PCB copper plating floating frame device

Abstract

The utility model discloses a PCB (Printed Circuit Board) copper plating floating frame device, which relates to the technical field of PCB production and electroplating processing and comprises a mounting frame, a plurality of groups of isolation limiting rods used for separating a plurality of groups of PCBs are arranged on the inner side of the mounting frame in a matched manner, and each group of isolation limiting rods comprises a sectional rod body used for separating the plurality of groups of PCBs; the two sliding assemblies are in sliding fit with the inner side of the mounting frame, the sliding assemblies are arranged at the two ends of the sectional rod body, and the upper side and the lower side of the mounting frame are each provided with a plurality of detachable limiting frames used for limiting a PCB. When the copper plating device is used, the size of a PCB (Printed Circuit Board) to be plated with copper needs to be determined firstly, and the distance between the two adjacent groups of U-shaped sliding blocks is adjusted according to the size of the PCB and the distance measuring range on the reference sliding plate. Due to the adjustability of the isolation limiting rods, the application range is expanded, the whole adjusted mounting frame can be repeatedly used, and the production cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology in PCB board production, specifically to a copper plating floating frame device for PCB boards. Background Technology

[0002] Electroplating in PCB manufacturing refers to the process of applying a thin metal film to the surface of a PCB using electrolysis. This metal film is typically composed of conductive materials such as copper, nickel, and gold, and aims to enhance the conductivity of the PCB while also protecting and beautifying it. Electroplating also ensures a uniform distribution of the metal layer on the PCB surface, thereby improving its reliability and stability.

[0003] A PCB board float is an auxiliary device used in the electroplating process of PCB board production. Its main function is to fix the electroplated parts, ensuring that the PCB board can be stably suspended in the electroplating solution during the electroplating process. This prevents the lower end of the part from deviating from the center position due to the impact of the plating solution flow, thereby ensuring the quality and uniformity of electroplating.

[0004] The shortcomings of existing technical solutions are that most PCB board floats on the market currently lack adjustable clamping structures, meaning they are difficult to adapt to PCB boards of various sizes. This limitation leads to frequent float replacements or the use of other auxiliary tools to secure circuit boards of different sizes during actual operation, which not only reduces production efficiency but also increases operational difficulty and cost. Utility Model Content

[0005] The purpose of this utility model is to provide a PCB board copper plating float device to solve the technical problem that most PCB board floats on the market lack adjustable clamping structures and are difficult to adapt to PCB boards of various sizes.

[0006] The technical problem to be solved by this utility model can be achieved through the following technical solution:

[0007] A copper plating floating frame device for PCB boards includes a mounting frame. Multiple sets of isolation limiting rods for separating multiple groups of PCB boards are fitted inside the mounting frame. Each set of isolation limiting rods includes a segmented rod body for separating the multiple groups of PCB boards, and two sets of sliding components that slide in cooperation with the inner side of the mounting frame. The sliding components are located at both ends of the segmented rod body. Multiple sets of detachable limiting frames for limiting the PCB boards are provided on the upper and lower sides of the mounting frame.

[0008] As a further embodiment of this utility model: each group of segmented rods has multiple sets of V-shaped bottom surrounding grooves equidistantly provided on its side for limiting the PCB board, and the positions of the multiple sets of surrounding grooves on adjacent groups of segmented rods correspond to each other.

[0009] As a further embodiment of this utility model: a sliding plate is fixedly connected to both sides inside the mounting frame, and each set of sliding components includes a U-shaped slider that slides with the sliding plate. Each set of U-shaped sliders is fixedly connected to one end of the segmented rod, and a positioning bolt that mates with the sliding plate is threaded onto the U-shaped slider.

[0010] As a further embodiment of this utility model: a set of the aforementioned sliding plates is provided with a spacing range for adjusting the spacing between two adjacent sets of segmented rods.

[0011] As a further embodiment of this utility model: the upper side of the mounting frame is provided with an upper limit threaded hole, and the limiting frame includes a U-shaped frame for limiting the PCB board, and threaded connecting blocks fixed at both ends of the U-shaped frame and threadedly connected to the upper limit threaded hole.

[0012] As a further embodiment of this utility model: multiple sets of lower limit threaded holes that cooperate with the limit frame are opened laterally on the lower side of the mounting frame.

[0013] As a further embodiment of this utility model, the upper limit threaded hole is longitudinally distributed in multiple sets.

[0014] As a further embodiment of this utility model: openings are provided on both sides of the mounting frame, and both ends of each set of sliding plates extend to the opening positions.

[0015] As a further embodiment of this utility model, the surface of the segmented rod is coated with a protective paint layer.

[0016] As a further embodiment of this utility model, the inner surface of the U-shaped frame is coated with a protective paint layer.

[0017] The beneficial effects of this utility model are:

[0018] 1. In use, the dimensions of the PCB board to be copper-plated must first be determined. Based on the PCB board dimensions and referring to the spacing range on the sliding plate, the spacing between the two adjacent sets of U-shaped sliders is adjusted. The PCB board is then placed sequentially between the two adjacent sets of segmented rods, ensuring that the edges of the PCB board are aligned with the corresponding surrounding grooves on the two sets of segmented rods. The two sets of surrounding grooves provide positioning and guidance for the PCB board. After the PCB board is placed between the two sets of segmented rods, its bottom contacts the U-shaped frame at the bottom of the mounting frame, which supports the PCB board. Finally, an upper limit bracket is installed on the appropriately sized upper limit threaded hole, thus limiting the PCB board and ensuring its stability during the copper plating process. The adjustability of the isolation limit rods expands the applicability, and the adjusted mounting frame can be reused multiple times, reducing production costs.

[0019] 2. When using this utility model, the isolation limit rod will wear out after a long period of use. When it is necessary to replace the isolation limit rod, the positioning bolt can be rotated so that the U-shaped slider slides relative to the slide plate. Then push the U-shaped slider to move along the slide plate until the opening position is reached, at which point the U-shaped slider disengages from the slide plate, thus facilitating the disassembly and replacement of the isolation limit rod. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings.

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the isolation and limiting rod structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the limiting frame structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the longitudinal section structure of the segmented rod of this utility model.

[0025] In the diagram: 1. Mounting frame; 2. Isolation limit rod; 201. Sectional rod body; 202. U-shaped slider; 203. Positioning bolt; 3. Slide plate; 4. PCB board; 5. Upper limit threaded hole; 6. Limiting frame; 601. U-shaped frame; 602. Threaded connecting block; 7. Lower limit threaded hole. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] like Figures 1-4 As shown, a PCB board copper plating floating frame device includes a mounting frame 1, as... Figure 2 As shown, the inner side of the mounting frame 1 is provided with multiple sets of isolation limiting rods 2 for separating multiple sets of PCB boards 4. Each set of isolation limiting rods 2 includes a segmented rod body 201 for separating multiple sets of PCB boards 4, and two sets of sliding components that slide in cooperation with the inner side of the mounting frame 1. Each set of segmented rod body 201 has multiple sets of V-shaped bottom surrounding grooves equidistantly provided on its side for limiting the PCB boards 4. The structure of the segmented rod body 201 is as follows: Figure 4As shown, the surrounding grooves serve to limit and guide the PCB board 4. The positions of multiple surrounding grooves on adjacent sets of segmented rods 201 correspond to each other, facilitating the limiting of the PCB board 4. Sliding components are located at both ends of the segmented rods 201. Slide plates 3 are fixedly connected to both sides inside the mounting frame 1. Each sliding component includes a U-shaped slider 202 that slides with the slide plate 3, as shown... Figure 2 As shown, the U-shaped slider 202 can slide along the slide plate 3. Each set of U-shaped sliders 202 is fixedly connected to one end of the segmented rod 201. The U-shaped slider 202 is threaded with a positioning bolt 203 that mates with the slide plate 3. By rotating the positioning bolt 203, the positioning bolt 203 presses against the slide plate 3, thereby achieving the positioning of the U-shaped slider 202 and the slide plate 3. A set of slide plates 3 is provided with a spacing range for adjusting the distance between adjacent sets of segmented rods 201. After the size of the PCB board 4 is determined, the distance between adjacent sets of segmented rods 201 can be adjusted according to the size of the PCB board 4, thereby adapting the size of the PCB board 4.

[0028] The upper side of the mounting frame 1 has a horizontally opened upper limit threaded hole 5. The upper and lower sides of the mounting frame 1 are provided with multiple sets of detachable limit frames 6 for limiting the PCB board 4. The limit frame 6 includes a U-shaped frame 601 for limiting the PCB board 4, and threaded connecting blocks 602 fixed at both ends of the U-shaped frame 601 and threadedly connected to the upper limit threaded hole 5. The threaded connecting blocks 602 are threadedly connected to the upper limit threaded hole 5 by bolts, thereby realizing the positioning of the U-shaped frame 601 and ensuring the limiting effect of the U-shaped frame 601 on the PCB board 4.

[0029] Multiple sets of lower limit threaded holes 7 are horizontally opened on the lower side of the mounting frame 1 to cooperate with the limit bracket 6. By bolting the limit bracket 6 to the lower limit threaded holes 7 at the corresponding positions, the bottom of the PCB board 4 is supported.

[0030] The upper limit threaded holes 5 are distributed in multiple sets longitudinally. By adjusting the connection of the threaded connecting block 602 with the upper limit threaded holes 5 at different heights, the height of the U-shaped frame 601 can be adjusted, so that the U-shaped frame 601 can be adapted to the height of the PCB board 4.

[0031] like Figure 2 As shown, the mounting frame 1 has openings on both sides, and each set of slide plates 3 extends to the opening position at both ends. Pushing the U-shaped slider 202 along the slide plate 3, the U-shaped slider 202 disengages from the slide plate 3 at the opening position, thereby facilitating the disassembly and replacement of the isolation limit rod 2.

[0032] The surface of the segmented rod 201 is coated with a protective paint layer, and the inner surface of the U-shaped frame 601 is coated with a protective paint layer. This protective paint layer includes epoxy resin, thereby ensuring that the surface of the segmented rod 201 and the inner surface of the U-shaped frame 601 have a certain degree of wear resistance, thereby improving the service life of the segmented rod 201 and the U-shaped frame 601.

[0033] To facilitate understanding of the embodiments of this solution by those skilled in the art, the working principle of the embodiments of this solution will now be explained in conjunction with specific application scenarios:

[0034] In use, the dimensions of the PCB board 4 to be copper plated must first be determined. Based on the dimensions of the PCB board 4, and referring to the spacing range on the sliding plate 3, the spacing between the two adjacent sets of U-shaped sliders 202 is adjusted. Then, the PCB board 4 is placed between the two adjacent sets of segmented rods 201, so that the two side edges of the PCB board 4 are aligned with the corresponding surrounding grooves on the two adjacent sets of segmented rods 201. The two sets of surrounding grooves limit and guide the PCB board 4. After the PCB board 4 is placed between the two adjacent sets of segmented rods 201, the bottom of the PCB board 4 will contact the U-shaped frame 601 at the bottom of the mounting frame 1. The U-shaped frame 601 supports the PCB board 4. Finally, the upper limit frame 6 is installed on the upper limit threaded hole 5 of appropriate height, thereby limiting the PCB board 4.

[0035] When the size of the PCB board 4 to be copper plated changes, in addition to adjusting the spacing between the two adjacent sets of segmented rods 201, it is also necessary to adjust the position of the limiting frame 6 relative to the mounting frame 1, so as to ensure that there are two sets of U-shaped frames 601 at the bottom of each set of installed PCB board 4 to support the PCB board 4, and to ensure the stability of the PCB board 4 during the copper plating process.

[0036] After prolonged use, the isolation limit rod 2 will experience some wear. When it is necessary to replace the isolation limit rod 2, the positioning bolt 203 can be rotated to allow the U-shaped slider 202 to slide relative to the slide plate 3. Then, push the U-shaped slider 202 to move along the slide plate 3 until the opening position is reached, at which point the U-shaped slider 202 disengages from the slide plate 3, thus facilitating the disassembly and replacement of the isolation limit rod 2.

[0037] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A PCB board copper plating floating frame device, characterized in that, The system includes a mounting frame (1), and the inner side of the mounting frame (1) is provided with multiple sets of isolation limiting rods (2) for separating multiple sets of PCB boards (4). Each set of isolation limiting rods (2) includes a segmented rod body (201) for separating multiple sets of PCB boards (4), and two sets of sliding components that slide in cooperation with the inner side of the mounting frame (1). The sliding components are located at both ends of the segmented rod body (201). The upper and lower sides of the mounting frame (1) are provided with multiple sets of detachable limiting frames (6) for limiting the PCB boards (4).

2. The PCB copper plating floatation frame device according to claim 1, wherein, Each set of segmented rods (201) has multiple sets of V-shaped bottom surrounding grooves equidistantly provided on the side for limiting the PCB board (4), and the positions of the multiple sets of surrounding grooves on adjacent sets of segmented rods (201) correspond to each other.

3. The PCB copper plating floatation device of claim 1, wherein, The mounting frame (1) has a sliding plate (3) fixedly connected to both sides inside. Each set of sliding components includes a U-shaped slider (202) that slides with the sliding plate (3). Each set of U-shaped sliders (202) is fixedly connected to one end of the segmented rod (201). The U-shaped slider (202) is threaded with a positioning bolt (203) that mates with the sliding plate (3).

4. The PCB copper plating floatation device of claim 3, wherein, A set of the aforementioned slide plates (3) is provided with a spacing range for adjusting the spacing between two adjacent sets of segmented rods (201).

5. The PCB copper plating floatation device of claim 1, wherein, The mounting frame (1) has an upper limit threaded hole (5) on its upper side. The limiting frame (6) includes a U-shaped frame (601) for limiting the PCB board (4) and threaded connecting blocks (602) fixed at both ends of the U-shaped frame (601) and threadedly connected to the upper limit threaded hole (5).

6. The PCB copper plating floatation rack apparatus of claim 1, wherein, The mounting frame (1) has multiple sets of lower limit threaded holes (7) that cooperate with the limit frame (6) on the lower side.

7. The PCB copper plating floatation device of claim 5, wherein, The upper limit threaded hole (5) is longitudinally distributed in multiple sets.

8. The PCB copper plating floatation device of claim 3, wherein, The mounting frame (1) has openings on both sides, and the two ends of each set of sliding plates (3) extend to the opening positions.

9. The PCB copper plating floatation rack apparatus of claim 1, wherein, The surface of the segmented rod (201) is coated with a protective paint layer.

10. The PCB copper plating floatation device of claim 5, wherein, The inner surface of the U-shaped frame (601) is coated with a protective paint layer.

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