Thyristor assembly with multiple combined chips

Abstract

A thyristor assembly with multiple combined chips comprises a shell and a base, the base is provided with at least three groups of chipsets which are combined to form a rectangular shape, and each chipset comprises a chip, an electrode, a first conductive plate, a second conductive plate, a third conductive plate and a fourth conductive plate. The first current-conducting plate, the second current-conducting plate, the third current-conducting plate and the fourth current-conducting plate are spliced to form a rectangular shape. The at least two chip sets are arranged on the same base in parallel, and the four current-conducting plates are spliced into the rectangle, so that the internal space of the shell is fully utilized, the whole assembly is more compact, the tedious procedure of selecting from multiple groups when three or more groups are formed by two chips as one group in the prior art is eliminated, and the production efficiency is improved. Therefore, the installation efficiency and the assembly consistency are obviously improved. The overall structure is reasonable, the space utilization rate is high, material waste is reduced, the size of the shell is reduced, miniaturization design and on-site rapid replacement of equipment are facilitated, and the system integration degree and operation and maintenance convenience are further improved.

Description

Technical Field

[0001] This utility model relates to a thyristor assembly with multiple chips, belonging to the field of thyristors. Background Technology

[0002] Thyristors possess the characteristics of silicon rectifier devices, enabling them to operate under high voltage and high current conditions. Their operation is controllable, and they are widely used in electronic circuits such as controlled rectification, AC voltage regulation, contactless electronic switches, inverters, and frequency converters. Existing thyristor modules are characterized by miniaturization, compact structure, and ease of installation, leading to their widespread application.

[0003] However, in existing thyristor assemblies, the chips are usually arranged in pairs, facing each other and connected by copper strips. This arrangement results in a large space occupation, a lot of wasted space, an unreasonable structure, and slow installation efficiency. Furthermore, when three sets of chips are required, personnel must select the chips from multiple sets, which takes a long time. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings and deficiencies of the existing technology and to provide a thyristor assembly with multiple chips.

[0005] A multi-chip thyristor assembly includes a housing and a base. At least two chip sets are mounted on the base. Each chip set includes a chip, electrodes, a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate. The first, second, third, and fourth conductive plates are assembled to form a rectangular shape, thus forming the chip set. By arranging at least two chip sets side-by-side on the same base and forming a rectangle with four conductive plates, not only is the internal space of the housing fully utilized, making the overall assembly more compact, but the cumbersome process of selecting from multiple sets is eliminated when there are three or more sets, as in traditional "two chips per set" methods. This significantly improves installation efficiency and assembly consistency. The overall structure is reasonable and has high space utilization, reducing material waste and allowing for a smaller housing size. This facilitates miniaturized equipment design and rapid on-site replacement, further enhancing system integration and ease of operation and maintenance. The four conductive plates are assembled into a rectangular structure, which minimizes and symmetrically connects the electrodes of each chip group, reduces parasitic inductance and resistance, improves the uniformity of current distribution and overall conductivity, facilitates stable operation under high voltage and high current conditions, and enhances the thermal balance and reliability of the components.

[0006] Preferably, both the second and third conductive plates are bent with concave and convex shapes, allowing their edges to fit together. This bending and splicing method simplifies the assembly process of the component, eliminating the need for additional welding or fasteners, and achieves a firm fit on the base, thus improving production efficiency and reducing manufacturing costs.

[0007] Furthermore, the second conductive plate is provided with a first chip and at least one first electrode, and the third conductive plate is provided with a second chip and at least one second electrode. The first chip is electrically connected to the third conductive plate via a bridge-type copper strip, and the second chip is electrically connected to the second conductive plate via a bridge-type copper strip. By directly mounting the first chip and its first electrode on the second conductive plate, and directly mounting the second chip and its second electrode on the third conductive plate, an integrated layout of the chip and its respective conductive plate is achieved, making the internal structure of the device more compact and reducing the space occupied by additional connectors. The first chip and the third conductive plate, and the second chip and the second conductive plate are respectively electrically connected via bridge-type copper strips to form a "double-bridge" interconnection structure, making the current output path of each group of chips symmetrical and the shortest, effectively reducing loop resistance and parasitic inductance, and improving conduction speed and switching performance.

[0008] Preferably, the first conductive plate is provided with a third electrode, and the fourth conductive plate is provided with a fourth electrode. The first conductive plate is electrically connected to the first chip via a bridge-shaped copper sheet, and the fourth conductive plate is electrically connected to the second chip via a bridge-shaped copper sheet. The first and fourth conductive plates not only perform conductive functions but also act as heat sinks, rapidly transferring heat from the first and second chips to the casing, which is beneficial for overall heat dissipation, reducing operating temperature, and improving long-term reliability. The elastic fit of the bridge-shaped copper sheets bending the conductive plates forms a stable electrical and mechanical bond, enhancing the component's resistance to vibration and impact, and enabling stable operation under harsh conditions.

[0009] Preferably, each of the conductive plates and chips is horizontally laid on the base. Horizontal laying ensures that the heat conduction path between each chip and the base is consistent, and the base can serve as a heat dissipation platform, evenly distributing heat across the entire bottom, helping to reduce the risk of localized overheating and improve thermal management. Coplanar wiring reduces intersections and detours between different heights, lowering wire length and parasitic inductance and resistance, thereby improving switching speed and conduction efficiency.

[0010] Preferably, a gap is provided between the first conductive plate, the second conductive plate, the third conductive plate, and the fourth conductive plate. Leaving gaps between adjacent conductive plates effectively prevents direct electrical short circuits between the plates, improving the safety margin and overvoltage resistance of the component. The gaps also facilitate air convection, enhancing inter-plate heat dissipation efficiency, reducing heat buildup, and improving overall thermal management.

[0011] Preferably, the housing is provided with connection holes for each electrode to extend outwards. The standardized connection hole design facilitates quick insertion and removal or bolting of connectors, reducing on-site installation and maintenance time, and improving the maintainability and modular replacement efficiency of the equipment.

[0012] Furthermore, the outer casing is provided with mounting holes and grooves on both sides for external fixation. These mounting holes and grooves allow the components to be easily and securely connected to the equipment frame or mounting plate, improving the overall structural stability and vibration resistance. Reinforcing ribs or thickened structures can be designed around the mounting holes and grooves to enhance local strength, prevent stress damage during installation, and ensure reliability even under high vibration or impact environments.

[0013] The beneficial effects of this utility model are as follows: By arranging at least three chip groups side-by-side on the same base and forming a rectangle with four conductive plates, not only is the internal space of the housing fully utilized, making the overall component more compact, but the cumbersome process of selecting from multiple groups when there are three or more groups, as in the traditional "two chips per group" approach, is also eliminated. This significantly improves installation efficiency and assembly consistency. The overall structure is reasonable and has a high space utilization rate, which not only reduces material waste but also allows for a smaller housing size, facilitating miniaturized equipment design and rapid on-site replacement, further enhancing system integration and ease of operation and maintenance. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, obtaining other drawings based on these drawings without creative effort still falls within the scope of this utility model.

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a front view of the present invention;

[0017] Figure 3 This is a schematic diagram of the structure of this utility model with the outer shell removed;

[0018] Figure 4 This is a schematic diagram of another embodiment of the present invention;

[0019] Figure 5 This is a schematic diagram of another embodiment of the present invention;

[0020] In the diagram, 1 is the outer casing; 11 is the connecting hole; 12 is the fixing hole; 2 is the base; 31 is the first conductive plate; 32 is the second conductive plate; 33 is the third conductive plate; 34 is the fourth conductive plate; 35 is the first chip; 36 is the second chip; 37 is the first electrode; 38 is the second electrode; 39 is the third electrode; 40 is the fourth electrode; 41 is the bridge-shaped copper sheet; and 42 is the gap. Detailed Implementation

[0021] To make the objectives, technical solutions and advantages of this utility model clearer, the utility model will be described in further detail below with reference to the accompanying drawings.

[0022] It should be noted that all uses of "first" and "second" in the embodiments of this utility model are for the purpose of distinguishing two entities or parameters with the same name but different names. It is clear that "first" and "second" are only for the convenience of expression and should not be construed as limiting the embodiments of this utility model. Subsequent embodiments will not explain this in detail.

[0023] The directional and positional terms used in this utility model, such as "up," "down," "front," "back," "left," "right," "inner," "outer," "top," "bottom," and "side," are merely for reference to the accompanying drawings. Therefore, the directional and positional terms used are for the purpose of explaining and understanding this utility model, and not for limiting the scope of protection of this utility model.

[0024] like Figure 1-5 The diagram illustrates an embodiment of a multi-chip thyristor assembly according to this invention. It includes a housing 1 and a base 2. At least two chip sets are mounted on the base 2. Each chip set includes a chip, electrodes, a first conductive plate 31, a second conductive plate 32, a third conductive plate 33, and a fourth conductive plate 34. The first conductive plate 31, the second conductive plate 32, the third conductive plate 33, and the fourth conductive plate 34 are assembled to form a rectangular shape, thus forming the chip set. By arranging at least two chip sets side-by-side on the same base 2 and forming a rectangle from four conductive plates, the internal space of the housing is fully utilized, making the assembly more compact. Furthermore, it eliminates the cumbersome process of selecting from multiple sets when there are three or more sets, as required by traditional two-chip-per-set assembly methods. This significantly improves installation efficiency and assembly consistency. The overall structure is reasonable and has high space utilization, reducing material waste and allowing for a smaller housing 1, facilitating miniaturized equipment design and rapid on-site replacement. This further enhances system integration and ease of operation and maintenance. The four conductive plates are arranged into a rectangular structure, which minimizes and symmetrically connects the electrodes of each chip group. This reduces parasitic inductance and resistance, improves the uniformity of current distribution and overall conductivity, and facilitates stable operation under high voltage and high current conditions. It also enhances the thermal balance and reliability of the component. The number and orientation of the chip groups can be arbitrarily set, and they can be combined to form different shapes to suit various application scenarios and conditions.

[0025] Both the second conductive plate 32 and the third conductive plate 33 are bent with concave and convex shapes, allowing the edges of the second conductive plate 32 and the third conductive plate to fit together. This bending and splicing method simplifies the assembly process of the component, eliminating the need for additional welding or fasteners, and achieves a firm fit on the base 2, which helps to improve production efficiency and reduce manufacturing costs.

[0026] The second conductive plate 32 is provided with a first chip 35 and at least one first electrode 37, and the third conductive plate 33 is provided with a second chip 36 and at least one second electrode 38. The first chip 35 is electrically connected to the third conductive plate 33 through a bridge-type copper strip 41, and the second chip 36 is electrically connected to the second conductive plate 32 through the bridge-type copper strip 41. By directly mounting the first chip 35 and its first electrode 37 on the second conductive plate 32, and directly mounting the second chip 36 and its second electrode 38 on the third conductive plate 33, an integrated layout of the chip and its respective conductive plate is achieved, making the internal structure of the device more compact and reducing the space occupied by additional connectors. The first chip 35 and the third conductive plate 33, and the second chip 36 and the second conductive plate 32 are respectively electrically connected through the bridge-type copper strip 41 to form a "double-bridge" interconnection structure, making the current output path of each group of chips symmetrical and the shortest, effectively reducing loop resistance and parasitic inductance, and improving conduction speed and switching performance.

[0027] The first conductive plate 31 is provided with a third electrode 39, and the fourth conductive plate 34 is provided with a fourth electrode 40. The first conductive plate 31 is electrically connected to the first chip 35 through a bridge-shaped copper sheet 41, and the fourth conductive plate 34 is electrically connected to the second chip 36 through the bridge-shaped copper sheet 41. The first and fourth conductive plates 34 not only perform the function of conducting electricity, but also act as heat sinks, quickly conducting the heat of the first and second chips 36 to the outer casing 1, which is beneficial for overall heat dissipation, reducing the operating temperature, and improving long-term reliability. The elastic fit of the bridge-shaped copper sheet 41 with the conductive plate forms a stable electrical and mechanical combination, enhancing the component's resistance to vibration and impact, and adapting to stable operation under harsh working conditions.

[0028] Each of the conductive plates and chips is horizontally laid on the base 2. This horizontal laying ensures a consistent heat conduction path between each chip and the base 2. The base 2 serves as a heat dissipation platform, evenly distributing heat across the entire bottom, which helps reduce the risk of localized overheating and improves thermal management. Coplanar wiring reduces intersections and detours between different heights, lowering wire length and parasitic inductance and resistance, thereby improving switching speed and conduction efficiency.

[0029] A gap 42 is provided between the first conductive plate 31, the second conductive plate 32, the third conductive plate 33, and the fourth conductive plate 34. The gap 42 between adjacent conductive plates effectively prevents direct electrical short circuits between the plates, improving the safety margin and overvoltage resistance of the component. The gap 42 also facilitates air convection, enhancing heat dissipation efficiency between the plates, reducing heat accumulation, and improving overall thermal management.

[0030] The housing 1 is provided with connection holes 11 for each electrode to extend outward. The standardized connection hole 11 design facilitates quick insertion and removal or bolt fixing of connectors, reduces on-site installation and maintenance time, and improves the maintainability and modular replacement efficiency of the equipment.

[0031] The outer casing 1 has mounting holes 12 and mounting grooves on both sides for external fixation. These mounting holes 12 and grooves on both sides of the outer casing 1 allow the components to be easily and securely connected to the equipment frame or mounting plate, improving the overall structural stability and vibration resistance. Reinforcing ribs or thickened structures can be designed around the mounting holes 12 and grooves to enhance local strength, prevent stress damage during installation, and ensure reliability even under high vibration or impact environments.

[0032] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.

[0033] Although the present invention has been described with reference to several specific embodiments, it should be understood that the present invention is not limited to the specific embodiments disclosed. The present invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A thyristor assembly of multiple modular chips, characterized by: The device includes a housing and a base. At least two sets of chipsets are mounted on the base. Each chipet includes a chip, electrodes, a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate. The first conductive plate, the second conductive plate, the third conductive plate, and the fourth conductive plate are assembled to form a rectangular shape, thereby forming the chipet.

2. The multi-combined chip thyristor assembly of claim 1, wherein: Both the second and third conductive plates are bent and have concave-convex designs, so that the edges of the second conductive plate and the third conductive plate can be fitted together.

3. The thyristor assembly with multiple combined chips as described in claim 2, characterized in that: The second conductive plate is provided with a first chip and at least one first electrode, and the third conductive plate is provided with a second chip and at least one second electrode. The first chip is electrically connected to the third conductive plate through a bridge-shaped copper sheet, and the second chip is electrically connected to the second conductive plate through a bridge-shaped copper sheet.

4. The multi-combined chip thyristor assembly of claim 1, wherein: The first conductive plate is provided with a third electrode, and the fourth conductive plate is provided with a fourth electrode. The first conductive plate is electrically connected to the first chip through a bridge-shaped copper sheet, and the fourth conductive plate is electrically connected to the second chip through a bridge-shaped copper sheet.

5. The multi-combined chip thyristor assembly of claim 1, wherein: Each of the conductive plates and chips is laid horizontally on the base.

6. The multi-combined chip thyristor assembly of claim 1, wherein: A gap is provided between the first conductive plate, the second conductive plate, the third conductive plate and the fourth conductive plate.

7. The multi-combined chip thyristor assembly of claim 1, wherein: The outer casing is provided with connection holes for each electrode to extend to the outside.

8. The thyristor assembly with multiple combined chips as described in claim 1 or 7, characterized in that: The outer casing has fixing holes and fixing grooves on both sides for fixing to the outside.

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