Flexible circuit board with efficient heat dissipation

Abstract

The utility model discloses a flexible circuit board with efficient heat dissipation, which comprises a base material, the base material is a flexible substrate and is made of polyimide materials, a conducting layer is arranged on the upper side of the base material, the conducting layer is a copper foil layer, a circuit is arranged in the conducting layer, an insulating heat conduction layer is arranged between the conducting layer and the base material and is made of silicon nitride inorganic materials, and the insulating heat conduction layer is made of silicon nitride inorganic materials. The insulating heat-conducting layer is arranged on the surface of the conductive layer. According to the flexible circuit board with the efficient heat dissipation function, heat generated by the conductive layer is absorbed through the insulation heat conduction layer, meanwhile, due to the fact that the lower portion of the insulation heat conduction layer is exposed to the outside, the heat dissipation openings are located in the positions where air can circulate, and heat exchange is conducted between the air and the insulation heat conduction layer; the air can take away heat in the insulating heat conduction layer, so that heat dissipation of the insulating heat conduction layer is accelerated, heat dissipation of the conductive layer can be effectively accelerated, and the flexible circuit board has the excellent property of efficient heat dissipation.

Description

Technical Field

[0001] This utility model relates to the technical field of circuit boards, specifically to a flexible circuit board with high-efficiency heat dissipation. Background Technology

[0002] Flexible printed circuit boards (FPCBs), also known as "flexible boards," are printed circuits made from flexible insulating substrates. Flexible circuits offer excellent electrical performance, meeting the design needs for smaller and higher-density installations, and also help reduce assembly steps and enhance reliability. FPCBs are the only solution for meeting the miniaturization and mobility requirements of electronic products. They can be freely bent, rolled, and folded, withstand millions of dynamic bends without damaging the wires, can be arranged arbitrarily according to spatial layout requirements, and can move and stretch freely in three-dimensional space, thereby achieving integration of component assembly and wire connection.

[0003] Existing flexible circuit boards (Flexible Printed Circuits) generate heat during operation due to their conductive structures. However, current Flexible Circuit Boards lack dedicated heat dissipation structures for these conductive structures, leading to various adverse effects due to inadequate heat dissipation. For example, Flexible Circuit Boards undergo thermal expansion at high temperatures, affecting the stability and reliability of electrical connections. Flexible materials such as polyimide may warp or deform at high temperatures, increasing the risk of poor electrical connections, short circuits, or open circuits. Furthermore, continuous high temperatures cause aging of the materials inside the Flexible Circuit Board, resulting in signal transmission delays and attenuation, impacting circuit efficiency and reliability. Therefore, we propose a Flexible Circuit Board with highly efficient heat dissipation. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a flexible circuit board with high-efficiency heat dissipation.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] This utility model discloses a flexible circuit board with high-efficiency heat dissipation, comprising a substrate, which is a flexible substrate made of polyimide material, a conductive layer disposed on the upper side of the substrate, the conductive layer being a copper foil layer, circuitry disposed in the conductive layer, and an insulating and thermally conductive layer disposed between the conductive layer and the substrate, the insulating and thermally conductive layer being a silicon nitride inorganic material, and the insulating and thermally conductive layer being disposed on the surface of the conductive layer.

[0007] It also includes a protective layer covering the conductive layer and the insulating and thermally conductive layer. The protective layer is made of polyimide and is used to protect the circuitry in the conductive layer. It also includes a connector that penetrates the protective layer and is electrically connected to the circuitry in the conductive layer. The connector is used to establish an electrical connection between the flexible circuit board and other electronic components.

[0008] The protective layer and the substrate are bonded together with an adhesive, the conductive layer and the protective layer are bonded together with an adhesive, and the insulating and thermally conductive layer is bonded together with the substrate and the conductive layer with an adhesive.

[0009] The substrate has multiple heat dissipation openings that penetrate the substrate, and the insulating and thermally conductive layer is exposed to the outside through the heat dissipation openings.

[0010] As a preferred embodiment of this utility model, the heat dissipation vent is provided with a plurality of equidistantly arranged support components, which are used to support the heat dissipation vent and keep the heat dissipation vent in an open state.

[0011] As a preferred embodiment of the present invention, the support component includes two spaced blocks, both of which are inserted into heat dissipation vents, and a support strip is provided between the two blocks.

[0012] As a preferred embodiment of this utility model, the support bar is configured in an X shape, and the upper and lower ends of the support bar are fixedly connected to the blocks on both sides, and the surface of the blocks is provided with anti-slip texture.

[0013] As a preferred embodiment of this utility model, both the bottom surface of the substrate and the upper surface of the protective layer are coated with a fireproof layer.

[0014] As a preferred embodiment of this invention, the fireproof layer is a neoprene latex fireproof coating.

[0015] As a preferred embodiment of this invention, the outer side of the fireproof layer is bonded with a flexible wear-resistant layer by an adhesive.

[0016] As a preferred embodiment of this invention, the flexible wear-resistant layer is made of polyvinyl chloride polymer material.

[0017] As a preferred technical solution of this utility model, the outer surfaces of the flexible wear-resistant layers on both sides are integrally provided with raised reinforcing ribs.

[0018] The beneficial effects of this utility model are:

[0019] In this type of flexible circuit board with high-efficiency heat dissipation, the heat generated by the conductive layer is absorbed by the insulating thermally conductive layer. At the same time, since the area below the insulating thermally conductive layer is exposed to the outside world, the heat dissipation vent is open to airflow. The air exchanges heat with the insulating thermally conductive layer, and the air can carry away the heat in the insulating thermally conductive layer, thereby accelerating the heat dissipation of the insulating thermally conductive layer. Therefore, it can effectively accelerate the heat dissipation of the conductive layer, giving the flexible circuit board excellent properties of high-efficiency heat dissipation.

[0020] The support strip, together with two blocks, provides support for the heat dissipation vent, preventing the vent from collapsing and becoming blocked. This ensures unobstructed airflow within the vent, helping the insulating thermally conductive layer maintain efficient heat dissipation. Attached Figure Description

[0021] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0022] Figure 1 This is a schematic diagram of the structure of a flexible circuit board with high-efficiency heat dissipation according to the present invention;

[0023] Figure 2 This utility model relates to a flexible circuit board with high-efficiency heat dissipation. Figure 1 A schematic diagram of the layered structure at point A in the diagram.

[0024] In the figure: substrate 101, conductive layer 102, insulating and thermally conductive layer 103, protective layer 104, connector 105, heat dissipation port 106, block 107, support strip 108, fireproof layer 109, flexible wear-resistant layer 110, reinforcing rib 111. Detailed Implementation

[0025] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0026] Example: Figure 1 and Figure 2 As shown, this utility model discloses a flexible circuit board with high-efficiency heat dissipation, comprising a substrate 101, which is a flexible substrate made of polyimide. A conductive layer 102, which is a copper foil layer, is disposed on the upper side of the substrate 101, and circuitry is disposed within the conductive layer 102. An insulating and thermally conductive layer 103, made of silicon nitride inorganic material, is disposed between the conductive layer 102 and the substrate 101, and is disposed on the surface of the conductive layer 102. The insulating and thermally conductive layer 103 possesses both good insulation and good thermal conductivity, and can absorb the heat generated by the conductive layer 102 during operation.

[0027] It also includes a protective layer 104 covering the conductive layer 102 and the insulating and thermally conductive layer 103. The protective layer 104 is made of polyimide and is used to protect the circuitry in the conductive layer 102. It also includes a connector 105 that penetrates the protective layer 104 and is electrically connected to the circuitry in the conductive layer 102. The connector 105 is used to establish electrical connections between the flexible circuit board and other electronic components. The protective layer 104, together with the insulating and thermally conductive layer 103, provides good protection and insulation for the circuitry in the conductive layer 102.

[0028] The protective layer 104 and the substrate 101 are bonded together with an adhesive, the conductive layer 102 and the protective layer 104 are bonded together with an adhesive, and the insulating and thermally conductive layer 103 is bonded together with the substrate 101 and the conductive layer 102 with an adhesive.

[0029] The substrate 101 has multiple heat dissipation holes 106 that penetrate the substrate 101, and the insulating and thermally conductive layer 103 is exposed to the outside through the heat dissipation holes 106.

[0030] The heat generated by the conductive layer 102 is absorbed by the insulating thermally conductive layer 103. At the same time, since the area below the insulating thermally conductive layer 103 is exposed to the outside, the heat dissipation port 106 is open to airflow. The air exchanges heat with the insulating thermally conductive layer 103, and the air can carry away the heat in the insulating thermally conductive layer 103, thereby accelerating the heat dissipation of the insulating thermally conductive layer 103. Therefore, the heat dissipation of the conductive layer 102 can be effectively accelerated, giving the flexible circuit board excellent properties of high-efficiency heat dissipation.

[0031] Because flexible circuit boards need to bend or undergo other deformations during operation, the heat dissipation vent 106 may be in a recessed state, preventing outside air from circulating efficiently in the heat dissipation vent 106, thus affecting the normal heat dissipation of the flexible circuit board.

[0032] The heat dissipation vent 106 is provided with multiple equidistantly arranged support components, which support the heat dissipation vent 106 and keep it in an open state. Each support component includes two spaced-apart blocks 107, both of which are inserted into the heat dissipation vent 106, with a support strip 108 positioned between them. To install the blocks 107 and support strip 108, simply insert them into the heat dissipation vent 106, with the support strips 108 spaced apart.

[0033] Multiple sets of support bars 108 and blocks 107 work together to support the heat dissipation port 106, preventing the heat dissipation port 106 from collapsing and becoming blocked. This ensures that the airflow inside the heat dissipation port 106 remains unobstructed, which helps the insulating heat-conducting layer 103 maintain a state of efficient heat dissipation.

[0034] The support bar 108 is X-shaped, and the upper and lower ends of the support bar 108 are fixed to the blocks 107 on both sides. The surface of the blocks 107 is provided with anti-slip texture, so that the blocks 107 are not easy to slide in the heat dissipation vent 106, thus the support bar 108 and the blocks 107 are not easy to detach from the heat dissipation vent 106.

[0035] Both the bottom surface of the substrate 101 and the upper surface of the protective layer 104 are coated with a fire-retardant layer 109. The fire-retardant layer 109 is a neoprene rubber emulsion fire-retardant coating. This coating exhibits excellent fire resistance. When exposed to a fire source, it forms a protective layer, effectively isolating oxygen and slowing the spread of fire. Simultaneously, the neoprene rubber emulsion fire-retardant coating releases hydrogen chloride gas at high temperatures, providing a certain degree of fire extinguishing effect. This improved fire resistance is of great significance in protecting flexible circuit boards from fire damage.

[0036] The fireproof layer 109 has a flexible wear-resistant layer 110 bonded to its outer side with an adhesive. The flexible wear-resistant layer 110 is made of polyvinyl chloride (PVC) polymer material. PVC polymer material has excellent wear resistance, effectively resisting external abrasion and scratches. This significantly improves the overall wear resistance of the structure and extends its service life. Simultaneously, PVC polymer material has a certain degree of flexibility, allowing it to adapt to the deformation of the flexible circuit board.

[0037] The outer surfaces of both flexible wear-resistant layers 110 are integrally provided with raised reinforcing ribs 111. By setting the reinforcing ribs 111, the tensile strength of the flexible circuit board in the horizontal direction is enhanced, making the flexible circuit board less likely to be pulled apart during use.

[0038] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A flexible circuit board with high-efficiency heat dissipation, characterized in that, The substrate (101) is a flexible substrate made of polyimide. A conductive layer (102) is disposed on the upper side of the substrate (101). The conductive layer (102) is a copper foil layer and has circuits disposed therein. An insulating and thermally conductive layer (103) is disposed between the conductive layer (102) and the substrate (101). The insulating and thermally conductive layer (103) is made of silicon nitride inorganic material and is disposed on the surface of the conductive layer (102). It also includes a protective layer (104) covering the conductive layer (102) and the insulating and thermally conductive layer (103), the protective layer (104) being polyimide, the protective layer (104) being used to protect the circuitry in the conductive layer (102), and a connector (105) being included, the connector (105) penetrating the protective layer (104) and being electrically connected to the circuitry in the conductive layer (102), the connector (105) being used to establish an electrical connection between the flexible circuit board and other electronic components; The protective layer (104) and the substrate (101) are bonded together with an adhesive, the conductive layer (102) and the protective layer (104) are bonded together with an adhesive, and the insulating and thermally conductive layer (103) is bonded together with the substrate (101) and the conductive layer (102) with an adhesive. The substrate (101) has a plurality of heat dissipation holes (106) that penetrate the substrate (101), and the insulating thermally conductive layer (103) is exposed to the outside through the heat dissipation holes (106).

2. The flexible circuit board of claim 1, wherein, The heat dissipation vent (106) is provided with a plurality of equidistantly arranged support components, which are used to support the heat dissipation vent (106) and keep the heat dissipation vent (106) in an open state.

3. The flexible circuit board of claim 2, wherein, The support assembly includes two spaced blocks (107), both of which are inserted into the heat dissipation vent (106), and a support strip (108) is provided between the two blocks (107).

4. The flexible circuit board of claim 3, wherein The support bar (108) is set in an X shape. The upper and lower ends of the support bar (108) are fixed to the blocks (107) on both sides. The surface of the blocks (107) is provided with anti-slip texture.

5. The flexible circuit board of claim 1, wherein, The bottom surface of the substrate (101) and the upper surface of the protective layer (104) are both coated with a fireproof layer (109).

6. The flexible circuit board of claim 5, wherein, The fireproof layer (109) is a neoprene emulsion fireproof coating.

7. The flexible circuit board of claim 5, wherein the conductive layer is formed of a material selected from the group consisting of copper, aluminum, silver, gold, and combinations thereof. The fireproof layer (109) has a flexible wear-resistant layer (110) bonded to its outer side by an adhesive.

8. The flexible circuit board of claim 7, wherein, The flexible wear-resistant layer (110) is made of polyvinyl chloride polymer material.

9. The flexible circuit board of claim 7, wherein the conductive layer is formed of a material selected from the group consisting of copper, silver, gold, aluminum, and combinations thereof. Both sides of the flexible wear-resistant layer (110) are integrally provided with raised reinforcing ribs (111).

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