Silicon wafer bearing device

Abstract

The utility model discloses a silicon wafer bearing device, which comprises a frame and a clamping piece, and is characterized in that the frame is internally provided with an accommodating cavity; a plurality of clamping pieces are arranged on the two opposite sides in the first direction in the containing cavity respectively, the clamping pieces are connected to the frame, the multiple clamping pieces are arranged at intervals in the second direction so that a clamping groove can be formed between every two adjacent clamping pieces to clamp a silicon wafer, and the second direction intersects with the first direction; wherein the clamping piece comprises a first clamping part and a second clamping part, the first clamping part is connected to the frame, and the second clamping part is connected to the first clamping part; the distance between every two adjacent first clamping parts is a first distance, the distance between every two adjacent second clamping parts is a second distance, the second distance is larger than or equal to the first distance, and the surface of each second clamping part bends and protrudes towards the interior of the clamping groove to form a curved surface. Therefore, the silicon wafer can be clamped and limited by the clamping piece, the silicon wafer can be conveniently inserted and taken out, and the risk that the surface of the silicon wafer is scratched by the clamping piece can be reduced.

Description

Technical Field

[0001] This application belongs to the field of photovoltaic technology, specifically relating to a silicon wafer carrier device. Background Technology

[0002] Photovoltaic power generation is one of the main ways to utilize solar energy. Due to its cleanliness, safety, convenience, and high efficiency, it has become an emerging industry that is of widespread concern and development focus in countries around the world. Solar cells are one of the essential components of photovoltaic power generation, and silicon solar cells are a type of solar cell that are currently widely used.

[0003] In the process of solar cell fabrication, silicon wafers need to be placed in a wafer basket for cleaning. Existing wafer baskets use evenly distributed slots on the inner, facing surfaces of the basket's side plates to limit the movement of the silicon wafers. However, this method is prone to scratches during wafer insertion and removal, leading to a significant reduction in yield and production capacity. Utility Model Content

[0004] This application aims to provide a silicon wafer carrier device that can solve the problem of scratches that easily occur during the insertion and removal of silicon wafers in related technologies.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide a silicon wafer carrier device, comprising:

[0007] A frame, wherein a receiving cavity is provided in the frame;

[0008] The clamping member comprises a plurality of clamping members respectively arranged on opposite sides of the receiving cavity along a first direction. The clamping members are connected to the frame. The plurality of clamping members are arranged at intervals along a second direction to form a slot between two adjacent clamping members for clamping silicon wafers. The second direction intersects the first direction. The clamping member includes a first clamping part and a second clamping part. One end of the first clamping part is connected to the frame, and the second clamping part is connected to the other end of the first clamping part. In two adjacent clamping members, the distance between two first clamping parts is a first distance, and the distance between two second clamping parts is a second distance. The second distance is greater than or equal to the first distance, and the surface of the second clamping part is curved and protrudes into the slot to form a curved surface.

[0009] Optionally, the first clamping part includes a first end and a second end disposed opposite to each other, and the second clamping part includes a third end and a fourth end disposed opposite to each other, the first end being connected to the frame, and the third end being connected to the second end;

[0010] From the first end to the second end, the spacing between the first clamping portions of two adjacent clamping members is equal;

[0011] And / or, from the third end to the fourth end, the distance between the second clamping portions of two adjacent clamping members gradually increases.

[0012] Optionally, the first clamping part includes a first end and a second end that are disposed opposite to each other, and the second clamping part includes a third end and a fourth end that are disposed opposite to each other. The first end is connected to the frame, and the third end is connected to the second end, defining a third direction that is perpendicular to the first direction and the second direction, respectively.

[0013] From the first end to the second end, the width of the first clamping part is equal in the third direction;

[0014] And / or, from the third end to the fourth end, the width of the second clamping portion gradually decreases in the third direction.

[0015] Optionally, a third direction is defined to be perpendicular to both the first direction and the second direction; the width of the first clamping part in the second direction is smaller than the width of the first clamping part in the third direction.

[0016] And / or, the width of the second clamping portion in the second direction is less than or equal to the width of the second clamping portion in the third direction.

[0017] Optionally, the silicon wafer carrier shall satisfy at least one of the following conditions:

[0018] A. Along the first direction, the length of the clamping member is 0.1 to 0.25 times the width of the silicon wafer;

[0019] B. The length of the first clamping part is 0.02 to 0.05 times the width of the silicon wafer;

[0020] C. Along the second direction, the distance between two adjacent first clamping portions is 7.00 to 9.00 times the thickness of the silicon wafer;

[0021] D. The maximum distance between two adjacent second clamping parts is 15.00 to 18.00 times the thickness of the silicon wafer.

[0022] Optionally, the silicon wafer carrier shall satisfy at least one of the following conditions:

[0023] E. The distance between the first clamping portions of two adjacent clamping members is H1, which satisfies: 0.9mm≤H1≤1.3mm;

[0024] F. In two adjacent clamping members, the distance between the ends of the two second clamping parts that are away from the first clamping part is H2, which satisfies: 1.8mm≤H2≤2.5mm;

[0025] G. The length of the clamping member along the first direction is L0, which satisfies: 20mm≤L0≤30mm;

[0026] H. The length of the first clamping part along the first direction is L1, which satisfies: 4mm≤L1≤6mm;

[0027] I. The side of the first clamping part facing the slot is cylindrical;

[0028] J. The surface of the second clamping part facing the slot is conical;

[0029] K. Draw a preset plane through the center of the clamping member. The preset plane is parallel to the first direction and the second direction. The boundary line between the preset plane and the surface of the first clamping part facing the slot is the first line segment. The boundary line between the preset plane and the surface of the second clamping part facing the slot is the second line segment. The second line segment and the extension of the first line segment form an angle A, satisfying: 1°≤A≤5°.

[0030] Optionally, the side surface of the clamping member facing the slot is a first surface, and the end of the clamping member facing the receiving cavity along the first direction has a second surface, the second surface being connected to the first surface; the second surface and the first surface are connected by an arc transition.

[0031] Optionally, the frame includes a frame body and fasteners. The frame body has the receiving cavity formed therein. The fasteners are spaced apart in the receiving cavity along the first direction. The clamping member is mounted on the fastener. The two ends of the fastener along the second direction are respectively connected to the frame body. At least one end of the fastener is provided with a tensioning structure between itself and the frame body. The tensioning structure is used to tension the fastener along the second direction.

[0032] Optionally, the silicon wafer carrier further includes an adjusting member, the fixing member has a connecting portion at at least one end along the second direction, the frame body has a mounting hole, the connecting portion passes through the mounting hole, the adjusting member is located on the side of the frame body away from the receiving cavity, and the adjusting member is threadedly connected to the connecting portion to form the tensioning structure.

[0033] Optionally, the plurality of clamping members are arranged at equal intervals;

[0034] And / or, the clamping member has a centerline extending along the first direction, and the clamping member has a symmetrical structure about the centerline as an axis of symmetry.

[0035] Compared with the prior art, the silicon wafer carrier device of this application has at least the following beneficial effects:

[0036] 1. In this application, multiple clamping members are provided on the inner side of the frame to clamp and fix the silicon wafer. The clamping members are set as a segmented structure so that when the silicon wafer is inserted into the slot, the first clamping part with a small spacing forms a better clamping and limiting effect on the edge of the silicon wafer. Combined with the toughness and elasticity of the silicon wafer itself, the silicon wafer can be kept in a flat state, thereby effectively avoiding the problem of adhesion between silicon wafers. At the same time, the spacing of the second clamping part is appropriately increased to reduce the difficulty of wafer insertion and facilitate actual operation while satisfying the clamping and limiting effect on the silicon wafer.

[0037] 2. By setting a tensioning structure between the end of the fastener and the frame body, the fastener can be tensioned along the second direction. This can prevent the spacing between multiple clamping parts on the fastener from changing due to bending of the fastener during use, thereby ensuring the quality stability of the silicon wafer manufacturing process. It can also prevent the clamping parts from deforming due to uneven force and improve the service life of the clamping parts.

[0038] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments will be briefly introduced below, wherein:

[0040] Figure 1 This is a schematic diagram of a silicon wafer carrier device according to an embodiment of this application;

[0041] Figure 2 yes Figure 1 An enlarged view of part A, shown in the center circle;

[0042] Figure 3 This is a cross-sectional view of a silicon wafer carrier device according to an embodiment of this application;

[0043] Figure 4 yes Figure 3 An enlarged view of section B, shown in the center circle;

[0044] Figure 5 This is a schematic diagram of the structure of two adjacent clamping members according to an embodiment of this application;

[0045] Figure 6 This is a front view of the clamping member according to an embodiment of this application;

[0046] Figure 7 This is a top view of the clamping member according to an embodiment of this application;

[0047] Figure 8 This is a left view of the clamping member according to an embodiment of this application.

[0048] Figure label:

[0049] 10: Frame; 10a: Receiving cavity; 11: Frame body; 110: Mounting hole; 111: End plate; 1110: Reinforcing rib; 112: Connecting rod; 113: Stop rod; 12: Fixing member; 121: Connecting part; 20: Clamping member; 20a: First surface; 20b: Second surface; 201: Slot; 21: First clamping part; 21a: First end; 21b: Second end; 22: Second clamping part; 22a: Third end; 22b: Fourth end; 30: Adjusting member; X: First direction; Y: Second direction; Z: Third direction. Detailed Implementation

[0050] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0051] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0052] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0053] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0054] The silicon wafer carrier device provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0055] like Figure 1 , Figure 2 and Figure 5 As shown, a silicon wafer carrier device according to some embodiments of this application includes: a frame 10 and clamping members 20. The frame 10 has a receiving cavity 10a. Multiple clamping members 20 are respectively provided on opposite sides along a first direction X in the receiving cavity 10a. The clamping members 20 are connected to the frame 10. The multiple clamping members 20 are arranged at intervals along a second direction Y to form a slot 201 between two adjacent clamping members 20 for clamping the silicon wafer. The second direction Y intersects the first direction X. The clamping member 20 includes a first clamping part 21 and a second clamping part 22. One end of the first clamping part 21 is connected to the frame 10, and the second clamping part 22 is connected to the other end of the first clamping part 21. In two adjacent clamping members 20, the distance between two first clamping parts 21 is a first distance, and the distance between two second clamping parts 22 is a second distance. The second distance is greater than or equal to the first distance, and the surface of the second clamping part 22 is curved and protrudes into the slot 201 to form a curved surface.

[0056] In this embodiment of the application, the frame 10 is provided with a receiving cavity 10a for accommodating silicon wafers. By providing multiple clamping members 20 on opposite sides along the first direction X in the receiving cavity 10a, and arranging the multiple clamping members 20 at intervals along the second direction Y, a slot 201 is formed between two adjacent clamping members 20, which facilitates inserting both ends of the silicon wafer into the slot 201. The adjacent clamping members 20 form a clamping limit on the silicon wafer, avoiding large displacement of the silicon wafer in the receiving cavity 10a. At the same time, the isolation effect of the clamping members 20 can prevent the adhesion problem between adjacent silicon wafers.

[0057] Furthermore, the clamping member 20 includes a first clamping portion 21 and a second clamping portion 22 connected to each other along a first direction near the frame 10. The second clamping portion 22 extends toward the interior of the receiving cavity 10a, and the distance between the second clamping portions 22 of two adjacent clamping members 20 is greater than or equal to the distance between the first clamping portions 21 of two adjacent clamping members 20. In this way, the first clamping portions 21 of the two clamping members 20 can form a better clamping and limiting effect on the silicon wafer, keeping the silicon wafer in an approximately planar state, thereby reducing the problem of silicon wafer sticking. At the same time, by appropriately increasing the distance between the second clamping portions 22 of the two clamping members 20, it is easier to smoothly insert or remove the silicon wafer. In addition, the surface of the second clamping portion 22 is set as a curved surface that bends and protrudes toward the slot 201, which can reduce the risk of the clamping member 20 scratching the surface of the silicon wafer, thereby helping to improve the yield and production efficiency.

[0058] It is understood that the silicon wafer carrier device in this application embodiment can be applied in photovoltaic cell manufacturing processes, and can simultaneously accommodate multiple silicon wafers for corresponding process operations, such as silicon wafer cleaning. Of course, the specific application scenario of the silicon wafer carrier device in this application can be flexibly selected according to actual needs, and is not limited here.

[0059] Specifically, the frame 10 may have intersecting first direction X, second direction Y, and third direction Z. The frame 10 includes a receiving cavity 10a for accommodating silicon wafers. The receiving cavity 10a has an opening along one side of the third direction Z, allowing for the insertion and removal of silicon wafers. Multiple clamping members 20 are respectively provided on two opposite inner sides along the first direction X within the receiving cavity 10a. These clamping members 20 are spaced apart along the second direction Y, forming a slot 201 between adjacent clamping members 20. This allows at least a portion of the silicon wafer to be inserted into the slot 201, clamping and limiting the silicon wafer to prevent significant displacement and damage during processing. Simultaneously, the isolation effect of the clamping members 20 prevents adjacent silicon wafers from sticking together. Furthermore, the frame 10 may have a perforated structure around its perimeter to allow process media such as cleaning fluid to enter the receiving cavity 10a and contact the silicon wafers.

[0060] Specifically, such as Figure 1 and Figure 2 As shown, the frame 10 includes a frame body 11 and fasteners 12. The frame body 11 may include two end plates 111 spaced apart along the second direction Y. A plurality of connecting rods 112 are provided between the two end plates 111, arranged circumferentially around the end plates 111. The two ends of each connecting rod 112 are connected to the end plates 111, thus forming a box structure with a receiving cavity 10a by the two end plates 111 and the four connecting rods 112. The receiving cavity 10a has an opening and a bottom. A stop bar 113 may also be provided at the bottom of the receiving cavity 10a to improve the load-bearing capacity of the silicon wafer.

[0061] Furthermore, at least two fixing members 12 are provided between the two end plates 111. These fixing members 12 are spaced apart along the first direction X to form the sidewall of the receiving cavity 10a. Multiple clamping members 20 are mounted on the side of the fixing members 12 facing into the receiving cavity 10a. These clamping members 20 are spaced apart along the second direction Y to form a slot 201 between adjacent clamping members 20. Specifically, one or more fixing members 12 can be provided on each side of the receiving cavity 10a along the first direction X, and each fixing member 12 is provided with multiple clamping members 20 spaced apart along the second direction Y. For example, such as... Figure 1 As shown, the receiving cavity 10a has two fixing members 12 on each side along the first direction X, and each fixing member 12 has multiple clamping members 20.

[0062] In some embodiments, the plurality of clamping members 20 on each fixing member 12 are arranged at equal intervals, thereby ensuring the consistency of the clamping effect of the plurality of clamping members 20 on the silicon wafer. Furthermore, as... Figure 2 As shown, a reinforcing rib 1110 can also be provided on the side of the end plate 111 facing the receiving cavity 10a to improve the structural strength of the end plate 111, thereby increasing the service life of the bearing device.

[0063] It should be noted that the number and location of the fasteners 12 in the frame 10, as well as the number and spacing of the clamping parts 20 on each fastener 12, can be flexibly set according to actual needs and are not limited here.

[0064] Furthermore, by setting the surface of the second clamping part 22 facing the slot 201 to have a curved structure, and this curved structure bends and protrudes into the slot 201 along the second direction Y, the second clamping part 22 contacts the silicon wafer through the curved surface during the silicon wafer insertion process. This effectively avoids the risk of the second clamping part 22 scratching the surface of the silicon wafer, thus protecting the silicon wafer while satisfying the function of clamping and limiting it. Moreover, the curved structure also acts as a guide during the silicon wafer insertion into the slot 201, allowing for quick and accurate insertion of the silicon wafer into the slot 201, facilitating the wafer insertion operation.

[0065] In some embodiments, the surface of the first clamping part 21 facing the slot 201 can also be configured as a curved structure, thereby ensuring that the silicon wafer edge is stably clamped by the two adjacent first clamping parts 21, while effectively avoiding the risk of scratching the silicon wafer surface by the first clamping part 21, thus protecting the silicon wafer.

[0066] For example, the surface can be a quadratic surface, including but not limited to: circular arc surface, elliptical arc surface, elliptical parabola, etc.

[0067] It is understandable that if the spacing between two adjacent clamping members 20 at different positions is a fixed spacing, then when the spacing is large, it cannot form a stable clamping and limiting effect on the silicon wafer, and the silicon wafer is prone to large displacement, which will lead to damage to the silicon wafer; while when the spacing is small, the corresponding accuracy requirement for the insertion is high, which is not convenient for the insertion operation.

[0068] Therefore, in this application, the clamping member 20 is configured as a segmented structure so that when the silicon wafer is inserted into the slot 201, the first clamping part 21 with a smaller spacing forms a better clamping and limiting effect on the edge of the silicon wafer. Combined with the toughness and resilience of the silicon wafer itself, the silicon wafer can be kept in a flat state, thereby effectively avoiding the problem of adhesion between silicon wafers. At the same time, the spacing of the second clamping part 22 is appropriately increased to reduce the difficulty of wafer insertion and facilitate actual operation while satisfying the clamping and limiting effect on the silicon wafer.

[0069] It is understood that the surface of the clamping member 20 is curved, and the curved surface has vertices along the second direction Y. The distance between the first clamping parts 21 of two adjacent clamping members 20 refers to the distance between the vertices of the two first clamping parts 21 on the side surfaces that are close to each other along the second direction Y. Similarly, the distance between the second clamping parts 22 of two adjacent clamping members refers to the distance between the vertices of the two second clamping parts 22 on the side surfaces that are close to each other along the second direction Y.

[0070] Optionally, such as Figure 6As shown, the first clamping part 21 includes a first end 21a and a second end 21b disposed opposite to each other along the first direction X, and the second clamping part 22 includes a third end 22a and a fourth end 22b disposed opposite to each other along the first direction X. The first end 21a is connected to the frame 10, and the third end 22a is connected to the second end 21b. From the first end 21a to the second end 21b of the first clamping part 21, the distance between the first clamping parts 21 of two adjacent clamping members 20 is equal.

[0071] In this embodiment of the application, by making the distance between the first clamping portions 21 of two adjacent clamping members 20 a constant distance, it is possible to ensure that the two adjacent first clamping portions 21 form a good clamping and limiting effect on the silicon wafer, thereby reducing the problem of adhesion between adjacent silicon wafers.

[0072] Understandably, because the distance between the first clamping portions 21 of the two clamping members 20 is relatively small, when the silicon wafer is inserted into the slot 201, the two first clamping portions 21 can form a stable clamping and fixing effect on the edge of the silicon wafer. When the middle part of the silicon wafer bends, because the edge of the silicon wafer is clamped and fixed, under the toughness and elasticity of the silicon wafer, the bent silicon wafer can automatically return to a flat or near-flat state. This can effectively avoid the problem of silicon wafer adhesion caused by local bending of the silicon wafer.

[0073] Optionally, such as Figure 6 As shown, from the third end 22a to the fourth end 22b of the second clamping part 22, the distance between the second clamping parts 22 of two adjacent clamping members 20 gradually increases.

[0074] It is understandable that during the insertion and removal of silicon wafers, the middle part of the silicon wafer is prone to bending deformation, and the deformation is greater closer to the center of the silicon wafer along the first direction X. Therefore, in this application, from the third end 22a to the fourth end 22b of the second clamping part 22, the distance between the second clamping parts 22 of two adjacent clamping members 20 gradually decreases to match the deformation trend of the silicon wafer, thereby facilitating the insertion and removal of the silicon wafer and reducing the risk of scratching the silicon wafer by the clamping members 20.

[0075] In some embodiments, the side surface of the first clamping part 21 facing the card slot 201 and the side surface of the second clamping part 22 facing the card slot 201 are both set as curved surfaces, and an arc transition surface is provided between the side surface of the first clamping part 21 facing the card slot 201 and the side surface of the second clamping part 22 facing the card slot 201 to avoid scratching the silicon wafer at the connection.

[0076] In other embodiments, the surface of the first clamping part 21 facing the slot 201 can be set as a cylindrical surface, including but not limited to: a cylindrical surface, an elliptical cylindrical surface, a parabolic cylindrical surface, etc.

[0077] In other embodiments, the surface of the second clamping part 22 facing the slot 201 is conical, including but not limited to: conical surface, elliptical conical surface, etc.

[0078] Optionally, such as Figure 7 As shown, from the first end 21a to the second end 21b of the first clamping part 21, the width of the first clamping part 21 in the third direction Z is equal.

[0079] In this embodiment of the application, from the first end 21a to the second end 21b of the first clamping part 21, the dimensions of each part of the first clamping part 21 in the third direction Z are set to be equal, so as to ensure the overall structural strength of the first clamping part 21 and thereby enhance the clamping and limiting effect of the first clamping part 21 on the silicon wafer.

[0080] Optionally, such as Figure 7 As shown, from the third end 22a to the fourth end 22b of the second clamping part 22, the width of the second clamping part 22 in the third direction Z gradually decreases.

[0081] In this embodiment, from the third end 22a to the fourth end 22b of the second clamping part 22, the size of the second clamping part 22 gradually decreases in the third direction Z. That is, the second clamping part 22 has a structure where the third end 22a is larger and the fourth end 22b is smaller. This ensures that the second clamping part 22 can clamp and limit the silicon wafer while reducing the overall volume of the second clamping part 22, thereby reducing material costs. In addition, the clamping member 20 in this application can be manufactured by injection molding. By setting the second clamping part 22 to have a structure where the third end 22a is larger and the fourth end 22b is smaller, it is also convenient to demold the clamping member 20 during the production process.

[0082] Optionally, such as Figure 8 As shown, the width of the first clamping part 21 in the second direction Y is less than the width of the first clamping part 21 in the third direction Z; the third direction Z is perpendicular to the first direction X and the second direction Y respectively; and / or, the width of the second clamping part 22 in the second direction Y is less than or equal to the width of the second clamping part 22 in the third direction Z.

[0083] In this embodiment, by setting the clamping member 20 to be relatively wide in the third direction Z, the clamping member 20 can be used to improve the clamping and limiting effect of the clamping member 20 on the silicon wafer. At the same time, by setting the clamping member 20 to be relatively thin in the second direction Y, more clamping members 20 can be arranged in the receiving cavity 10a along the second direction Y, thereby increasing the number of silicon wafers that can be accommodated in the receiving cavity 10a.

[0084] In some embodiments, the clamping member 20 has a centerline extending along a first direction X, and the clamping member 20 is axially symmetrical about the centerline along a second direction Y, and / or, the clamping member 20 is axially symmetrical about the centerline along a third direction Z. By setting the clamping member 20 to a symmetrical structure, the uniformity of the overall structure of the clamping member 20 is improved. This ensures both the balanced clamping effect of the clamping member 20 on the silicon wafer and facilitates the processing of the clamping member 20.

[0085] Optionally, such as Figure 6 As shown, along the first direction X, the length L0 of the clamping member 20 is 0.1 to 0.25 times the width L2 of the silicon wafer; for example, it can be any value between 0.1, 0.11, 0.12, 0.13, 14, 0.15, 0.16, 0.17, 0.18, 0.19, 0.2, 0.21, 0.22, 0.23, 0.24, 0.25, or 0.1 to 0.25 times. The length L1 of the first clamping part 21 is 0.02 to 0.05 times the width L2 of the silicon wafer; for example, it can be any value between 0.02, 0.03, 0.04, 0.05, or 0.02 to 0.05 times.

[0086] It is worth noting that the shape of silicon wafers is generally square or rectangular. For example, the size of silicon wafers can be 182mm×182mm, 182mm×210mm, 210mm×210mm, etc. The width of silicon wafers in this application is the value of the side with the smaller side length.

[0087] In this application, the clamping member 20 is designed as a segmented structure, so that the first clamping part 21 plays the main clamping and fixing role, and the second clamping part 22 plays the role of clamping and limiting. At the same time, it can take into account the convenience of silicon wafer insertion and removal. Furthermore, by setting a reasonable ratio range of L0, L1 and L2, the structure of the clamping member 20 can be better matched with the silicon wafer structure, thereby meeting the silicon wafer bearing requirements of different specifications. This avoids the first clamping part 21 being too short to effectively clamp and fix the silicon wafer, and also avoids the first clamping part 21 being too long to interfere with the silicon wafer process operation.

[0088] It is understood that the silicon wafer has a rectangular structure, and the rectangular silicon wafer has a length, width, and thickness. The length and width of the silicon wafer are both greater than the thickness, and the length is greater than or equal to the width. When the silicon wafer is supported by a carrier device, it is inserted into the receiving cavity 10a with the width direction of the silicon wafer parallel to the first direction X. The width of the silicon wafer mentioned above is the width L2.

[0089] Optionally, such as Figure 6As shown, along the second direction Y, the distance between two adjacent first clamping portions 21 is H1, the maximum distance between two adjacent second clamping portions is H2, and the thickness of the silicon wafer is H3. H1 is 7.00 to 9.00 times H3; for example, it can be any value between 7.00, 7.05, 7.10, 7.15, 7.25, 7.35, 7.50, 8.00, 8.15, 8.16, 8.18, 8.20, 8.30, 8.50, 8.60, 8.70, 8.80, 8.90, 9.00, or 7.00 to 9.00 times. H2 is 15.00 to 18.00 times H3; for example, it can be any value between 15.00, 15.05, 15.10, 15.15, 15.25, 15.35, 15.50, 16.00, 16.15, 16.16, 16.18, 16.20, 16.30, 16.50, 16.60, 16.70, 16.80, 16.90, 17.00, 17.25, 17.35, 17.50, or 15.00 to 18.00 times.

[0090] It is understandable that this application uses a segmented structure for the clamping member, so that the first clamping part 21 plays the main clamping and fixing role, and the second clamping part 22 plays the role of clamping and limiting. At the same time, it can also take into account the convenience of silicon wafer insertion and removal. By setting a reasonable ratio range of H1, H2 and H3, the structure of the clamping member can better match the structure of the silicon wafer, thereby meeting the load-bearing requirements of silicon wafers of different specifications. It avoids the silicon wafer being easily damaged by the gap between the two clamping members if it is too small, and also avoids the silicon wafer not being effectively clamped and limited by the gap between the two clamping members if it is too large.

[0091] In some embodiments, such as Figure 6 As shown, the distance between the first clamping portions 21 of two adjacent clamping members 20 (i.e., the aforementioned first distance) is H1, which satisfies: 0.9mm ≤ H1 ≤ 1.3mm. For example, the distance H1 can be set to: 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, etc.

[0092] In this embodiment, by setting a reasonable range of the distance H1 between the first clamping portions 21 of two adjacent clamping members 20, the first clamping portions 21 of the two clamping members 20 can effectively clamp and limit the edge of the silicon wafer, thereby reducing the adhesion problem between adjacent silicon wafers. If the distance H1 is too large, it cannot effectively clamp and limit the silicon wafer, and the silicon wafer is prone to large displacement within the slot 201, resulting in damage to the silicon wafer; while if the distance H1 is too small, the clamping members 20 clamp the silicon wafer too tightly, making it difficult to insert or remove the silicon wafer, and may even cause the silicon wafer to be damaged.

[0093] In some embodiments, such as Figure 6 As shown, in two adjacent clamping members 20, the distance between the fourth ends 22b of the two second clamping parts 22 is H2, which satisfies: 1.8mm≤H2≤2.5mm. For example, the distance H2 can be set to: 1.8mm, 1.9mm, 2mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, 2.5mm, etc.

[0094] In this embodiment of the application, by setting a reasonable range of the distance H2 between the fourth ends 22b of the two second clamping parts 22 in two adjacent clamping members 20, it is possible to better adapt to the wafer insertion requirements. This not only enables the second clamping parts 22 to form a clamping and limiting effect on the silicon wafer, but also facilitates the insertion and removal of the silicon wafer, reducing the risk of scratching the silicon wafer by the clamping members 20.

[0095] In some embodiments, such as Figure 6 As shown, the length of the clamping member 20 along the first direction X is L0, which satisfies: 20mm≤L0≤30mm. For example, the length L0 of the clamping member 20 along the first direction X can be set to: 20mm, 22mm, 25mm, 26mm, 28mm, 30mm, etc.

[0096] Understandably, if the length L0 of the clamping member 20 along the first direction X is too large, the width of the slot 201 formed between two adjacent clamping members 20 along the first direction X will be too wide, resulting in a large contact area between the silicon wafer and the clamping member 20. This makes it difficult to insert and remove the silicon wafer, and the clamping member 20 will also cover too much of the silicon wafer surface, hindering operations such as cleaning. Conversely, if the length L0 of the clamping member 20 along the first direction X is too small, the clamping portion of the clamping member 20 will be too small, failing to provide effective clamping and limiting of the silicon wafer. Therefore, in this application, by setting the length L0 of the clamping member 20 along the first direction X to between 20mm and 30mm, it is possible to ensure effective clamping and limiting of the silicon wafer using the clamping member 20 while facilitating the insertion and removal of the silicon wafer.

[0097] In some embodiments, such as Figure 6As shown, the length of the first clamping part 21 along the first direction X is L1, which satisfies: 4mm≤L1≤6mm. For example, the length L1 of the first clamping part 21 along the first direction X can be set to: 4mm, 4.3mm, 4.5mm, 5mm, 5.2mm, 5.5mm, 6mm, etc.

[0098] In this embodiment, by setting the length L1 of the first clamping part 21 along the first direction X to be between 4mm and 6mm, it is ensured that the first clamping part 21 of the two adjacent clamping members 20 forms a stable clamping and fixing effect on the edge of the silicon wafer, thereby cooperating with the resilience of the silicon wafer itself to ensure that the silicon wafer remains in a flat state, thereby avoiding the problem of silicon wafer adhesion.

[0099] In some embodiments, such as Figure 6 As shown, a preset plane is drawn through the center of the clamping member 20. The preset plane is parallel to the first direction X and the second direction Y. The boundary line between the preset plane and the surface of the first clamping part 21 facing the slot 201 is the first line segment. The boundary line between the preset plane and the surface of the second clamping part 22 facing the slot 201 is the second line segment. The second line segment and the extension of the first line segment form an angle A, satisfying: 1°≤A≤5°. For example, the included angle A can be set to 1°, 1.5°, 2°, 2.5°, 3°, 3.5°, 4°, 4.5°, etc.

[0100] It is understood that the first line segment is a straight line parallel to the first direction X, and the second line segment has a certain inclination relative to the first line segment. The angle of inclination is the included angle A. By setting the included angle A between 1° and 5°, a gradual spacing is formed between the second clamping parts 22 of two adjacent clamping members 20. This facilitates the insertion and removal of the silicon wafer while using the second clamping parts 22 to clamp and limit the silicon wafer.

[0101] Optionally, such as Figure 5 As shown, the side surface of the clamping member 20 facing the slot 201 is a first surface 20a, and the end of the clamping member 20 facing the receiving cavity 10a along the first direction X has a second surface 20b, which is connected to the first surface 20a; there is a rounded transition between the second surface 20b and the first surface 20a. In this application, by providing a rounded transition at the junction of the second surface 20b and the first surface 20a, the scratches on the silicon wafer surface by the end of the clamping member 20 during the insertion or removal of the silicon wafer are reduced.

[0102] Optionally, such as Figures 1 to 4As shown, the frame 10 includes a frame body 11 and a fastener 12. The frame body 11 has a receiving cavity 10a. The fastener 12 is spaced apart in the receiving cavity 10a along the first direction X. The clamping member 20 is installed on the fastener 12. The two ends of the fastener 12 along the second direction Y are respectively connected to the frame body 11. At least one end of the fastener 12 is provided with a tensioning structure between it and the frame body 11. The tensioning structure is used to tension the fastener 12 along the second direction Y.

[0103] In this embodiment of the application, by providing a tensioning structure between the end of the fixing member 12 and the corresponding frame body 11, the fixing member 12 is tensioned along the second direction Y. This can prevent the spacing between the multiple clamping members 20 on the fixing member 12 from changing due to bending of the fixing member 12 during use, thereby ensuring the quality stability of the silicon wafer manufacturing process. At the same time, it can also prevent the clamping members 20 from deforming due to uneven force, and improve the service life of the clamping members 20.

[0104] Optionally, such as Figure 4 As shown, the silicon wafer carrier device also includes an adjusting member 30, and the fixing member 12 has a connecting part 121 at at least one end along the second direction Y. The frame body 11 has a mounting hole 110, the connecting part 121 passes through the mounting hole 110, the adjusting member 30 is located on the side of the frame body 11 away from the receiving cavity 10a, and the adjusting member 30 is threadedly connected to the connecting part 121 to form a tensioning structure.

[0105] In this embodiment, by having the connecting part 121 at the end of the fastener 12 pass through the mounting hole 110 in the frame body 11, and by providing a threaded connection of the connecting part 121 of the adjusting member 30 to form a tensioning structure, the fastener 12 can be tightened along the second direction Y by turning the adjusting member 30, so that the fastener 12 is kept in a stretched state. This tensioning structure is simple and convenient for processing, assembly and use.

[0106] In some embodiments, such as Figure 4 As shown, the adjusting member 30 can be a bolt. A threaded hole is provided in the connecting part 121 at the end of the fixing member 12. The connecting part 121 extends into the mounting hole 110 of the frame body 11. The bolt passes through the mounting hole 110 and is threadedly connected to the threaded hole in the connecting part 121. The fixing member 12 can be tightened by turning the bolt.

[0107] In other embodiments, the adjusting member 30 can be a nut, and an external thread is provided on the outer periphery of the connecting portion 121 at the end of the fixing member 12. The connecting portion 121 passes through the mounting hole 110 of the frame body 11 and is at least partially exposed outside the mounting hole 110. The nut is then threadedly connected to the connecting portion 121 from the side of the frame body 11 away from the receiving cavity 10a. The fixing member 12 can be tightened by turning the nut.

[0108] It should be noted that the tensioning structure between the fastener 12 and the frame body 11 can also be other structures, as long as it can achieve the tensioning effect on the fastener 12 along the second direction Y. It can be flexibly set according to the actual situation and is not limited here.

[0109] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0110] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A silicon wafer carrier device, characterized in that, include: A frame, wherein a receiving cavity is provided in the frame; The clamping member comprises a plurality of clamping members respectively provided on opposite sides of the receiving cavity along a first direction. The clamping members are connected to the frame. The plurality of clamping members are arranged at intervals along a second direction to form a slot between two adjacent clamping members. The second direction intersects the first direction. The clamping member includes a first clamping part and a second clamping part. One end of the first clamping part is connected to the frame, and the second clamping part is connected to the other end of the first clamping part. In two adjacent clamping members, the distance between two first clamping parts is a first distance, and the distance between two second clamping parts is a second distance. The second distance is greater than or equal to the first distance, and the surface of the second clamping part is curved and protrudes into the slot to form a curved surface.

2. The silicon wafer carrier device according to claim 1, characterized in that, The first clamping part includes a first end and a second end that are disposed opposite to each other, and the second clamping part includes a third end and a fourth end that are disposed opposite to each other. The first end is connected to the frame, and the third end is connected to the second end. From the first end to the second end, the spacing between the first clamping portions of two adjacent clamping members is equal; And / or, from the third end to the fourth end, the distance between the second clamping portions of two adjacent clamping members gradually increases.

3. The silicon wafer carrier device according to claim 1, characterized in that, The first clamping part includes a first end and a second end that are disposed opposite to each other, and the second clamping part includes a third end and a fourth end that are disposed opposite to each other. The first end is connected to the frame, and the third end is connected to the second end. The third direction is defined to be perpendicular to the first direction and the second direction, respectively. From the first end to the second end, the width of the first clamping part is equal in the third direction; And / or, from the third end to the fourth end, the width of the second clamping portion gradually decreases in the third direction.

4. The silicon wafer carrier device according to claim 1, characterized in that, A third direction is defined to be perpendicular to both the first direction and the second direction; the width of the first clamping part in the second direction is smaller than the width of the first clamping part in the third direction; And / or, the width of the second clamping portion in the second direction is less than or equal to the width of the second clamping portion in the third direction.

5. The silicon wafer carrier device according to any one of claims 1-4, characterized in that, The silicon wafer carrier must satisfy at least one of the following conditions: A. Along the first direction, the length of the clamping member is 0.1 to 0.25 times the width of the silicon wafer; B. Along the first direction, the length of the first clamping portion is 0.02 to 0.05 times the width of the silicon wafer; C. Along the second direction, the distance between two adjacent first clamping portions is 7.00 to 9.00 times the thickness of the silicon wafer; D. Along the second direction, the maximum distance between two adjacent second clamping portions is 15.00 to 18.00 times the thickness of the silicon wafer.

6. The silicon wafer carrier device according to any one of claims 1-4, characterized in that, The silicon wafer carrier must satisfy at least one of the following conditions: E. The distance between the first clamping portions of two adjacent clamping members is H1, which satisfies: 0.9mm≤H1≤1.3mm; F. In two adjacent clamping members, the distance between the ends of the two second clamping parts that are away from the first clamping part is H2, which satisfies: 1.8mm≤H2≤2.5mm; G. The length of the clamping member along the first direction is L0, which satisfies: 20mm≤L0≤30mm; H. The length of the first clamping part along the first direction is L1, which satisfies: 4mm≤L1≤6mm; I. The side of the first clamping part facing the slot is cylindrical; J. The surface of the second clamping part facing the slot is conical; K. Draw a preset plane through the center of the clamping member. The preset plane is parallel to the first direction and the second direction. The boundary line between the preset plane and the surface of the first clamping part facing the slot is the first line segment. The boundary line between the preset plane and the surface of the second clamping part facing the slot is the second line segment. The second line segment and the extension of the first line segment form an angle A, satisfying: 1°≤A≤5°.

7. The silicon wafer support device according to any one of claims 1-4, characterized in that, The side surface of the clamping member facing the slot is a first surface, and the end of the clamping member facing the receiving cavity along the first direction has a second surface, which is connected to the first surface; the second surface and the first surface have a rounded transition.

8. The silicon wafer carrier device according to any one of claims 1-4, characterized in that, The frame includes a frame body and fasteners. The frame body has the receiving cavity. The fasteners are spaced apart in the receiving cavity along the first direction. The clamping member is mounted on the fastener. The two ends of the fastener along the second direction are respectively connected to the frame body. At least one end of the fastener is provided with a tensioning structure between itself and the frame body. The tensioning structure is used to tension the fastener along the second direction.

9. The silicon wafer carrier device according to claim 8, characterized in that, The silicon wafer carrier further includes an adjusting member, the fixing member has a connecting portion at at least one end along the second direction, the frame body has a mounting hole, the connecting portion passes through the mounting hole, the adjusting member is located on the side of the frame body away from the receiving cavity, and the adjusting member is threadedly connected to the connecting portion to form the tensioning structure.

10. The silicon wafer carrier device according to any one of claims 1-4, characterized in that, The multiple clamping members are arranged at equal intervals; And / or, the clamping member has a centerline extending along the first direction, and the clamping member has a symmetrical structure about the centerline as an axis of symmetry.

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