Passive RFID temperature measuring device for mold

Abstract

The utility model discloses a passive RFID temperature measuring device used for a mould, comprising a probe assembly, an antenna assembly and a data acquisition assembly, the probe assembly comprises a probe arranged in the mould to be measured in a penetrating manner, the probe assembly and the antenna assembly form detachable connection through a radio frequency joint, the antenna assembly comprises an RFID antenna, and the data acquisition assembly is connected with the probe assembly. The data acquisition assembly comprises a data acquisition antenna and an RFID reader-writer, wherein the data acquisition antenna is used for receiving and processing transmission signals of the RFID antenna. According to the probe assembly disclosed by the utility model, the probe is embedded in the mold, the probe is not in contact with the molding cavity on the inner surface of the mold under the condition that temperature data in the mold can be accurately obtained, the molding work of the mold is not influenced, and the wire harness of the probe assembly is arranged on the outer side of the mold, so that the use work of the mold is not interfered.

Description

Technical Field

[0001] This utility model belongs to the field of tag temperature measurement technology, and relates to a passive RFID temperature measurement device for molds. Background Technology

[0002] In the injection molding and casting process, in order to ensure that the product is easy to form, has a smooth surface, accurate dimensions, and extends the service life of the mold, it is necessary to ensure that the mold temperature is selected within a suitable range.

[0003] Traditionally, mold temperature detection methods mainly include contact temperature measurement and non-contact temperature measurement. Existing non-contact temperature measurement uses infrared radiation to measure the temperature of the mold surface to infer the temperature change inside the mold. The measurement error is affected by temperature, light, and the surface finish of the object, and it cannot accurately display the internal temperature of the mold. Existing contact temperature measurement mostly uses temperature sensors such as thermocouples or thermistors. They are mostly set up as patches. If accurate data is required, they need to be attached to the inner surface of the molding cavity of the mold. The setup and operation are cumbersome, and the lead wires can easily interfere with the mold, and it is difficult to avoid affecting the molding effect of the mold. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model provides a passive RFID temperature measurement device for molds.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A passive RFID temperature measurement device for molds includes a probe assembly, an antenna assembly, and a data acquisition assembly. The probe assembly includes a probe inserted into the mold to be measured. The probe assembly and the antenna assembly are detachably connected via an RFID connector. The antenna assembly includes an RFID antenna. The data acquisition assembly includes a data acquisition antenna for receiving and processing the transmitted signals from the RFID antenna and an RFID reader.

[0007] Furthermore, the probe includes a PCB board, a temperature sensing chip, and a protective housing. The temperature sensing chip is connected to the PCB board, and the protective housing surrounds the outside of the PCB board. The temperature sensing chip forms contact points on the protective housing for contacting the mold under test.

[0008] Furthermore, the protective shell is made of metal, and the mold to be tested has holes for the protective shell to pass through. The outer wall or front end of the protective shell contacts the inner wall of the holes, and the temperature measuring chip is connected to the protective shell.

[0009] Furthermore, the front end of the protective shell abuts against the bottom of the hole to obtain the mold temperature, and a heat insulation gap is formed between the outer wall of the protective shell and the inner wall of the hole.

[0010] Furthermore, the protective shell is filled with a thermally conductive protective layer, which encloses the PCB board and the temperature sensing chip. The temperature sensing chip is connected to the protective shell through the thermally conductive protective layer.

[0011] Furthermore, the opening of the hole is provided with a sealing element. Furthermore, the probe assembly includes a first radio frequency connector, which is located outside the mold under test, and the probe is connected to the first radio frequency connector via a radio frequency cable.

[0012] Furthermore, the antenna assembly includes a second radio frequency connector for connection to the first radio frequency connector, and the RFID antenna is connected to the second radio frequency connector via a radio frequency line.

[0013] Furthermore, the RFID reader is provided with multiple interfaces for connecting multiple data acquisition antennas.

[0014] Furthermore, it also includes a host computer, which is connected to the RFID reader / writer.

[0015] In summary, the advantages of this utility model are as follows:

[0016] The probe assembly of this invention is embedded inside the mold, allowing for accurate acquisition of temperature data within the mold without contacting the inner surface of the molding cavity, thus not affecting the molding process. Furthermore, the probe assembly's wiring harness is located on the outside of the mold, without interfering with its operation. The probe assembly transmits and collects data via an antenna assembly and a data acquisition assembly. The detachable design of the antenna and probe assemblies allows for easy reassembly and disassembly when replacing molds, making it highly adaptable, convenient for mold setup, material-saving, and easy to manage. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the temperature measuring device of this utility model.

[0018] Figure 2 for Figure 1 A magnified structural diagram of A in the diagram.

[0019] The diagram shows the following components: 1. Mold to be tested; 211. PCB board; 212. Temperature sensing chip; 213. Protective shell; 214. Sealing component; 215. Thermal conductive protective layer; 216. Thermal insulation gap; 22. First RF connector; 31. RFID antenna; 32. Second RF connector; 41. Data acquisition antenna; 42. RFID reader; 43. Host computer. Detailed Implementation

[0020] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0021] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0022] In this embodiment of the invention, all directional indicators (such as up, down, left, right, front, back, horizontal, vertical, etc.) are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indicator will also change accordingly.

[0023] Due to installation errors and other reasons, the parallel relationship referred to in the embodiments of this utility model may actually be an approximate parallel relationship, and the perpendicular relationship may actually be an approximate perpendicular relationship.

[0024] This embodiment provides a passive RFID temperature measurement device for molds, used for temperature monitoring inside the mold, including a probe assembly, an antenna assembly, and a data acquisition assembly.

[0025] Reference Figure 1 The probe assembly includes a probe, an RF cable, and a first RF connector 22. The probe and the first RF connector 22 are connected by the RF cable. The probe and part of the RF cable are embedded in the mold under test 1, while the first RF connector 22 and the other part of the RF cable are exposed outside the mold under test 1. The embedding method includes, but is not limited to, drilling holes in the mold under test 1 to insert the probe, and providing a sealing member 214 at the opening of the hole. The sealing member 214 can be a molded part inserted into the opening, or it can be a hole opening filled with glue to seal it.

[0026] Reference Figure 2As shown, the probe includes a PCB board 211, a temperature sensing chip 212, and a protective shell 213. The temperature sensing chip 212 is disposed on the PCB board 211, and the protective shell 213 is sleeved on the outside of the PCB board 211, surrounding the entire PCB board 211 and the temperature sensing chip 212. The temperature sensing chip 212 forms a contact point for temperature sensing at the front end of the protective shell 213, which is used to make direct contact with the mold 1 under test, thereby obtaining the temperature data inside the mold 1 under test.

[0027] In this embodiment, the front end of the protective shell 213 abuts against the bottom of the hole, and the temperature measuring chip 212 accurately obtains the temperature of the mold under test through the heat conduction of the protective shell 213. A heat insulation gap 216 is formed between the outer wall of the protective shell 213 and the inner wall of the hole. The heat insulation gap 216 can reduce the high temperature impact of the mold temperature on the peripheral wall of the protective shell 213 and the electronic components on the PCB board 211 inside it, thereby improving the service life of the devices. Furthermore, when the sealing member 214 is molded by potting, the sealing member 214 will extend into the heat insulation gap 216. The adhesive sealing member 214 can further hinder the heat conduction from the mold under test to the peripheral wall of the protective shell 213. However, this utility model does not limit this in any way. In other embodiments, the outer wall of the protective shell 213 can also be set to be in contact with the inner wall of the mold under test 1 (i.e., the inner wall of the hole), and the temperature measuring chip 212 obtains the temperature of the mold under test through the outer wall of the protective shell 213.

[0028] In this embodiment, the protective shell 213 is made of metal to ensure excellent thermal conductivity, so that the temperature of the mold under test can be conducted to the temperature sensing chip 212 through the protective shell 213. However, this invention does not impose any limitations on this. In other embodiments, the temperature sensing chip may be located at the front end of the protective shell and exposed to the protective shell to directly contact the mold under test, while the protective shell covers other electronic components on the PCB board; this structure does not limit the thermal conductivity of the protective shell.

[0029] In this embodiment, the protective shell 213 is filled with a thermally conductive protective layer 215, which covers the PCB board 211 and the temperature measuring chip 212. The temperature measuring chip 212 is connected to the protective shell 213 through the thermally conductive protective layer. Specifically, the thermally conductive protective layer 215 is a thermally conductive and high-temperature resistant epoxy resin. However, this utility model does not impose any limitations on this.

[0030] In this embodiment, a resistor (not shown in the figure due to viewing angle) matching the impedance of the temperature sensing chip 212 is provided on the PCB board 211. The resistance of this resistor is 40 ohms to 60 ohms. Preferably, the resistance of this resistor is 50 ohms.

[0031] The antenna assembly includes an RFID antenna 31, a radio frequency line, and a second radio frequency connector 32. The RFID antenna 31 and the second radio frequency connector 32 are connected by the radio frequency line. The second radio frequency connector 32 is used to connect with the first radio frequency connector 22, so that the RFID antenna 31 is connected to the temperature measuring chip 212 of the probe. The temperature data inside the mold 1 to be tested obtained by the temperature measuring chip 212 is transmitted to the RFID antenna 31 through the radio frequency line and the radio frequency connector, and then transmitted outward through the RFID antenna 31.

[0032] The first RF connector 22 and the second RF connector 32 can be SMA connectors or MCX connectors. However, this invention does not impose any limitations on them.

[0033] Multiple probe assemblies can be installed inside a mold to monitor the temperature at different points inside the mold through different settings. There are multiple antenna assemblies, and the multiple antenna assemblies are connected to the multiple probe assemblies in a one-to-one correspondence.

[0034] The data acquisition component includes a data acquisition antenna 41, an RF cable, and an RFID reader / writer 42. The data acquisition antenna 41 and the RFID reader / writer 42 are connected via the RF cable. After the temperature measuring chip 212 is activated, the generated temperature data is transmitted outward through the RFID antenna 31. The data acquisition antenna 41 receives and acquires the signal from the RFID antenna 31 and sends it to the RFID reader / writer 42 for processing. One data acquisition antenna 41 can sequentially acquire the temperature data of multiple RFID antennas 31, and one RFID reader / writer 42 can have multiple interfaces for connecting multiple data acquisition antennas 41.

[0035] The RFID reader 42 is connected to a host computer 43 via a data transmission line. The host computer 43 is a computer or display instrument. The temperature data processed by the RFID reader 42 is uploaded to the host computer 43 for data display. Each probe component has an editable ID number. The temperature data can be uploaded to the computer in real time according to the ID number, which is convenient for monitoring the mold temperature based on the temperature data of different temperature measurement points. It is intuitive, efficient and beneficial to product molding.

[0036] Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort should fall within the protection scope of this utility model.

Claims

1. A passive RFID temperature measuring device for a mold, characterized by, The probe assembly includes a probe arranged in a mold (1) to be measured, the probe assembly is detachably connected with the antenna assembly through a radio frequency connector, the antenna assembly includes an RFID antenna (31), and the data acquisition assembly includes a data acquisition antenna (41) and an RFID reader (42) for receiving and processing a transmission signal of the RFID antenna (31).

2. The passive RFID temperature measuring device for a mold according to claim 1, wherein The probe includes a PCB (211), a temperature measuring chip (212) and a protective shell (213), the temperature measuring chip (212) is connected to the PCB (211), the protective shell (213) is arranged outside the PCB (211), and the temperature measuring chip (212) forms a contact point on the protective shell (213) for contacting the mold (1) to be measured.

3. The passive RFID temperature measuring device for a mold according to claim 2, wherein The protective shell (213) is made of metal, the mold (1) to be measured is provided with a hole for the protective shell (213) to pass through, and the outer wall or front end of the protective shell (213) is in contact with the inner wall of the hole.

4. The passive RFID temperature measuring device for a mold according to claim 3, wherein The front end of the protective shell (213) abuts against the bottom of the hole to obtain the mold temperature, and a heat insulation gap (215) is formed between the outer wall of the protective shell (213) and the inner wall of the hole.

5. The passive RFID temperature measuring device for a mold according to claim 3, wherein The protective shell (213) is filled with a heat-conducting protective layer, the heat-conducting protective layer wraps the PCB (211) and the temperature measuring chip (212), and the temperature measuring chip (212) is connected to the protective shell (213) through the heat-conducting protective layer.

6. The passive RFID temperature measuring device for a mold according to claim 3, wherein An opening of the hole is provided with a closure (214), the probe assembly includes a first radio frequency connector (22), the first radio frequency connector (22) is located outside the mold (1) to be measured, and the probe is connected to the first radio frequency connector (22) through a radio frequency line.

7. The passive RFID temperature measuring device for a mold according to claim 6, wherein The antenna assembly includes a second radio frequency connector (32) for connecting the first radio frequency connector (22), and the RFID antenna (31) is connected to the second radio frequency connector (32) through a radio frequency line.

8. The passive RFID temperature measuring device for a mold according to claim 1, wherein The RFID reader (42) is provided with a plurality of interfaces for connecting a plurality of data acquisition antennas (41).

9. The passive RFID temperature measuring device for a mold according to claim 1, wherein Further comprising a host computer (43), and the host computer (43) is connected with the RFID reader (42).

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