Heat dissipation device
By introducing multi-layer heat-conducting components and mounting grooves into the heat dissipation device, the heat-conducting contact area is increased, solving the problem that heat cannot be dissipated on the surface of the heat pipe that is not in contact with the finned unit, thus achieving more efficient heat dissipation and temperature uniformity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TENON HEAT EXCHANGE TECH (ZHONGSHAN) CO LTD
- Filing Date
- 2025-04-03
- Publication Date
- 2026-04-17
AI Technical Summary
In existing heat dissipation devices, the heat released from the surface of the heat pipe that is not in contact with the finned unit cannot be effectively absorbed and dissipated, resulting in limited heat dissipation power.
It adopts a combined structure of heat dissipation unit, primary heat conduction unit, secondary heat conduction unit and tertiary heat conduction unit. By increasing the contact area between heat dissipation component and heat conduction component, including the design of mounting groove, heat conduction component and heat conduction part, the expansion of multi-layer heat conduction path is realized.
It improves the heat dissipation efficiency and temperature uniformity of the heat dissipation device, and expands its application range, especially suitable for working conditions with high power heat dissipation requirements.
Smart Images
Figure CN224139320U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of radiator technology, and in particular to a heat dissipation device. Background Technology
[0002] Currently, commonly used heat dissipation devices include heat pipe units and fin units. A heat pipe unit consists of multiple heat pipes, which are designed with a square cross-section through flattening technology. The heat pipes are then used to increase the heat conduction area by having their two sides in face-to-face contact with the fin unit.
[0003] However, the surface of the heat pipe that is not in contact with the finned unit can still release a large amount of heat that cannot be directly absorbed and dissipated by the finned unit, resulting in limited heat dissipation power of the heat dissipation device.
[0004] To solve the above problems, there is an urgent need to provide a heat dissipation device. Utility Model Content
[0005] The purpose of this invention is to propose a heat dissipation device that increases the contact area between the secondary and tertiary heat-conducting components and the heat dissipation unit, thereby improving the heat dissipation power.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] A heat dissipation device, comprising:
[0008] A heat dissipation unit, comprising multiple sets of heat dissipation components arranged along a first direction, wherein each heat dissipation component has a mounting groove on two sides along the first direction.
[0009] A primary heat-conducting unit, on which the heating element is disposed;
[0010] A secondary heat-conducting unit is disposed on the primary heat-conducting unit, and the secondary heat-conducting unit includes multiple sets of secondary heat-conducting components arranged sequentially along the first direction;
[0011] The three-stage heat dissipation unit includes multiple sets of three-stage heat dissipation components arranged sequentially along the first direction. A portion of the three-stage heat dissipation component and a portion of the two-stage heat dissipation components are respectively accommodated in the mounting slots of two adjacent heat dissipation components. At least half of the side surface of the portion of the two-stage heat dissipation component is in contact with the side wall of the mounting slot, and at least half of the side surface of the portion of the three-stage heat dissipation component is in contact with the side wall of the mounting slot. The portions of the two-stage heat dissipation component and the portions of the three-stage heat dissipation component are in surface-to-surface contact.
[0012] As an optional solution, the primary heat-conducting unit includes:
[0013] The mounting plate is a heat spreader, and the heating element is mounted on the mounting plate.
[0014] As an optional solution, the primary heat-conducting unit includes:
[0015] Mounting plate, the heating element is disposed on the mounting plate, and the mounting plate has a first receiving groove;
[0016] Multiple primary heat-conducting components are arranged in parallel in the first receiving groove, with adjacent primary heat-conducting components in contact with each other, and the cross-sectional shape of each primary heat-conducting component is square.
[0017] As an optional embodiment, the secondary heat-conducting assembly includes multiple secondary heat-conducting elements, wherein the secondary heat-conducting elements include:
[0018] The secondary heat absorption section abuts against the primary heat conduction unit. The secondary heat absorption section is arranged along the second direction, and multiple secondary heat absorption sections are arranged in parallel along the first direction, with adjacent secondary heat absorption sections abutting each other surface to surface.
[0019] Two secondary connecting parts are respectively connected to both ends of the secondary heat absorption part in a U-shape;
[0020] Two secondary bending portions, each of which is connected to one end of the two secondary connecting portions away from the secondary heat-absorbing portion; and
[0021] Two secondary heat-conducting parts are respectively connected to the ends of the two secondary bending parts away from the secondary connecting parts, and the secondary heat-conducting parts extend along a third direction. The secondary heat-conducting parts of multiple secondary heat-conducting components are arranged parallel to each other and spaced apart along a second direction, and the secondary heat-conducting parts of multiple secondary heat-conducting components are arranged coplanarly.
[0022] As an optional solution, the cross-sectional shape of the secondary heat absorption section is square;
[0023] And / or, the cross-sectional shape of the secondary connecting part and the secondary bending part is flattened oval, and the dimension of the secondary connecting part along the first direction is smaller than the dimension of the secondary connecting part along the second direction, and the dimension of the secondary bending part along the first direction is smaller than the dimension of the secondary bending part along the second direction;
[0024] And / or, the cross-sectional shape of the secondary heat-conducting part is square.
[0025] As an optional embodiment, the three-stage heat-conducting assembly includes multiple coplanarly arranged three-stage heat-conducting elements, wherein the three-stage heat-conducting elements include:
[0026] Two tertiary thermal conductive sections, both of which extend in a third direction; and
[0027] The three-stage connection part has two ends connected to the two three-stage heat-conducting parts respectively. The two three-stage heat-conducting parts and the three-stage connection part are connected in a U-shape, and the opening of the U-shape is oriented towards the first-stage heat-conducting unit.
[0028] As an optional solution, the cross-sectional shape of the three-stage heat-conducting section is square.
[0029] As an optional embodiment, the mounting slot is divided into a second receiving slot and a plurality of strip slots. The plurality of strip slots extend along a third direction. Along the third direction, the second receiving slot on one side of the heat dissipation component is located on the side of the strip slot away from the first-stage heat conduction unit, and the second receiving slot on the other side of the heat dissipation component is located on the side of the strip slot closer to the first-stage heat conduction unit. The tertiary heat conduction part of the tertiary heat conduction component is at least partially located in one group of strip slots facing each other in two adjacent groups of heat dissipation components, and the secondary heat conduction part of the secondary heat conduction component is at least partially located in the other group of strip slots facing each other in two adjacent groups of heat dissipation components.
[0030] As an alternative, the local surfaces of two adjacent sets of heat dissipation components are in contact with each other.
[0031] As an optional solution, the heat dissipation component includes:
[0032] Multiple heat sinks are formed by stamping and riveting along a third direction.
[0033] The beneficial effects of this utility model are as follows:
[0034] This invention provides a heat dissipation device, comprising a heat dissipation unit, a primary heat conduction unit, a secondary heat conduction unit, and a tertiary heat conduction unit. The heat dissipation unit includes multiple sets of heat dissipation components arranged along a first direction, each heat dissipation component having a mounting groove on each of its two sides along the first direction. A heat-generating element is disposed on the primary heat conduction unit. The secondary heat conduction unit is disposed on the primary heat conduction unit and includes multiple sets of secondary heat conduction components arranged sequentially along the first direction. The tertiary heat conduction unit includes multiple sets of tertiary heat conduction components arranged sequentially along the first direction. A portion of the tertiary heat conduction component and a portion of the secondary heat conduction component are respectively accommodated in the opposing mounting grooves of two adjacent heat dissipation components. At least half of the side surface of the portion of the secondary heat conduction component contacts the sidewall of the mounting groove, and at least half of the side surface of the portion of the tertiary heat conduction component is in contact with the sidewall of the mounting groove. The portions of the secondary and tertiary heat conduction components are in surface-to-surface contact. Compared to existing solutions, this heat dissipation device increases the contact area between the tertiary heat conduction components and the heat dissipation components, which is beneficial for improving the heat dissipation efficiency of the heat dissipation device. Attached Figure Description
[0035] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0036] Figure 1 This is a schematic diagram of the structure of the heat dissipation device provided in this embodiment of the utility model. Figure 1 ;
[0037] Figure 2 This is a schematic diagram of the structure of the heat dissipation component provided in an embodiment of the present invention;
[0038] Figure 3 This is a schematic diagram of the structure of the heat dissipation device provided in this embodiment of the utility model. Figure 2 ;
[0039] Figure 4 This is a schematic diagram of the structure of the primary heat-conducting unit, the secondary heat-conducting unit, and the tertiary heat-conducting unit provided in the embodiment of this utility model.
[0040] The markings in the image are as follows:
[0041] 100 - Heat dissipation unit; 110 - Heat dissipation assembly; 111 - Mounting slot; 1111 - Second receiving slot; 1112 - Strip slot; 112 - Heat dissipation component;
[0042] 200 - Primary heat-conducting unit; 210 - Mounting plate; 211 - First receiving groove; 220 - Primary heat-conducting component;
[0043] 300 - Secondary heat conduction unit; 310 - Secondary heat conduction assembly; 311 - Secondary heat conduction component; 3111 - Secondary heat absorption part; 3112 - Secondary connection part; 3113 - Secondary bending part; 3114 - Secondary heat conduction part;
[0044] 400 - Three-stage heat conduction unit; 410 - Three-stage heat conduction assembly; 411 - Three-stage heat conduction component; 4111 - Three-stage heat conduction part; 4112 - Three-stage connection part. Detailed Implementation
[0045] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only partial structures relevant to the present invention, not the complete structure.
[0046] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the connection of the internal structures of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0047] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0048] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0049] like Figure 1 and Figure 2 As shown, this embodiment provides a heat dissipation device. The heat dissipation device includes a heat dissipation unit 100, which includes multiple sets of heat dissipation components 110 arranged along the X direction (first direction). Each heat dissipation component 110 includes multiple heat dissipation elements 112, which are stamped and riveted along the Z direction (third direction), which improves production efficiency. Furthermore, to enable automatic riveting of the multiple heat dissipation elements 112 within a continuous stamping die, four rows of riveting points on the same plane and of the same thickness are added to each heat dissipation element 112. In this embodiment, the X and Z directions are arranged perpendicularly.
[0050] Furthermore, the surfaces of two adjacent heat dissipation components 110 are in partial contact with each other, so that the two adjacent heat dissipation components 110 can also conduct heat to each other, which is beneficial to improving the heat dissipation effect and temperature uniformity of the heat dissipation device.
[0051] Please see Figure 2Each heat dissipation component 110 has a mounting groove 111 on each of its two sides along the X direction.
[0052] Specifically, the mounting groove 111 is divided into a second receiving groove 1111 and a plurality of strip grooves 1112, which extend along the Z direction.
[0053] The heat dissipation device also includes a primary heat-conducting unit 200, on which the heat-generating component is mounted. The heat-generating component can be a stage light, LED light, CPU, high-heat components, or other heat-generating structures.
[0054] like Figure 3 As shown, in one embodiment, the primary heat-conducting component includes a mounting plate 210, which is a heat spreader, and the heating element is disposed on the mounting plate 210. The heat spreader has high heat absorption and conduction performance, which is beneficial for rapid heat absorption and conduction from the heating element. At the same time, the heat spreader has a temperature uniformity effect. Even if different positions of the heating element generate different amounts of heat, the heat spreader can maintain a uniform temperature, preventing deformation of the heat spreader due to uneven heat distribution, and thus improving the structural stability of the primary heat-conducting component.
[0055] In another embodiment, please refer to Figure 1 and Figure 4 The primary heat conduction unit 200 includes a mounting plate 210 and a plurality of primary heat conduction components 220. The mounting plate 210 has a second receiving groove 1111. The plurality of primary heat conduction components 220 are arranged in parallel in the second receiving groove 1111. Two adjacent primary heat conduction components 220 are in contact with each other. The primary heat conduction components 220 are conducive to further improving the heat absorption and heat conduction efficiency of the primary heat conduction component.
[0056] Preferably, multiple primary heat-conducting elements 220 extend along the X direction. Since multiple heat dissipation components 110 are arranged in parallel along the X direction, when the primary heat-conducting elements 220 extend along the X direction, each primary heat-conducting element 220 can correspond to all the heat dissipation components 110, which helps to increase the temperature uniformity of the heat dissipation device and avoid heat concentration that could cause deformation of the mounting plate 210.
[0057] Furthermore, the cross-sectional shape of the primary heat-conducting element 220 is square, thereby increasing the contact area between two adjacent primary heat-conducting elements 220, reducing thermal resistance, and improving the temperature uniformity of the primary heat-conducting assembly. Simultaneously, the surface of the square-section primary heat-conducting element 220 that contacts the heating element is planar, which further increases the contact area between the primary heat-conducting element 220 and the heating element, reduces thermal resistance, and results in higher thermal conductivity.
[0058] Optionally, the primary heat-conducting component 220 is a heat pipe. The heat pipe utilizes capillary action to conduct and dissipate heat. Moreover, the heat pipe's heat absorption, conduction, and dissipation technologies are mature, which helps to ensure the heat dissipation effect of the heat dissipation device, and the cost is relatively low.
[0059] like Figure 1 , Figure 3 and Figure 4 The heat dissipation device also includes a secondary heat conduction unit 300, which is disposed on the primary heat conduction unit 200. The secondary heat conduction unit 300 includes multiple sets of secondary heat conduction components 310 arranged sequentially along the X direction. One set of mounting grooves 111 in the opposing mounting grooves of two adjacent heat dissipation components 110 accommodates a portion of the secondary heat conduction component 310, and at least half of the side of the portion of the secondary heat conduction component 310 is in contact with the sidewall of the mounting groove 111. This allows the portion of the secondary heat conduction component 310 to have a larger contact area with the sidewall of the mounting groove 111, thereby increasing the heat conduction effect by increasing the contact area between the secondary heat conduction component 310 and the mounting groove 111, and thus improving the heat dissipation efficiency of the heat dissipation device.
[0060] Furthermore, the secondary heat conduction component 310 includes multiple secondary heat conduction elements 311, which abut against the primary heat conduction unit 200 to ensure that the primary heat conduction unit 200 and the secondary heat conduction elements 311 can conduct heat directly, which is beneficial to improving the heat conduction effect.
[0061] The secondary heat-conducting component 311 includes a secondary heat-absorbing portion 3111, which is arranged along the Y direction (second direction). In this configuration, the secondary heat-absorbing portion 3111 can contact multiple primary heat-conducting components 220 to improve heat conduction and temperature uniformity of the heat dissipation device. Multiple secondary heat-absorbing portions 3111 are arranged parallel to each other along the X direction, with adjacent portions 3111 abutting each other surface-to-surface. This ensures heat conduction between adjacent portions 3111, facilitating temperature uniformity along the X direction. In this embodiment, the X, Y, and Z directions are mutually perpendicular, and these directions are only used to describe the position of the structure in this embodiment and are not intended to limit the scope of this application.
[0062] Optionally, the secondary heat-conducting component 311 is a heat pipe. The heat pipe utilizes capillary action to conduct and dissipate heat. Moreover, the heat pipe's heat absorption, conduction, and dissipation technologies are mature, which helps to ensure the heat dissipation effect of the heat dissipation device, and the cost is low.
[0063] For example, each group of secondary heat-conducting components 310 may include two, three, four, five, or even more secondary heat-conducting elements 311. In this embodiment, the secondary heat-conducting component 310 includes four secondary heat-conducting elements 311, and the four secondary heat-absorbing parts 3111 of the four secondary heat-conducting elements 311 abut against the mounting plate 210, so that as much area of the mounting plate 210 as possible abuts against the secondary heat-absorbing parts 3111, thereby improving the heat dissipation effect.
[0064] The secondary heat-conducting component 311 also includes two secondary connecting portions 3112, two secondary bending portions 3113, and two secondary heat-conducting portions 3114. The two secondary connecting portions 3112 are connected to both ends of the secondary heat-absorbing portion 3111 in a U-shape. The two secondary bending portions 3113 are connected to the ends of the two secondary connecting portions 3112 away from the secondary heat-absorbing portion 3111. The two secondary heat-conducting portions 3114 are connected to the ends of the two secondary bending portions 3113 away from the secondary connecting portions 3112, and the secondary heat-conducting portions 3114 extend along the Z direction. The secondary heat-conducting portions 3114 of the multiple secondary heat-conducting components 311 are arranged parallel and spaced apart along the Y direction, and the secondary heat-conducting portions 3114 of the multiple secondary heat-conducting components 311 are arranged coplanarly. The secondary heat-conducting component 311 is bent so that all the secondary heat-conducting parts 3114 of the multiple secondary heat-conducting components 311 in each group of secondary heat-conducting components 310 are located on the same plane. This helps to ensure that each secondary heat-conducting part 3114 can contact the heat dissipation component 110, which helps to improve heat dissipation efficiency.
[0065] The cross-sectional shape of the secondary heat absorption section 3111 is square to increase the contact area between the secondary heat absorption section 3111 and the primary heat conduction unit 200, and at the same time increase the contact area between two adjacent secondary heat absorption sections 3111, so as to improve the heat absorption efficiency of the secondary heat absorption section 3111 and the heat conduction and temperature uniformity between the secondary heat absorption sections 3111.
[0066] And / or, the cross-sectional shape of the secondary connecting part 3112 and the secondary bending part 3113 is flattened oval, and the dimension of the secondary connecting part 3112 along the X direction is smaller than the dimension of the secondary connecting part 3112 along the Y direction, and the dimension of the secondary bending part 3113 along the X direction is smaller than the dimension of the secondary bending part 3113 along the Y direction. The smaller dimension of the flattened oval cross-section along the X direction is beneficial to reducing its space occupation in the X direction. At the same time, since the secondary heat sink 112 is a heat pipe, the flattened oval cross-section bending pipe can be realized by only a flattening process, which increases the contact area between the secondary connecting part 3112 and the secondary bending part 3113 and the heat sink 110, improves the heat dissipation effect of the heat sink, and also reduces the processing steps and processing costs of processing the secondary connecting part 3112 and the secondary bending part 3113 into a square shape, which is beneficial to improving production efficiency.
[0067] And / or, the cross-sectional shape of the secondary heat-conducting part 3114 is square, thereby increasing the contact area between the secondary heat-conducting part 3114 and the mounting groove 111.
[0068] The second receiving groove 1111, located on one side of the heat dissipation assembly 110, is situated on the side of the strip groove 1112 closest to the primary heat conduction unit 200. The secondary heat conduction portion 3114 of the secondary heat conduction assembly 310 is at least partially located within this strip groove 1112. The secondary heat conduction portion 3114, with its square cross-section, can contact the sidewalls of the strip groove 1112 on three sides, which helps to further increase the contact area between the secondary heat conduction portion 3114 and the heat dissipation assembly 110, thereby improving heat dissipation efficiency.
[0069] like Figure 1 , Figure 3 and Figure 4 As an optional solution, the heat dissipation device further includes a three-stage heat conduction unit 400. The three-stage heat conduction unit 400 includes multiple sets of three-stage heat conduction components 410 arranged sequentially along the X direction. In another set of mounting grooves 111 of two adjacent heat dissipation components 110, a portion of the three-stage heat conduction component 410 is accommodated. Three sides of the portion of the three-stage heat conduction component 410 contact the sidewall of the mounting groove 111. A portion of the two-stage heat conduction component 310 and a portion of the three-stage heat conduction component 410 are in surface-to-surface contact. In existing heat dissipation devices, if the heat pipe has a circular interface, the heat pipe and the surface of the finned unit are in line contact; if the heat pipe has a square cross-section, the heat pipe and the surface of the finned unit are in surface-to-surface contact, with one side of the heat pipe contacting the finned unit. The solution in this embodiment increases the contact area between the three-stage heat conduction component 410 and the heat dissipation component 110 compared to existing solutions, which is beneficial for improving the heat dissipation efficiency of the heat dissipation device.
[0070] Meanwhile, the heat dissipation device conducts heat in three stages through a heat conduction unit, a secondary heat conduction unit 300, and a tertiary heat conduction unit 400. This helps to increase the heat conduction distance along the Z direction, thereby improving the heat dissipation power and making it suitable for high-power heat dissipation conditions, thus expanding the applicability of the heat dissipation device.
[0071] Furthermore, the tertiary heat conduction assembly 410 includes multiple coplanarly arranged tertiary heat conduction elements 411. The tertiary heat conduction elements 411 abut against the secondary heat conduction part 3114 of the secondary heat conduction unit 300 to ensure that the secondary heat conduction part 3114 and the tertiary heat conduction elements 411 can conduct heat directly, which is beneficial to improving the heat conduction effect.
[0072] Optionally, the tertiary heat-conducting component 411 is a heat pipe. The heat pipe utilizes capillary action to conduct and dissipate heat. Moreover, the heat pipe's heat absorption, conduction, and dissipation technologies are mature, which helps to ensure the heat dissipation effect of the heat dissipation device, and the cost is low.
[0073] For example, each group of three-stage heat conduction components 410 may include two, three, four, five, or even more secondary heat conduction elements 311. In this embodiment, the three-stage heat conduction component 410 includes four tertiary heat conduction elements 411, and the four tertiary heat absorption parts of the four tertiary heat conduction elements 411 abut against the mounting plate 210, so that as much area of the mounting plate 210 as possible abuts against the tertiary heat absorption parts, thereby improving the heat dissipation effect.
[0074] The tertiary heat-conducting component 411 includes a tertiary connecting portion 4112 and two tertiary heat-conducting portions 4111. The two tertiary heat-conducting portions 4111 extend along the Z-direction. The two ends of the tertiary connecting portion 4112 are connected to the two tertiary heat-conducting portions 4111 respectively. The two tertiary heat-conducting portions 4111 and the tertiary connecting portion 4112 are connected in a U-shape, with the opening of the U-shape facing the primary heat-conducting unit 200. This tertiary heat-conducting component 411 forms a structure opposite to the opening of the secondary heat-conducting component 311, thus extending the heat conduction distance and enabling direct heat conduction through surface-to-surface contact between the tertiary heat-conducting portions 4111 and the secondary heat-conducting portions 3114, which is beneficial for improving the heat conduction effect. This structure is beneficial for improving the heat conduction efficiency of the heat dissipation device.
[0075] The tertiary heat-conducting part 4111 has a square cross-sectional shape, thereby increasing the contact area between the tertiary heat-conducting part 4111 and the secondary heat-conducting part 3114.
[0076] Along the Z direction, the second receiving groove 1111 on one side of the heat dissipation component 110 is located on the side of the strip groove 1112 away from the primary heat conduction unit 200, and the second receiving groove 1111 on the other side of the heat dissipation component 110 is located on the side of the strip groove 1112 close to the primary heat conduction unit 200. The tertiary heat conduction part 4111 of the tertiary heat conduction component 410 is at least partially located in one set of strip grooves 1112 facing each other in two adjacent sets of heat dissipation components 110. The secondary heat conduction part 3114 of the secondary heat conduction component 310 is at least partially located in another set of strip grooves 1112 facing each other in two adjacent sets of heat dissipation components 110. The heat dissipation device has a stepped structure formed by the secondary heat conduction unit 300 and the tertiary heat conduction unit 400 located in the mounting grooves 111 on both sides of the heat dissipation component 110. This structure allows the secondary heat conduction part 3114 and the tertiary heat conduction part 4111 to simultaneously make surface-to-surface contact with the heat dissipation components 110 on both sides. Furthermore, the four sides of the square cross-section structure of the secondary heat conduction part 3114 and the four sides of the tertiary heat conduction part 4111 can all make contact with the two adjacent heat dissipation components 110, which greatly increases the heat conduction area of the secondary heat conduction unit 300 and the tertiary heat conduction unit 400, thereby improving the heat dissipation efficiency of the heat dissipation device.
[0077] Note that the above description illustrates and describes the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope. All such changes and modifications fall within the scope of the claimed utility model, which is defined by the appended claims and their equivalents.
Claims
1. A heat dissipating device, characterized by, include: A heat dissipation unit (100) includes multiple sets of heat dissipation components (110) arranged along a first direction, and the heat dissipation components (110) have mounting grooves (111) on two sides along the first direction. A primary heat-conducting unit (200) is provided, and a heating element is disposed on the primary heat-conducting unit (200); A secondary heat-conducting unit (300) is disposed on the primary heat-conducting unit (200), and the secondary heat-conducting unit (300) includes multiple sets of secondary heat-conducting components (310) arranged sequentially along the first direction; A three-stage heat-conducting unit (400) includes multiple sets of three-stage heat-conducting components (410) arranged sequentially along the first direction. A portion of the three-stage heat-conducting component (410) and a portion of the two-stage heat-conducting component (310) are respectively accommodated in the opposite mounting grooves (111) of two adjacent heat-dissipating components (110). At least half of the side surface of the portion of the two-stage heat-conducting component (310) is in contact with the side wall of the mounting groove (111), and at least half of the side surface of the portion of the three-stage heat-conducting component (410) is in contact with the side wall of the mounting groove (111). The surface of the portion of the two-stage heat-conducting component (310) is in surface-to-surface contact with the surface of the portion of the three-stage heat-conducting component (410).
2. The heat dissipating device according to claim 1, wherein The primary heat-conducting unit (200) includes: Mounting plate (210), the mounting plate (210) is a heat spreader, and the heating element is disposed on the mounting plate (210).
3. The heat dissipating device of claim 1, wherein The primary heat-conducting unit (200) includes: Mounting plate (210), the heating element is disposed on the mounting plate (210), and the mounting plate (210) has a first receiving groove (211); Multiple primary heat-conducting components (220) are arranged in parallel in the first receiving groove (211), with two adjacent primary heat-conducting components (220) in contact with each other, and the cross-sectional shape of the primary heat-conducting component (220) is square.
4. The heat dissipating device of claim 1, wherein The secondary heat-conducting component (310) includes multiple secondary heat-conducting elements (311), and the secondary heat-conducting elements (311) include: The secondary heat absorption section (3111) abuts against the primary heat conduction unit (200). The secondary heat absorption section (3111) is arranged along the second direction. A plurality of the secondary heat absorption sections (3111) are arranged in parallel along the first direction, and the surfaces of two adjacent secondary heat absorption sections (3111) abut against each other. Two secondary connecting parts (3112) are respectively connected to both ends of the secondary heat absorption part (3111) in a U-shape; Two secondary bending portions (3113), each of which is connected to one end of the two secondary connecting portions (3112) away from the secondary heat-absorbing portion (3111); and Two secondary heat-conducting parts (3114) are respectively connected to the ends of the two secondary bending parts (3113) away from the secondary connecting part (3112), and the secondary heat-conducting parts (3114) extend along a third direction. The secondary heat-conducting parts (3114) of the multiple secondary heat-conducting components (311) are arranged parallel to each other and spaced apart along a second direction, and the secondary heat-conducting parts (3114) of the multiple secondary heat-conducting components (311) are arranged coplanarly.
5. The heat dissipating device according to claim 4, wherein The cross-sectional shape of the secondary heat absorption section (3111) is square; And / or, the cross-sectional shape of the secondary connecting part (3112) and the secondary bending part (3113) is flattened oval, and the dimension of the secondary connecting part (3112) along the first direction is smaller than the dimension of the secondary connecting part (3112) along the second direction, and the dimension of the secondary bending part (3113) along the first direction is smaller than the dimension of the secondary bending part (3113) along the second direction; And / or, the cross-sectional shape of the secondary heat-conducting part (3114) is square.
6. The heat dissipating device of claim 1, wherein The three-stage heat-conducting assembly (410) includes multiple coplanarly arranged three-stage heat-conducting elements (411), and the three-stage heat-conducting elements (411) include: Two tertiary heat-conducting sections (4111), the two tertiary heat-conducting sections (4111) extending in a third direction; and The three-stage connection part (4112) is connected at both ends to the two three-stage heat-conducting parts (4111) respectively. The two three-stage heat-conducting parts (4111) and the three-stage connection part (4112) are connected in a U-shape, and the opening direction of the U-shape is set towards the first-stage heat-conducting unit (200).
7. The heat dissipating device according to claim 6, wherein The cross-sectional shape of the three-stage heat-conducting part (4111) is square.
8. The heat dissipating device according to claim 4 or 6, wherein The mounting slot (111) is divided into a second receiving slot (1111) and a plurality of strip slots (1112). The plurality of strip slots (1112) extend along a third direction. Along the third direction, the second receiving slot (1111) on one side of the heat dissipation assembly (110) is located on the side of the strip slots (1112) away from the primary heat conduction unit (200). The second receiving slot (1111) on the other side of the heat dissipation assembly (110) is located on the side of the strip slots (1112) away from the primary heat conduction unit (200). The strip groove (1112) is located on one side near the primary heat-conducting unit (200). The tertiary heat-conducting part (4111) of the tertiary heat-conducting component (410) is at least partially located in one set of strip grooves (1112) facing each other in two adjacent sets of heat dissipation components (110). The secondary heat-conducting part (3114) of the secondary heat-conducting component (310) is at least partially located in another set of strip grooves (1112) facing each other in two adjacent sets of heat dissipation components (110).
9. The heat dissipating device of claim 1, wherein, The surfaces of two adjacent heat dissipation components (110) are in partial contact with each other.
10. The heat dissipating device of claim 1, wherein, The heat dissipation assembly (110) includes: Multiple heat sinks (113) are formed by stamping and riveting along a third direction.