the insulating limiting part can be integrated into the heat dissipation module. After the functional module and the heat dissipation module are assembled, the end of the insulating limiting part that is away from the heat dissipation module can contact the functional module.

[0064] In some embodiments, the cross-sectional shape of the insulating limiting part can be an annular shape; in other embodiments, the cross-sectional shape of the insulating limiting part can be a square annular shape; and in still other embodiments, the cross-sectional shape of the insulating limiting part can be irregular. The cross-sectional shape of the insulating limiting part can be designed according to the actual shape of the functional module and the heat dissipation module.

[0065] In one possible implementation, the insulating limiting part is a foam component, a glass fiber component, or a ceramic fiber component. In other embodiments, the insulating limiting part may also be made of other insulating materials.

[0066] By using foam, fiberglass, or ceramic fiber components as insulating limit parts, the insulation performance of the insulating limit parts can be effectively guaranteed, thereby reducing the possibility of conductive and heat-conducting media flowing out of the central empty area of ​​the insulating limit parts and reducing the probability of conductive and heat-conducting media coming into contact with other electronic components in the electronic equipment, thus ensuring the stability of the electronic equipment.

[0067] In some embodiments, the electronic device may not have an insulating limiting part. In this case, the coverage area of ​​the conductive and thermally conductive medium can be reduced by controlling the amount of conductive and thermally conductive medium used, thereby reducing the probability of the conductive and thermally conductive medium coming into contact with other electronic components in the electronic device, thus ensuring the stability of the electronic device.

[0068] It should be noted that, regardless of the arrangement of the first and second insulating heat-conducting components, an insulating limiting part may or may not be provided in the electronic device.

[0069] In one possible implementation, the functional module includes a circuit board and components disposed on the circuit board, wherein the conductive and thermally conductive medium is in contact with the side of the components opposite to the circuit board.

[0070] It should be noted that, regardless of the arrangement of the first insulating heat-conducting component, the second insulating heat-conducting component, and the insulating limiting part, a shielding component may or may not be installed inside the electronic device.

[0071] It should be noted that electronic components are the basic building blocks of electronic circuits, possessing specific electrical properties and functions, and are used to realize various signal processing, energy conversion, and other operations in electronic devices. For example, processor chips, memory chips, and image sensors in camera modules are all electronic components.

[0072] Understandably, during the operation of the functional module, the components generate a lot of heat. By placing the conductive and thermally conductive medium in contact with the side of the component away from the circuit board, the heat generated by the component can be directly transferred to the heat dissipation module through the conductive and thermally conductive medium. In this way, the heat absorbed by the circuit board can be reduced, thereby lowering the temperature of the circuit board and reducing the impact on other components connected to the circuit board.

[0073] In one possible implementation, the circuit board is further provided with a shielding component, the components are located within the shielding area of ​​the shielding component, and the conductive and thermally conductive medium contacts the components through the shielding component.

[0074] It should be noted that in some embodiments, multiple components can be set in the shielding area of ​​the shielding component, while in other embodiments, a separate shielding component can be set for each component, that is, only one component is set in a shielding area.

[0075] The shielding area of ​​a shielding component can isolate components from the external environment, blocking external electromagnetic interference outside the shielding area, ensuring the normal operation of components within the shielding area, and providing a relatively stable electromagnetic environment for signal transmission. This reduces the coupling between signals and external electromagnetic interference, thereby ensuring signal integrity. In addition, the shielding component can also limit the electromagnetic radiation generated by the components to a certain range, reducing its interference to other electronic components on the circuit board and surrounding electronic equipment. In other words, the shielding component can isolate various components and signal lines, suppress crosstalk between signals, and ensure that each signal can be transmitted and processed accurately.

[0076] In some embodiments, the conductive and thermally conductive medium can contact the surface of the shielding component, and the first insulating and thermally conductive component is disposed between the conductive and thermally conductive medium and the shielding component. The first insulating and thermally conductive component can be attached to the surface of the shielding component, so that the heat generated by the components can be transferred to the heat dissipation module through the shielding component and the conductive and thermally conductive medium. In some embodiments, when the first insulating and thermally conductive component is provided with an adhesive layer, the first insulating and thermally conductive component can be adhered to the surface of the shielding component.

[0077] In one possible implementation, the shielding component includes a frame and a plate, the frame and the plate being connected and enclosing the shielding area, the side of the frame facing away from the plate being connected to the circuit board, and the conductive and thermally conductive medium contacting the side of the plate facing away from the component.

[0078] The shielding component formed by the enclosure and plate has a well-defined geometry and boundaries. When installed on a circuit board or device, its position and orientation are easily determined, allowing for precise alignment with other components. This improves installation efficiency and accuracy, reducing problems such as poor shielding effectiveness or interference with other components due to improper installation. The structural form of the enclosure and plate facilitates integration with other structural components of electronic equipment. For example, the enclosure can be designed to match the edge of the circuit board or other fixed structures, while the plate can be customized to adapt to different installation spaces and functional requirements, achieving an integrated design of the shielding component and the entire device structure. Furthermore, the interconnected enclosure and plate block electromagnetic signals from entering and exiting the shielded area from all directions. Compared to partially open shielding structures, this provides more comprehensive and efficient electromagnetic shielding, ensuring that internal electronic components are protected from external electromagnetic interference while preventing internally generated electromagnetic radiation from affecting the outside world.

[0079] In some embodiments, the frame and plate can be made of metal, which improves the shielding effect of the shielding component on signals. Furthermore, the heat generated by the components can be quickly transferred to the heat dissipation module through the shielding component and the conductive and thermally conductive medium, improving the heat dissipation effect on the components. For example, the frame and plate can be made of metals such as copper, silver, or gold; the materials of the frame and plate can be the same or different.

[0080] In some embodiments, the edges of the plate can be glued to the end face of the frame. In other embodiments, fasteners such as screws can be used to connect the plate to the frame.

[0081] In some embodiments, the frame and the plate can be connected as a whole by welding or other means to form an integrated shielding component. This can reduce the possibility of gaps between the frame and the plate and improve the shielding capability of the shielding component.

[0082] In some embodiments, the inner side of the insulating limiting portion surrounding the conductive and thermally conductive medium can abut against the peripheral side of the shield. For example, the inner side of the insulating limiting portion can abut against the peripheral side of the frame. In this way, the path of the conductive and thermally conductive medium to the circuit board can be blocked, reducing the probability of a short circuit in the circuit board.

[0083] In one possible implementation, the electronic device further includes a support portion connected to the circuit board and the heat dissipation module respectively, so as to space the heat dissipation module and the circuit board.

[0084] A support is provided between the circuit board and the heat dissipation module, with both ends of the support connected to the circuit board and the heat dissipation module respectively. This allows the gap between the circuit board and the heat dissipation module to be stable, thereby enabling the conductive and thermally conductive medium to make stable contact with the components and the heat dissipation module, ensuring that the heat generated by the components can be stably transferred to the heat dissipation module.

[0085] In a second aspect, an electrical connection component is provided, including a conductive and thermally conductive medium, a heat dissipation module, and a functional module, wherein the conductive and thermally conductive medium is disposed between the heat dissipation module and the functional module to conduct heat generated by the functional module to the heat dissipation module.

[0086] An insulating thermally conductive component is further provided between the heat dissipation module and the functional module. The insulating thermally conductive component is disposed on the side of the conductive thermally conductive medium facing the heat dissipation module, and / or the insulating thermally conductive component is disposed on the side of the conductive thermally conductive medium facing the functional module, so as to make the heat dissipation module and the functional module insulated from each other.

[0087] In this embodiment of the electrical connection assembly, a conductive and thermally conductive medium is placed between the functional module and the heat dissipation module. This allows the heat generated by the functional module to be transferred to the heat dissipation module in a timely manner, reducing heat accumulation within the functional module and ensuring the overall performance of the electrical connection assembly. An insulating thermally conductive component is also placed between the functional module and the heat dissipation module. This component provides an insulated connection between the two modules, preventing electrical conduction due to the conductive and thermally conductive medium. This reduces electromagnetic compatibility issues (such as spurious radiation), thereby improving the overall performance and reliability of the electrical connection assembly. Furthermore, the insulating thermally conductive component is an independent structure, and its position can be flexibly set according to the design requirements of the functional module and the heat dissipation module. The insulating thermally conductive component can be placed between the conductive and thermally conductive medium and the functional module, or between the conductive and thermally conductive medium and the heat dissipation module, facilitating the installation of the electrical connection assembly.

[0088] The insulating thermally conductive component disposed between the conductive and thermally conductive medium and the functional module can be referred to as the first insulating thermally conductive component, and the insulating thermally conductive component disposed between the conductive and thermally conductive medium and the heat dissipation module can be referred to as the second insulating thermally conductive component.

[0089] In some embodiments, the electrical connection component can be applied to the above-described electronic device, such that the conductive and thermally conductive medium, the first insulating and thermally conductive element, the second insulating and thermally conductive element, the heat dissipation module, and the functional module of the electrical connection component respectively correspond to the conductive and thermally conductive medium, the first insulating and thermally conductive element, the second insulating and thermally conductive element, the heat dissipation module, and the functional module of the electronic device in any of the above embodiments.

[0090] In one possible implementation, the insulating thermally conductive element includes an insulating layer and a thermally conductive layer stacked on one side of the insulating layer;

[0091] The insulating layer is disposed between the thermally conductive layer and the conductive and thermally conductive medium, or the thermally conductive layer is disposed between the insulating layer and the conductive and thermally conductive medium.

[0092] The insulating layer is made of insulating material. The heat-conducting layer can also be made of insulating material, in which case the heat-conducting layer does not have electrical conductivity. Alternatively, the heat-conducting layer can be made of conductive material, in which case the heat-conducting layer has electrical conductivity.

[0093] The insulating and thermally conductive component is composed of stacked insulating and thermally conductive layers. The insulating layer provides insulation, ensuring an insulated connection between the functional module and the heat dissipation module. The thermally conductive layer enhances the thermal conductivity of the insulating and thermally conductive component, ensuring that the heat generated by the functional module can be quickly transferred to the heat dissipation module. Furthermore, the layered insulating layer has a large area, thus guaranteeing insulation between the functional module and the heat dissipation module, reducing the possibility of electrical continuity between them, and helping to ensure the performance of the electrical connection components.

[0094] In some embodiments, the insulating thermally conductive element may be in the form of a sheet.

[0095] In one possible implementation, the thermally conductive layer includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

[0096] It should be noted that in some embodiments, the thermally conductive layer can be a single-layer structure, which can be a graphite layer, a boron nitride layer, or a metal layer. In other embodiments, the thermally conductive layer can be a multi-layer structure. For example, it can include two graphite layers, two metal layers, or a graphite layer and a boron nitride layer, or a boron nitride layer and a metal layer, or a graphite layer and a metal layer, or a graphite layer, a boron nitride layer, and a metal layer. The number of layers in the thermally conductive layer can be two, three, four, five, or even more. In some embodiments, when the thermally conductive layer has multiple layers, the insulating layer can be sandwiched between two thermally conductive layers, or it can be not sandwiched between the thermally conductive layers.

[0097] Graphite layers, boron nitride layers, and metal layers have strong thermal conductivity. A thermally conductive layer formed by at least one of these three layers has high thermal conductivity, which can improve the overall thermal conductivity of the insulating thermally conductive component, so that the heat generated by the functional module can be quickly transferred to the heat dissipation module.

[0098] In one possible implementation, the insulating layer includes at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

[0099] It should be noted that in some embodiments, the insulating layer may be a single-layer structure, which may be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer. In other embodiments, the insulating layer may be a multi-layer structure, for example, it may include two polyethylene terephthalate layers, or a polyethylene terephthalate layer and a polyethylene layer, or a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer. The number of insulating layers may be two, three, four, five, or even more. In some embodiments, when the insulating layer is multi-layered, the thermally conductive layer may be sandwiched between two insulating layers, or it may not be sandwiched between the insulating layers.

[0100] The polyethylene terephthalate (PET) layer, polyethylene (PE) layer, polypropylene (PP) layer, and PVC layer have relatively low density and light weight, thus not adding extra or excessive weight to the electrical connection assembly. In addition, the PET, PE, PP, and PVC layers have good flexibility, which allows the insulating and thermally conductive components to withstand external forces such as bending and stretching to a certain extent, thereby facilitating the assembly of the electrical connection assembly.

[0101] In some embodiments, the overall thickness of the insulating thermally conductive component is 0.1mm to 0.15mm. For example, the overall thickness of the insulating thermally conductive component can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, or 0.15mm.

[0102] Setting the overall thickness of the insulating thermally conductive component to no less than 0.1 mm can give it a certain strength, reducing the risk of breakage. Setting the overall thickness to no more than 0.15 mm can reduce the space occupied by the component, thus minimizing its impact on the overall size of the electrical connection components and contributing to the thinner and smaller design of electronic devices.

[0103] An insulating thermally conductive component disposed between a conductive and thermally conductive medium and a functional module can be referred to as a first insulating thermally conductive component. In this case, the thermally conductive layer and the insulating layer of the first insulating thermally conductive component can be referred to as a first thermally conductive layer and a first insulating layer, respectively. An insulating thermally conductive component disposed between a conductive and thermally conductive medium and a heat dissipation module can be referred to as a second insulating thermally conductive component. Furthermore, the size, structure, and material of the first insulating thermally conductive component and the second insulating thermally conductive component can be the same. In other embodiments, the size, structure, and material of the first insulating thermally conductive component and the second insulating thermally conductive component can be different.

[0104] When the electrical connection component is applied to the aforementioned electronic device, the first thermally conductive layer, the first insulating layer, the second thermally conductive layer, and the second insulating layer of the electrical connection component correspond to the first thermally conductive layer, the first insulating layer, the second thermally conductive layer, and the second insulating layer of the aforementioned electronic device, respectively.

[0105] In one possible implementation, the conductive and thermally conductive medium comprises a colloid, wherein at least one of liquid metal, metal particles, and carbon particles is disposed within the colloid; or,

[0106] The conductive and thermally conductive medium is liquid metal.

[0107] It should be noted that there are many types of colloids. For example, colloids can be inorganic colloids, organic colloids, composite colloids, etc.

[0108] It should be noted that liquid metals generally refer to metals or alloys with melting points below room temperature (25°C) or that remain liquid within a certain temperature range. Common liquid metals include mercury, gallium-based alloys (such as gallium-indium alloys, gallium-indium-tin alloys, etc.), and sodium-potassium alloys.

[0109] It should be noted that metal particles refer to tiny particles of a metallic material that have electrical conductivity. For example, metal particles can be silver particles, gold particles, copper particles, nickel particles, etc.

[0110] It should be noted that carbon particles are tiny particulate substances composed of carbon elements. The main types of carbon particles include carbon black particles, activated carbon particles, carbon nanotubes, and graphene. Carbon particles exhibit various morphologies, commonly including spherical, sheet-like, and fibrous shapes. For example, carbon black particles are typically spherical, composed of multiple nanoscale carbon crystallites aggregated together; graphene can be considered a special type of sheet-like carbon particle, composed of a single layer of carbon atoms; and carbon nanotubes exhibit a fibrous shape with a high aspect ratio.

[0111] It should be noted that the colloid of the conductive and thermally conductive medium may contain only one of the following: liquid metal, metal particles, and carbon particles; or any two of the following: liquid metal, metal particles, and carbon particles; or simultaneously: liquid metal, metal particles, and carbon particles.

[0112] The colloid has a certain adhesive ability, which allows it to form a stable heat conduction channel with the functional module and the heat dissipation module. This ensures that the heat generated by the functional module can be continuously transferred to the heat dissipation module. By setting at least one of liquid metal, metal particles, and carbon particles in the colloid of the conductive and thermally conductive medium, the overall thermal conductivity of the conductive and thermally conductive medium can be improved. In this way, the heat generated by the functional module can be quickly transferred to the heat dissipation module, realizing rapid heat dissipation of the functional module.

[0113] When the conductive and thermally conductive medium includes a colloid, it can adhere to the space between the heat dissipation module and the functional module. When an insulating thermally conductive component is located on the side of the conductive and thermally conductive medium facing the heat dissipation module, the conductive and thermally conductive medium can adhere to this component. It is understandable that colloids have weak flowability, meaning the flow resistance of the conductive and thermally conductive medium is relatively high. When the conductive and thermally conductive medium is located between the functional module and the heat dissipation module, it is difficult for it to flow beyond the gap between the two modules using its own fluidity.

[0114] For example, the conductive and thermally conductive medium can be liquid gold grease, which includes silicon grease and a liquid gallium indium alloy mixed in with the silicon grease.

[0115] In other embodiments, the conductive and thermally conductive medium can be liquid metal. Common liquid metals include mercury, gallium-based alloys (such as gallium-indium alloy, gallium-indium-tin alloy, etc.), sodium-potassium alloy, etc. Directly using liquid metal as the conductive and thermally conductive medium can maximize its thermal conductivity, thereby enabling the heat generated by the functional module to be continuously transferred to the heat dissipation module. In addition, liquid metal has a certain degree of fluidity, which allows it to change its shape to fill the gap between the functional module and the heat dissipation module, so that it can make stable contact with the functional module and the heat dissipation module, forming a stable heat conduction channel.

[0116] In one possible implementation, the liquid metal comprises gallium-based alloys and / or sodium-potassium alloys.

[0117] In other words, liquid metal can be gallium-based alloy, sodium-potassium alloy, or a mixture of gallium-based alloy and sodium-potassium alloy.

[0118] Gallium-based alloys and sodium-potassium alloys remain liquid at room temperature (25°C), allowing for good contact between the conductive and thermally conductive media and the functional and heat dissipation modules. This enables rapid heat transfer from the functional modules to the heat dissipation modules. Furthermore, gallium-based alloys and sodium-potassium alloys exhibit good stability and are not easily volatilized at room temperature, thus reducing environmental pollution and ensuring user safety.

[0119] It should be noted that when the conductive and thermally conductive medium is liquid metal, it can adhere to the space between the heat dissipation module and the functional module. When a second insulating thermally conductive element is provided on the side of the conductive and thermally conductive medium facing the heat dissipation module, the conductive and thermally conductive medium can adhere to the second insulating thermally conductive element. When a first insulating thermally conductive element is provided on the side of the conductive and thermally conductive medium facing the heat dissipation module, the conductive and thermally conductive medium can adhere to the first insulating thermally conductive element. It is understandable that liquid metal has relatively weak fluidity, meaning the flow resistance of the conductive and thermally conductive medium is relatively high. When the conductive and thermally conductive medium is placed between the functional module and the heat dissipation module, it is difficult for the conductive and thermally conductive medium to flow beyond the gap between the functional module and the heat dissipation module using its own fluidity.

[0120] In one possible implementation, the electrical connection assembly further includes an insulating limiting portion surrounding the conductive and thermally conductive medium, with the ends of the insulating limiting portion contacting the functional module and the heat dissipation module, respectively, and the conductive and thermally conductive medium located within the central empty area of ​​the insulating limiting portion.

[0121] It should be noted that when the conductive and thermally conductive medium is squeezed by the heat dissipation module and the functional module, the conductive and thermally conductive medium can flow to both sides. If the conductive and thermally conductive medium flows to near the insulating limit part, the inner side of the insulating limit part can abut against the edge of the conductive and thermally conductive medium, so that the conductive and thermally conductive medium can always be located in the central empty area of ​​the insulating limit part.

[0122] The ends of the insulating limiting part are respectively in contact with the functional module and the heat dissipation module, and the insulating limiting part is arranged around the periphery of the conductive and thermally conductive medium. In this way, the inner surface of the insulating limiting part can restrict the flow of the conductive and thermally conductive medium, thereby reducing the possibility of the conductive and thermally conductive medium flowing out of the central empty area of ​​the insulating limiting part and reducing the probability of the conductive and thermally conductive medium coming into contact with other electronic components, thereby ensuring the stability of the electrical connection assembly.

[0123] In some embodiments, the insulating limiting part can be integrated into the functional module. After the functional module and the heat dissipation module are assembled, the end of the insulating limiting part that is away from the functional module can contact the heat dissipation module. In other embodiments, the insulating limiting part can be integrated into the heat dissipation module. After the functional module and the heat dissipation module are assembled, the end of the insulating limiting part that is away from the heat dissipation module can contact the functional module.

[0124] In some embodiments, the cross-sectional shape of the insulating limiting part can be an annular shape, while in other embodiments, the cross-sectional shape of the insulating limiting part can be a square annular shape. In addition, the cross-sectional shape of the insulating limiting part can also be irregular. The cross-sectional shape of the insulating limiting part can be designed according to the actual shape of the functional module and the heat dissipation module.

[0125] In one possible implementation, the insulating limiting part is a foam component, a glass fiber component, or a ceramic fiber component.

[0126] By using foam, fiberglass, or ceramic fiber components as insulating limit parts, the insulation performance of the insulating limit parts can be effectively guaranteed, thereby reducing the possibility of conductive and thermally conductive media flowing out of the central empty area of ​​the insulating limit parts and reducing the probability of conductive and thermally conductive media coming into contact with other electronic components, thus ensuring the stability of electronic equipment.

[0127] When the electrical connection assembly is applied to the aforementioned electronic device, the insulating limiting portion of the electrical connection assembly corresponds to the insulating limiting portion of the aforementioned electronic device.

[0128] It should be noted that regardless of the arrangement of the first and second insulating thermally conductive components, the electrical connection assembly may or may not have an insulating limiting part. When the electrical connection assembly does not have an insulating limiting part, the coverage area of ​​the conductive thermally conductive medium can be reduced by controlling the amount of conductive thermally conductive medium used, thereby reducing the probability of the conductive thermally conductive medium coming into contact with other electronic components, and thus ensuring the stability of the electrical connection assembly.

[0129] In one possible implementation, the functional module includes a circuit board and components disposed on the circuit board, wherein the conductive and thermally conductive medium is in contact with the side of the components opposite to the circuit board.

[0130] Understandably, during the operation of the functional module, the components generate a lot of heat. By placing the conductive and thermally conductive medium in contact with the side of the component away from the circuit board, the heat generated by the component can be directly transferred to the heat dissipation module through the conductive and thermally conductive medium. In this way, the heat absorbed by the circuit board can be reduced, thereby lowering the temperature of the circuit board and reducing the impact on other components connected to the circuit board.

[0131] In one possible implementation, the circuit board is further provided with a shielding component, the components are located within the shielding area of ​​the shielding component, and the conductive and thermally conductive medium contacts the components through the shielding component.

[0132] It should be noted that, regardless of the arrangement of the first insulating heat-conducting component, the second insulating heat-conducting component, and the insulating limiting part, the electrical connection assembly may or may not have a shield.

[0133] It should be noted that in some embodiments, multiple components can be set in the shielding area of ​​the shielding component, while in other embodiments, a separate shielding component can be set for each component, that is, only one component is set in a shielding area.

[0134] The shielding area of ​​a shielding component can isolate components from the external environment, blocking external electromagnetic interference outside the shielding area, ensuring the normal operation of components within the shielding area, and providing a relatively stable electromagnetic environment for signal transmission. This reduces the coupling between signals and external electromagnetic interference, thereby ensuring signal integrity. In addition, the shielding component can also limit the electromagnetic radiation generated by the components to a certain range, reducing its interference to other electronic components on the circuit board and surrounding electronic equipment. In other words, the shielding component can isolate various components and signal lines, suppress crosstalk between signals, and ensure that each signal can be transmitted and processed accurately.

[0135] In some embodiments, the conductive and thermally conductive medium can contact the surface of the shielding component, and the first insulating and thermally conductive component is disposed between the conductive and thermally conductive medium and the shielding component. The first insulating and thermally conductive component can be attached to the surface of the shielding component, so that the heat generated by the components can be transferred to the heat dissipation module through the shielding component and the conductive and thermally conductive medium. In some embodiments, when the first insulating and thermally conductive component is provided with an adhesive layer, the first insulating and thermally conductive component can be adhered to the surface of the shielding component.

[0136] In some embodiments, when the electrical connection component is applied to the electronic device described above, the shield of the electrical connection component corresponds to the shield of the electronic device described above.

[0137] In one possible implementation, the shielding component includes a frame and a plate, the frame and the plate being connected and enclosing the shielding area, the side of the frame facing away from the plate being connected to the circuit board, and the conductive and thermally conductive medium contacting the side of the plate facing away from the component.

[0138] The shielding component formed by the enclosure and plate has a well-defined geometry and boundaries. When installed on a circuit board or device, its position and orientation are easily determined, allowing for precise alignment with other components. This improves installation efficiency and accuracy, reducing problems such as poor shielding effectiveness or interference with other components due to improper installation. The structural form of the enclosure and plate facilitates integration with other structural components. For example, the enclosure can be designed to match the edge of the circuit board or other fixed structures, while the plate can be customized to adapt to different installation spaces and functional requirements, achieving an integrated design of the shielding component and the entire device structure. Furthermore, the interconnected enclosure and plate block electromagnetic signals from entering and exiting the shielded area from all directions. Compared to partially open shielding structures, this provides more comprehensive and efficient electromagnetic shielding, ensuring that internal electronic components are protected from external electromagnetic interference while preventing internally generated electromagnetic radiation from affecting the outside environment.

[0139] In some embodiments, the frame and plate can be made of metal, which improves the shielding effect of the shielding component on signals. Furthermore, the heat generated by the components can be quickly transferred to the heat dissipation module through the shielding component and the conductive and thermally conductive medium, improving the heat dissipation effect on the components. For example, the frame and plate can be made of metals such as copper, silver, or gold; the materials of the frame and plate can be the same or different.

[0140] In some embodiments, the edges of the plate can be glued to the end face of the frame. In other embodiments, fasteners such as screws can be used to connect the plate to the frame.

[0141] In some embodiments, the frame and the plate can be connected as a whole by welding or other means to form an integrated shielding component. This can reduce the possibility of gaps between the frame and the plate and improve the shielding capability of the shielding component.

[0142] In some embodiments, the inner side of the insulating limiting portion surrounding the conductive and thermally conductive medium can abut against the peripheral side of the shield. For example, the inner side of the insulating limiting portion can abut against the peripheral side of the frame. In this way, the path of the conductive and thermally conductive medium to the circuit board can be blocked, reducing the probability of a short circuit in the circuit board.

[0143] In some embodiments, when the electrical connection component is applied to the above-described electronic device, the frame and board of the electrical connection component correspond to the frame and board of the electronic device. Attached Figure Description

[0144] Figure 1 This is a schematic diagram of the structure of an electronic device based on related technologies.

[0145] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0146] Figure 3 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0147] Figure 4 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0148] Figure 5 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0149] Figure 6 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0150] Figure 7 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0151] Figure 8 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0152] Figure 9 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0153] Figure 10 This is a top view of the cross-section of an insulating limiting portion provided in an embodiment of this application.

[0154] Figure 11 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0155] Figure 12 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0156] Figure 13 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0157] Figure 14 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0158] Figure 15 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0159] Figure 16 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application.

[0160] Appendix Figure 1 The marker in:

[0161] 1' Functional module; 2' Liquid metal grease; 3' Heat dissipation module;

[0162] Appendix Figures 2 to 16 The marker in:

[0163] 1. Functional module; 11. Circuit board; 12. Components; 13. Shielding; 131. Frame; 132. Board body; 133. Shielding area;

[0164] 21. Conductive and thermally conductive medium; 22. First insulating and thermally conductive component; 221. First thermally conductive layer; 222. First insulating layer; 23. Second insulating and thermally conductive component; 231. Second thermally conductive layer; 232. Second insulating layer;

[0165] 3. Heat dissipation module;

[0166] 4. Insulating limiting part;

[0167] 5. Support section. Detailed Implementation

[0168] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0169] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0170] In the description of this application, it should be understood that the terms "upper", "lower", "side", "front", "rear", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0171] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0172] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0173] In today's era of rapid technological advancement, electronic devices are widely used in all aspects of people's lives and work. From everyday smartphones and tablets to professional servers and high-performance computers, these electronic devices are becoming increasingly powerful and their performance is constantly improving. However, with the increasing integration of electronic devices and the gradual increase in the operating power of functional modules, heat dissipation has become one of the key factors restricting further improvements in the performance of electronic devices.

[0174] Figure 1 This is a schematic diagram of the structure of an electronic device in related technologies. In related technologies, refer to... Figure 1 Electronic devices mainly consist of a heat dissipation module 3' and a power-consuming functional module 1'. The function of the heat dissipation module 3' is to dissipate the large amount of heat generated by the functional module 1' during operation in a timely manner, ensuring that the functional module 1' can operate stably in a suitable temperature environment and avoiding performance degradation or even damage due to overheating. The functional module 1' is the core component of the electronic device that realizes various specific functions, such as the central processing unit (CPU) and graphics processing unit (GPU) in a mobile phone, which consume a large amount of electrical energy and generate heat during operation.

[0175] To achieve efficient heat transfer, liquid metal grease 2' is often used to connect the heat dissipation module 3' and the functional module 1'. Liquid metal grease 2' is a heat dissipation material that combines the good thermal conductivity of liquid metal with the plasticity and filling properties of silicone grease. It can form a tight heat conduction path between the heat dissipation module and the functional module 1', effectively improving heat dissipation efficiency.

[0176] However, this liquid metal grease 2' also brings some problems. Because liquid metal grease 2' contains metallic materials, these materials have good conductivity. During the operation of electronic devices, if a physical connection is established between functional module 1' and heat dissipation module 3' through liquid metal grease 2', this can easily create an electrical conductive path. If electrical signals in functional module 1' are transmitted to heat dissipation module 3' through this conductive path, it will trigger a series of electromagnetic compatibility (EMC) problems, among which radiated spurious emissions are a particularly prominent issue.

[0177] Radiated spurious signals refer to unwanted electromagnetic signals emitted into the surrounding space by electronic devices during normal operation due to electromagnetic interference from their internal circuitry. These spurious radiated signals can easily interfere with the normal operation of other electronic devices in the vicinity, affecting their performance and stability. Furthermore, radiated spurious signals can also affect the signal reception and processing capabilities of the electronic devices themselves, reducing their overall performance and reliability.

[0178] Based on this, embodiments of this application provide an electrical connection component and an electronic device that can achieve an insulated connection between the functional module and the heat dissipation module while ensuring heat dissipation performance, thus having high reliability.

[0179] This application first provides an electronic device, which may be, for example, a mobile phone, tablet computer, laptop computer, television set, in-vehicle equipment, wearable device, personal digital assistant (PDA), point of sale (POS) terminal, video surveillance equipment, or other electronic products with communication, photography, or video recording functions. The mobile phone may be, for example, a conventional candybar phone or a foldable phone, such as a small vertical folding phone, a horizontally folding phone, or a horizontally folding phone. Wearable devices may include, for example, smart bracelets, smartwatches, wireless headphones, augmented reality (AR) glasses, AR headsets, virtual reality (VR) glasses, or VR headsets.

[0180] Electronic devices can have functional modules such as a display screen, a camera, a central processing unit (CPU), and a memory. The CPU, as the core of the computer system for operation and control, is the final execution unit for information processing and program execution. For example, the CPU can be connected to the display screen, the camera, and the memory respectively, so that the display screen can display the image captured by the camera and the memory can store the captured image.

[0181] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. (Refer to...) Figure 2An electronic device provided in this application includes a conductive and thermally conductive medium 21, a heat dissipation module 3, and a functional module 1. The conductive and thermally conductive medium 21 is disposed between the heat dissipation module 3 and the functional module 1 to conduct heat generated by the functional module 1 to the heat dissipation module 3. A first insulating thermally conductive element 22 is also disposed between the heat dissipation module 3 and the functional module 1. The first insulating thermally conductive element 22 is disposed on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3, or the first insulating thermally conductive element 22 is disposed on the side of the conductive and thermally conductive medium 21 facing the functional module 1, so that the heat dissipation module 3 and the functional module 1 are insulated from each other.

[0182] It should be noted that the functional module 1 within an electronic device refers to a hardware unit composed of multiple electronic components, possessing a specific function and capable of performing that function relatively independently. These functional modules 1 are important components of the electronic device, enabling it to complete various complex tasks through mutual cooperation. For example, functional modules 1 may include a display screen, camera, central processing unit (CPU), memory, microcontroller, flash memory, wireless communication module, wired communication module, battery management module, gravity sensor, etc. In some embodiments, each functional module 1 is designed to perform one or a specific type of function. For instance, a camera is specifically responsible for image capture and video recording, converting optical images into digital image signals through the collaborative work of components such as optical lenses, image sensors, and signal processing circuits. In some embodiments, for some complex functions of the electronic device, multiple functional modules 1 need to work together to achieve the desired result. Taking smartphone internet access as an example, the communication module needs to establish a network connection, the CPU needs to process data and parse protocols, the display screen needs to present web page content, and the memory needs to cache relevant data. Multiple functional modules 1 each play their respective roles, working together to complete the complex function of internet access.

[0183] It should be noted that functional module 1 typically generates heat when powered on. When current flows through the electronic components within functional module 1, the resistance of these components causes the current to do work and convert into heat energy. Even wires with low resistance will generate heat when current flows through them, and this heat accumulates as the current increases and the time passes. Furthermore, functional module 1 may also contain semiconductor components. During data processing, signal transmission, and logic operations, complex electron migration and charge transfer processes occur within these semiconductor components. During these processes, electrons collide with the crystal lattice, causing some electrical energy to be converted into heat energy. Moreover, the higher the operating frequency of the semiconductor components and the larger the amount of data processed, the more heat is generated. For example, when a CPU performs high-intensity computational tasks, its internal transistors rapidly turn on and off, with a large number of electrons flowing within, generating significant heat and causing the CPU temperature to rise. In summary, functional module 1 generates a certain amount of heat during operation.

[0184] It should be noted that the conductive and thermally conductive medium 21 is a type of material that can efficiently transfer heat. It usually has a certain conductivity. In some embodiments, the material of the conductive and thermally conductive medium 21 can be metal, carbon, etc. In other embodiments, the conductive and thermally conductive medium 21 can be a mixture of metal and polymer, or a mixture of carbon material and polymer.

[0185] It should be noted that the conductive and thermally conductive medium 21 is disposed between the heat dissipation module 3 and the functional module 1. When the first insulating thermally conductive element 22 is disposed between the conductive and thermally conductive medium 21 and the heat dissipation module 3, the conductive and thermally conductive medium 21 and the heat dissipation module 3 are in indirect contact. When the first insulating thermally conductive element 22 is disposed between the conductive and thermally conductive medium 21 and the functional module 1, the conductive and thermally conductive medium 21 and the functional module 1 are in indirect contact. Regardless of whether the conductive and thermally conductive medium 21 is in direct or indirect contact with the functional module 1 and the heat dissipation module 3, the heat generated by the functional module 1 can be transferred to the heat dissipation module 3 through the conductive and thermally conductive medium 21, thereby achieving heat dissipation for the functional module 1.

[0186] It should be noted that common forms of heat dissipation modules include air-cooled modules, water-cooled modules, heat pipe modules, vapor chamber modules, liquid-cooled plate modules, and natural cooling modules. Air-cooled modules typically consist of a cooling fan, heat sink fins, and a heatsink base. The fan generates airflow, which carries heat away from the heat sink fins. Water-cooled modules generally include a water block, water pump, water tank, radiator, and cooling fan. The water block contacts the heat-generating components, transferring heat to the circulating coolant. Driven by the pump, the coolant flows through the radiator, where the cooling fan dissipates heat, allowing the coolant to cool before returning to the water block, thus completing the cycle. The heat pipe cooling module consists of heat pipes, heat dissipation fins, and a heat dissipation base. The working fluid inside the heat pipe absorbs heat in the evaporation section and evaporates into a gaseous state. Under the pressure difference within the heat pipe, the gaseous working fluid flows to the condensation section, releases heat, and re-condenses into a liquid state. The liquid working fluid then flows back to the evaporation section through structures such as a wick, thus achieving efficient heat transfer. Finally, the heat is dissipated into the air by the heat dissipation fins. The vapor chamber cooling module mainly consists of a vapor chamber. In some embodiments, the vapor chamber may be used in conjunction with a cooling fan or heat dissipation fins. The vapor chamber contains a vacuum chamber with a special thermally conductive medium and capillary structures. When one side of the vapor chamber is heated, the thermally conductive medium evaporates to form vapor. The vapor rapidly diffuses into a lower-temperature area within the vacuum chamber and condenses into a liquid. The liquid flows back to the heated area through the capillary structures, continuing to evaporate and dissipate heat, thereby achieving rapid and uniform heat dissipation. The liquid-cooled plate heat dissipation module includes a liquid-cooled plate and a coolant circulation system. The coolant flows within the liquid-cooled plate, absorbing heat, and then the heat is carried to an external heat dissipation device through the circulation system. The natural heat dissipation module mainly relies on the equipment's own casing or heat sink structure. It uses heat conduction to transfer heat from inside the equipment to the casing or heat sink, and then dissipates the heat to the surrounding environment through natural convection and thermal radiation. The appropriate type of heat dissipation module 3 can be selected according to the type of functional module 1 to ensure effective heat dissipation for functional module 1, allowing it to operate at a suitable temperature.

[0187] It should be noted that the first insulating thermally conductive element 22 is a material used to achieve both insulation and thermal conductivity. It is typically based on a high-molecular polymer, such as silicone rubber or polyimide. These materials possess good insulation properties, flexibility, and chemical stability, providing the basic physical and chemical characteristics for the insulating thermally conductive element and ensuring stable performance under different environmental conditions. Furthermore, to impart good thermal conductivity, some thermally conductive materials can be incorporated into the base material to improve the overall thermal conductivity of the first insulating thermally conductive element 22. In some embodiments, the first insulating thermally conductive element 22 may be in the form of a sheet.

[0188] It should be noted that the first insulating heat-conducting element 22 is disposed on one side of the conductive heat-conducting medium 21, and the first insulating heat-conducting element 22 is used to insulate the connection between the heat dissipation module 3 and the functional module 1. (Refer to...) Figure 2 In some embodiments, the first insulating thermally conductive element 22 may be disposed between the conductive thermally conductive medium 21 and the functional module 1. Figure 3 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application. (Refer to...) Figure 3 In other embodiments, the first insulating thermally conductive element 22 may be disposed between the conductive thermally conductive medium 21 and the heat dissipation module 3.

[0189] It should be noted that an adhesive layer may be provided on one side of the first insulating heat-conducting component 22. When the first insulating heat-conducting component 22 is disposed between the conductive heat-conducting medium 21 and the functional module 1, the adhesive layer of the first insulating heat-conducting component 22 can be bonded to the functional module 1. When the first insulating heat-conducting component 22 is disposed between the conductive heat-conducting medium 21 and the heat dissipation module 3, the adhesive layer of the first insulating heat-conducting component 22 can be bonded to the heat dissipation module 3, so as to reduce the positional displacement of the first insulating heat-conducting component 22.

[0190] In the electronic device of this embodiment, a conductive and thermally conductive medium 21 is provided between the functional module 1 and the heat dissipation module 3. This allows the heat generated by the functional module 1 to be transferred to the heat dissipation module 3 in a timely manner, reducing heat accumulation within the functional module 1 and ensuring the overall performance of the electronic device. A first insulating thermally conductive element 22 is provided between the functional module 1 and the heat dissipation module 3. The first insulating thermally conductive element 22 provides an insulated connection between the heat dissipation module 3 and the functional module 1, preventing electrical conduction between them due to the conductive and thermally conductive medium 21. This reduces electromagnetic compatibility issues (such as spurious radiation), thereby improving the overall performance and reliability of the electronic device. Furthermore, the first insulating thermally conductive element 22 is an independent structure, and its position can be flexibly set according to the design requirements of the functional module 1 and the heat dissipation module 3. The first insulating thermally conductive element 22 can be placed between the conductive and thermally conductive medium 21 and the functional module 1, or between the conductive and thermally conductive medium 21 and the heat dissipation module 3, to facilitate the installation of the electronic device.

[0191] Figure 4 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application; Figure 5 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application. (Refer to...) Figures 2 to 5 The first insulating and heat-conducting element 22 includes a first insulating layer 222 and a first heat-conducting layer 221 stacked on one side of the first insulating layer 222; see reference. Figure 2 and Figure 3 In some embodiments, the first insulating layer 222 is disposed between the first thermally conductive layer 221 and the conductive and thermally conductive medium 21; see reference. Figure 4 and Figure 5 In other embodiments, the first thermally conductive layer 221 is disposed between the first insulating layer 222 and the conductive and thermally conductive medium 21.

[0192] It should be noted that the first insulating layer 222 is made of insulating material, and the first thermally conductive layer 221 can also be made of insulating material. In this case, the first thermally conductive layer 221 does not have electrical conductivity. Alternatively, the first thermally conductive layer 221 can also be made of conductive material. In this case, the first thermally conductive layer 221 has electrical conductivity.

[0193] The first insulating and heat-conducting component 22 is composed of a first insulating layer 222 and a first thermally conductive layer 221 stacked together. The first insulating layer 222 serves as an insulator, achieving an insulated connection between the functional module 1 and the heat dissipation module 3. The first thermally conductive layer 221 enhances the thermal conductivity of the first insulating and heat-conducting component 22, ensuring that the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3. Furthermore, the layered first insulating layer 222 has a large area, thereby ensuring insulation between the functional module 1 and the heat dissipation module 3, reducing the possibility of electrical conduction between them, and thus helping to ensure the performance of the electronic device.

[0194] Reference Figure 4 In some embodiments, when the first insulating heat-conducting element 22 is disposed between the functional module 1 and the conductive heat-conducting medium 21, the first heat-conducting layer 221 can be disposed between the first insulating layer 222 and the conductive heat-conducting medium 21. That is, the first insulating layer 222 can be connected to the functional module 1, and the first insulating layer 222 can insulate the functional module 1 from the first heat-conducting layer 221. In this way, the first insulating layer 222 can block the current flowing from the functional module 1 to the first heat-conducting layer 221, which can reduce the interference current flowing out of the functional module 1 and help improve the stability and reliability of the electronic device.

[0195] In some embodiments, the first thermally conductive layer 221 includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

[0196] It should be noted that in some embodiments, the first thermally conductive layer 221 can be a single-layer structure, which can be a graphite layer, a boron nitride layer, or a metal layer. In other embodiments, the first thermally conductive layer 221 can be a multi-layer structure. For example, it can include two graphite layers, two metal layers, or a graphite layer and a boron nitride layer, or a boron nitride layer and a metal layer, or a graphite layer and a metal layer, or a graphite layer, a boron nitride layer, and a metal layer. The number of layers in the first thermally conductive layer 221 can be two, three, four, five, or even more, and this application does not impose any limitations on this. In some embodiments, when the first thermally conductive layer 221 is provided with multiple layers, the first insulating layer 222 can be sandwiched between two first thermally conductive layers 221, or it can be not sandwiched between the first thermally conductive layers 221.

[0197] The graphite layer, boron nitride layer, and metal layer have strong thermal conductivity. The first thermally conductive layer 221, formed by at least one of the graphite layer, boron nitride layer, and metal layer, has high thermal conductivity. In this way, the overall thermal conductivity of the first insulating thermally conductive component 22 can be improved, so that the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3.

[0198] In some embodiments, the first insulating layer 222 includes at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

[0199] It should be noted that in some embodiments, the first insulating layer 222 can be a single-layer structure, which can be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer. In other embodiments, the first insulating layer 222 can be a multi-layer structure. For example, it can include two polyethylene terephthalate layers, or include a polyethylene terephthalate layer and a polyethylene layer, or include a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer. The number of layers of the first insulating layer 222 can be two, three, four, five, or even more, and this application does not limit this. In some embodiments, when the first insulating layer 222 is provided with multiple layers, the first thermally conductive layer 221 can be sandwiched between two first insulating layers 222, or it can be not sandwiched between the first insulating layers 222.

[0200] The polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer have relatively low density and light weight, so they will not add extra or excessive weight to the electronic device. In addition, the polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer have good flexibility, so the first insulating heat-conducting component 22 can withstand external forces such as bending and stretching to a certain extent, thereby facilitating the assembly of the electronic device.

[0201] In some embodiments, the overall thickness of the first insulating heat-conducting element 22 is 0.1mm to 0.15mm. For example, the overall thickness of the first insulating heat-conducting element 22 can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, or 0.15mm.

[0202] Setting the overall thickness of the first insulating heat-conducting component 22 to not less than 0.1 mm can give the first insulating heat-conducting component 22 a certain strength, thereby reducing the risk of breakage. Setting the overall thickness of the first insulating heat-conducting component 22 to not more than 0.15 mm can reduce the space occupied by the first insulating heat-conducting component 22 inside the electronic device. This can reduce the impact of the first insulating heat-conducting component 22 on the overall size of the electronic device, and help to achieve the design of the electronic device to be thinner and smaller.

[0203] Figure 6 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application. (Refer to...) Figure 6 In some embodiments, a first insulating thermally conductive element 22 is disposed on the side of the conductive thermally conductive medium 21 facing the functional module 1, and a second insulating thermally conductive element 23 is disposed on the side of the conductive thermally conductive medium 21 facing the heat dissipation module 3, so that the conductive thermally conductive medium 21 and the heat dissipation module 3 are insulatedly connected.

[0204] It should be noted that the second insulating heat-conducting element 23 is a material used to achieve both insulation and heat conduction functions. It is typically based on a high-molecular polymer, such as silicone rubber or polyimide. These materials possess good insulation properties, flexibility, and chemical stability, providing the basic physical and chemical properties for the insulating heat-conducting element and ensuring stable performance under different environmental conditions. Furthermore, to impart good thermal conductivity, some thermally conductive materials can be added to the base material to improve the overall thermal conductivity of the first insulating heat-conducting element 22. Moreover, the structure and materials of the second insulating heat-conducting element 23 and the first insulating heat-conducting element 22 can be the same or different. In some embodiments, the second insulating heat-conducting element 23 can be in the form of a sheet.

[0205] A first insulating thermally conductive element 22 is disposed on the side of the conductive thermally conductive medium 21 facing the functional module 1, and a second insulating thermally conductive element 23 is disposed on the side of the conductive thermally conductive medium 21 facing the heat dissipation module 3. The first insulating thermally conductive element 22 and the second insulating thermally conductive element 23 can respectively insulate the conductive thermally conductive medium 21 from the functional module 1 and the heat dissipation module 3. In this way, the insulating connection between the functional module 1 and the heat dissipation module 3 can be further guaranteed, reducing the possibility of current flowing from the functional module 1 into the heat dissipation module 3, thereby ensuring the reliability of the electronic device. In addition, when one of the first insulating thermally conductive element 22 and the second insulating thermally conductive element 23 is damaged, the other insulating thermally conductive element can still play an insulating role, thereby ensuring the insulating connection between the functional module 1 and the heat dissipation module 3, further improving the reliability of the electronic device.

[0206] Figure 7 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application. (Refer to...) Figure 6 and Figure 7 The second insulating and heat-conducting element 23 includes a second insulating layer 232 and a second heat-conducting layer 231 disposed on one side of the second insulating layer 232; see reference. Figure 7 In some embodiments, the second insulating layer 232 is disposed between the second thermally conductive layer 231 and the conductive and thermally conductive medium 21, as shown in the figure. Figure 6 In other embodiments, the second thermally conductive layer 231 is disposed between the second insulating layer 232 and the conductive and thermally conductive medium 21.

[0207] It should be noted that the second insulating layer 232 is made of insulating material, and the second thermally conductive layer 231 can also be made of insulating material. In this case, the second thermally conductive layer 231 does not have electrical conductivity. Alternatively, the second thermally conductive layer 231 can also be made of conductive material. In this case, the second thermally conductive layer 231 has electrical conductivity.

[0208] The second insulating and heat-conducting component 23 is composed of a second insulating layer 232 and a second heat-conducting layer 231 stacked together. The second insulating layer 232 serves as an insulator, achieving an insulated connection between the functional module 1 and the heat dissipation module 3. The second heat-conducting layer 231 enhances the heat conduction capacity of the second insulating and heat-conducting component 23, ensuring that the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3. In addition, the layered second insulating layer 232 has a large area, thereby ensuring insulation between the conductive and heat-conducting medium 21 and the heat dissipation module 3, reducing the possibility of electrical conduction between the functional module 1 and the heat dissipation module 3, and thus helping to ensure the performance of the electronic device.

[0209] Reference Figure 7 In some embodiments, the second thermally conductive layer 231 can be disposed on the side of the second insulating layer 232 away from the conductive and thermally conductive medium 21. That is, the second insulating layer 232 is connected to the conductive and thermally conductive medium 21, and the second thermally conductive layer 231 is connected to the heat dissipation module 3. If the conductive and thermally conductive medium 21 is accidentally connected to the functional module 1, the second insulating layer 232 can block the current from flowing to the second thermally conductive layer 231, which can reduce the flow range of interference current and help improve the stability and reliability of electronic devices.

[0210] In some embodiments, the second thermally conductive layer 231 includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

[0211] It should be noted that in some embodiments, the second thermally conductive layer 231 can be a single-layer structure, which can be a graphite layer, a boron nitride layer, or a metal layer. In other embodiments, the second thermally conductive layer 231 can be a multi-layer structure. For example, it can include two graphite layers, two metal layers, or a graphite layer and a boron nitride layer, or a boron nitride layer and a metal layer, or a graphite layer and a metal layer, or a graphite layer, a boron nitride layer, and a metal layer. The number of layers of the second thermally conductive layer 231 can be two, three, four, five, or even more, and this application does not impose any limitations on this embodiment. In some embodiments, when the second thermally conductive layer 231 is provided with multiple layers, the second insulating layer 232 can be sandwiched between two second thermally conductive layers 231, or it can be not sandwiched between the second thermally conductive layers 231.

[0212] The graphite layer, boron nitride layer, and metal layer have strong thermal conductivity. The second thermally conductive layer 231 formed by at least one of the graphite layer, boron nitride layer, and metal layer has high thermal conductivity. In this way, the overall thermal conductivity of the second insulating thermally conductive component 23 can be improved, so that the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3.

[0213] In some embodiments, the second insulating layer 232 includes at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

[0214] It should be noted that in some embodiments, the second insulating layer 232 can be a single-layer structure, which can be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer. In other embodiments, the second insulating layer 232 can be a multi-layer structure. For example, it can include two polyethylene terephthalate layers, or include a polyethylene terephthalate layer and a polyethylene layer, or include a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer. The number of layers of the second insulating layer 232 can be two, three, four, five, or even more, and this application does not limit this. In some embodiments, when the second insulating layer 232 is provided with multiple layers, the second thermally conductive layer 231 can be sandwiched between two second insulating layers 232, or it can be not sandwiched between the second insulating layers 232.

[0215] The polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer have relatively low density and light weight, so they will not add extra or excessive weight to the electronic device. In addition, the polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer have good flexibility, so the second insulating heat-conducting component 23 can withstand external forces such as bending and stretching to a certain extent, thereby facilitating the assembly of the electronic device.

[0216] In some embodiments, the overall thickness of the second insulating heat-conducting element 23 is 0.1mm to 0.15mm. For example, the overall thickness of the second insulating heat-conducting element 23 can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, or 0.15mm.

[0217] Setting the overall thickness of the second insulating heat-conducting component 23 to not less than 0.1 mm can give the second insulating heat-conducting component 23 a certain strength, thereby reducing the risk of breakage. Setting the overall thickness of the second insulating heat-conducting component 23 to not more than 0.15 mm can reduce the space occupied by the second insulating heat-conducting component 23 inside the electronic device. This can reduce the impact of the second insulating heat-conducting component 23 on the overall size of the electronic device, and help to achieve the design of the electronic device to be thinner and smaller.

[0218] It should be noted that in some embodiments, the size, structure and material of the first insulating heat-conducting element 22 and the second insulating heat-conducting element 23 may be the same, while in other embodiments, the size, structure and material of the first insulating heat-conducting element 22 and the second insulating heat-conducting element 23 may be different.

[0219] Figure 8 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application; Figure 9 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application. The mounting methods of the first insulating heat-conducting element 22 and the second insulating heat-conducting element 23 can be varied; for example, refer to... Figure 6 In some embodiments, the first thermally conductive layer 221 of the first insulating thermally conductive element 22 and the second thermally conductive layer 231 of the second insulating thermally conductive element 23 can both be bonded to the conductive thermally conductive medium 21. In this case, the first insulating layer 222 of the first insulating thermally conductive element 22 is bonded to the functional module 1, and the second insulating layer 232 of the second insulating thermally conductive element 23 is bonded to the heat dissipation module 3. (Refer to...) Figure 7 In some embodiments, the first thermally conductive layer 221 and the first insulating layer 222 of the first insulating thermally conductive element 22 can be bonded to the conductive thermally conductive medium 21 and the functional module 1, respectively; the second thermally conductive layer 231 and the second insulating layer 232 of the second insulating thermally conductive element 23 can be bonded to the heat dissipation module 3 and the conductive thermally conductive medium 21, respectively. (Refer to...) Figure 8 In some embodiments, the first thermally conductive layer 221 and the first insulating layer 222 of the first insulating thermally conductive element 22 can be bonded to the functional module 1 and the conductive thermally conductive medium 21, respectively; the second thermally conductive layer 231 and the second insulating layer 232 of the second insulating thermally conductive element 23 can be bonded to the heat dissipation module 3 and the conductive thermally conductive medium 21, respectively. (Refer to...) Figure 9 In some embodiments, the first thermally conductive layer 221 and the first insulating layer 222 of the first insulating thermally conductive element 22 can be bonded to the functional module 1 and the conductive and thermally conductive medium 21, respectively; the second thermally conductive layer 231 and the second insulating layer 232 of the second insulating thermally conductive element 23 can be bonded to the conductive and thermally conductive medium 21 and the heat dissipation module 3, respectively. In some other embodiments, the first insulating thermally conductive element 22 and the second insulating thermally conductive element 23 can also be installed in the electronic device in other forms, which will not be described in detail in this application.

[0220] In some embodiments, the conductive and thermally conductive medium 21 includes a colloid, and at least one of liquid metal, metal particles, and carbon particles is disposed within the colloid.

[0221] It should be noted that there are many types of colloids. For example, colloids can be inorganic colloids, organic colloids, composite colloids, etc.

[0222] It should be noted that liquid metals generally refer to metals or alloys with melting points below room temperature (25°C) or that remain liquid within a certain temperature range. Common liquid metals include mercury, gallium-based alloys (such as gallium-indium alloys, gallium-indium-tin alloys, etc.), and sodium-potassium alloys.

[0223] It should be noted that metal particles refer to tiny particles of a metallic material that have electrical conductivity. For example, metal particles can be silver particles, gold particles, copper particles, nickel particles, etc.

[0224] It should be noted that carbon particles are tiny particulate substances composed of carbon elements. The main types of carbon particles include carbon black particles, activated carbon particles, carbon nanotubes, and graphene. Carbon particles exhibit various morphologies, commonly including spherical, sheet-like, and fibrous shapes. For example, carbon black particles are typically spherical, composed of multiple nanoscale carbon crystallites aggregated together; graphene can be considered a special type of sheet-like carbon particle, composed of a single layer of carbon atoms; and carbon nanotubes exhibit a fibrous shape with a high aspect ratio.

[0225] It should be noted that the conductive and thermally conductive medium 21 may contain only one of the following: liquid metal, metal particles, and carbon particles; or any two of the following: liquid metal, metal particles, and carbon particles; or simultaneously: liquid metal, metal particles, and carbon particles.

[0226] The colloid has a certain adhesive ability, which allows it to contact the functional module 1 and the heat dissipation module 3 to form a stable heat conduction channel. This ensures that the heat generated by the functional module 1 can be continuously transferred to the heat dissipation module 3. By setting at least one of liquid metal, metal particles, and carbon particles in the colloid of the conductive and thermally conductive medium 21, the overall thermal conductivity of the conductive and thermally conductive medium 21 can be improved. In this way, the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3, realizing the rapid heat dissipation of the functional module 1.

[0227] Specifically, when the conductive and thermally conductive medium 21 includes a colloid, it can adhere to both the heat dissipation module 3 and the functional module 1. When a second insulating thermally conductive element 23 is provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3, it can adhere to the second insulating thermally conductive element 23. When a first insulating thermally conductive element 22 is provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3, it can adhere to the first insulating thermally conductive element 22. It is understood that the colloid has relatively weak fluidity, meaning the conductive and thermally conductive medium 21 has significant flow resistance. When the conductive and thermally conductive medium 21 is positioned between the functional module 1 and the heat dissipation module 3, it is difficult for it to flow beyond the gap between them using its own fluidity.

[0228] For example, the conductive and thermally conductive medium 21 may be liquid gold grease, which includes silicon grease and liquid gallium indium alloy mixed in the silicon grease.

[0229] In other embodiments, the conductive and thermally conductive medium 21 can be a liquid metal. Common liquid metals include mercury, gallium-based alloys (such as gallium-indium alloy, gallium-indium-tin alloy, etc.), sodium-potassium alloy, etc. Directly using liquid metal as the conductive and thermally conductive medium 21 can maximize the thermal conductivity of the conductive and thermally conductive medium 21, thereby enabling the heat generated by the functional module 1 to be continuously transferred to the heat dissipation module 3; in addition, liquid metal has a certain fluidity, which can change its shape to fill the gap between the functional module 1 and the heat dissipation module 3, so that it can make stable contact with the functional module 1 and the heat dissipation module 3, forming a stable heat conduction channel.

[0230] In some embodiments, the liquid metal includes gallium-based alloys and / or sodium-potassium alloys, that is, the liquid metal can be a gallium-based alloy, a sodium-potassium alloy, or a mixture of gallium-based alloys and sodium-potassium alloys.

[0231] Gallium-based alloys and sodium-potassium alloys remain liquid at room temperature (25°C), allowing for good contact between the conductive and thermally conductive medium 21 and the functional module 1 and the heat dissipation module 3. This enables the heat generated by the functional module 1 to be quickly transferred to the heat dissipation module 3. Furthermore, gallium-based alloys and sodium-potassium alloys exhibit good stability and are not easily volatilized at room temperature, thus reducing environmental pollution and ensuring user safety.

[0232] It should be noted that when the conductive and thermally conductive medium 21 is liquid metal, it can adhere to both the heat dissipation module 3 and the functional module 1. When a second insulating thermally conductive element 23 is provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3, it can adhere to the second insulating thermally conductive element 23. When a first insulating thermally conductive element 22 is provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3, it can adhere to the first insulating thermally conductive element 22. It is understandable that liquid metal has relatively weak fluidity, meaning the flow resistance of the conductive and thermally conductive medium 21 is relatively large. When the conductive and thermally conductive medium 21 is positioned between the functional module 1 and the heat dissipation module 3, it is difficult for it to flow beyond the gap between them using its own fluidity.

[0233] Reference Figure 9 In some embodiments, the electronic device further includes an insulating limiting portion 4 surrounding the conductive and thermally conductive medium 21, and the ends of the insulating limiting portion 4 are in contact with the functional module 1 and the heat dissipation module 3, so that the conductive and thermally conductive medium 21 is located in the central empty area of ​​the insulating limiting portion 4.

[0234] It should be noted that when the conductive and thermally conductive medium 21 is squeezed by the heat dissipation module 3 and the functional module 1, the conductive and thermally conductive medium 21 can flow to both sides. If the conductive and thermally conductive medium 21 flows to the point of approaching the insulating limiting part 4, the inner side of the insulating limiting part 4 can abut against the edge of the conductive and thermally conductive medium 21, so that the conductive and thermally conductive medium 21 can always be located in the central empty area of ​​the insulating limiting part 4.

[0235] The ends of the insulating limiting part 4 are respectively in contact with the functional module 1 and the heat dissipation module 3, and the insulating limiting part 4 is arranged around the periphery of the conductive and heat-conducting medium 21. In this way, the inner surface of the insulating limiting part 4 can restrict the flow of the conductive and heat-conducting medium 21, thereby reducing the probability of the conductive and heat-conducting medium 21 flowing out of the central empty area of ​​the insulating limiting part 4 and reducing the probability of the conductive and heat-conducting medium 21 coming into contact with other electronic components in the electronic device, thereby ensuring the stability of the electronic device.

[0236] In some embodiments, the insulating limiting part 4 can be integrated into the functional module 1. After the functional module 1 and the heat dissipation module 3 are assembled, the end of the insulating limiting part 4 that is away from the functional module 1 can contact the heat dissipation module 3. In other embodiments, the insulating limiting part 4 can be integrated into the heat dissipation module 3. After the functional module 1 and the heat dissipation module 3 are assembled, the end of the insulating limiting part 4 that is away from the heat dissipation module 3 can contact the functional module 1.

[0237] Figure 10 This is a top view of the cross-section of the insulating limiting part 4 provided in an embodiment of this application. (Refer to...) Figure 10 In (a) of the embodiments, the cross-sectional shape of the insulating limiting portion 4 may be annular, see reference. Figure 10 In (b) of the above embodiments, in other embodiments, the cross-sectional shape of the insulating limiting portion 4 may be a square annular shape, as shown in reference to [reference]. Figure 10 In (c), the cross-sectional shape of the insulating limiting part 4 can also be irregular. The cross-sectional shape of the insulating limiting part 4 can be designed according to the actual shape of the functional module 1 and the heat dissipation module 3. This application embodiment does not impose any restrictions here.

[0238] In some embodiments, the insulating limiting part 4 is a foam part, a glass fiber part, or a ceramic fiber part. In other embodiments, the insulating limiting part 4 may also be made of other insulating materials, and this application does not limit the embodiments.

[0239] By setting the insulating limiting part 4 as a foam part, glass fiber cotton part, or ceramic fiber cotton part, the insulation performance of the insulating limiting part 4 can be effectively guaranteed, thereby reducing the possibility of the conductive and heat-conducting medium 21 flowing out of the central empty area of ​​the insulating limiting part 4 and reducing the probability of the conductive and heat-conducting medium 21 coming into contact with other electronic components in the electronic device, thereby ensuring the stability of the electronic device.

[0240] Figure 11This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application; Figure 12 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application. (Refer to...) Figure 11 and Figure 12 In some embodiments, the electronic device may not have an insulating limiting part 4. In this case, the coverage area of ​​the conductive and thermally conductive medium 21 can be reduced by controlling the amount of conductive and thermally conductive medium 21 used, thereby reducing the probability of the conductive and thermally conductive medium 21 coming into contact with other electronic components in the electronic device, thus ensuring the stability of the electronic device.

[0241] It should be noted that, Figure 9 The conductive and thermally conductive medium 21 of the electronic device shown is provided with a first insulating thermally conductive element 22 and a second insulating thermally conductive element 23 on both sides, and an insulating limiting part 4 is provided on the periphery of the conductive and thermally conductive medium 21. Figure 11 The conductive and thermally conductive medium 21 of the electronic device shown is provided with a first insulating thermally conductive element 22 on the side facing the component 12, and no second insulating thermally conductive element 23 is provided on the side facing the heat dissipation module 3. No insulating limiting part 4 is provided on the periphery of the conductive and thermally conductive medium 21. Figure 12 The conductive and thermally conductive medium 21 of the electronic device shown has a first insulating thermally conductive element 22 and a second insulating thermally conductive element 23 respectively provided on both sides. The peripheral part of the conductive and thermally conductive medium 21 is not provided with an insulating limiting part 4. That is, no matter how the first insulating thermally conductive element 22 and the second insulating thermally conductive element 23 are arranged, the insulating limiting part 4 can be provided or not provided in the electronic device.

[0242] Reference Figure 9 The functional module 1 includes a circuit board 11 and components 12 disposed on the circuit board 11. The conductive and thermally conductive medium 21 is in contact with the side of the components 12 away from the circuit board 11.

[0243] It should be noted that component 12 is a basic building block in electronic circuits, possessing specific electrical properties and functions, used to realize various signal processing, energy conversion, and other operations in electronic devices. Examples of components 12 include the processor chip, memory chip, and image sensor in a mobile phone camera module.

[0244] Understandably, during the operation of functional module 1, the components 12 generate a lot of heat. By making the conductive and heat-conducting medium 21 contact the side of the components 12 away from the circuit board 11, the heat generated by the components 12 can be directly transferred to the heat dissipation module 3 through the conductive and heat-conducting medium 21. In this way, the heat absorbed by the circuit board 11 can be reduced, thereby lowering the temperature of the circuit board 11 and reducing the impact on other components 12 connected to the circuit board 11.

[0245] Figure 13 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application; Figure 14 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application; Figure 15 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application; Figure 16 This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application. (Refer to...) Figures 13 to 16 The circuit board 11 is also provided with a shield 13, and the component 12 is located in the shielding area 133 of the shield 13. The conductive and thermally conductive medium 21 contacts the component 12 through the shield 13.

[0246] It should be noted that, Figure 5 The electronic device shown does not have a shield 13, and the conductive and thermally conductive medium 21 can contact the surface of the component 12; Figure 9 The electronic device shown does not have a shield 13. A first insulating heat-conducting element 22 is provided on the side of the conductive and thermally conductive medium 21 facing the component 12. The conductive and thermally conductive medium 21 can contact the surface of the component 12 through the first insulating heat-conducting element 22. An insulating limiting part 4 is provided around the conductive and thermally conductive medium 21. Figure 13 The electronic device shown is provided with a shield 13. A first insulating heat-conducting component 22 and a second insulating heat-conducting component 23 are respectively provided on both sides of the conductive and heat-conducting medium 21. The first insulating heat-conducting component 22 is attached to the surface of the shield 13. An insulating limiting part 4 is provided around the conductive and heat-conducting medium 21. Figure 14 The electronic device shown is provided with a shield 13. A first insulating heat-conducting component 22 is provided on the side of the conductive and thermally conductive medium 21 facing the component 12. The first insulating heat-conducting component 22 is attached to the surface of the shield 13. A second insulating heat-conducting component 23 is not provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3. An insulating limiting part 4 is not provided on the periphery of the conductive and thermally conductive medium 21. Figure 15 The electronic device shown is equipped with a shielding component 13. A first insulating heat-conducting component 22 and a second insulating heat-conducting component 23 are respectively provided on both sides of the conductive and heat-conducting medium 21. The first insulating heat-conducting component 22 is attached to the surface of the shielding component 13. The peripheral part of the conductive and heat-conducting medium 21 is not provided with an insulating limiting part 4. Figure 16 The electronic device shown is equipped with a shield 13. A first insulating heat-conducting element 22 is provided on the side of the conductive and thermally conductive medium 21 facing the component 12. The first insulating heat-conducting element 22 is attached to the surface of the shield 13. A second insulating heat-conducting element 23 is not provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3. An insulating limiting part 4 is provided around the periphery of the conductive and thermally conductive medium 21. That is, regardless of the arrangement of the first insulating heat-conducting element 22, the second insulating heat-conducting element 23, and the insulating limiting part 4, the electronic device may or may not have a shield 13.

[0247] It should be noted that in some embodiments, multiple components 12 can be provided in the shielding area 133 of the shielding component 13, while in other embodiments, a shielding component 13 can be provided separately for each component 12, that is, only one component 12 is provided in a shielding area 133.

[0248] The shielding area 133 of the shielding component 13 can isolate the component 12 from the external environment, blocking external electromagnetic interference outside the shielding area 133, ensuring that the component 12 in the shielding area 133 works normally, and providing a relatively stable electromagnetic environment for signal transmission, reducing the coupling of signals with external electromagnetic interference, thereby ensuring signal integrity; in addition, the shielding component 13 can also limit the electromagnetic radiation generated by the component 12 to a certain range, reducing its interference to other electronic components on the circuit board 11 and surrounding electronic equipment. That is, the shielding component 13 can isolate each component 12 and signal line, suppress crosstalk between signals, and ensure that each signal can be transmitted and processed accurately.

[0249] In some embodiments, the conductive and thermally conductive medium 21 can contact the surface of the shield 13, and the first insulating and thermally conductive element 22 is disposed between the conductive and thermally conductive medium 21 and the shield 13. The first insulating and thermally conductive element 22 can be attached to the surface of the shield 13, so that the heat generated by the component 12 can be transferred to the heat dissipation module 3 through the shield 13 and the conductive and thermally conductive medium 21. In some embodiments, when the first insulating and thermally conductive element 22 is provided with an adhesive layer, the first insulating and thermally conductive element 22 can be adhered to the surface of the shield 13.

[0250] Continue to refer to Figure 13 The shielding component 13 includes a frame 131 and a plate 132. The frame 131 and the plate 132 are connected and enclose a shielding area 133. The side of the frame 131 facing away from the plate 132 is connected to the circuit board 11. The conductive and thermally conductive medium 21 is in contact with the side of the plate 132 facing away from the component 12.

[0251] The shielding component 13, formed by the frame 131 and the plate 132, has a well-defined geometric shape and boundaries. When installed on the circuit board 11 or equipment, its position and orientation are easily determined, allowing for precise alignment with other components. This improves installation efficiency and accuracy, reducing problems such as poor shielding performance or interference with other components due to improper installation. The structural form of the frame 131 and plate 132 facilitates integration with other structural components of the electronic device. For example, the frame 131 can be designed to match the edge of the circuit board 11 or other fixed structures, while the plate 132 can be customized to adapt to different installation spaces and functional requirements, achieving an integrated design of the shielding component 13 with the entire device structure. Furthermore, the interconnected frame 131 and plate 132 block electromagnetic signals from entering and exiting the shielding area 133 from all directions. Compared to partially open shielding structures, this provides more comprehensive and efficient electromagnetic shielding, ensuring that internal electronic components are protected from external electromagnetic interference while preventing internally generated electromagnetic radiation from affecting the outside world.

[0252] In some embodiments, the frame 131 and the plate 132 can be made of metal, which can improve the shielding effect of the shielding component 13 on the signal. In addition, the heat generated by the component 12 can be quickly transferred to the heat dissipation module 3 through the shielding component 13 and the conductive and thermally conductive medium 21, thereby improving the heat dissipation effect of the component 12. For example, the frame 131 and the plate 132 can be made of metals such as copper, silver, and gold. The materials of the frame 131 and the plate 132 can be the same or different.

[0253] In some embodiments, the edge of the plate 132 may be glued to the end face of the frame 131. In other embodiments, fasteners such as screws may be used to connect the plate 132 to the frame 131.

[0254] In some embodiments, the frame 131 and the plate 132 can be connected as a whole by welding or other means to form an integrated shielding component 13. This can reduce the possibility of gaps between the frame 131 and the plate 132 and improve the shielding capability of the shielding component 13.

[0255] Continue to refer to Figure 13 In some embodiments, the inner side of the insulating limiting part 4 surrounding the conductive and thermally conductive medium 21 can abut against the peripheral side of the shield 13. For example, the inner side of the insulating limiting part 4 can abut against the peripheral side of the frame 131. In this way, the path of the conductive and thermally conductive medium 21 to the circuit board 11 can be blocked, reducing the probability of a short circuit in the circuit board 11.

[0256] Continue to refer to Figure 13 The electronic device also includes a support part 5, which is connected to the circuit board 11 and the heat dissipation module 3 respectively, so that the heat dissipation module 3 and the circuit board 11 are spaced apart.

[0257] A support portion 5 is provided between the circuit board 11 and the heat dissipation module 3, and the two ends of the support portion 5 are respectively connected to the circuit board 11 and the heat dissipation module 3. This can stabilize the gap between the circuit board 11 and the heat dissipation module 3, thereby enabling the conductive and thermally conductive medium 21 to make stable contact with the component 12 and the heat dissipation module 3, so as to ensure that the heat generated by the component 12 can be stably transferred to the heat dissipation module 3.

[0258] In the electronic device of this embodiment, a first insulating thermally conductive element 22 is used to insulate the functional module 1 and the heat dissipation module 3. The heat dissipation module 3 and the functional module 1 will not be electrically connected due to the conductive thermally conductive medium 21. This reduces electromagnetic compatibility issues (such as spurious radiation), thereby improving the overall performance and reliability of the electronic device. The use of the conductive thermally conductive medium 21 to transfer heat from the functional module 1 to the heat dissipation module 3 ensures the heat dissipation speed of the components 12 within the functional module 1, reducing the possibility of overheating and malfunction of the components 12. This helps the electronic device to operate continuously at high speed. Furthermore, the first insulating thermally conductive element 22 is an independent structure, and its position can be flexibly set according to the design requirements of the functional module 1 and the heat dissipation module 3, thus facilitating the installation of the electronic device.

[0259] Reference Figure 2 , Figure 3 and Figure 6 This application also provides an electrical connection assembly, including a conductive and thermally conductive medium 21, a heat dissipation module 3, and a functional module 1. The conductive and thermally conductive medium 21 is disposed between the heat dissipation module 3 and the functional module 1 to conduct heat generated by the functional module 1 to the heat dissipation module 3. An insulating thermally conductive component is also disposed between the heat dissipation module 3 and the functional module 1, as shown in the reference. Figure 3 In some embodiments, the insulating thermally conductive element is disposed on the side of the conductive thermally conductive medium 21 facing the heat dissipation module 3, as shown in the figure. Figure 2 In other embodiments, an insulating thermally conductive element is disposed on the side of the conductive and thermally conductive medium 21 facing the functional module 1, as shown in the figure. Figure 6 In some embodiments, insulating thermally conductive elements are respectively disposed on the side of the conductive thermally conductive medium 21 facing the heat dissipation module 3 and on the side of the conductive thermally conductive medium 21 facing the functional module 1, so as to make the heat dissipation module 3 and the functional module 1 insulatedly connected.

[0260] In this embodiment of the electrical connection component, a conductive and thermally conductive medium 21 is provided between the functional module 1 and the heat dissipation module 3. This allows the heat generated by the functional module 1 to be transferred to the heat dissipation module 3 in a timely manner, reducing heat accumulation within the functional module 1 and ensuring the overall performance of the electrical connection component. An insulating thermally conductive component is also provided between the functional module 1 and the heat dissipation module 3. This insulating component ensures an insulated connection between the two modules, preventing electrical conduction due to the conductive and thermally conductive medium 21. This reduces electromagnetic compatibility issues (such as spurious radiation), thereby improving the overall performance and reliability of the electrical connection component. Furthermore, the insulating thermally conductive component is an independent structure, and its position can be flexibly set according to the design requirements of the functional module 1 and the heat dissipation module 3. The insulating thermally conductive component can be placed between the conductive and thermally conductive medium 21 and the functional module 1, or between the conductive and thermally conductive medium 21 and the heat dissipation module 3, facilitating the installation of the electrical connection component.

[0261] The insulating heat-conducting component disposed between the conductive and thermally conductive medium 21 and the functional module 1 can be referred to as the first insulating heat-conducting component 22, and the insulating heat-conducting component disposed between the conductive and thermally conductive medium 21 and the heat dissipation module 3 can be referred to as the second insulating heat-conducting component 23.

[0262] In some embodiments, the electrical connection component can be applied to the electronic device in any of the above embodiments, such that the conductive and thermally conductive medium 21, the first insulating thermally conductive element 22, the second insulating thermally conductive element 23, the heat dissipation module 3, and the functional module 1 of the electrical connection component correspond to the conductive and thermally conductive medium 21, the first insulating thermally conductive element 22, the second insulating thermally conductive element 23, the heat dissipation module 3, and the functional module 1 of the electronic device in any of the above embodiments.

[0263] Reference Figures 6 to 9 In some embodiments, the insulating thermally conductive element includes an insulating layer and a thermally conductive layer stacked on one side of the insulating layer; the insulating layer is disposed between the thermally conductive layer and the conductive thermally conductive medium 21, or the thermally conductive layer is disposed between the insulating layer and the conductive thermally conductive medium 21.

[0264] The insulating layer is made of insulating material. The heat-conducting layer can also be made of insulating material, in which case the heat-conducting layer does not have electrical conductivity. Alternatively, the heat-conducting layer can be made of conductive material, in which case the heat-conducting layer has electrical conductivity.

[0265] An insulating and heat-conducting component is constructed using stacked insulating and heat-conducting layers. The insulating layer provides insulation, ensuring an insulated connection between functional module 1 and heat dissipation module 3. The heat-conducting layer enhances the thermal conductivity of the insulating and heat-conducting component, ensuring that heat generated by functional module 1 can be quickly transferred to heat dissipation module 3. Furthermore, the layered insulating layer has a large area, thus guaranteeing insulation between functional module 1 and heat dissipation module 3, reducing the possibility of electrical continuity between them, and helping to ensure the performance of the electrical connection components.

[0266] In some embodiments, the insulating thermally conductive element may be in the form of a sheet.

[0267] In some embodiments, the thermally conductive layer includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

[0268] It should be noted that in some embodiments, the thermally conductive layer can be a single-layer structure, which can be a graphite layer, a boron nitride layer, or a metal layer. In other embodiments, the thermally conductive layer can be a multi-layer structure. For example, it can include two graphite layers, two metal layers, or a graphite layer and a boron nitride layer, or a boron nitride layer and a metal layer, or a graphite layer and a metal layer, or a graphite layer, a boron nitride layer, and a metal layer. The number of layers in the thermally conductive layer can be two, three, four, five, or even more, and this application does not limit this. In some embodiments, when the thermally conductive layer has multiple layers, the insulating layer can be sandwiched between two thermally conductive layers, or it can be not sandwiched between the thermally conductive layers.

[0269] The graphite layer, boron nitride layer, and metal layer have strong thermal conductivity. The thermal conductive layer formed by at least one of the graphite layer, boron nitride layer, and metal layer has high thermal conductivity. In this way, the overall thermal conductivity of the insulating thermal conductive component can be improved, so that the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3.

[0270] In some embodiments, the insulating layer includes at least one of a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer.

[0271] It should be noted that in some embodiments, the insulating layer can be a single-layer structure, which can be a polyethylene terephthalate layer, a polyethylene layer, a polypropylene layer, or a polyvinyl chloride layer. In other embodiments, the insulating layer can be a multi-layer structure. For example, it can include two polyethylene terephthalate layers, or a polyethylene terephthalate layer and a polyethylene layer, or a polyethylene layer, a polypropylene layer, and a polyvinyl chloride layer. The number of insulating layers can be two, three, four, five, or even more, and this application does not limit this. In some embodiments, when the insulating layer is multi-layered, the thermally conductive layer can be sandwiched between two insulating layers, or it can be not sandwiched between the insulating layers.

[0272] The polyethylene terephthalate (PET) layer, polyethylene (PE) layer, polypropylene (PP) layer, and PVC layer have relatively low density and light weight, thus not adding extra or excessive weight to the electrical connection assembly. In addition, the PET, PE, PP, and PVC layers have good flexibility, which allows the insulating and thermally conductive components to withstand external forces such as bending and stretching to a certain extent, thereby facilitating the assembly of the electrical connection assembly.

[0273] In some embodiments, the overall thickness of the insulating thermally conductive component is 0.1mm to 0.15mm. For example, the overall thickness of the insulating thermally conductive component can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, or 0.15mm.

[0274] Setting the overall thickness of the insulating thermally conductive component to no less than 0.1 mm can give it a certain strength, reducing the risk of breakage. Setting the overall thickness to no more than 0.15 mm can reduce the space occupied by the component, thus minimizing its impact on the overall size of the electrical connection components and contributing to the thinner and smaller design of electronic devices.

[0275] The insulating heat-conducting component disposed between the conductive and thermally conductive medium 21 and the functional module 1 can be referred to as the first insulating heat-conducting component 22. In this case, the thermally conductive layer and the insulating layer of the first insulating heat-conducting component 22 can be referred to as the first thermally conductive layer 221 and the first insulating layer 222, respectively. The insulating heat-conducting component disposed between the conductive and thermally conductive medium 21 and the heat dissipation module 3 can be referred to as the second insulating heat-conducting component 23. In this case, the thermally conductive layer and the insulating layer of the second insulating heat-conducting component can be referred to as the second thermally conductive layer 231 and the second insulating layer 232, respectively. Furthermore, the first insulating heat-conducting component 22 and the second insulating heat-conducting component 23 can have the same size, structure, and material. In other embodiments, the first insulating heat-conducting component 22 and the second insulating heat-conducting component 23 can have different size, structure, and material.

[0276] When the electrical connection component is applied to the electronic device in any of the above embodiments, the first thermally conductive layer 221, the first insulating layer 222, the second thermally conductive layer 231, and the second insulating layer 232 of the electrical connection component correspond to the first thermally conductive layer 221, the first insulating layer 222, the second thermally conductive layer 231, and the second insulating layer 232 of the electronic device in any of the above embodiments.

[0277] In some embodiments, the conductive and thermally conductive medium 21 of the electrical connection component includes a colloid, wherein at least one of liquid metal, metal particles, and carbon particles is disposed within the colloid.

[0278] It should be noted that there are many types of colloids. For example, colloids can be inorganic colloids, organic colloids, composite colloids, etc.

[0279] It should be noted that liquid metals generally refer to metals or alloys with melting points below room temperature (25°C) or that remain liquid within a certain temperature range. Common liquid metals include mercury, gallium-based alloys (such as gallium-indium alloys, gallium-indium-tin alloys, etc.), and sodium-potassium alloys.

[0280] It should be noted that metal particles refer to tiny particles of a metallic material that have electrical conductivity. For example, metal particles can be silver particles, gold particles, copper particles, nickel particles, etc.

[0281] It should be noted that carbon particles are tiny particulate substances composed of carbon elements. The main types of carbon particles include carbon black particles, activated carbon particles, carbon nanotubes, and graphene. Carbon particles exhibit various morphologies, commonly including spherical, sheet-like, and fibrous shapes. For example, carbon black particles are typically spherical, composed of multiple nanoscale carbon crystallites aggregated together; graphene can be considered a special type of sheet-like carbon particle, composed of a single layer of carbon atoms; and carbon nanotubes exhibit a fibrous shape with a high aspect ratio.

[0282] It should be noted that the conductive and thermally conductive medium 21 may contain only one of the following: liquid metal, metal particles, and carbon particles; or any two of the following: liquid metal, metal particles, and carbon particles; or simultaneously: liquid metal, metal particles, and carbon particles.

[0283] The colloid has a certain adhesive ability, which allows it to contact the functional module 1 and the heat dissipation module 3 to form a stable heat conduction channel. This ensures that the heat generated by the functional module 1 can be continuously transferred to the heat dissipation module 3. By setting at least one of liquid metal, metal particles, and carbon particles in the colloid of the conductive and thermally conductive medium 21, the overall thermal conductivity of the conductive and thermally conductive medium 21 can be improved. In this way, the heat generated by the functional module 1 can be quickly transferred to the heat dissipation module 3, realizing the rapid heat dissipation of the functional module 1.

[0284] When the conductive and thermally conductive medium 21 includes a colloid, it can adhere to the space between the heat dissipation module 3 and the functional module 1. When an insulating thermally conductive component is provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3, it can adhere to this component. It is understood that colloids have weak fluidity, meaning the flow resistance of the conductive and thermally conductive medium 21 is relatively high. When the conductive and thermally conductive medium 21 is positioned between the functional module 1 and the heat dissipation module 3, it is difficult for it to flow beyond the gap between them using its own fluidity.

[0285] For example, the conductive and thermally conductive medium 21 may be liquid gold grease, which includes silicon grease and liquid gallium indium alloy mixed in the silicon grease.

[0286] In other embodiments, the conductive and thermally conductive medium 21 can be a liquid metal. Common liquid metals include mercury, gallium-based alloys (such as gallium-indium alloy, gallium-indium-tin alloy, etc.), sodium-potassium alloy, etc. Directly using liquid metal as the conductive and thermally conductive medium 21 can maximize the thermal conductivity of the conductive and thermally conductive medium 21, thereby enabling the heat generated by the functional module 1 to be continuously transferred to the heat dissipation module 3; in addition, liquid metal has a certain fluidity, which can change its shape to fill the gap between the functional module 1 and the heat dissipation module 3, so that it can make stable contact with the functional module 1 and the heat dissipation module 3, forming a stable heat conduction channel.

[0287] In some embodiments, the liquid metal includes gallium-based alloys and / or sodium-potassium alloys, that is, the liquid metal can be a gallium-based alloy, a sodium-potassium alloy, or a mixture of gallium-based alloys and sodium-potassium alloys.

[0288] Gallium-based alloys and sodium-potassium alloys remain liquid at room temperature (25°C), allowing for good contact between the conductive and thermally conductive medium 21 and the functional module 1 and the heat dissipation module 3. This enables the heat generated by the functional module 1 to be quickly transferred to the heat dissipation module 3. Furthermore, gallium-based alloys and sodium-potassium alloys exhibit good stability and are not easily volatilized at room temperature, thus reducing environmental pollution and ensuring user safety.

[0289] It should be noted that when the conductive and thermally conductive medium 21 is liquid metal, it can adhere to the space between the heat dissipation module 3 and the functional module 1. When a second insulating thermally conductive element 23 is provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3, it can adhere to the second insulating thermally conductive element 23. When a first insulating thermally conductive element 22 is provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3, it can adhere to the first insulating thermally conductive element 22. It is understandable that liquid metal has relatively weak fluidity, meaning the flow resistance of the conductive and thermally conductive medium 21 is relatively large. When the conductive and thermally conductive medium 21 is placed between the functional module 1 and the heat dissipation module 3, it is difficult for it to flow beyond the gap between the functional module 1 and the heat dissipation module 3 due to its own fluidity.

[0290] Reference Figure 9 In some embodiments, the electrical connection assembly may further include an insulating limiting portion 4 surrounding the conductive and thermally conductive medium 21, and the ends of the insulating limiting portion 4 are in contact with the functional module 1 and the heat dissipation module 3, so that the conductive and thermally conductive medium 21 is located in the central empty area of ​​the insulating limiting portion 4.

[0291] It should be noted that when the conductive and thermally conductive medium 21 is squeezed by the heat dissipation module 3 and the functional module 1, the conductive and thermally conductive medium 21 can flow to both sides. If the conductive and thermally conductive medium 21 flows to the point of approaching the insulating limiting part 4, the inner side of the insulating limiting part 4 can abut against the edge of the conductive and thermally conductive medium 21, so that the conductive and thermally conductive medium 21 can always be located in the central empty area of ​​the insulating limiting part 4.

[0292] The ends of the insulating limiting part 4 are respectively in contact with the functional module 1 and the heat dissipation module 3, and the insulating limiting part 4 is arranged around the periphery of the conductive and thermally conductive medium 21. In this way, the inner surface of the insulating limiting part 4 can restrict the flow of the conductive and thermally conductive medium 21, thereby reducing the possibility that the conductive and thermally conductive medium 21 will flow out of the central empty area of ​​the insulating limiting part 4, reducing the probability that the conductive and thermally conductive medium 21 will come into contact with other electronic components, thereby ensuring the stability of the electrical connection assembly.

[0293] In some embodiments, the insulating limiting part 4 can be integrated into the functional module 1. After the functional module 1 and the heat dissipation module 3 are assembled, the end of the insulating limiting part 4 that is away from the functional module 1 can contact the heat dissipation module 3. In other embodiments, the insulating limiting part 4 can be integrated into the heat dissipation module 3. After the functional module 1 and the heat dissipation module 3 are assembled, the end of the insulating limiting part 4 that is away from the heat dissipation module 3 can contact the functional module 1.

[0294] Reference Figure 10 In (a) of the embodiments, the cross-sectional shape of the insulating limiting portion 4 may be annular, see reference. Figure 10 In (b) of the above embodiments, in other embodiments, the cross-sectional shape of the insulating limiting portion 4 may be a square annular shape, as shown in reference to [reference]. Figure 10 In (c), the cross-sectional shape of the insulating limiting part 4 can also be irregular. The cross-sectional shape of the insulating limiting part 4 can be designed according to the actual shape of the functional module 1 and the heat dissipation module 3. This application embodiment does not impose any restrictions here.

[0295] In some embodiments, the insulating limiting part 4 is a foam part, a glass fiber part, or a ceramic fiber part. In other embodiments, the insulating limiting part 4 may also be made of other insulating materials, and this application does not limit the embodiments.

[0296] By setting the insulating limiting part 4 as a foam part, glass fiber cotton part, or ceramic fiber cotton part, the insulation performance of the insulating limiting part 4 can be effectively guaranteed, thereby reducing the outflow of the conductive and heat-conducting medium 21 from the central empty area of ​​the insulating limiting part 4, reducing the probability of the conductive and heat-conducting medium 21 coming into contact with other electronic components, and thus ensuring the stability of the electrical connection assembly.

[0297] When the electrical connection component is applied to the electronic device in any of the above embodiments, the insulation limiting part 4 of the electrical connection component corresponds to the insulation limiting part 4 of the electronic device in any of the above embodiments.

[0298] Reference Figure 11 and Figure 12 In some embodiments, the electrical connection assembly may not have an insulating limiting part 4. In this case, the coverage area of ​​the conductive and thermally conductive medium 21 can be reduced by controlling the amount of conductive and thermally conductive medium 21, thereby reducing the probability of the conductive and thermally conductive medium 21 coming into contact with other electronic components, thus ensuring the stability of the electrical connection assembly.

[0299] It should be noted that, Figure 9 The conductive and thermally conductive medium 21 shown has a first insulating thermally conductive element 22 and a second insulating thermally conductive element 23 respectively provided on both sides, and an insulating limiting part 4 is provided on the periphery of the conductive and thermally conductive medium 21. Figure 11 The conductive and thermally conductive medium 21 shown has a first insulating thermally conductive element 22 on the side facing the component 12, and no second insulating thermally conductive element 23 on the side facing the heat dissipation module 3. The conductive and thermally conductive medium 21 does not have an insulating limiting part 4 on its periphery. Figure 12 The conductive and thermally conductive medium 21 shown has a first insulating thermally conductive element 22 and a second insulating thermally conductive element 23 respectively provided on both sides, and the peripheral part of the conductive and thermally conductive medium 21 is not provided with an insulating limiting part 4. That is, no matter how the first insulating thermally conductive element 22 and the second insulating thermally conductive element 23 are arranged, the electrical connection assembly can be provided or not provided with an insulating limiting part 4.

[0300] Reference Figure 9 The functional module 1 includes a circuit board 11 and components 12 disposed on the circuit board 11. The conductive and thermally conductive medium 21 is in contact with the side of the components 12 away from the circuit board 11.

[0301] It should be noted that component 12 is a basic building block in electronic circuits, possessing specific electrical properties and functions, used to realize various signal processing, energy conversion, and other operations in electronic devices. Examples of components 12 include the processor chip, memory chip, and image sensor in a mobile phone camera module.

[0302] Understandably, during the operation of functional module 1, the components 12 generate a lot of heat. By making the conductive and heat-conducting medium 21 contact the side of the components 12 away from the circuit board 11, the heat generated by the components 12 can be directly transferred to the heat dissipation module 3 through the conductive and heat-conducting medium 21. In this way, the heat absorbed by the circuit board 11 can be reduced, thereby lowering the temperature of the circuit board 11 and reducing the impact on other components 12 connected to the circuit board 11.

[0303] Reference Figures 13 to 16 The circuit board 11 is also provided with a shield 13, and the component 12 is located in the shielding area 133 of the shield 13. The conductive and thermally conductive medium 21 contacts the component 12 through the shield 13.

[0304] It should be noted that, Figure 5 The electrical connection assembly shown does not have a shield 13, and the conductive and thermally conductive medium 21 can contact the surface of the component 12; Figure 9 The electrical connection assembly shown does not have a shield 13. The conductive and thermally conductive medium 21 has a first insulating and thermally conductive element 22 on the side facing the component 12. The conductive and thermally conductive medium 21 can contact the surface of the component 12 through the first insulating and thermally conductive element 22. Figure 13 The electrical connection assembly shown is provided with a shield 13. A first insulating heat-conducting component 22 and a second insulating heat-conducting component 23 are respectively provided on both sides of the conductive and heat-conducting medium 21. The first insulating heat-conducting component 22 is attached to the surface of the shield 13. An insulating limiting part 4 is provided around the conductive and heat-conducting medium 21. Figure 14 The electrical connection assembly shown is provided with a shield 13. A first insulating heat-conducting component 22 is provided on the side of the conductive and thermally conductive medium 21 facing the component 12. The first insulating heat-conducting component 22 is attached to the surface of the shield 13. A second insulating heat-conducting component 23 is not provided on the side of the conductive and thermally conductive medium 21 facing the heat dissipation module 3. An insulating limiting part 4 is not provided on the periphery of the conductive and thermally conductive medium 21. Figure 15 The electrical connection assembly shown is provided with a shield 13. A first insulating heat-conducting component 22 and a second insulating heat-conducting component 23 are respectively provided on both sides of the conductive and heat-conducting medium 21. The first insulating heat-conducting component 22 is attached to the surface of the shield 13. The peripheral part of the conductive and heat-conducting medium 21 is not provided with an insulating limiting part 4. Figure 16 The electrical connection assembly shown is provided with a shield 13. A first insulating and thermally conductive element 22 is provided on the side of the conductive and thermally conductive medium 21 facing the component 12. The conductive and thermally conductive medium 21 can contact the surface of the shield 13 through the first insulating and thermally conductive element 22. An insulating limiting part 4 is provided around the periphery of the conductive and thermally conductive medium 21. That is, no matter how the first insulating and thermally conductive element 22, the second insulating and thermally conductive element 23 and the insulating limiting part 4 are arranged, the electrical connection assembly can be provided with or without a shield 13.

[0305] It should be noted that in some embodiments, multiple components 12 can be provided in the shielding area 133 of the shielding component 13, while in other embodiments, a shielding component 13 can be provided separately for each component 12, that is, only one component 12 is provided in a shielding area 133.

[0306] The shielding area 133 of the shielding component 13 can isolate the component 12 from the external environment, blocking external electromagnetic interference outside the shielding area 133, ensuring that the component 12 in the shielding area 133 works normally, and providing a relatively stable electromagnetic environment for signal transmission, reducing the coupling of signals with external electromagnetic interference, thereby ensuring signal integrity; in addition, the shielding component 13 can also limit the electromagnetic radiation generated by the component 12 to a certain range, reducing its interference to other electronic components on the circuit board 11 and surrounding electronic equipment. That is, the shielding component 13 can isolate each component 12 and signal line, suppress crosstalk between signals, and ensure that each signal can be transmitted and processed accurately.

[0307] In some embodiments, the conductive and thermally conductive medium 21 can contact the surface of the shield 13, and the first insulating and thermally conductive element 22 is disposed between the conductive and thermally conductive medium 21 and the shield 13. The first insulating and thermally conductive element 22 can be attached to the surface of the shield 13, so that the heat generated by the component 12 can be transferred to the heat dissipation module 3 through the shield 13 and the conductive and thermally conductive medium 21. In some embodiments, when the first insulating and thermally conductive element 22 is provided with an adhesive layer, the first insulating and thermally conductive element 22 can be adhered to the surface of the shield 13.

[0308] In some embodiments, when the electrical connection component is applied to the electronic device in any of the above embodiments, the shield 13 of the electrical connection component corresponds to the shield 13 of the electronic device in any of the above embodiments.

[0309] Continue to refer to Figure 13 The shielding component 13 includes a frame 131 and a plate 132. The frame 131 and the plate 132 are connected and enclose a shielding area 133. The side of the frame 131 facing away from the plate 132 is connected to the circuit board 11. The conductive and thermally conductive medium 21 is in contact with the side of the plate 132 facing away from the component 12.

[0310] The shielding component 13, formed by the frame 131 and the plate 132, has a well-defined geometric shape and boundaries. When installed on the circuit board 11 or equipment, its position and orientation are easily determined, allowing for precise alignment with other components, improving installation efficiency and accuracy, and reducing problems such as poor shielding performance or interference with other components due to improper installation. The structural form of the frame 131 and the plate 132 facilitates integration with other structural components. For example, the frame 131 can be designed to match the edge of the circuit board 11 or other fixed structures, while the plate 132 can be customized to adapt to different installation spaces and functional requirements, achieving an integrated design of the shielding component 13 with the entire equipment structure. Furthermore, the interconnection of the frame 131 and the plate 132 blocks electromagnetic signals from entering and exiting the shielding area 133 from all directions. Compared to partially open shielding structures, this provides more comprehensive and efficient electromagnetic shielding, ensuring that internal electronic components are protected from external electromagnetic interference while preventing internally generated electromagnetic radiation from affecting the outside world.

[0311] In some embodiments, the frame 131 and the plate 132 can be made of metal, which can improve the shielding effect of the shielding component 13 on the signal. In addition, the heat generated by the component 12 can be quickly transferred to the heat dissipation module 3 through the shielding component 13 and the conductive and thermally conductive medium 21, thereby improving the heat dissipation effect of the component 12. For example, the frame 131 and the plate 132 can be made of metals such as copper, silver, and gold. The materials of the frame 131 and the plate 132 can be the same or different.

[0312] In some embodiments, the edge of the plate 132 may be glued to the end face of the frame 131. In other embodiments, fasteners such as screws may be used to connect the plate 132 to the frame 131.

[0313] In some embodiments, the frame 131 and the plate 132 can be connected as a whole by welding or other means to form an integrated shielding component 13. This can reduce the possibility of gaps between the frame 131 and the plate 132 and improve the shielding capability of the shielding component 13.

[0314] Continue to refer to Figure 13 In some embodiments, the inner side of the insulating limiting part 4 surrounding the conductive and thermally conductive medium 21 can abut against the peripheral side of the shield 13. For example, the inner side of the insulating limiting part 4 can abut against the peripheral side of the frame 131. In this way, the path of the conductive and thermally conductive medium 21 to the circuit board 11 can be blocked, reducing the probability of a short circuit in the circuit board 11.

[0315] In some embodiments, when the electrical connection component is applied to the electronic device in any of the above embodiments, the frame 131 and plate 132 of the electrical connection component correspond to the frame 131 and plate 132 of the electronic device in any of the above embodiments.

[0316] In some embodiments, when the electrical connection component is applied to the electronic device in any of the above embodiments, the support portion 5 of the electronic device may be disposed between the circuit board 11 and the heat dissipation module 3, and the support portion 5 may be connected to the circuit board 11 and the heat dissipation module 3 to make the heat dissipation module 3 and the circuit board 11 spaced apart.

[0317] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, comprising: It includes a conductive and thermally conductive medium (21), a heat dissipation module (3) and a functional module (1). The conductive and thermally conductive medium (21) is disposed between the heat dissipation module (3) and the functional module (1) to conduct the heat generated by the functional module (1) to the heat dissipation module (3). A first insulating heat-conducting component (22) is provided between the heat dissipation module (3) and the functional module (1). The first insulating heat-conducting component (22) is disposed on the side of the conductive heat-conducting medium (21) facing the heat dissipation module (3), or the first insulating heat-conducting component (22) is disposed on the side of the conductive heat-conducting medium (21) facing the functional module (1), so that the heat dissipation module (3) and the functional module (1) are insulated from each other.

2. The electronic device of claim 1, wherein, The first insulating and heat-conducting component (22) includes a first insulating layer (222) and a first heat-conducting layer (221) stacked on one side of the first insulating layer (222); The first insulating layer (222) is disposed between the first thermally conductive layer (221) and the conductive and thermally conductive medium (21), or the first thermally conductive layer (221) is disposed between the first insulating layer (222) and the conductive and thermally conductive medium (21).

3. The electronic device of claim 2, wherein, The first thermally conductive layer (221) includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

4. The electronic device of claim 2 or 3, wherein, The first insulating layer (222) includes at least one of polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer.

5. The electronic device of any of claims 1-4, wherein, The first insulating heat-conducting component (22) is disposed on the side of the conductive heat-conducting medium (21) facing the functional module (1), and the second insulating heat-conducting component (23) is disposed on the side of the conductive heat-conducting medium (21) facing the heat dissipation module (3) so that the conductive heat-conducting medium (21) and the heat dissipation module (3) are insulatedly connected.

6. The electronic device of claim 5, wherein, The second insulating heat-conducting element (23) includes a second insulating layer (232) and a second heat-conducting layer (231) disposed on one side of the second insulating layer (232); The second insulating layer (232) is disposed between the second thermally conductive layer (231) and the conductive and thermally conductive medium (21), or the second thermally conductive layer (231) is disposed between the second insulating layer (232) and the conductive and thermally conductive medium (21).

7. The electronic device of claim 6, wherein, The second thermally conductive layer (231) includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

8. The electronic device of claim 6 or 7, wherein, The second insulating layer (232) includes at least one of polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer.

9. The electronic device of any of claims 1-8, wherein, The conductive and thermally conductive medium (21) includes a colloid, wherein at least one of liquid metal, metal particles, and carbon particles is disposed within the colloid; or, The conductive and thermally conductive medium (21) is a liquid metal.

10. The electronic device of claim 9, wherein, The liquid metal includes gallium-based alloys and / or sodium-potassium alloys.

11. The electronic device of any of claims 1-10, wherein, The electronic device further includes an insulating limiting part (4) surrounding the conductive and thermally conductive medium (21), and the ends of the insulating limiting part (4) are in contact with the functional module (1) and the heat dissipation module (3) respectively, and the conductive and thermally conductive medium (21) is located in the central empty area of ​​the insulating limiting part (4).

12. The electronic device of claim 11, wherein, The insulating limiting part is a foam component, a glass fiber component, or a ceramic fiber component.

13. The electronic device of any of claims 1-12, wherein, The functional module (1) includes a circuit board (11) and components (12) disposed on the circuit board (11), wherein the conductive and thermally conductive medium (21) is in contact with the side of the components (12) away from the circuit board (11).

14. The electronic device of claim 13, wherein, The circuit board (11) is also provided with a shield (13), and the component (12) is located in the shielding area (133) of the shield (13). The conductive and thermally conductive medium (21) contacts the component (12) through the shield (13).

15. The electronic device of claim 14, wherein, The shielding component (13) includes a frame (131) and a plate (132). The frame (131) and the plate (132) are connected and enclose the shielding area (133). The side of the frame (131) away from the plate (132) is connected to the circuit board (11). The conductive and thermally conductive medium (21) is in contact with the side of the plate (132) away from the component (12).

16. The electronic device of any of claims 13-15, wherein, The electronic device also includes a support (5), which is connected to the circuit board (11) and the heat dissipation module (3) respectively, so that the heat dissipation module (3) and the circuit board (11) are spaced apart.

17. An electrical connection assembly, characterised in that It includes a conductive and thermally conductive medium (21), a heat dissipation module (3) and a functional module (1). The conductive and thermally conductive medium (21) is disposed between the heat dissipation module (3) and the functional module (1) to conduct the heat generated by the functional module (1) to the heat dissipation module (3). An insulating thermally conductive component is provided between the heat dissipation module (3) and the functional module (1). The insulating thermally conductive component is disposed on the side of the conductive thermally conductive medium (21) facing the heat dissipation module (3), and / or, the insulating thermally conductive component is disposed on the side of the conductive thermally conductive medium (21) facing the functional module (1), so that the heat dissipation module (3) and the functional module (1) are insulated from each other.

18. The electrical connection assembly according to claim 17, characterized in that, The insulating and heat-conducting component includes an insulating layer and a heat-conducting layer stacked on one side of the insulating layer; The insulating layer is disposed between the thermally conductive layer and the conductive and thermally conductive medium (21), or the thermally conductive layer is disposed between the insulating layer and the conductive and thermally conductive medium (21).

19. An electrical connection assembly according to claim 18, wherein, The thermally conductive layer includes at least one of a graphite layer, a boron nitride layer, and a metal layer.

20. An electrical connection assembly according to claim 18 or 19, characterised in that, The insulating layer includes at least one of polyethylene terephthalate layer, polyethylene layer, polypropylene layer, and polyvinyl chloride layer.

21. An electrical connection assembly according to any of claims 17 to 20, wherein, The conductive and thermally conductive medium (21) includes a colloid, wherein at least one of liquid metal, metal particles, and carbon particles is disposed within the colloid; or, The conductive and thermally conductive medium (21) is a liquid metal.

22. An electrical connection assembly according to claim 21, wherein, The liquid metal includes gallium-based alloys and / or sodium-potassium alloys.

23. An electrical connection assembly according to any of claims 17 to 22, wherein, The electrical connection assembly further includes an insulating limiting part (4) surrounding the conductive and thermally conductive medium (21), and the ends of the insulating limiting part (4) are in contact with the functional module (1) and the heat dissipation module (3) respectively, and the conductive and thermally conductive medium (21) is located in the central empty area of ​​the insulating limiting part (4).

24. An electrical connection assembly according to claim 23, wherein, The insulating limiting part is a foam component, a glass fiber component, or a ceramic fiber component.

25. An electrical connection assembly according to any of claims 17 to 24, wherein, The functional module (1) includes a circuit board (11) and components (12) disposed on the circuit board (11), wherein the conductive and thermally conductive medium (21) is in contact with the side of the components (12) away from the circuit board (11).

26. The electrical connection assembly according to claim 25, characterized in that, The circuit board (11) is also provided with a shield (13), and the component (12) is located in the shielding area (133) of the shield (13). The conductive and thermally conductive medium (21) contacts the component (12) through the shield (13).

27. An electrical connection assembly according to claim 26, wherein, The shielding component (13) includes a frame (131) and a plate (132). The frame (131) and the plate (132) are connected and enclose the shielding area (133). The side of the frame (131) away from the plate (132) is connected to the circuit board (11). The conductive and thermally conductive medium (21) is in contact with the side of the plate (132) away from the component (12).

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