MOPA laser processing subsystem
By integrating the laser head, beam expander assembly, and field lens assembly into a housing, and combining them with an optical path adjustment and heat dissipation system, the complex adjustment and high maintenance costs of the MOPA laser processing system are solved, achieving the effect of simplified adjustment and reduced maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUHAN HUARUI ULTRAFAST FIBER LASER TECH CO LTD
- Filing Date
- 2025-04-18
- Publication Date
- 2026-04-21
AI Technical Summary
Existing MOPA laser processing systems suffer from complex optical path adjustments and high maintenance costs.
The laser head, beam expander assembly, and field lens assembly are integrated into the housing. The laser beam expansion and focusing are achieved through the optical path adjustment device. The heat dissipation components and water cooling system are integrated into the housing to avoid exposing optical components, simplifying adjustment and reducing maintenance costs.
It simplifies the laser processing setup process, reduces maintenance costs, and improves the stability and applicability of laser processing, making it suitable for the processing needs of different products.
Smart Images
Figure CN224143728U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser processing equipment technology, and in particular to a MOPA laser processing subsystem. Background Technology
[0002] For MOPA laser applications, since the laser emitted by a single MOPA laser cannot be directly used for laser processing, multiple external optical path devices are required to complete the beam expansion and focusing functions of the laser to achieve precision cutting, drilling, marking and other processes. This process requires complex coordination and adjustment of each optical path device, and since the optical path devices are exposed, the subsequent maintenance cost of each optical path device is high. Utility Model Content
[0003] The main purpose of this invention is to propose an MOPA laser processing subsystem, which aims to solve the problems of existing laser processing systems requiring complex adjustments and incurring high subsequent maintenance costs.
[0004] To achieve the above objectives, this utility model proposes a MOPA laser processing subsystem, comprising a housing, a laser head, and an optical path adjustment device. The laser head and the optical path adjustment device are both disposed within the housing. A laser emission port is provided on the housing. The optical path adjustment device and the laser emission port are both located on the optical path of the laser emitted from the laser head. The optical path adjustment device includes a beam expander assembly and a field lens assembly. The beam expander assembly is disposed on the optical path between the laser head and the field lens assembly.
[0005] According to some embodiments of the present invention, the optical path adjustment device further includes a focus adjustment component for adjusting the position of the emitted laser focus in the z-direction, the focus adjustment component being disposed in the optical path between the beam expander component and the field lens component.
[0006] According to some embodiments of the present invention, the focus adjustment assembly includes a convex lens and a concave lens, wherein the convex lens is movable relative to the concave lens in the z-direction.
[0007] According to some embodiments of the present invention, the concave lens is fixed on the housing, and the convex lens is connected to the motor via a ball screw drive and is moved in the z-direction by the motor drive.
[0008] According to some embodiments of this utility model, the motor is a brake motor.
[0009] According to some embodiments of the present invention, the optical path adjustment device further includes a reflector assembly, which is disposed in the optical path between the beam expander assembly and the field lens assembly, and the reflector assembly includes a plurality of reflectors.
[0010] According to some embodiments of the present invention, the optical path adjustment device further includes a galvanometer assembly, which is disposed on the optical path between the reflector assembly and the field mirror assembly.
[0011] According to some embodiments of the present invention, the field lens assembly is configured to block the laser emission port.
[0012] According to some embodiments of the present invention, a heat dissipation component is also provided inside the housing, the heat dissipation component includes a heat-conducting plate, and the laser head is disposed on the heat-conducting plate.
[0013] According to some embodiments of the present invention, the heat dissipation component further includes a water-cooled pipe that can be connected to an external water source, and the water-cooled pipe is disposed between the heat-conducting plate and the housing.
[0014] This utility model has at least the following beneficial effects:
[0015] In this invention, the laser emitted from the laser head is first expanded by a beam expander assembly to reduce its energy density. Then, the field lens assembly focuses the laser to increase its energy density. Because the divergence angle can be compressed during beam expansion to reduce the focused spot, the energy density of the focused laser is significantly improved. This high-energy-density laser can then be used for laser processing of products. This invention integrates the laser head, the beam expander assembly, and the field lens assembly into a housing. Operators can directly move the MOPA laser processing subsystem above the product to be processed for laser processing without complex adjustments. Furthermore, the housing protects the beam expander assembly and the field lens assembly, preventing damage to the optical components and reducing subsequent maintenance costs. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the structure of a MOPA laser processing subsystem provided in an embodiment of the present invention.
[0018] Explanation of reference numerals in the attached figures:
[0019] 100-MOPA Laser Processing Subsystem; 1-House; 11-Laser Emission Port; 2-Laser Head; 3-Optical Path Adjustment Device; 31-Beam Expander Assembly; 32-Field Lens Assembly; 33-Focus Adjustment Assembly; 331-Convex Lens; 332-Concave Lens; 333-Motor; 334-Ball Screw; 34-Reflector Assembly; 341-Reflector; 35-Galvanometer Assembly; 4-Heat Dissipation Assembly; 41-Heat Conducting Plate; 5-Handle. Detailed Implementation
[0020] The technical solutions in the embodiments of this utility model are described clearly and completely below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0021] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0022] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0023] This invention provides an MOPA laser processing subsystem. Figure 1 This invention provides a specific embodiment of a MOPA laser processing subsystem.
[0024] like Figure 1As shown, this utility model embodiment provides a MOPA laser processing subsystem 100, including a housing 1, a laser head 2, and an optical path adjustment device 3. The laser head 2 and the optical path adjustment device 3 are both disposed within the housing 1. The housing 1 has a laser emission port 11. The optical path adjustment device 3 and the laser emission port 11 are both located on the optical path of the laser emitted from the laser head 2. The optical path adjustment device 3 includes a beam expander assembly 31 and a field lens assembly 32. The beam expander assembly 31 is disposed on the optical path between the laser head 2 and the field lens assembly 32.
[0025] In this invention, the laser emitted from the laser head 2 is first expanded by the beam expander assembly 31 to reduce the laser's energy density. Then, the field lens assembly 32 focuses the laser to increase its energy density. Because the divergence angle can be compressed during beam expansion to reduce the focused spot, the energy density of the focused laser is significantly improved. At this point, the high-energy-density laser can be used for laser processing of products. This invention integrates the laser head 2, the beam expander assembly 31, and the field lens assembly 32 into the housing 1. Operators can directly move the MOPA laser processing subsystem 100 above the product to be processed for laser processing without complex adjustments. At the same time, the housing 1 protects the beam expander assembly 31 and the field lens assembly 32, preventing damage to the optical components and reducing subsequent maintenance costs.
[0026] It should be noted that, as Figure 1 As shown, the housing 1 is connected to a plurality of handles 5, which can be held by the operator to move the MOPA laser processing subsystem 100.
[0027] Furthermore, in some embodiments, such as Figure 1 As shown, the field lens assembly 32 is configured to seal the laser emission port 11. This achieves a sealing effect on the housing 1, preventing dust from entering the housing 1 and affecting the laser output.
[0028] Specifically, the beam expander assembly 31 includes a convex mirror and a concave mirror. By adjusting the distance between the convex mirror and the concave mirror, the size of the laser spot can be changed to adapt to the processing requirements of different products.
[0029] Because the height of the processing location varies between different products, and if the surface to be processed is curved, the height of different processing locations will also differ. Therefore, it is necessary to adjust the focal position of the emitted laser. In some embodiments, such as... Figure 1As shown, the optical path adjustment device 3 further includes a focus adjustment component 33 for adjusting the position of the emitted laser focus in the z-direction. The focus adjustment component 33 is disposed in the optical path between the beam expander component 31 and the field lens component 32. Since the MOPA laser processing subsystem 100 is placed directly above the product to be processed, and the laser emission port 11 is oriented downwards, the focus adjustment component 33 adjusts the position of the laser focus in the z-direction, enabling the MOPA laser processing subsystem 100 to adapt to products with curved surfaces, thus improving the applicability of the MOPA laser processing subsystem 100.
[0030] The specific structure of the focus adjustment component 33 is not limited, as long as it ensures that the focus adjustment component 33 can adjust the position of the laser focus in the z-direction. For example, in some embodiments, such as... Figure 1 As shown, the focus adjustment component 33 includes a convex lens 331 and a concave lens 332, with the convex lens 331 movable relative to the concave lens 332 in the z-direction. With this configuration, the position of the laser focus in the z-direction can be adjusted by regulating the distance between the convex lens 331 and the concave lens 332. The specific optical principle is prior art and will not be described further.
[0031] Furthermore, in some embodiments, such as Figure 1 As shown, the concave lens 332 is fixed to the housing 1, and the convex lens 331 is driven to move in the z-direction by the motor 333 via a ball screw 334. In this configuration, the output shaft of the motor 333 is connected to the ball screw 334, converting rotation into translation to drive the convex lens 331 to move in the z-direction.
[0032] Specifically, the motor 333 is a brake motor 333. When the power is off or the motor is stationary, the brake motor 333 locks the output shaft of the motor 333 by electromagnetic braking to prevent Z-axis displacement caused by mechanical vibration, external interference or gravity. The brake function provides rigid locking and ensures the long-term stability of the laser processing process.
[0033] In order for the laser emitted by the laser head 2 to be output from the laser emission port 11 of the housing 1, the laser head 2 must be positioned above the laser emission port 11. This restricts the installation position of the laser head 2. Therefore, in some embodiments, such as Figure 1As shown, the optical path adjustment device 3 further includes a reflector assembly 34, which is disposed in the optical path between the beam expander assembly 31 and the field lens assembly 32. The reflector assembly 34 includes multiple reflectors 341. With this configuration, the laser head 2 can be installed inside the housing 1 according to the distribution of components within the housing 1. The optical path of the emitted laser is altered by the reflectors 341 within the reflector assembly 34 to ensure that the laser is output from the laser emission port 11. Simultaneously, the reflector assembly 34's placement in the optical path between the beam expander assembly 31 and the field lens assembly 32 allows the laser to be expanded first to reduce its energy density before being reflected by the reflectors 341, preventing the reflectors 341 from directly contacting the high-energy beam and causing coating ablation or thermal deformation.
[0034] To adapt to the processing shape requirements of different products, it is necessary to adjust the horizontal position of the laser focus. Therefore, in some embodiments, such as Figure 1 As shown, the optical path adjustment device 3 further includes a galvanometer assembly 35, which is disposed in the optical path between the reflector assembly 34 and the field lens assembly 32. The galvanometer assembly 35 is an optical device known to those skilled in the art. It includes a reflector and a drive unit that adjusts the angle of the reflector. By adjusting the angle of the reflector through the drive unit, the laser output angle after reflection by the reflector can be adjusted, thereby adjusting the position of the laser focal point in the horizontal direction.
[0035] Because the housing 1 integrates the main board of other control circuits and the laser head 2, these components generate a significant amount of heat. To avoid heat buildup affecting the laser output effect, in some embodiments, such as... Figure 1 As shown, the MOPA laser processing subsystem 100 also includes a heat dissipation component 4 disposed within the housing 1. The heat dissipation component 4 includes a heat-conducting plate 41, and the laser head 2 is disposed on the heat-conducting plate 41. The main board of the control circuit within the housing 1 is also disposed on the heat-conducting plate 41. With this arrangement, the heat-conducting plate 41 can dissipate the heat from each heat-generating component, preventing heat accumulation from affecting the laser output effect.
[0036] Heat is dissipated solely through the heat-conducting plate 41. After prolonged use, as the temperature of the heat-conducting plate 41 rises, its thermal conductivity decreases. Therefore, in some embodiments, such as... Figure 1 As shown, the heat dissipation assembly 4 also includes a water-cooled pipe that can be connected to an external water source, and the water-cooled pipe is located between the heat-conducting plate 41 and the housing 1. This arrangement allows heat to be transferred out of the housing 1 through the water-cooled pipe, ensuring the thermal conductivity of the heat-conducting plate 41.
[0037] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A MOPA laser machining subsystem, characterized by, The device includes a housing, a laser head, and an optical path adjustment device. The laser head and the optical path adjustment device are both located inside the housing. The housing has a laser emission port. The optical path adjustment device and the laser emission port are both located on the optical path of the laser emitted by the laser head. The optical path adjustment device includes a beam expander assembly and a field lens assembly. The beam expander assembly is located on the optical path between the laser head and the field lens assembly.
2. The MOPA laser processing subsystem of claim 1, wherein, The optical path adjustment device further includes a focus adjustment component for adjusting the position of the emitted laser focus in the z-direction, the focus adjustment component being disposed in the optical path between the beam expander component and the field lens component.
3. The MOPA laser processing subsystem of claim 2, wherein, The focus adjustment assembly includes a convex lens and a concave lens, wherein the convex lens is movable relative to the concave lens in the z-direction.
4. The MOPA laser processing subsystem of claim 3, wherein, The concave lens is fixed to the housing, and the convex lens is connected to the motor via a ball screw drive and is moved in the z-direction by the motor.
5. The MOPA laser processing subsystem of claim 4, wherein, The motor is a brake motor.
6. The MOPA laser processing subsystem of claim 1, wherein, The optical path adjustment device further includes a reflector assembly, which is disposed in the optical path between the beam expander assembly and the field lens assembly, and the reflector assembly includes multiple reflectors.
7. The MOPA laser processing subsystem of claim 6, wherein, The optical path adjustment device further includes a galvanometer assembly, which is disposed on the optical path between the reflector assembly and the field mirror assembly.
8. The MOPA laser processing subsystem of claim 1, wherein, The field lens assembly is configured to block the laser emission port.
9. The MOPA laser processing subsystem of claim 1, wherein, It also includes a heat dissipation assembly disposed within the housing, the heat dissipation assembly including a heat-conducting plate, and the laser head disposed on the heat-conducting plate.
10. The MOPA laser processing subsystem of claim 9, wherein, The heat dissipation assembly also includes a water-cooled pipe that can be connected to an external water source, and the water-cooled pipe is located between the heat-conducting plate and the housing.