Two-dimensional material transfer device and two-dimensional material transfer production line

Abstract

The utility model relates to the technical field of semiconductors, and discloses a two-dimensional material transfer device and a two-dimensional material transfer production line, and the two-dimensional material transfer device comprises an adsorption table which is used for placing a target substrate, and the table surface of the adsorption table can adsorb the target substrate; the heating mechanism is used for heating the table top of the adsorption table; and the air knife is arranged on one side of the adsorption table and can blow air towards the target substrate on the adsorption table. The two-dimensional material transfer device disclosed by the embodiment of the utility model can replace manual work to carry out the operation of stripping the heat release adhesive tape, is high in process stability, can ensure that the force and the angle are completely consistent, greatly saves the graphene transfer time, improves the transfer efficiency, ensures the process stability in the process of stripping the support substrate, and improves the production efficiency. And batch transfer of the graphene can be realized.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a two-dimensional material transfer device and a two-dimensional material transfer production line. Background Technology

[0002] Two-dimensional materials, such as graphene, are generally prepared on a growth substrate. After preparation, in order to realize the subsequent application of graphene wafers, it is necessary to transfer the graphene on the growth substrate to a target substrate such as a silicon wafer.

[0003] In the process of transferring graphene, a support substrate, such as a heat-release tape, is required as a carrier for the graphene. After the graphene is transferred to the target substrate, the support substrate needs to be peeled off from the graphene. However, in related technologies, the process of peeling the support substrate from the graphene is usually done manually, which has poor process stability, low transfer efficiency, and is not conducive to the mass production of graphene transfer operations. Utility Model Content

[0004] In view of this, the present invention provides a two-dimensional material transfer device and a two-dimensional material transfer production line to solve the problems in the related technology that the process of separating two-dimensional materials from the growth substrate has poor stability, low transfer efficiency, and is not conducive to the batch production of two-dimensional material transfer operations.

[0005] In a first aspect, this utility model provides a two-dimensional material transfer device, comprising:

[0006] An adsorption stage is used to place the target substrate, and the stage surface can adsorb the target substrate.

[0007] Heating mechanism for heating the surface of the adsorption stage;

[0008] An air knife, located on one side of the adsorption stage, blows air toward the target substrate on the adsorption stage.

[0009] Beneficial effects: In the use of the two-dimensional material transfer device of this utility model embodiment, the target substrate with heat-release adhesive tape applied can be placed on the adsorption stage. The adsorption stage adsorbs the target substrate, and the heating mechanism heats it, causing the heat-release adhesive tape to lose its adhesion. After the heat-release adhesive tape loses its adhesion, an air knife can blow towards the target substrate, thereby blowing off the lost heat-release adhesive tape and completing the separation of the target substrate from the support substrate.

[0010] Therefore, the two-dimensional material transfer device of this utility model embodiment can replace manual operation of peeling off heat release tape, has high process stability, can ensure that the force angle is completely consistent, greatly saves the graphene transfer time, improves the transfer efficiency, and ensures the process stability of peeling off the support substrate, and helps to realize the batch transfer of graphene.

[0011] In one alternative embodiment, the adsorption stage includes:

[0012] The countertop has vacuum adsorption grooves formed on it.

[0013] A vacuum pumping device is connected to the vacuum adsorption groove and is used to evacuate the vacuum adsorption groove.

[0014] Beneficial effects: The vacuum device can evacuate the vacuum adsorption trench, thereby creating a vacuum area between the target substrate and the mesa, which in turn adsorbs the target substrate onto the mesa.

[0015] In one alternative implementation, the adsorption stage is provided with a retractable pin.

[0016] Beneficial effects: With this setup, the target substrate with heat-release tape can be placed on the ejector pin of the adsorption stage. The target substrate descends onto the heating plate with the ejector pin, and then a vacuum device is used to create a vacuum. Under the action of the vacuum adsorption trench, the target substrate is adsorbed. The heating plate heats up, causing the heat-release tape to lose its adhesion. An air knife blows air to remove the lost-adhesion heat-release tape from the target substrate. The air blowing is stopped, and then the vacuum adsorption is turned off. The ejector pin rises, lifting the target substrate to facilitate subsequent graphene target substrate transfer operations.

[0017] In one alternative embodiment, there are multiple ejector pins, which are spaced apart around the outer periphery of the vacuum adsorption groove.

[0018] Beneficial effects: The spaced arrangement of multiple ejector pins ensures more uniform stress on the target substrate during adsorption, preventing deformation or breakage due to uneven local stress. During processing, equipment vibration can affect the stability of the target substrate. Multiple ejector pins increase the contact points between the target substrate and the adsorption stage, thereby reducing the impact of vibration on the target substrate and improving processing accuracy.

[0019] In one optional embodiment, the two-dimensional material transfer device further includes:

[0020] The drive mechanism, connected to the ejector pin, can drive the ejector pin to extend or retract onto the table.

[0021] In one alternative embodiment, the two-dimensional material transfer device further includes a base, wherein when a target substrate is placed on the adsorption stage, the upper edge of the air knife is flush with the upper edge of the target substrate.

[0022] Beneficial effect: With this configuration, the air knife can blow air toward the target substrate placed on the adsorption stage, thereby blowing away the heat-releasing adhesive tape on the target substrate.

[0023] In one alternative embodiment, the system further includes a base, an adsorption platform disposed on the base, and an air knife connected to the base via a lifting mechanism.

[0024] Beneficial effects: With this setup, the operator can adjust the height of the air knife's outlet via the lifting mechanism, making it suitable for removing support substrates from target substrates of different shapes and sizes.

[0025] In one alternative implementation, the lifting mechanism includes:

[0026] Support base, connected to the base;

[0027] A connecting section is connected between the support base and the air knife. One of the support base and the connecting section is provided with a strip hole that extends vertically. The other of the support base and the connecting section is provided with a connecting hole.

[0028] Fasteners pass through the strip hole and connect to the connection hole.

[0029] Beneficial effect: With this setup, when the height of the air knife needs to be adjusted, the operator can drive the fastener to slide within the slot, thereby raising or lowering the air knife.

[0030] In one optional embodiment, the two-dimensional material transfer device further includes:

[0031] The tape collection structure is located on the side of the adsorption platform away from the air knife.

[0032] Beneficial effect: With this configuration, the heat release tape blown away by the air knife can fall into the tape collection structure under the action of wind, thereby achieving automatic collection of heat release tape without adding any components.

[0033] Secondly, this utility model also provides a two-dimensional material transfer production line, comprising:

[0034] The two-dimensional material transfer device provided in the first aspect of this utility model;

[0035] A transport mechanism used to transport the target substrate.

[0036] Beneficial effects: The two-dimensional material transfer production line of the second aspect of this utility model includes or uses the two-dimensional material transfer device of the first aspect of this utility model, and therefore has its beneficial effects, namely: it can replace manual operation of peeling off heat release tape, has high process stability, can ensure that the force angle is completely consistent, greatly saves the time of graphene transfer, improves the transfer efficiency, and ensures the process stability of peeling off the support substrate, and helps to realize the batch transfer of graphene. Attached Figure Description

[0037] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0038] Figure 1 This is a perspective view of a two-dimensional material transfer device according to an embodiment of the present invention;

[0039] Figure 2 This is a top view of a two-dimensional material transfer device according to an embodiment of the present invention;

[0040] Figure 3 This is a front view of a two-dimensional material transfer device according to an embodiment of the present invention;

[0041] Figure 4 for Figure 3 Enlarged view of point A in the image;

[0042] Figure 5 This is a flowchart illustrating the operation of a two-dimensional material transfer device according to an embodiment of the present invention.

[0043] Explanation of reference numerals in the attached figures:

[0044] 1. Adsorption stage; 101. Stage surface; 102. Vacuum adsorption groove; 103. Ejector pin;

[0045] 2. Wind knife;

[0046] 3. Base;

[0047] 4. Lifting mechanism; 401. Support base; 4011. Strip hole; 402. Connecting section;

[0048] 5. Tape collection structure;

[0049] 6. Heat-release tape;

[0050] 7. Target substrate. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0052] Single-crystal copper wafers are obtained by sputtering a thin copper film onto sapphire using magnetron sputtering followed by annealing. The shape of the single-crystal copper wafer is consistent with that of silicon wafers in the semiconductor industry. Graphene wafers are fabricated on these ultra-flat single-crystal copper wafers using chemical vapor deposition. To realize subsequent applications of graphene wafers, a graphene wafer transfer process is needed to transfer the graphene from the single-crystal copper wafer to a target substrate such as a silicon wafer.

[0053] In related technologies, the graphene wafer transfer process can be roughly divided into four steps: spin-coating the transfer medium, separation from the growth substrate, bonding with the target substrate, and removal of the transfer medium. However, the graphene wafer transfer process is limited by its cumbersome operation, extensive manual operation, and numerous physicochemical processes involving solutions, making it difficult to carry out batch transfer.

[0054] In view of this, the applicant has developed a graphene wafer batch transfer technology, the process of which is as follows: pre-treating the graphene wafer in 1-octyl mercaptan to reduce the adhesion between the graphene and the growth substrate; spin-coating a polyvinyl alcohol transfer medium onto the surface of the graphene wafer; attaching a heat-release tape (TRT) as a support substrate to the surface of the transfer medium; separating the graphene / polyvinyl alcohol / TRT from the growth substrate (single-crystal copper wafer) by dry peeling; attaching the graphene / polyvinyl alcohol / TRT to the target substrate; releasing and removing the TRT by heating; and removing the polyvinyl alcohol by dissolving it in water.

[0055] For dry exfoliation and transfer of graphene, related technologies employ manual bonding and peeling. First, a thermally released adhesive tape of appropriate size is cut and rolled onto a wafer that has already been spin-coated with the transfer medium. Then, the thermally released adhesive tape is manually peeled off, and the graphene is peeled off along with the tape. The resulting thermally released tape / transfer medium / graphene is then rolled onto the target substrate again, and then heated to cause the thermally released tape to lose its adhesion, after which the thermally released tape is manually peeled off.

[0056] However, for manually operated dry exfoliation and transfer of graphene, the process stability is poor because it is impossible to ensure that the force and angle of the heat-releasing adhesive tape are exactly the same each time. When the exfoliated graphene is attached to the target substrate, it is difficult to achieve perfect alignment, resulting in some waste.

[0057] The two-dimensional material transfer device of this application embodiment can be applied to the transfer method to heat and blow off the heat-release adhesive tape 6. This equipment greatly saves the graphene transfer time, improves the transfer efficiency, and ensures the process stability of the peeling off of the support substrate.

[0058] The following is combined Figures 1 to 5 The following describes embodiments of the present invention.

[0059] According to an embodiment of the present invention, a two-dimensional material transfer device is provided, including an adsorption stage 1, a heating mechanism, and an air knife 2.

[0060] The adsorption stage 1 is used to place the target substrate 7 carrying two-dimensional material, and the stage surface 101 of the adsorption stage 1 can adsorb the target substrate 7. The heating mechanism is used to heat the stage surface 101 of the adsorption stage 1. The air knife 2 is located on one side of the adsorption stage 1 and can blow air towards the target substrate 7 on the adsorption stage 1.

[0061] In the use of the two-dimensional material transfer device of this embodiment, the target substrate 7 with the heat-release adhesive tape 6 applied can be placed on the adsorption stage 1. The adsorption stage 1 adsorbs the target substrate 7, and the heating mechanism heats it, causing the heat-release adhesive tape 6 to lose its adhesion. After the heat-release adhesive tape 6 loses its adhesion, the air knife 2 can blow towards the target substrate 7, thereby blowing off the lost heat-release adhesive tape 6, completing the peeling of the target substrate 7 from the support substrate.

[0062] Therefore, the two-dimensional material transfer device of this utility model embodiment can replace manual operation of peeling off the heat release tape 6, with high process stability, can ensure that the force angle is completely consistent, greatly saves the graphene transfer time, improves the transfer efficiency, and ensures the process stability of peeling off the support substrate, and helps to realize the batch processing of graphene transfer operation.

[0063] The two-dimensional material is typically only one layer or a few layers thick, and may be graphene. As an alternative implementation, in some embodiments not shown in the accompanying drawings, the two-dimensional material may also be hexagonal boron nitride or molybdenum sulfide, etc.

[0064] It should be noted that although the target substrate 7 shown in the figure is a silicon wafer, the target substrate 7 is not limited to a silicon wafer. Its material and shape can be specifically set according to the application requirements of the target substrate 7, such as being square.

[0065] In one embodiment, the adsorption stage 1 includes a table surface 101 and a vacuum device.

[0066] Vacuum adsorption trenches 102 are formed on the mesa 101. A vacuum pumping device is connected to the vacuum adsorption trenches 102 to create a vacuum region between the target substrate 7 and the mesa 101, thereby adsorbing the target substrate 7 onto the mesa 101.

[0067] The vacuum pump is preferred, but not limited to, the vacuuming device.

[0068] In one embodiment, the platform 101 of the adsorption stage 1 is a heating plate, and a heating mechanism can heat the heating plate. A vacuum adsorption groove 102 is formed on the upper surface of the heating plate, or a heating element is embedded in the vacuum adsorption groove 102. This configuration can improve the overall performance and efficiency of the adsorption stage 1 and reduce the size and complexity of the equipment.

[0069] As an alternative implementation, the vacuum adsorption groove 102 may also be disposed on the platform 101 of the adsorption stage 1, with the heating plate disposed below the platform 101.

[0070] In one embodiment, the adsorption stage 1 is provided with a retractable pin 103.

[0071] With this setup, the target substrate 7 with the heat-release tape 6 attached can be placed on the ejector pin 103 of the adsorption stage 1. The target substrate 7 descends onto the heating plate with the ejector pin 103. Then, a vacuum device is used to create a vacuum, and the target substrate 7 is adsorbed under the action of the vacuum adsorption groove 102. The heating plate heats up, causing the heat-release tape 6 to lose its adhesion. The air knife 2 blows air to remove the lost adhesion heat-release tape 6 from the target substrate 7. The blowing is stopped, and then the vacuum adsorption is turned off. The ejector pin 103 rises, lifting the target substrate 7 to facilitate subsequent operations.

[0072] In one embodiment, there are multiple ejector pins 103, which are spaced apart around the outer periphery of the vacuum adsorption groove 102.

[0073] The multiple ejector pins 103 spaced apart ensure more uniform force distribution on the target substrate 7 during adsorption, preventing deformation or breakage due to uneven localized force. During processing, equipment vibration can affect the stability of the target substrate 7. The multiple ejector pins 103 increase the contact points between the target substrate 7 and the adsorption stage 1, thereby reducing the impact of vibration on the target substrate 7 and improving processing accuracy.

[0074] It should be noted that, in this embodiment of the application, the specific number of ejector pins 103 is not limited. For example, such as Figure 2 In the illustrated embodiment, there are three ejector pins 103, which are evenly arranged along the axial direction. As a variable implementation, in some embodiments not shown in the figures, the number of ejector pins 103 may also be four, five, or six, etc.

[0075] In one embodiment, the two-dimensional material transfer device further includes a drive mechanism. The drive mechanism is connected to the ejector pin 103 and is capable of driving the ejector pin 103 to extend or retract from the table surface 101.

[0076] The drive mechanism is preferably, but not limited to, a combination of a motor and a ball screw, a cylinder, a cam mechanism, or an electromagnetic drive mechanism.

[0077] In one embodiment, the two-dimensional material transfer device further includes a base 3, an air knife 2 and an adsorption stage 1 disposed on the base 3, and when a target substrate 7 is disposed on the adsorption stage 1, the upper edge of the air knife 2 is flush with the upper edge of the target substrate 7.

[0078] With this configuration, the air knife 2 can blow air towards the target substrate 7 positioned on the adsorption stage 1, thereby blowing away the heat-releasing adhesive tape 6 on the target substrate 7. Preferably, as shown... Figure 4 As shown, the blowing direction of the air knife 2 can be selected as horizontal.

[0079] In one embodiment, the air blade 2 is connected to the base 3 via a lifting mechanism 4.

[0080] With this setup, the operator can adjust the height of the air outlet of the air knife 2 via the lifting mechanism 4, thus making it suitable for removing the support substrate from target substrates 7 of different shapes and sizes.

[0081] In one embodiment, the lifting mechanism 4 includes a support base 401, a connecting section 402, and fasteners.

[0082] The support base 401 is connected to the base 3. The connecting section 402 connects the support base 401 and the air knife 2. One of the support base 401 and the connecting section 402 has a strip hole 4011 extending vertically, and the other of the support base 401 and the connecting section 402 has a connecting hole. Fasteners pass through the strip hole 4011 and are connected to the connecting hole.

[0083] With this setup, when the height of the air knife 2 needs to be adjusted, the operator can drive the fastener to slide within the slot 4011, thereby raising or lowering the air knife 2.

[0084] In one embodiment, such as Figure 1 and Figure 3 As shown, the strip hole 4011 is provided on the support base 401, and the connecting hole is provided on the connecting section 402.

[0085] As a possible implementation, in an embodiment not shown in the accompanying drawings, the strip hole 4011 is provided on the connecting section 402, and the connecting hole is provided on the support base 401.

[0086] In one embodiment, the two-dimensional material transfer device further includes a tape collection structure 5. The tape collection structure 5 is located on the side of the adsorption stage 1 away from the air knife 2.

[0087] With this configuration, the heat-releasing tape 6 blown away by the air knife 2 can fall into the tape collection structure 5 under the action of wind, thereby achieving automatic collection of the heat-releasing tape 6 without adding any components.

[0088] In one embodiment, such as Figure 1As shown, the tape collection structure 5 includes an isolation net, and the isolation net has a first opening on the side facing the adsorption table 1. The heat-released tape 6 blown off by the air knife 2 can enter the isolation net through the first opening.

[0089] In one embodiment, a second opening is provided on the lower side of the isolation net, and a collection box is provided below the isolation net, so that the heat-release tape 6 that enters the isolation net can fall into the collection box through the second opening.

[0090] According to an embodiment of the present invention, another aspect provides a two-dimensional material transfer production line, including a two-dimensional material transfer device and a handling mechanism.

[0091] The two-dimensional material transfer device is the one provided in the first aspect of this utility model. The transport mechanism is used to transport the target substrate 7.

[0092] The two-dimensional material transfer production line of the second aspect of this utility model includes or uses the two-dimensional material transfer device of the first aspect of this utility model, and therefore has its beneficial effects, namely: it can replace manual operation of peeling off the heat release tape 6, has high process stability, can ensure that the force angle is completely consistent, greatly saves the time of graphene transfer, improves the transfer efficiency, and ensures the process stability of peeling off the support substrate, and helps to realize the batch transfer of graphene.

[0093] The preferred, but not limited to, handling device is a robotic arm.

[0094] The working process of the two-dimensional material transfer production line according to this embodiment of the present invention will be described below:

[0095] First, the transport device transfers the target substrate 7, which has been coated with graphene, polyvinyl alcohol and heat release tape 6, onto the pin 103 of the adsorption stage 1.

[0096] After the transport device is removed, the target substrate 7 descends onto the platform 101 of the adsorption stage 1 along with the ejector pin 103. Then, the vacuum device is turned on and the vacuum adsorption trench 102 adsorbs the silicon target substrate 7. The heating mechanism heats the substrate, causing the heat release tape 6 to lose its adhesion.

[0097] After the heat release tape 6 loses its adhesion, the air knife 2 is activated to blow airflow through it, and the lost heat release tape 6 is blown into the mobile phone structure. Then the air knife 2 stops blowing, and the vacuum adsorption is turned off. The ejector pin 103 rises and lifts the silicon target substrate 7. The transport device picks up the silicon target substrate 7 and puts it into the cartridge.

[0098] In summary, the two-dimensional material transfer device of the first aspect of this utility model and the two-dimensional material transfer production line of the second aspect of this utility model can realize the batch processing of the heat release process of graphene transfer. By integrating the heat release process into the equipment and using a robotic arm for transfer, the transfer operation time is greatly reduced, the transfer efficiency is improved, and the transfer stability is guaranteed.

[0099] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and all such modifications and variations fall within the scope of protection claimed by the present invention.

Claims

1. A two-dimensional material transfer device, characterized by, include: An adsorption stage (1) is used to place a target substrate (7) carrying two-dimensional materials. The stage (101) of the adsorption stage (1) is capable of adsorbing the target substrate (7). A heating mechanism for heating the table surface (101) of the adsorption stage (1); The air knife (2) is located on one side of the adsorption stage (1) and can blow air toward the target substrate (7) on the adsorption stage (1).

2. The two-dimensional material transfer device of claim 1, wherein, The adsorption stage (1) includes: A platform (101) on which vacuum adsorption grooves (102) are formed; A vacuum pumping device is connected to the vacuum adsorption groove (102) and is used to evacuate the vacuum adsorption groove (102).

3. The two-dimensional material transfer device of claim 2, wherein, The adsorption stage (1) is equipped with a retractable pin (103).

4. The two-dimensional material transfer device of claim 3, wherein, There are multiple ejector pins (103), and the multiple ejector pins (103) are arranged at intervals around the outer periphery of the vacuum adsorption groove (102).

5. The two-dimensional material transfer device of claim 3, wherein, Also includes: A drive mechanism, connected to the ejector pin (103), is capable of driving the ejector pin (103) to extend or retract from the table surface (101).

6. The two-dimensional material transfer apparatus of any one of claims 1 to 5, wherein, When the adsorption stage (1) is provided with a target substrate (7), the upper edge of the air knife (2) is flush with the upper edge of the target substrate (7).

7. The two-dimensional material transfer device of claim 6, wherein, It also includes a base (3), the adsorption platform (1) is disposed on the base (3), and the air knife (2) is connected to the base (3) through a lifting mechanism (4).

8. The two-dimensional material transfer device of claim 7, wherein, The lifting mechanism (4) includes: Support base (401) is connected to the base (3); A connecting section (402) is connected between the support base (401) and the air knife (2). One of the support base (401) and the connecting section (402) is provided with a strip hole (4011) that extends vertically. The other of the support base (401) and the connecting section (402) is provided with a connecting hole. Fasteners pass through the strip hole (4011) and are connected to the connection hole.

9. The two-dimensional material transfer apparatus of any one of claims 1 to 5, wherein, Also includes: The tape collection structure (5) is located on the side of the adsorption platform (1) away from the air knife (2).

10. A two-dimensional material transfer production line, characterized by, include: Two-dimensional material transfer apparatus as described in any one of claims 1 to 9; A transport mechanism for transporting the target substrate (7).

Images