Heat dissipation structure and intelligent equipment

Abstract

The embodiment of the utility model discloses a heat dissipation structure and intelligent equipment. The utility model provides a heat dissipation structure. The heat dissipation structure comprises a mainboard and heat dissipation fins, the radiating fin comprises a first radiating fin and a second radiating fin, and the first radiating fin and the second radiating fin are vertically and fixedly connected. The first cooling fin is attached to the mainboard, and the second cooling fin is attached to a middle frame of the intelligent device. The first cooling fin is attached to the mainboard, heat generated by the mainboard is guided into the second cooling fin through the first cooling fin, then the heat is guided into the middle frame of the intelligent equipment through the second cooling fin, and the heat is dissipated into the environment through large-area contact between the middle frame and the environment, so that the cooling efficiency of the mainboard is improved, and the service life of the mainboard is prolonged. And continuous and reliable operation of the mainboard is ensured.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and intelligent device. Background Technology

[0002] In the current technology, most electronic products are smaller, lighter, and more aesthetically pleasing. However, people have high demands for the functionality and processing power of electronic products, and most electronic products tend to have high integration and high performance, with increasingly compact internal structures. At the same time, motherboard chips and batteries are also high-heat electrical components. If heat cannot be dissipated in a confined space, the temperature will continue to rise, affecting the computing performance of the motherboard chips. Utility Model Content

[0003] To address the problems of existing technologies, this application discloses a heat dissipation structure and a smart device. The heat dissipation structure provided by this application includes a motherboard and a heat sink; the heat sink includes a first heat sink and a second heat sink, which are vertically fixedly connected; the first heat sink is attached to the motherboard, and the second heat sink is attached to the mid-frame of the smart device. This application improves the heat dissipation efficiency of the motherboard by attaching the first heat sink to the motherboard, allowing the heat generated by the motherboard to be transferred to the second heat sink, and then to the mid-frame of the smart device. The mid-frame has a large contact area with the environment, dissipating the heat into the environment, thus improving the motherboard's heat dissipation efficiency and ensuring continuous and reliable operation. The technical solution of this application is as follows:

[0004] On the one hand, this application provides a heat dissipation structure, including a motherboard and a heat sink;

[0005] The heat sink includes a first heat sink and a second heat sink, wherein the first heat sink and the second heat sink are vertically and fixedly connected.

[0006] The first heat sink is attached to the motherboard, and the second heat sink is attached to the mid-frame of the smart device.

[0007] In some specific embodiments, a thermally conductive medium is provided between the motherboard and the first heat sink;

[0008] Alternatively, a first heat-conducting plate may be provided between the motherboard and the first heat sink.

[0009] In some specific embodiments, the middle frame includes a first sidewall and a second sidewall, which are vertically fixedly connected.

[0010] A microphone and a charging port are provided on the first sidewall;

[0011] The second heat sink is provided with a microphone clearance hole, through which the microphone is disposed.

[0012] In some specific embodiments, a second heat-conducting sheet is provided between the second heat sink and the first sidewall.

[0013] In some specific embodiments, a heat sink clearance step is provided between the first heat sink and the second heat sink, and the heat sink clearance step is used to avoid the charging port.

[0014] In some specific embodiments, a mounting hole is provided on the second sidewall for mounting the sensor assembly;

[0015] A heat insulation strip is provided between the mounting hole and the sensor assembly.

[0016] In some specific implementations, slots are provided on the edge of the motherboard.

[0017] In some specific embodiments, the first heat sink extends downwards near the motherboard to form a fixing plate, and the first heat sink is inserted into the slot and fixed to the motherboard through the fixing plate.

[0018] In some specific embodiments, the heat sink avoids the step in an "L" shape.

[0019] On the other hand, this application also provides a smart device, including a mid-frame and the aforementioned heat dissipation structure, wherein the heat dissipation structure is disposed within the mid-frame.

[0020] By adopting the above technical solution, the heat dissipation structure and intelligent device provided in this application have the following beneficial effects:

[0021] This application discloses a heat dissipation structure and a smart device. The heat dissipation structure includes a motherboard and a heat sink; the heat sink includes a first heat sink and a second heat sink, which are vertically fixedly connected; the first heat sink is attached to the motherboard, and the second heat sink is attached to the mid-frame of the smart device. By attaching the first heat sink to the motherboard, the heat generated by the motherboard is transferred to the second heat sink, and then to the mid-frame of the smart device. The mid-frame has a large contact area with the environment, dissipating the heat into the environment and ensuring continuous and reliable operation of the motherboard. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A cross-sectional view of the heat dissipation structure provided in an embodiment of this application;

[0024] Figure 2 This is an assembly diagram of the heat dissipation structure and the smart device provided in the embodiments of this application;

[0025] Figure 3 This is an assembly diagram of the heat dissipation structure and the smart device provided in the embodiments of this application;

[0026] Figure 4 This is a structural diagram of the heat sink provided in an embodiment of this application;

[0027] The following is supplementary explanation of the attached figures:

[0028] 1-Motherboard;

[0029] 2-Heat sink; 21-First heat sink; 211-Fixing plate; 22-Second heat sink; 221-Microphone clearance hole; 23-Heat sink clearance step;

[0030] 3-Heat-conducting medium;

[0031] 4-Second heat-conducting plate;

[0032] 5-Middle frame; 51-First sidewall; 511-Microphone; 512-Charging port; 52-Second sidewall; 521-Mounting hole; 522-Sensor assembly; 523-Heat insulation strip. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0034] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this application. In the description of this application, it should be understood that the terms "upper," "lower," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0035] When a numerical range is disclosed herein, the range is considered continuous and includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to an integer, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are included. For example, a specified range from “1 to 10” should be considered to include any and all subranges between the minimum value 1 and the maximum value 10. Exemplary subranges of the range 1 to 10 include, but are not limited to, 1 to 6.1, 3.5 to 7.8, 5.5 to 10, etc.

[0036] Please see Figure 1 and Figure 2 The heat dissipation structure of this application embodiment includes a motherboard 1 and a heat sink 2. Specifically, the heat sink 2 is disposed above the motherboard 1 and is parallel and attached to the motherboard 1 to increase the contact area with the motherboard 1. The heat generated by the motherboard 1 during operation is transferred to the heat sink 2 and dissipated through the heat sink 2, thereby realizing continuous and rapid heat dissipation of the motherboard 1 and effectively reducing the operating temperature of the motherboard 1.

[0037] The heat sink 2 includes a first heat sink 21 and a second heat sink 22. The first heat sink 21 and the second heat sink 22 are vertically fixedly connected. The first heat sink 21 is disposed above the motherboard, and the outer contour of the first heat sink 21 is the same size as the outer contour of the motherboard 1. The first heat sink 21 completely covers the motherboard 1. The second heat sink 22 is disposed on the inner wall of the middle frame 5 of the smart device.

[0038] The first heat sink 21 is attached to the motherboard 1, and the second heat sink 22 is attached to the mid-frame 5 of the smart device. The motherboard 1 transfers the generated heat to the first heat sink 21, which then transfers the heat to the second heat sink 22. The second heat sink 22 contacts the inner wall of the mid-frame 5, and through the mid-frame 5, it has a large contact area with the surrounding environment, finally dissipating the heat into the environment. This improves the heat dissipation efficiency of the motherboard 1 and effectively prevents heat from accumulating inside the mid-frame 5, which could lead to increased temperature and affect the computing performance of the motherboard 1.

[0039] In some specific embodiments, a thermally conductive medium 3 is provided between the motherboard 1 and the first heat sink 21. Specifically, the thermally conductive medium 3 is evenly applied to the side of the motherboard 1 near the first heat sink 21. Preferably, the thermally conductive medium 3 can be thermal grease. The motherboard 1 conducts the generated heat into the thermally conductive medium 3. The thermally conductive medium 3 contacts the first heat sink 21 and then conducts the heat into the first heat sink 21. The heat is then transferred from the first heat sink 21 to the second heat sink 22. The second heat sink 22 contacts the inner wall of the middle frame 5 and finally contacts the surrounding environment over a large area through the middle frame 5, dissipating the heat into the environment. This effectively ensures that the heat of the motherboard 1 is quickly and reliably transferred outward, improving the heat dissipation efficiency of the motherboard 1, effectively ensuring that the motherboard 1 remains at a low operating temperature, thereby improving the working performance and reliability of the motherboard and effectively extending the service life of the motherboard 1.

[0040] In some specific embodiments, a first thermally conductive sheet is provided between the motherboard 1 and the first heat sink 21. Specifically, the first thermally conductive sheet is bonded to the motherboard 1 on the side of the motherboard 1 closest to the first heat sink 21 by adhesive bonding; or the first thermally conductive sheet is bonded to the first heat sink 21 on the side of the motherboard 1 closest to the first heat sink 21 by adhesive bonding. Preferably, the first thermally conductive sheet can be a heat-dissipating silicon sheet, and the outer contour of the heat-dissipating silicon sheet is the same size as the outer contour of the motherboard 1 or the first heat sink 21. The motherboard 1 conducts the generated heat to the first thermally conductive sheet, which then contacts the first heat sink 21 and conducts the heat to the first heat sink 21. The heat is then transferred from the first heat sink 21 to the second heat sink 22, which contacts the inner wall of the middle frame 5 and finally contacts the surrounding environment over a large area through the middle frame 5, dissipating the heat into the environment. This effectively ensures that the heat of the motherboard 1 is quickly and reliably transferred outward, improving the heat dissipation efficiency of the motherboard 1, effectively ensuring that the motherboard 1 remains at a low operating temperature, thereby improving the working performance and reliability of the motherboard and effectively extending the service life of the motherboard 1.

[0041] For some specific implementation methods, please refer to [link / reference]. Figure 1 and Figure 2The middle frame 5 includes a first sidewall 51 and a second sidewall 52, which are vertically fixedly connected. Specifically, the first sidewall 51 is attached to the second heat sink 22, and the second sidewall 52 is located below the motherboard 1 and is parallel to the motherboard 1.

[0042] A microphone 511 and a charging port 512 are provided on the first sidewall 51; specifically, the microphone 511 is located above the charging port 512.

[0043] The second heat sink 22 is provided with a microphone clearance hole 221. The microphone 511 is set through the microphone clearance hole 221, which facilitates the installation and removal of the microphone 511 and makes the setting more reasonable.

[0044] In some specific implementation methods, see [reference] Figure 3 A second heat-conducting plate 4 is disposed between the second heat sink 22 and the first sidewall 51. Preferably, the second heat-conducting plate 4 can be a heat-dissipating silicon wafer, and there can be multiple second heat-conducting plates 4, for example, two, which are respectively disposed at both ends of the microphone clearance hole 221. The heat from the second heat sink 22 is conducted to the middle frame 5 through the second heat-conducting plate 4. The middle frame 5 has a large contact area with the surrounding environment, dissipating the heat into the environment and improving heat dissipation efficiency.

[0045] A heat sink clearance step 23 is provided between the first heat sink 21 and the second heat sink 22 to avoid the charging port 512. Specifically, the heat sink clearance step 23 includes an extending surface and a clearance surface. One end of the extending surface extends upward along the first heat sink 21 and is vertically fixedly connected to the first heat sink 21, while the other end is fixedly connected to the clearance surface. The clearance surface is located above the charging port 512, and the end of the charging port 512 facing away from the first heat sink 21 is fixedly connected to the second heat sink 22. By providing the heat sink clearance step 23 between the first heat sink 21 and the second heat sink 22, the installation of the charging port 512 is facilitated. The heat sink clearance step 23 contacts the outer wall of the charging port. When the device is charging, the heat generated by the charging port can be directly conducted to the heat sink clearance step 23, and then conducted to the middle frame 5 through the second heat sink 22. The middle frame 5 has a large contact area with the surrounding environment, dissipating the heat into the environment and improving heat dissipation efficiency.

[0046] In some specific implementation methods, see [reference] Figure 2 The second sidewall 52 has a mounting hole 521 for mounting the sensor assembly 522. Specifically, the sensor assembly 522 may include a base, an infrared sensor and a camera. The infrared sensor and the camera are mounted on the base. The sensor assembly 522 is detachably connected to the second sidewall 52, which facilitates the installation, removal and maintenance of the sensor assembly 522.

[0047] A heat insulation strip 523 is provided between the mounting hole 521 and the sensor assembly 522. Preferably, the heat insulation strip 523 can be heat insulation cotton. The heat insulation strip 523 is set around the mounting hole 521. The sensor assembly 522 is installed in the mounting hole 521. By setting the heat insulation strip 523, the sensor assembly 522 is designed to not contact the middle frame 5, preventing the heat generated by the heat sink on the motherboard 1 from being conducted to the first side wall and the heat from diffusing to the second side wall 52, which would affect the sensor assembly 522. At the same time, when the infrared sensor detects the temperature inside the pot, the temperature change of the second side wall 52 will affect the temperature measurement offset of the infrared sensor, thus increasing the error.

[0048] In some specific embodiments, slots are provided on the edge of the motherboard 1. Specifically, there are multiple slots, for example, three slots, which are respectively arranged around the edge of the motherboard 1 to fix the first heat sink 21 and prevent the first heat sink 21 from moving outward.

[0049] In some specific implementation methods, see [reference] Figure 3 and Figure 4 The first heatsink 21 extends downwards from the side closest to the motherboard 1 to form a fixing plate 211. The first heatsink 21 is fixed to the motherboard 1 by inserting the fixing plate 211 into a slot. Specifically, the first heatsink 21 extends downwards from three sides away from the second heatsink 22 to form the fixing plate 211. When the first heatsink 21 is installed on the motherboard 1, the fixing plate 211 is inserted downwards into the slot, which facilitates installation and fixes the first heatsink 21 to the motherboard 1, preventing movement.

[0050] In some specific implementation methods, see [reference] Figure 4 The heat sink avoidance step 23 is L-shaped, with a simple structure and reasonable design, which makes the heat sink avoidance step 23 fit more closely with the charging hole 512.

[0051] A smart device includes a mid-frame 5 and the aforementioned heat dissipation structure, the heat dissipation structure being disposed within the mid-frame 5. This allows the heat from the heat dissipation structure to have a large contact area with the surrounding environment through the mid-frame 5, dissipating the heat into the environment, improving heat dissipation efficiency, and ensuring the continuous and reliable operation of the motherboard 1.

[0052] This application discloses a heat dissipation structure and a smart device. The heat dissipation structure includes a motherboard and a heat sink; the heat sink includes a first heat sink and a second heat sink, which are vertically fixedly connected; the first heat sink is attached to the motherboard, and the second heat sink is attached to the mid-frame of the smart device. By attaching the first heat sink to the motherboard, the heat generated by the motherboard is transferred to the second heat sink, and then to the mid-frame of the smart device. The mid-frame has a large contact area with the environment, dissipating the heat into the environment and ensuring continuous and reliable operation of the motherboard.

[0053] The above description is only an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipating structure, characterized by comprising: Includes a motherboard (1) and a heatsink (2); The heat sink (2) includes a first heat sink (21) and a second heat sink (22), wherein the first heat sink (21) and the second heat sink (22) are vertically fixedly connected; The first heat sink (21) is attached to the motherboard (1), and the second heat sink (22) is attached to the mid-frame (5) of the smart device.

2. The heat dissipation structure according to claim 1, wherein A heat-conducting medium (3) is provided between the motherboard (1) and the first heat sink (21). Alternatively, a first heat-conducting sheet may be provided between the motherboard (1) and the first heat sink (21).

3. The heat dissipation structure according to claim 1, wherein The middle frame (5) includes a first side wall (51) and a second side wall (52), and the first side wall (51) and the second side wall (52) are vertically fixedly connected; A microphone (511) and a charging port (512) are provided on the first sidewall (51). The second heat sink (22) is provided with a microphone clearance hole (221), and the microphone (511) is disposed through the microphone clearance hole (221).

4. The heat dissipation structure according to claim 3, wherein A second heat-conducting plate (4) is provided between the second heat sink (22) and the first sidewall (51).

5. The heat dissipation structure according to claim 3, wherein A heat sink clearance step (23) is provided between the first heat sink (21) and the second heat sink (22), and the heat sink clearance step (23) is used to avoid the charging hole (512).

6. The heat dissipation structure according to claim 3, wherein The second sidewall (52) has a mounting hole (521) for mounting the sensor assembly (522). A heat insulation strip (523) is provided between the mounting hole (521) and the sensor assembly (522).

7. The heat dissipation structure of claim 1, wherein, The motherboard (1) has slots on its edge.

8. The heat dissipation structure according to claim 7, wherein The first heat sink (21) extends downward near the motherboard (1) to form a fixing plate (211), and the first heat sink (21) is inserted into the slot and fixed to the motherboard (1) through the fixing plate (211).

9. The heat dissipation structure of claim 5, wherein, The heat sink avoidance step (23) is L-shaped.

10. A smart device, comprising: It includes a middle frame (5) and a heat dissipation structure according to any one of claims 1 to 9, wherein the heat dissipation structure is disposed within the middle frame (5).

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