Atomic layer etching machine
By using fasteners and support bars in the atomic layer etching machine, the problem of reaction stage wobbling was solved, achieving reaction stability and consistency, and ensuring the effective execution of the thermal atomic layer etching process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 嘉兴中科微电子仪器与设备工程中心
- Filing Date
- 2025-02-13
- Publication Date
- 2026-04-21
AI Technical Summary
During thermal atomic layer etching, the chaotic movement of the reactive gases causes the reaction stage to shake, affecting the reaction effect.
Fasteners are used to keep the reaction platform stable in the reaction chamber to prevent it from shaking under the action of gas. The stability of the reaction platform is ensured by the combination of support bars and sockets.
It effectively prevents the reaction platform from shaking under gas impact, ensuring the stability and consistency of the reaction effect.
Smart Images
Figure CN224153359U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of atomic layer etching machine technology, and in particular to an atomic layer etching machine. Background Technology
[0002] Thermal atomic layer etching (ALE) is a thin-film etching process utilizing a series of self-limiting reactions. Similar to the layer-by-layer growth concept of atomic layer deposition (ALD), thermal ALE removes the thin-film material layer by layer. The reactions include surface modification and surface removal. For the ALE process, surface modification refers to the formation of a chemisorbed layer on the etched surface through the self-limiting adsorption of precursor vapors. Surface removal refers to the conversion of the chemisorbed layer into volatile etchant by introducing a suitable precursor. In the thermal ALE process, the separation of half-reactions helps prevent the interaction between surface modification and surface removal, controlling the sequence of surface reactions, enabling self-limiting reactions, and creating the window for ALE. This "discontinuous" approach avoids the formation of thick mixed layers and the resulting unrestricted reactivity found in continuous plasma etching.
[0003] Currently, thermal ALE and plasma ALE involve a wide variety of reaction gases. During the reaction, the chaotic movement of the gases can cause the reaction table to shake, affecting the reaction effect. Utility Model Content
[0004] In view of this, the present invention provides an atomic layer etching machine.
[0005] Specifically, this utility model is achieved through the following technical solution:
[0006] According to a first aspect of the present invention, an atomic layer etching machine is provided, comprising:
[0007] A server rack is used to install various components;
[0008] A reaction chamber is provided to provide a reaction space; the reaction chamber is located inside the cabinet; an insertion port is provided at the bottom of the reaction chamber;
[0009] A reaction platform is used to hold reactants; the reaction platform is movably disposed within the reaction chamber; a support bar is provided at the bottom of the reaction platform, and the support bar is inserted into or detached from the socket accordingly;
[0010] Fasteners are used to lock the support bar; the fasteners are movably disposed at the bottom of the reaction chamber, and are at least partially inserted into the socket and extend out of the outer bottom wall of the reaction chamber, and abut against or disengage from the support bar.
[0011] Optionally, the reaction chamber includes a reaction cavity and a top cover, wherein the top cover is disposed on the reaction cavity and the edges of the two are correspondingly sealed and connected, the reaction space is formed between the reaction cavity and the top cover, the insertion port is formed at the bottom of the reaction cavity, and the fastener is movably disposed at the bottom of the reaction cavity.
[0012] Optionally, a receiving cavity is formed in the bottom shell of the reaction chamber, the receiving cavity is connected to the socket, the fastener is movably disposed in the receiving cavity, and at least partially extends into the socket and at least partially extends out of the outer bottom wall of the reaction chamber.
[0013] Optionally, a spring is provided inside the receiving cavity, and the spring abuts against the inner wall of the receiving cavity and the fastener.
[0014] Optionally, the support bar is hinged to the reaction table.
[0015] Optionally, a support block is provided on the inner wall of the reaction chamber, and a notch is provided on the edge of the reaction table. When the reaction table moves upward in the reaction chamber, the notch passes through the support block. When the reaction table rotates horizontally at a preset angle and moves downward toward the support block, the support block supports the bottom wall of the reaction table.
[0016] Optionally, the reaction platform is provided with a support groove.
[0017] Optionally, a heating lamp is provided on the inner bottom wall of the top cover facing the reaction table.
[0018] Optionally, a heating block is provided between the reaction chamber and the reaction table.
[0019] Optionally, a heating lamp is provided on the inner bottom wall of the top cover facing the reaction table.
[0020] The technical solution provided by this utility model brings at least the following beneficial effects:
[0021] The atomic layer etching machine provided in this application uses fasteners to stably hold the reaction stage in the reaction chamber, preventing the reaction stage from shaking under the action of gas and affecting the reaction effect. Attached Figure Description
[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.
[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of the overall structure of an atomic layer etching machine provided in an embodiment of the present invention;
[0025] Figure 2 This is a schematic diagram of the internal structure of an atomic layer etching machine provided in an embodiment of the present invention;
[0026] Figure 3 This is a schematic diagram of the internal structure of an atomic layer etching machine provided in an embodiment of the present invention;
[0027] Figure 4 A top view of the reaction stage in an atomic layer etching machine provided for an embodiment of this utility model;
[0028] Figure 5 This is a schematic diagram of the internal structure of an atomic layer etching machine provided for an embodiment of the present invention. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0030] Figure 1 An atomic layer etching machine suitable for embodiments of the present invention is illustrated schematically.
[0031] Reference Figure 1-5 As shown, this application provides an atomic layer etching machine, comprising:
[0032] Cabinet 10 is used to install various components;
[0033] The reaction chamber 20 is used to provide reaction space; the reaction chamber 20 is disposed inside the cabinet 10; the bottom of the reaction chamber 20 is provided with an insertion port 21;
[0034] The reaction platform 30 is used to carry the reactants; the reaction platform 30 is movably disposed within the reaction chamber 20; a support bar 31 is provided at the bottom of the reaction platform 30, and the support bar 31 is inserted into or detached from the insertion port 21 accordingly;
[0035] Fastener 40 is used to lock the support bar 31; the fastener 40 is movably disposed at the bottom of the reaction chamber 20, and is at least partially inserted into the socket 21 and extends out of the outer bottom wall of the reaction chamber 20, and abuts against or disengages from the support bar 31.
[0036] In this embodiment, during the reaction, the fastener 40 stably keeps the reaction table 30 in the reaction chamber 20 to prevent it from shaking due to the impact of gas and affecting the reaction effect; when the reaction is over and the reaction table 30 needs to be removed, the fastener 40 is moved away from the support bar 31 to facilitate the removal of the reaction table 30 by a robotic arm. At this time, the support bar 31 is disengaged from the socket 21.
[0037] For example, the reaction chamber 20 includes a reaction cavity 22 and a top cover 23, wherein the top cover 23 covers the reaction cavity 22 and the edges of the two are correspondingly sealed and connected, the reaction space is formed between the reaction cavity 22 and the top cover 23, the insertion port 21 is formed at the bottom of the reaction cavity 22, and the fastener 40 is movably disposed at the bottom of the reaction cavity 22.
[0038] In this embodiment, the reaction chamber 22 and the top cover 23 are tightened by threads at the edge, and the bottom of the reaction chamber 22 is provided with an insertion port 21 for the support bar 31 to pass through; the fastener 40 is provided at the bottom of the reaction chamber 22 and can move at the bottom of the reaction chamber 22.
[0039] For example, a receiving cavity 24 is formed in the bottom shell of the reaction chamber 22. The receiving cavity 24 is connected to the socket 21. The fastener 40 is movably disposed in the receiving cavity 24 and extends at least partially into the socket 21 and at least partially extends out of the outer bottom wall of the reaction chamber 22.
[0040] In this embodiment, the bottom shell of the reaction chamber 22 has a receiving cavity 24 for mounting the fastener 40. To facilitate the fastener 40's fastening of the support bar 31, the receiving cavity 24 is connected to the insertion port 21. The fastener 40 is movably disposed within the receiving cavity 24 and at least partially extends into the insertion port 21. To facilitate the movement of the fastener 40, a hole is provided on the bottom of the receiving cavity 24 for the fastener 40 to extend out.
[0041] For example, a spring 25 is provided inside the receiving cavity 24, and the spring 25 abuts against the inner sidewall of the receiving cavity 24 and the fastener 40.
[0042] In this embodiment, when an external force is applied to the fastener 40, the fastener 40 moves and compresses the spring 25; when the external force is released, the spring 25 releases its elastic potential energy, causing the fastener 40 to reset.
[0043] For example, the support bar 31 is hinged to the reaction table 30.
[0044] In this embodiment, the support bar 31 is hinged to the reaction table 30. The number of support bars 31 is 2, 3, or 4, etc., used to support the reaction table 30 inside the reaction chamber 20. When the support bar 31 is disengaged from the socket 21, the support bar 31 can be bent and folded up.
[0045] For example, a support block 27 is provided on the inner sidewall of the reaction chamber 22, and a notch 32 is provided on the edge of the reaction table 30. When the reaction table 30 moves upward in the reaction chamber 22, the notch 32 passes through the support block 27. When the reaction table 30 rotates horizontally at a preset angle and moves downward toward the support block 27, the support block 27 supports the bottom wall of the reaction table 30.
[0046] In this embodiment, when the reaction platform 30 moves upward within the reaction chamber 22, the edge notch 32 of the reaction platform 30 passes through the support block 27, causing the height of the reaction platform 30 to exceed that of the support block 27. Then, the reaction platform 30 is rotated so that the notch 32 no longer corresponds to the support block 27, at which point the reaction platform 30 can be placed on the support block 27. The support blocks 27 are disposed on two opposite side walls of the reaction chamber 22, and the number of blocks on each side wall can be selected as needed.
[0047] For example, the reaction table 30 is provided with a support groove 33.
[0048] In this embodiment, the support groove 33 is used to place the reactants.
[0049] For example, a heating lamp 28 is provided on the inner bottom wall of the top cover 23 facing the reaction table 30.
[0050] In this embodiment, the heating lamp 28 is used to provide the reaction temperature and ensure the reaction environment.
[0051] For example, a heating block 29 is provided between the reaction chamber 22 and the reaction table 30.
[0052] In this embodiment, the heating block 29 generates heat and then contacts the reaction platform 30, which receives the heat and acts on the reactants.
[0053] For example, a heating lamp 28 is provided on the inner bottom wall of the top cover 23 facing the reaction table 30.
[0054] In this embodiment, the heating lamp 28 provides heat to the reactants from above, and the heating block 29 provides heat to the reactants from below, ensuring the temperature of the reaction environment.
[0055] The atomic layer etching machine provided in this application uses fasteners to stably hold the reaction stage in the reaction chamber, preventing the reaction stage from shaking under the action of gas and affecting the reaction effect.
[0056] It should be noted that in this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.
[0057] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0058] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0059] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.
[0060] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.
Claims
1. An atomic layer etching machine, characterized by, include: A server rack is used to install various components; A reaction chamber is provided to provide a reaction space; the reaction chamber is located inside the cabinet; an insertion port is provided at the bottom of the reaction chamber; A reaction platform is used to hold reactants; the reaction platform is movably disposed within the reaction chamber; a support bar is provided at the bottom of the reaction platform, and the support bar is inserted into or detached from the socket accordingly; Fasteners are used to lock the support bar in place; The fastener is movably disposed at the bottom of the reaction chamber, and is at least partially inserted into the socket and extends out of the outer bottom wall of the reaction chamber, and abuts against or disengages from the support bar.
2. The atomic layer etching machine according to claim 1, wherein The reaction chamber includes a reaction cavity and a top cover, wherein the top cover is disposed on the reaction cavity and the edges of the two are correspondingly sealed and connected, the reaction space is formed between the reaction cavity and the top cover, the insertion port is formed at the bottom of the reaction cavity, and the fastener is movably disposed at the bottom of the reaction cavity.
3. The atomic layer etching machine according to claim 2, wherein A receiving cavity is formed in the bottom shell of the reaction chamber. The receiving cavity is connected to the socket. The fastener is movably disposed in the receiving cavity and extends at least partially into the socket and at least partially extends out of the outer bottom wall of the reaction chamber.
4. The atomic layer etching machine according to claim 3, wherein A spring is provided inside the receiving cavity, and the spring abuts against the inner wall of the receiving cavity and the fastener.
5. The atomic layer etching machine of claim 1, wherein, The support bar is hinged to the reaction table.
6. The atomic layer etching machine of claim 2, wherein, A support block is provided on the inner wall of the reaction chamber, and a notch is provided on the edge of the reaction table. When the reaction table moves upward in the reaction chamber, the notch passes through the support block. When the reaction table rotates horizontally at a preset angle and moves downward toward the support block, the support block supports the bottom wall of the reaction table.
7. The atomic layer etching machine of claim 1, wherein, The reaction platform is provided with a support groove.
8. The atomic layer etching machine of claim 2, wherein, A heating lamp is installed on the inner bottom wall of the top cover, facing the reaction table.
9. The atomic layer etching machine according to claim 2, characterized in that, A heating block is provided between the reaction chamber and the reaction table.
10. The atomic layer etching machine of claim 9, wherein, A heating lamp is installed on the inner bottom wall of the top cover, facing the reaction table.