IGBT (Insulated Gate Bipolar Translator) substrate forming die

Abstract

The utility model relates to the technical field of IGBT substrate forming dies, in particular to an IGBT substrate forming die which comprises an IGBT substrate, positioning through holes are formed in corners of the IGBT substrate, tangent planes are formed in the tops of the corners, the IGBT substrate forming die further comprises a lower die used for producing the IGBT substrate, an IGBT substrate placing area is arranged in the middle of the lower die, and the IGBT substrate placing area is used for placing the IGBT substrate. Sliding positioning mechanisms are arranged at four corners of the IGBT substrate placement area; the utility model discloses an IGBT (Insulated Gate Bipolar Translator) substrate forming die which comprises a forming die body, a sliding positioning mechanism is arranged on the forming die body, the sliding positioning mechanism comprises a sliding block, one end of the sliding block, which is close to an IGBT substrate placing area, is provided with a positioning groove, and the positioning groove is attached to the side edge of a corner of an IGBT substrate, the sliding positioning mechanism is used for adding a fastening mechanism on the periphery of the forming die body, so that the four corners of the IGBT substrate can be fastened during stamping, and the IGBT substrate is prevented from being damaged. Namely, the positioning grooves are attached to the side edges of the corners of the IGBT substrate, so that the IGBT substrate does not expand and protrude outwards.

Description

Technical Field

[0001] This utility model relates to the field of IGBT substrate molding mold technology, specifically an IGBT substrate molding mold. Background Technology

[0002] In the attached diagram of the instruction manual Figure 3 and Figure 4 This is a schematic diagram of an IGBT substrate. The IGBT substrate has four holes at its four corners, an angled solid part on the outside of the holes, and a ring-shaped solid part. The hole in the middle is punched out by a molding die.

[0003] During normal stamping, because these four holes are very close to the edge, the edge of the IGBT substrate can easily expand and bulge outward during stamping, resulting in quality problems.

[0004] Therefore, we invented an IGBT substrate molding mold. Utility Model Content

[0005] The purpose of this invention is to provide an IGBT substrate molding die to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An IGBT substrate forming mold includes an IGBT substrate, wherein positioning through holes are provided at the corners of the IGBT substrate and a cut surface is provided at the top of the corners; and a lower mold for producing the IGBT substrate is provided, wherein the middle of the lower mold is provided as an IGBT substrate placement area and sliding positioning mechanisms are provided at the four corners of the IGBT substrate placement area.

[0008] The sliding positioning mechanism includes a sliding block, and one end of the sliding block near the IGBT substrate placement area is configured as a positioning groove, which fits the corner or side of the IGBT substrate.

[0009] A spring is installed at the bottom of the sliding block to reset the sliding block;

[0010] The top of the sliding block has a guide slope that engages with the upper mold and moves the sliding block.

[0011] In a preferred embodiment of this utility model, positioning block one, positioning block two, and positioning block three are fixedly installed on the lower mold, and positioning block one, positioning block two, and positioning block three are located at the edge of the IGBT substrate placement area.

[0012] In a preferred embodiment of this utility model, the IGBT substrate placement area is provided with a stamped through hole corresponding to the positioning through hole of the IGBT substrate.

[0013] In a preferred embodiment of this utility model, guide positioning grooves are provided at both ends of the sliding block, and positioning block four is slidably connected to the inner wall of the guide positioning groove. Positioning block four is fixedly installed on the lower mold. Positioning block five is provided at the end of the sliding block away from the IGBT substrate placement area. Positioning block five is fixedly installed on the lower mold.

[0014] In a preferred embodiment of this utility model, a spring groove is provided at the bottom of the sliding block, a spring is provided inside the spring groove, the left end of the spring is connected to a positioning block six, the positioning block six is ​​fixedly installed on the lower mold, and the right end of the spring contacts the side wall of the spring groove.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

[0016] The lower mold has an IGBT substrate placement area in the middle, and sliding positioning mechanisms are set at the four corners of the IGBT substrate placement area. The sliding positioning mechanism includes a sliding block, and the end of the sliding block near the IGBT substrate placement area is set as a positioning groove. The positioning groove fits the edge and side of the IGBT substrate. The function of the sliding positioning mechanism is to add a fastening mechanism around the forming mold, so that the four corners of the IGBT substrate can be fastened during stamping. That is, the positioning groove fits the edge and side of the IGBT substrate, so that the IGBT substrate will not expand and bulge outward. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of the structure in an IGBT substrate molding die;

[0019] Figure 2 In an IGBT substrate molding die Figure 1 Enlarged view of region A in the middle;

[0020] Figure 3 This is a schematic diagram of the IGBT substrate structure in an IGBT substrate molding die;

[0021] Figure 4 This is a schematic diagram of the cross-sectional structure of an IGBT substrate in an IGBT substrate molding die;

[0022] Figure 5 This is a schematic diagram of the sliding positioning mechanism and spring connection in an IGBT substrate molding die.

[0023] In the figure: IGBT substrate 100, positioning through hole 110, corner 120, cut surface 130, lower mold 200, IGBT substrate placement area 210, positioning block one 220, positioning block two 230, positioning block three 240, stamping through hole 250, sliding positioning mechanism 300, sliding block 310, guide positioning groove 311, positioning groove 312, spring groove 313, guide inclined surface 314, positioning block four 320, positioning block five 330, positioning block six 400, spring 410. Detailed Implementation

[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0025] Please refer to Figure 1-5 An IGBT substrate forming mold includes an IGBT substrate 100. A positioning through hole 110 is provided at the corner 120 of the IGBT substrate 100, and a cut surface 130 is provided at the top of the corner 120. The corner 120, the positioning through hole 110 and the cut surface 130 are structures on the IGBT substrate 100.

[0026] It also includes a lower mold 200 for producing IGBT substrate 100, wherein the lower mold 200 is configured with an IGBT substrate placement area 210 in the middle, and sliding positioning mechanisms 300 are provided at the four corners of the IGBT substrate placement area 210.

[0027] The sliding positioning mechanism 300 includes a sliding block 310. One end of the sliding block 310 near the IGBT substrate placement area 210 is configured as a positioning groove 312. The positioning groove 312 fits against the side edge 120 of the IGBT substrate 100. The function of the sliding positioning mechanism 300 is to add a fastening mechanism around the forming mold so that the four corners of the IGBT substrate can be fastened during stamping. That is, the positioning groove 312 fits against the side edge 120 of the IGBT substrate 100 so that the IGBT substrate will not expand outward and bulge.

[0028] The bottom of the sliding block 310 is equipped with a spring 410 for resetting the sliding block 310;

[0029] The top of the sliding block 310 is provided with a guide slope 314 that engages with the upper mold and moves the sliding block 310.

[0030] Positioning blocks 1 220, 230, and 3 240 are fixedly installed on the lower mold 200. Positioning blocks 1 220, 230, and 3 240 are located at the edge of the IGBT substrate placement area 210. The IGBT substrate 100 is placed in the IGBT substrate placement area 210, and the edge of the IGBT substrate 100 is in contact with the edge of positioning blocks 1 220, 230, and 3 240. Positioning blocks 1 220, 230, and 3 240 have a positioning function for the IGBT substrate 100.

[0031] The IGBT substrate placement area 210 has a stamped through hole 250 corresponding to the positioning through hole 110 of the IGBT substrate 100.

[0032] The sliding block 310 has guide positioning grooves 311 at both ends. The inner wall of the guide positioning groove 311 is slidably connected to the positioning block 320. The positioning block 320 is fixedly installed on the lower mold 200. The end of the sliding block 310 away from the IGBT substrate placement area 210 is provided with a positioning block 330. The positioning block 330 is fixedly installed on the lower mold 200. The positioning block 320 cooperates with the guide positioning groove 311 to guide the sliding block 310 to move. The sliding block 310 rebounds under the force of the spring 410. The positioning block 330 abuts against the tail of the sliding block 310. The positioning blocks 320 and 330 have a positioning function for the sliding block 310.

[0033] The bottom of the sliding block 310 is provided with a spring groove 313, and a spring 410 is provided inside the spring groove 313. The left end of the spring 410 is connected to the positioning block 400, which is fixedly installed on the lower mold 200. The right end of the spring 410 contacts the side wall of the spring groove 313. When the upper mold and the lower mold 200 are closed, the guide block of the upper mold abuts against the guide slope 314 of the sliding block 310 and pushes the sliding block 310 to move towards the IGBT substrate placement area 210. During the movement, the spring 410 is compressed. When the upper mold is separated, the sliding block 310 rebounds and resets under the force of the spring 410.

[0034] The working principle of this utility model is as follows: An IGBT substrate 100 is placed within the IGBT substrate placement area 210, with the edges of the IGBT substrate 100 abutting the edges of positioning blocks 1 220, 230, and 3 240. Positioning through holes 110 correspond to punched through holes 250. When the upper and lower molds 200 are closed, the guide block of the upper mold abuts against the guide slope 314 of the sliding block 310, pushing the sliding block 310 towards the IGBT substrate placement area 210. During the movement, the spring 410 is compressed, and the positioning block 320, in conjunction with the guide positioning groove 311, guides the sliding block 310 to move. The positioning groove 312 abuts against the corner 120 of the IGBT substrate 100. The upper mold punches holes in the IGBT substrate 100. After the upper mold separates from the lower mold 200, the sliding block 310 rebounds under the force of the spring 410. The positioning block 330 abuts against the tail of the sliding block 310. Then, the IGBT substrate 100 can be taken out from the IGBT substrate placement area 210.

[0035] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An IGBT substrate forming die, comprising an IGBT substrate (100), a positioning through hole (110) is arranged at a corner (120) of the IGBT substrate (100), and a cut surface (130) is arranged at the top of the corner (120), characterized in that: It also includes a lower mold (200) for producing IGBT substrate (100), wherein the lower mold (200) is configured with an IGBT substrate placement area (210) in the middle, and a sliding positioning mechanism (300) is provided at the four corners of the IGBT substrate placement area (210). The sliding positioning mechanism (300) includes a sliding block (310), and one end of the sliding block (310) near the IGBT substrate placement area (210) is configured as a positioning groove (312), and the positioning groove (312) fits the side edge (120) of the IGBT substrate (100). The bottom of the sliding block (310) is equipped with a spring (410) for resetting the sliding block (310); The top of the sliding block (310) is provided with a guide slope (314) that engages with the upper mold and moves the sliding block (310).

2. The IGBT substrate forming mold according to claim 1, wherein Positioning block one (220), positioning block two (230) and positioning block three (240) are fixedly installed on the lower mold (200). Positioning block one (220), positioning block two (230) and positioning block three (240) are located at the edge of the IGBT substrate placement area (210).

3. The IGBT substrate forming mold according to claim 2, wherein The IGBT substrate placement area (210) has a stamped through hole (250) corresponding to the positioning through hole (110) of the IGBT substrate (100).

4. The IGBT substrate forming mold according to claim 1, wherein The sliding block (310) has guide positioning grooves (311) at both ends. The inner wall of the guide positioning groove (311) is slidably connected to the positioning block four (320). The positioning block four (320) is fixedly installed on the lower mold (200). The sliding block (310) is provided with a positioning block five (330) at the end away from the IGBT substrate placement area (210). The positioning block five (330) is fixedly installed on the lower mold (200).

5. The IGBT substrate forming mold according to claim 1, wherein The bottom of the sliding block (310) is provided with a spring groove (313), and a spring (410) is provided inside the spring groove (313). The left end of the spring (410) is connected to the positioning block six (400), and the positioning block six (400) is fixedly installed on the lower mold (200). The right end of the spring (410) contacts the side wall of the spring groove (313).

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