Miniature high-impedance TSS device

Abstract

The utility model discloses a small-sized high-impedance TSS device, which relates to the technical field of semiconductor packaging and comprises a product crystal grain. The frame electrode plate is arranged on the product crystal grains; the positive electrode plate is arranged at the top end of the frame electrode plate; the negative electrode plate is arranged at the bottom end of the product crystal grain; the impedance part is arranged between the positive electrode plate and the negative electrode plate; wherein the impedance part comprises an impedance body, one end of the impedance body is connected to the positive electrode plate, the other end of the impedance body is connected between the negative electrode plates, and the impedance body is used for increasing resistance between the positive electrode plate and the negative electrode plates; and the packaging part is used for packaging the product crystal grains, the frame electrode plate, the positive electrode plate, the negative electrode plate and the impedance part. The impedance part increases impedance between the positive electrode plate and the negative electrode plate, reduces current on the positive electrode plate and the negative electrode plate, and can play a certain protection role when facing surge current. And meanwhile, the impedance part can provide sufficient resistance value in a limited space, so that the use requirement is met.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a small, high-impedance TSS device. Background Technology

[0002] TSS (Thyristor Surge Suppressor), also known as a semiconductor discharge tube, is a PNPN junction four-layer structure device manufactured using semiconductor technology. Its current-voltage characteristics are similar to those of a thyristor, exhibiting typical switching characteristics. TSSs are generally used in parallel in circuits. Under normal operating conditions, the TSS is in the off state. When an abnormal overvoltage occurs in the circuit due to induced lightning, switching overvoltage, or other abnormalities, the TSS quickly conducts to discharge current, protecting downstream equipment from damage caused by the abnormal overvoltage. After the abnormal overvoltage disappears, the TSS returns to the off state.

[0003] As electronic products become increasingly miniaturized, TSS (Transmission Suspension Shield) devices are typically installed in small spaces to address space constraints in communication products. However, miniaturized TSS devices often struggle to provide impedance matching to abnormal overvoltages, resulting in persistently high currents that could still damage the protected circuit and fail to meet protection requirements. Therefore, a small, high-impedance TSS device is needed. Utility Model Content

[0004] The purpose of this invention is to increase the impedance between the positive and negative electrode plates by increasing the impedance inside the packaging part, thereby providing a sufficient resistance value to meet the usage requirements.

[0005] To achieve the above-mentioned objectives, this utility model provides the following technical solution:

[0006] A small, high-impedance TSS device, comprising a product die;

[0007] A frame electrode sheet is disposed on the product grain;

[0008] A positive electrode sheet is disposed at the top of the frame electrode sheet;

[0009] A negative electrode sheet is disposed at the bottom end of the product grain;

[0010] An impedance section is disposed between the positive electrode plate and the negative electrode plate;

[0011] The impedance section includes an impedance element with one end connected to the positive electrode plate and the other end connected between the negative electrode plate. The impedance element is used to increase the resistance between the positive electrode plate and the negative electrode plate.

[0012] The packaging section encapsulates the product die, frame electrode sheet, positive electrode sheet, negative electrode sheet, and impedance section.

[0013] As a preferred technical solution of this application, the impedance body is multi-segmented, and each segment of the impedance body is connected end to end.

[0014] As a preferred technical solution of this application, the impedance body includes a vertical section directly connected to the positive electrode plate, an inclined section connected to one end of the vertical section, and a horizontal section connected to the inclined section, wherein the horizontal section is directly connected to the negative electrode plate.

[0015] As a preferred technical solution of this application, the impedance body is a single-segment straight line, and the ends of the positive electrode plate and the negative electrode plate are both chamfered. One end of the impedance body is connected to the chamfer of the positive electrode plate, and the other end is connected to the chamfer of the negative electrode plate.

[0016] As a preferred technical solution of this application, the encapsulation part is a component made of epoxy resin black glue.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] 1. By setting an impedance section, the impedance section increases the impedance between the positive and negative electrode plates, reduces the current on the positive and negative electrode plates, and can play a certain protection role when facing surge current. At the same time, the impedance section can provide sufficient resistance value within a limited space to meet the usage requirements.

[0019] 2. By setting up multi-segment impedance elements with connected ends, the space of the package is fully utilized to obtain greater impedance, while avoiding right angles that would cause uneven resistance distribution and excessive current changes. Attached image description:

[0020] Figure 1 This is a cross-sectional view of the small high-impedance TSS device in Embodiment 1 of this utility model;

[0021] Figure 2 This is a cross-sectional view of the small high-impedance TSS device in Embodiment 2 of this utility model.

[0022] The diagram shows: 1. Product grain; 2. Frame electrode sheet; 3. Positive electrode sheet; 31. Chamfer; 4. Negative electrode sheet; 5. Impedance section; 51. Vertical section; 52. Oblique section; 53. Horizontal section; 6. Packaging section. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model.

[0024] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0025] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] Example 1:

[0028] See Figures 1 to 2 As shown, this embodiment provides a small, high-impedance TSS device.

[0029] A small, high-impedance TSS device, comprising product die 1;

[0030] A frame electrode sheet 2 is provided on the product crystal 1, a positive electrode sheet 3 is provided at the end of the frame electrode sheet away from the product crystal 1, and a negative electrode sheet 4 is provided at the bottom end of the product crystal 1.

[0031] An impedance section 5 is provided between the positive electrode plate 3 and the negative electrode plate 4;

[0032] The impedance part 5 includes an impedance body with one end connected to the positive electrode plate 3 and the other end connected to the negative electrode plate 4. The impedance body is used to increase the resistance between the positive electrode plate 3 and the negative electrode plate 4.

[0033] The encapsulation section 6 encapsulates the product die 1, frame electrode sheet 2, positive electrode sheet 3, negative electrode sheet 4, and impedance section 5, providing a certain degree of protection.

[0034] In use, the impedance section 5 increases the impedance between the positive electrode 3 and the negative electrode 4, reducing the current on the positive electrode 3 and the negative electrode 4, thus providing some protection against surge current. At the same time, the impedance section 5 can provide sufficient resistance within a limited space to meet usage requirements.

[0035] The impedance element is a single-segment straight line. Both the positive electrode plate 3 and the negative electrode plate 4 have chamfers 31 at their ends. One end of the impedance element is connected to the chamfer 31 of the positive electrode plate 3, and the other end is connected to the chamfer 31 of the negative electrode plate 4. The impedance value of the single-segment straight line impedance element is uniformly distributed, which can keep the current stable and uniform.

[0036] The encapsulation part 6 is a component made of epoxy resin black glue. The encapsulation part 6 is used to prevent current leakage and protect the internal electronic components.

[0037] Example 2:

[0038] See Figure 1 and Figure 2 As shown, this embodiment further elaborates on the impedance body compared to Embodiment 1.

[0039] As a preferred technical solution of this application, the impedance element is multi-segmented, with each segment connected end-to-end. The multi-segmented impedance element can make full use of the space of the package 6 to fill a larger impedance element, obtain a larger resistance, and increase the resistance value in a limited space.

[0040] The impedance element includes a vertical section 51 directly connected to the positive electrode plate, an inclined section 52 connected to one end of the vertical section 51, and a horizontal section 53 connected to the inclined section 52. The horizontal section 53 is directly connected to the negative electrode plate 4. By setting the vertical section 51, the inclined section 52, and the horizontal section 53, the resistance is increased on the one hand, and right angles are avoided on the other hand, reducing the excessive current change caused by the large resistance change at the right angle.

[0041] In the description of this utility model, it should be noted that the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. These terms are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0042] The above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, the present utility model is not limited to the specific embodiments described above. Therefore, any modifications or equivalent substitutions to the present utility model, and all technical solutions and improvements that do not depart from the spirit and scope of the utility model, are covered within the scope of the claims of the present utility model.

Claims

1. A small high impedance TSS device characterized by: Including product grains (1); A frame electrode sheet (2) is disposed on the product grain (1); A positive electrode sheet (3) is disposed at the top of the frame electrode sheet (2); The negative electrode sheet (4) is disposed at the bottom end of the product grain (1); An impedance section (5) is provided between the positive electrode plate (3) and the negative electrode plate (4); The impedance section (5) includes an impedance body with one end connected to the positive electrode plate (3) and the other end connected to the negative electrode plate (4). The impedance body is used to increase the resistance between the positive electrode plate (3) and the negative electrode plate (4). The impedance body is a single-segment straight line. The ends of the positive electrode plate (3) and the negative electrode plate are both provided with chamfers (31). One end of the impedance body is connected to the chamfer (31) of the positive electrode plate (3), and the other end is connected to the chamfer (31) of the negative electrode plate (4). The packaging section (6) encapsulates the product die (1), frame electrode sheet (2), positive electrode sheet (3), negative electrode sheet (4) and impedance section (5).

2. The small high-impedance TSS device as described in claim 1, characterized in that: The encapsulation part (6) is a component made of epoxy resin black glue.

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