Multi-frequency MEMS ultrasonic endoscopic probe
By designing a shared pad and ground structure for array elements in a MEMS ultrasonic endoscope probe, synchronous excitation and signal merging of multi-frequency probes were achieved, solving the problem of non-real-time synchronization of imaging in existing technologies and improving the accuracy and real-time performance of imaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU XISHENG TECH CO LTD
- Filing Date
- 2025-01-15
- Publication Date
- 2026-04-21
AI Technical Summary
Existing MEMS ultrasound endoscope probes require rotating at different angles to image the same target when achieving low-frequency and high-frequency imaging, resulting in position drift and non-real-time synchronization of imaging, thus failing to achieve high-precision ultrasound endoscope imaging.
A multi-frequency MEMS ultrasonic endoscope probe is adopted, with array elements distributed on the same side of the substrate. Array elements of the same frequency share a common pad and a common negative ground. After receiving the ultrasonic echo, the array elements transmit the signal to the host through a coaxial cable and a slip ring for signal processing, thereby achieving synchronous excitation and signal merging.
It enables the synchronous reception of ultrasound signals of different frequencies for the same target, improves the real-time performance and synchronization of imaging, reduces the number of catheter uses, and enhances the accuracy of imaging.
Smart Images
Figure CN224140843U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of medicated dressing technology, specifically relating to a multi-frequency MEMS ultrasonic endoscope probe. Background Technology
[0002] MEMS (Micro-Electro-Mechanical Systems) ultrasound endoscopes are advanced devices that apply microelectromechanical technology to the field of medical ultrasound endoscopy. Based on the principle of ultrasound imaging, they integrate miniature ultrasound transducers and other key components within the probe. The transducers convert electrical energy into ultrasonic mechanical energy to emit ultrasound waves. As these waves propagate within the body, they are reflected and scattered at different tissue interfaces. The reflected ultrasound signals are then received by the transducers and converted back into electrical signals. After further processing and analysis, corresponding ultrasound images are formed, helping doctors observe the condition of internal tissues. In short, MEMS technology allows ultrasound transducers to be made extremely small, resulting in a compact probe size that can easily pass through natural body cavities (such as the esophagus, gastrointestinal tract, and blood vessels) for examination, reducing invasiveness and discomfort. Furthermore, multiple functional components, such as transducer arrays, signal transmission lines, and drive circuits (some of which may be externally integrated), can be integrated within a small space to achieve complex and precise ultrasound signal transmission and reception functions.
[0003] However, current probes using dual-frequency or multi-frequency ultrasound transducers, while capable of simultaneously achieving low-frequency and high-frequency ultrasound imaging, have transducers that are distributed back-to-back or around the catheter. This means they do not simultaneously image the same target at the same location. Instead, they require rotation at different angles to achieve sequential imaging of blood vessels or the digestive tract. As the ultrasound endoscope catheter rotates at high speed, the probe's position at the center of the catheter and the catheter's position relative to the target will drift, resulting in non-real-time synchronous imaging of the same target. Therefore, deviations in catheter movement or tissue displacement prevent the achievement of highly accurate ultrasound endoscope imaging. Utility Model Content
[0004] The technical problem to be solved by this invention is to overcome the shortcomings of the existing technology and provide a brand-new multi-frequency MEMS ultrasonic endoscope probe.
[0005] To solve the above technical problems, the present invention adopts the following technical solution:
[0006] A multi-frequency MEMS ultrasonic endoscope includes a substrate, pads, and array elements, wherein the array elements have at least two different operating frequencies, and each array element is distributed on the same side of the substrate; each array element is a piezoelectric micromechanical ultrasonic transducer or a capacitive micromechanical ultrasonic transducer.
[0007] Preferably, there are multiple pads, and the positive terminals of array elements with the same operating frequency are connected to the same pad. Since array elements with the same frequency are excited simultaneously, it is sufficient to connect their positive terminals to the same pad.
[0008] According to a specific embodiment and preferred aspect of this utility model, the pads are arranged side by side at one end of the substrate and on the same side of the array elements, and the array elements are distributed in an array towards the other end of the substrate with the pads as a reference. To facilitate the alignment of the end of the endoscopic probe, generally inside the endoscopic catheter, the pads are connected to the host via a coaxial cable inside the catheter, that is, the corresponding array element distribution area corresponds to the interventional end of the endoscopic catheter.
[0009] Preferably, the negative terminals of all array elements share a common ground. This facilitates the formation of the array elements; that is, the array element structure designed using CMOS technology in this application is a cavity thin-film vibration structure.
[0010] In some specific implementations, the operating frequency of the array elements is 10–80 MHz. In short, the array elements can be freely combined in terms of high and low frequencies, for example, using 10 MHz for low frequencies and 20 MHz for high frequencies, or even higher frequencies such as 30 MHz and 50 MHz.
[0011] According to another specific embodiment and preferred aspect of this utility model, the thin film in the piezoelectric micromachined ultrasonic transducer is made of a material with piezoelectric properties, such as aluminum nitride, scandium-doped aluminum nitride, or piezoelectric ceramic; the thin film in the capacitive micromachined ultrasonic transducer is made of silicon or a polymer; or the capacitive micromachined ultrasonic transducer further includes a bias circuit to form a working bias voltage. The array element structure of the piezoelectric micromachined ultrasonic transducer is PMUT (Piezoelectric Micromachined Ultrasonic Transducer); the array element structure of the capacitive micromachined ultrasonic transducer is CMUT (Capacitive Micromachined Ultrasonic Transducers).
[0012] Preferably, the diameter of the thin film in each element is 1 to 100 μm, and the thickness of the cavity is between 0.1 mm and 1 mm.
[0013] In some specific implementations, the shape of each array element is circular or polygonal.
[0014] In addition, the array elements have two operating frequencies and are divided into two groups. Each group includes array element rows that are arranged side by side and spaced apart. The array element rows of the two groups are staggered and spaced apart.
[0015] Alternatively, the array elements can operate at three different frequencies, with each array element consisting of three different frequencies. Multiple array elements are arranged in horizontal rows and vertical columns on the same side of the base.
[0016] Due to the implementation of the above technical solution, this utility model has the following advantages compared with the prior art:
[0017] Existing dual-frequency or multi-frequency ultrasound transducers in endoscopic probes can simultaneously achieve low-frequency and high-frequency ultrasound imaging. However, the transducers are distributed back-to-back or around the catheter, and do not simultaneously image the same target at the same location. Instead, different rotation angles are required to achieve sequential imaging of blood vessels or the digestive tract. Due to the high-speed rotation of the ultrasound endoscopic catheter, the probe's position at the catheter center and the catheter's position relative to the target will experience some positional drift, resulting in non-real-time synchronous imaging of the same target. Therefore, deviations in catheter movement or tissue displacement prevent high-precision ultrasound endoscopic imaging. This invention cleverly solves the various shortcomings of existing structures by comprehensively designing the overall structure of a multi-frequency MEMS ultrasound endoscopic probe. Using this endoscopic probe, all transducers in the multi-frequency probe can be synchronously excited. The probe consists of array elements, each receiving its own ultrasonic echo. Since elements of the same frequency are connected in parallel, only one signal echo is ultimately formed. The ultrasonic echo signals of each frequency are then transmitted to the handle via cables and slip rings, and transferred to the system host for signal processing via a TR switch, before finally being displayed on the screen. Therefore, this invention can simultaneously and synchronously receive ultrasonic signals of different frequencies from the same target, effectively overcoming the time difference caused by different target positions in existing dual-frequency or multi-frequency solutions, which may be due to catheter or transducer offset. Furthermore, by utilizing the miniaturization of MEMS ultrasonic transducers and the advantages of sub-array elements, it not only reduces the number of times different frequency endoscopic catheters are used, but also improves the real-time performance, synchronization, and accuracy of imaging. In other words, the practical value it brings is very significant. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of the multi-frequency MEMS ultrasonic endoscope probe in Example 1;
[0019] Figure 2 for Figure 1 Schematic diagram of the central array element structure (CMUT);
[0020] Figure 3 for Figure 1 Schematic diagram of the central array element structure (PMUT);
[0021] Figure 4 This is a schematic diagram of the structure of the multi-frequency MEMS ultrasonic endoscope probe in Example 2;
[0022] Among them: 1. Matrix;
[0023] 2. Solder pads;
[0024] 3. Array element; 30. Individual array element;
[0025] G, High-frequency group; D, Low-frequency group; g, High-operating-frequency array element; z, Medium-operating-frequency array element; d, Low-operating-frequency array element. Detailed Implementation
[0026] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. Many specific details are set forth in the following description to provide a full understanding of the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed below.
[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0030] In utility models, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0031] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0032] Example 1
[0033] like Figure 1 As shown, the multi-frequency MEMS ultrasonic endoscope probe of this embodiment includes a substrate 1, a pad 2, and array elements 3. The array elements 3 have at least two different operating frequencies, and each array element 3 is distributed on the same side of the substrate 1. Each array element 3 is a piezoelectric micromechanical ultrasonic transducer or a capacitive micromechanical ultrasonic transducer.
[0034] Specifically, the operating frequency of array element 3 is 10-80MHz. In this example, array element 3 has two operating frequencies, and is distributed with high and low frequencies. The low frequency is 10MHz and the high frequency is 50MHz.
[0035] Pad 2 is located side by side at one end of the substrate 1 and on the same side as the array element 3. The array element 3 is distributed in an array towards the other end of the substrate 1 with the pad 2 as the reference. In order to facilitate the docking setting of the end of the endoscope probe, generally inside the endoscope tube, the pad is connected to the host through the coaxial cable inside the tube, that is, the corresponding array element distribution area corresponds to the intervention end of the endoscope tube.
[0036] There are three pads 2, and the positive terminals of array elements 3 operating at the same frequency are connected to the same pad 2. Since array elements at the same frequency are excited simultaneously, it is sufficient to connect their positive terminals to the same pad. The negative terminals of all array elements 3 share a common ground. This facilitates the formation of the array elements; that is, the array element structure designed using CMOS technology in this application is a cavity thin-film vibration structure.
[0037] Combination Figure 2As shown, the array element structure of the capacitive micromachined ultrasonic transducer is CMUT (Capacitive Micromachined Ultrasonic Transducers). The thin film in the capacitive micromachined ultrasonic transducer is made of silicon or a polymer. The capacitive micromachined ultrasonic transducer also has a bias circuit to form the working bias voltage. This structure is a conventional design in the field and will not be described in detail here.
[0038] Combination Figure 3 As shown, the array element structure of the piezoelectric micromachined ultrasonic transducer is PMUT (Piezoelectric Micromachined Ultrasonic Transducer). The thin film in the piezoelectric micromachined ultrasonic transducer is made of a material with piezoelectric properties, such as aluminum nitride (ALN), scandium-doped aluminum nitride (ALscN), or piezoelectric ceramic (PZT). This structure is a conventional design in this field and will not be described in detail here (generally, L is 5 to 6 times t, so that the film layer vibrates).
[0039] The diameter of the thin film in each element 3 is 1–100 μm, and the thickness of the cavity is between 0.1 mm and 1 mm. Each element 3 is circular in shape.
[0040] Specifically, the two operating frequencies are divided into a high-frequency group G and a low-frequency group D. The high-frequency group G includes multiple array elements arranged at intervals, and the low-frequency group D includes multiple array elements arranged at intervals. The array elements of the high-frequency group G and the low-frequency group D are arranged in a staggered and spaced manner.
[0041] Example 2
[0042] like Figure 4 As shown, the multi-frequency MEMS ultrasonic endoscope probe of this embodiment has a structure that is basically the same as that of Embodiment 1, except for the layout of the array element 3.
[0043] In this application, the array element 3 has three operating frequencies, and every three array elements with different operating frequencies (high, medium, and low) constitute an array element unit 30 (high operating frequency array element unit g, medium operating frequency array element unit z, and low operating frequency array element unit d). Multiple array element units 30 are arranged horizontally in rows and vertically in columns on the same side of the base 1. At the same time, there are four pads 2 in this example.
[0044] In summary, by using this endoscopic probe, all array elements in the multi-frequency probe can be excited synchronously. Each array element receives its own ultrasonic echo. Since array elements of the same frequency are connected in parallel, only one signal echo is ultimately formed. Then, the ultrasonic echo signals of each frequency are transmitted to the handle via cables and slip rings, and are transferred to the system host for signal processing via the TR switch, and finally displayed on the screen. Therefore, this invention can simultaneously and synchronously receive ultrasonic signals of different frequencies from the same target, effectively overcoming the differences caused by different target positions and time differences in existing dual-frequency or multi-frequency solutions, which may be due to catheter or transducer offset. On the other hand, by utilizing the miniaturization and sub-array advantages of MEMS ultrasonic transducers, it can not only reduce the number of times endoscopic catheters of different frequencies are used, but also improve the real-time performance, synchronization, and accuracy of imaging. In other words, the practical value it brings is very significant.
[0045] The present utility model has been described in detail above, with the aim of enabling those skilled in the art to understand its contents and implement it. However, this description should not be construed as limiting the scope of protection of the present utility model. All equivalent changes or modifications made in accordance with the spirit and essence of the present utility model should be included within the scope of protection of the present utility model.
Claims
1. A multi-frequency MEMS ultrasonic endoscopic probe comprising a substrate, a pad, an array element, characterized in that, The array elements have at least two different operating frequencies, and each array element is distributed on the same side of the substrate; each array element is a piezoelectric micromechanical ultrasonic transducer or a capacitive micromechanical ultrasonic transducer.
2. The multi-frequency MEMS ultrasonic endoscopic probe of claim 1, wherein: There are multiple pads, and the positive terminals of the array elements with the same operating frequency are connected to the same pad.
3. The multi-frequency MEMS ultrasonic endoscopic probe of claim 2, wherein: The pads are located side by side at one end of the substrate and on the same side as the array elements, and the array elements are distributed in an array towards the other end of the substrate with the pads as a reference.
4. The multi-frequency MEMS ultrasonic endoscopic probe of claim 3, wherein: The negative poles of all the array elements are grounded.
5. The multi-frequency MEMS ultrasonic endoscopic probe of claim 1, wherein: The array element operates at a frequency of 10–80 MHz.
6. The multi-frequency MEMS ultrasonic endoscopic probe of claim 1, wherein: The thin film in the piezoelectric micromechanical ultrasonic transducer is made of a material with piezoelectric properties, such as aluminum nitride, scandium-doped aluminum nitride, or piezoelectric ceramics; the thin film in the capacitive micromechanical ultrasonic transducer is made of silicon or a polymer; or the capacitive micromechanical ultrasonic transducer also has a bias circuit to form a working bias voltage.
7. The multi-frequency MEMS ultrasonic endoscopic probe of claim 6, wherein: The diameter of the thin film in each of the array elements is 1 to 100 μm, and the thickness of the cavity is between 0.1 mm and 1 mm.
8. The multi-frequency MEMS ultrasonic endoscopic probe of claim 1, wherein: Each of the array elements is circular or polygonal in shape.
9. The multi-frequency MEMS ultrasonic endoscopic probe of any one of claims 1 to 8, wherein: The array elements have two operating frequencies and are divided into two groups. Each group includes array element rows that are arranged side by side and spaced apart. The array element rows in the two groups are staggered and spaced apart.
10. The multi-frequency MEMS ultrasonic endoscopic probe of any one of claims 1 to 8, wherein: The array elements have three operating frequencies, and every three array elements with different operating frequencies constitute an array element unit. Multiple array element units are arranged horizontally in rows and vertically in intervals on the same side of the base.