Temperature control device for wafer vacuum coating transfer cavity

Abstract

The utility model provides a temperature control device for a wafer vacuum coating transfer cavity, which comprises a temperature control platform, the top surface of the temperature control platform is provided with a groove for accommodating a lifting bracket, the bottom of the temperature control platform is open and forms an accommodating cavity, the top in the accommodating cavity is provided with a mounting groove, and the mounting groove and the groove are not communicated and staggered. A temperature control chip is arranged in the mounting groove, a water-cooling heat dissipation structure is arranged in the containing cavity, the temperature control platform is provided with a center hole allowing the lifting driving structure to penetrate through, the lifting driving structure penetrates through the center hole to be connected with the lifting bracket, and the lifting driving structure drives the lifting bracket and a wafer arranged on the lifting bracket to ascend and descend. And when the lifting bracket descends and is arranged in the groove, the wafer is in contact with the temperature control platform, and the water-cooling heat dissipation structure and / or the temperature control sheet controls the temperature of the temperature control platform so as to control the temperature of the wafer. According to the utility model, stable adjustment of the temperature of the wafer in the transfer cavity is realized.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and in particular relates to a temperature control device for a wafer vacuum coating transfer cavity. Background Technology

[0002] In wafer vacuum coating processes, temperature significantly impacts coating quality. Due to the high vacuum requirements of vacuum coating equipment and the thick, poorly thermally conductive platform within the transfer cavity, wafer heat dissipation becomes a challenging issue. Currently, water cooling is primarily used, which relies on increasing flow rate to reduce coolant temperature. However, space constraints and irregularly shaped heat dissipation areas limit the contact heat transfer area of ​​water cooling. Furthermore, the low temperature of the coolant often leads to significant ice crystal formation or condensation at the water pipes. Additionally, the large heat dissipation area and long copper pipes result in uneven heat dissipation between the inlet and outlet. Moreover, some specialized processes require maintaining higher wafer temperatures through heating. To meet the demands of a wider temperature range (heating and cooling), a temperature control device capable of rapidly and stably regulating wafer operating temperature is urgently needed. Utility Model Content

[0003] This invention provides a temperature control device for a wafer vacuum coating transfer cavity, enabling stable adjustment of the wafer temperature within the transfer cavity.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A temperature control device for a wafer vacuum coating transfer cavity includes a temperature control platform. The top surface of the temperature control platform has a groove for accommodating a lifting bracket. The bottom of the temperature control platform is open, forming a receiving cavity. A mounting groove is provided at the top of the receiving cavity. The mounting groove is not connected to the groove and is offset from it. A temperature control element is disposed in the mounting groove. A water-cooling heat dissipation structure is disposed in the receiving cavity. The temperature control platform has a central hole allowing a lifting drive structure to pass through. The lifting drive structure passes through the central hole and connects to the lifting bracket. The lifting drive structure drives the lifting bracket and the wafer disposed on the lifting bracket to move up and down. When the lifting bracket descends into the groove, the wafer contacts the temperature control platform. The water-cooling heat dissipation structure and / or the temperature control element control the temperature of the temperature control platform, thereby controlling the temperature of the wafer.

[0006] Preferably, there are multiple mounting slots, which are spaced apart circumferentially along the central hole, and the mounting slots as a whole have a fan-shaped ring structure.

[0007] Preferably, the number of temperature control plates is the same as the number of mounting slots, and the temperature control plates have a fan-ring structure that matches the mounting slots.

[0008] Preferably, a first thermally conductive transition layer is provided on the contact surface between the temperature control plate and the temperature control platform.

[0009] Preferably, the water-cooled heat dissipation structure is located below the temperature control plate, and a second thermally conductive transition layer is provided on the top surface of the water-cooled heat dissipation structure.

[0010] Preferably, the water-cooled heat dissipation structure includes a heat spreader and a copper tube embedded in the heat spreader. The heat spreader is annular and has a notch. The copper tube is arranged annularly along the heat spreader and extends out from the notch to connect to an external cooling water structure.

[0011] Preferably, the lifting drive structure includes a lifting motor, a motor bracket, a mounting flange, and a bellows connected in sequence. The lifting motor drives the lifting rod to rise and fall, and the lifting rod passes through the bellows and connects to the lifting bracket.

[0012] Preferably, the lifting bracket is X-shaped, and the lifting rod connects to the central intersection point of the lifting bracket; the corrugated pipe passes through the central hole and seals the connection between the lifting bracket and the mounting flange.

[0013] Preferably, the mounting flange is sealed to the top surface of the receiving cavity of the temperature control platform outside the central hole, and a first sealing ring is provided outside the central hole.

[0014] Preferably, the bottom surface of the temperature control platform is connected to the conveying cavity, and a second sealing ring is provided on the outer periphery of the bottom surface of the temperature control platform.

[0015] Compared with the prior art, the technical solution of this utility model has beneficial effects.

[0016] For example, in a temperature control device for a wafer vacuum coating transfer cavity, the temperature control plate is placed in a mounting slot offset from the groove within the temperature control platform. This brings the temperature control plate closer to the top surface of the wafer, facilitating heat transfer and exchange, and enabling rapid temperature control. Rapid cooling or heating can be achieved by adjusting the magnitude and direction of the current in the temperature control plate. A water-cooled heat dissipation structure is installed in the housing cavity of the temperature control platform to further enhance the heat dissipation effect.

[0017] Furthermore, the addition of a thermally conductive transition layer facilitates temperature conduction and improves temperature control efficiency.

[0018] Furthermore, the temperature control platform is sealed to the lifting drive structure to ensure a vacuum inside the cavity containing the wafer. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the temperature control device for the wafer vacuum coating transfer cavity in an embodiment of this utility model.

[0020] Figure 2 This is a schematic diagram of the temperature control platform structure in an embodiment of this utility model;

[0021] Figure 3 This is a schematic diagram of the temperature control platform from another angle in an embodiment of this utility model;

[0022] Figure 4 This is a schematic diagram of the installation of the temperature control chip and water-cooled heat dissipation structure in an embodiment of this utility model;

[0023] Figure 5 This is a schematic diagram of the water-cooled heat dissipation structure in an embodiment of this utility model;

[0024] Figure 6 This is a schematic diagram of the lifting drive structure in an embodiment of this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1-Wafer;

[0027] 2-Temperature control platform; 21-Groove; 22-Receiving cavity; 23-Mounting groove; 24-Center hole; 25-First sealing ring; 26-Second sealing ring;

[0028] 3-Temperature control element; 31-First thermally conductive transition layer;

[0029] 4-Water-cooled heat dissipation structure; 41-Second thermal conductive transition layer; 42-Pop-up plate; 43-Copper pipe;

[0030] 5-Lifting drive structure; 51-Lifting motor; 52-Motor bracket; 53-Mounting flange; 54-Corrugated pipe;

[0031] 6-Lifting bracket. Detailed Implementation

[0032] To make the objectives, features, and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described below are merely for explaining this utility model and are not intended to limit it. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc., may be omitted.

[0033] Figure 1 This is a schematic diagram of the temperature control device for the wafer vacuum coating transfer cavity in an embodiment of this utility model. Figure 2This is a schematic diagram of the temperature control platform structure in an embodiment of this utility model; Figure 3 This is a schematic diagram of the temperature control platform from another angle in an embodiment of this utility model; Figure 4 This is a schematic diagram of the installation of the temperature control chip and water-cooled heat dissipation structure in an embodiment of this utility model; Figure 5 This is a schematic diagram of the water-cooled heat dissipation structure in an embodiment of this utility model; Figure 6 This is a schematic diagram of the lifting drive structure in an embodiment of this utility model.

[0034] Reference Figures 1-6 This utility model provides a temperature control device for a wafer vacuum coating transfer cavity.

[0035] Specifically, the temperature control device for the wafer vacuum coating transfer cavity includes a temperature control platform 2. The top surface of the temperature control platform 2 is provided with a groove 21 for accommodating a lifting bracket 6. The bottom of the temperature control platform 2 is open and forms a receiving cavity 22. The top of the receiving cavity 22 is provided with a mounting groove 23. The mounting groove 23 is not connected to the groove 21 and is staggered. A temperature control plate 3 is provided in the mounting groove 23. A water-cooled heat dissipation structure 4 is provided in the receiving cavity 22. The temperature control platform 2 is provided with a central hole that allows the lifting drive structure 5 to pass through. The lifting drive structure 5 passes through the central hole 24 and connects to the lifting bracket 6. The lifting drive structure 5 drives the lifting bracket 6 and the wafer 1 set on the lifting bracket 6 to rise and fall. When the lifting bracket 6 is lowered into the groove 21, the wafer 1 comes into contact with the temperature control platform 2. The water-cooled heat dissipation structure 4 and / or the temperature control plate 3 control the temperature of the temperature control platform 2 and thus control the temperature of the wafer 1.

[0036] In some embodiments, there are multiple mounting slots 23, which are spaced apart circumferentially along the central hole 24, and the mounting slots 23 are generally arranged in a fan-shaped ring structure.

[0037] In some embodiments, the number of temperature control plates 3 is the same as the number of mounting slots 23, and the temperature control plates 3 are in the form of a fan-ring structure that matches the mounting slots 23.

[0038] Specifically, the temperature control element 3 is small in size and can be customized for irregular spaces in narrow areas, minimizing its impact on existing structural designs in terms of structural dimensions. The temperature control element 3 achieves efficient temperature control. Made of semiconductor material, its basic unit consists of a pair of N-type and P-type semiconductors and connecting electrodes, which form the cold and hot ends. Under the influence of an applied electric field, current can transfer heat within the semiconductor, causing one end to absorb heat and the other to release it, thus achieving a cooling effect. When the current direction reverses, the cold and hot ends switch accordingly, achieving heating. Based on the Peltier effect, rapid temperature control is achieved by changing the magnitude and direction of the current.

[0039] In some embodiments, a first thermally conductive transition layer 31 is provided on the contact surface between the temperature control plate 3 and the temperature control platform 2.

[0040] In some embodiments, the water-cooled heat dissipation structure 4 is located below the temperature control plate 3, and a second thermally conductive transition layer 41 is provided on the top surface of the water-cooled heat dissipation structure 4.

[0041] Specifically, both the first thermally conductive transition layer 31 and the second thermally conductive transition layer 41 are made of highly thermally conductive insulating materials to ensure efficient heat transfer.

[0042] In some embodiments, the water-cooled heat dissipation structure 4 includes a heat spreader 42 and a copper pipe 43 embedded in the heat spreader 42. The heat spreader 42 is annular and has a notch. The copper pipe 43 is arranged annularly along the heat spreader 42 and extends out from the notch to connect to an external cooling water circulation structure.

[0043] Specifically, the heat spreader 42 is made of aluminum.

[0044] In some embodiments, the lifting drive structure 5 includes a lifting motor 51, a motor bracket 52, a mounting flange 53 and a bellows 54 connected in sequence. The lifting motor 51 drives the lifting rod (not shown) to rise and fall, and the lifting rod passes through the bellows 54 to connect to the lifting bracket 6.

[0045] Specifically, the lifting motor 51 can drive the lifting rod to rise and fall through the cooperation of a lead screw and a lead screw nut, which is not limited here.

[0046] In some embodiments, the lifting bracket 6 is generally X-shaped, and the lifting rod connects the central intersection point of the lifting bracket 6; the bellows 54 passes through the central hole 24 to seal and connect the lifting bracket 6 and the mounting flange 53.

[0047] In some embodiments, the mounting flange 53 is sealed to the top surface of the receiving cavity 22 of the temperature control platform 2 outside the central hole 24, and a first sealing ring 25 is provided outside the central hole 24.

[0048] In some embodiments, the bottom surface of the temperature control platform 2 is connected to a conveying cavity (not shown), and a second sealing ring 26 is provided on the outer periphery of the bottom surface of the temperature control platform 2.

[0049] In summary, the temperature control device for a wafer vacuum coating transfer cavity provided by this utility model places the temperature control plate 3 in the mounting groove 23, which is offset from the groove 21, within the temperature control platform 2. This makes the temperature control plate 3 closer to the top surface of the wafer 1, which is beneficial for heat transfer and exchange and for rapid temperature control. Rapid cooling or heating can be achieved by adjusting the magnitude and direction of the current in the temperature control plate 3. A water-cooled heat dissipation structure 4 is provided in the receiving cavity 22 of the temperature control platform 2 to further improve the heat dissipation effect.

[0050] Furthermore, the addition of a thermally conductive transition layer facilitates temperature conduction and improves temperature control efficiency.

[0051] Furthermore, the temperature control platform 2 is sealed to the lifting drive structure 5 to ensure the vacuum inside the cavity where the wafer 1 is located.

[0052] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of this utility model disclosure, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this utility model disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and may be derived from the technical features of the respective independent claims in any suitable manner rather than solely by the specific combinations listed in the claims.

[0053] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A temperature control device for a wafer vacuum coating transfer chamber, characterized in that, The device includes a temperature control platform. The top surface of the temperature control platform has a groove for accommodating a lifting bracket. The bottom of the temperature control platform is open, forming a receiving cavity. The top of the receiving cavity has a mounting groove, which is not connected to and is offset from the groove. A temperature control element is disposed in the mounting groove. A water-cooling heat dissipation structure is disposed in the receiving cavity. The temperature control platform has a central hole allowing a lifting drive structure to pass through. The lifting drive structure passes through the central hole and connects to the lifting bracket. The lifting drive structure drives the lifting bracket and the wafer disposed on the lifting bracket to rise and fall. When the lifting bracket descends and is placed in the groove, the wafer contacts the temperature control platform. The water-cooling heat dissipation structure and / or the temperature control element control the temperature of the temperature control platform, thereby controlling the temperature of the wafer.

2. The temperature control device for wafer vacuum coating transfer cavity according to claim 1, wherein, There are multiple mounting slots, which are spaced apart circumferentially along the central hole, and the mounting slots as a whole have a fan-shaped ring structure.

3. The temperature control device for wafer vacuum coating transfer cavity according to claim 2, wherein, The number of temperature control elements is the same as the number of mounting slots, and the temperature control elements have a fan-ring structure that matches the mounting slots.

4. The temperature control device for wafer vacuum coating transfer cavity according to claim 1, wherein, A first thermally conductive transition layer is provided on the contact surface between the temperature control element and the temperature control platform.

5. The temperature control device for wafer vacuum coating transfer cavity according to claim 1, wherein, The water-cooled heat dissipation structure is located below the temperature control plate, and a second thermally conductive transition layer is provided on the top surface of the water-cooled heat dissipation structure.

6. The temperature control device for wafer vacuum coating transfer cavity according to claim 1, wherein, The water-cooled heat dissipation structure includes a heat spreader and copper pipes embedded in the heat spreader. The heat spreader is annular and has a notch. The copper pipes are arranged annularly along the heat spreader and extend from the notch to connect to an external cooling water structure.

7. The temperature control device for wafer vacuum coating transfer cavity according to claim 1, wherein, The lifting drive structure includes a lifting motor, a motor bracket, a mounting flange, and a bellows connected in sequence. The lifting motor drives the lifting rod to rise and fall, and the lifting rod passes through the bellows and connects to the lifting bracket.

8. The temperature control device for wafer vacuum coating transfer cavity according to claim 7, wherein, The lifting bracket is generally X-shaped, and the lifting rod connects to the central intersection point of the lifting bracket; the corrugated pipe passes through the central hole and seals the connection between the lifting bracket and the mounting flange.

9. The temperature control device for wafer vacuum coating transfer cavity according to claim 7, wherein, The mounting flange is sealed to the top surface of the receiving cavity of the temperature control platform outside the central hole, and a first sealing ring is provided outside the central hole.

10. The temperature control device for wafer vacuum coating transfer cavity according to claim 1, wherein, The bottom surface of the temperature control platform is connected to the conveying cavity, and a second sealing ring is provided on the outer periphery of the bottom surface of the temperature control platform.

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