Cooling structure and electrical equipment

Abstract

The utility model relates to a cooling structure and electrical equipment, the cooling structure is used for the electrical equipment, the electrical equipment comprises a shell, a power module and a bus capacitor, the cooling structure comprises a first cooling flow channel, a second cooling flow channel and a third cooling flow channel which are connected in sequence, the power module and the bottom wall of the shell enclose to form the first cooling flow channel, and the second cooling flow channel is connected with the bus capacitor. A second cooling flow channel is formed in the side wall of the shell, a third cooling flow channel is formed in the bottom wall of the shell, the position, corresponding to the second cooling flow channel, of the copper bar of the bus capacitor is in heat conduction connection with the side wall of the shell, and the position, corresponding to the third cooling flow channel, of the main body of the bus capacitor is in heat conduction connection with the bottom wall of the shell. According to the cooling structure, the power module, the copper bar of the bus capacitor and the main body of the bus capacitor are respectively cooled by utilizing the space of the bottom wall and the side wall of the shell, so that the cooling effect of the power module and the bus capacitor is ensured, and adverse effects on the overall performance and reliability of the electrical equipment caused by over-high internal temperature of the electrical equipment are avoided.

Description

Technical Field

[0001] This utility model relates to the field of controller technology, and in particular to a cooling structure and electrical equipment. Background Technology

[0002] Currently, some electrical equipment, such as motor controllers and converters, has power modules and bus capacitors. During the operation of the electrical equipment, the bus capacitors convert into heat energy during charging and discharging, affecting the electrical and mechanical performance of the capacitors. The power modules generate a lot of heat under long-term operation and frequent switching, increasing the probability of failure and adversely affecting the overall performance and reliability of the electrical equipment. Therefore, how to design a heat dissipation and cooling structure to effectively dissipate heat from electrical equipment with power modules and bus capacitors has become an important technical problem that needs to be solved by those skilled in the art. Utility Model Content

[0003] The first objective of this invention is to provide a cooling structure that can cool and dissipate heat from power modules and bus capacitors in electrical equipment, thereby improving the overall performance and reliability of the electrical equipment.

[0004] The second objective of this invention is to provide an electrical device that includes the aforementioned cooling structure.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A cooling structure is provided for electrical equipment, the electrical equipment including a housing, a power module, and a bus capacitor. The cooling structure includes a first cooling channel, a second cooling channel, and a third cooling channel connected in sequence. The power module and the bottom wall of the housing form the first cooling channel. The second cooling channel is formed inside the side wall of the housing. The third cooling channel is formed inside the bottom wall of the housing. The copper busbar of the bus capacitor is thermally connected to the side wall of the housing at the location corresponding to the second cooling channel. The body of the bus capacitor is thermally connected to the bottom wall of the housing at the location corresponding to the third cooling channel.

[0007] In one embodiment of this application, the power module is provided with a needle-tooth water-cooled plate located in the first cooling channel.

[0008] In one embodiment of this application, the sidewall with the second cooling channel includes a sidewall body and a side mounting plate. The sidewall body and the side mounting plate are detachably and sealingly fitted to form the second cooling channel. A first heat dissipation member is provided on the sidewall body and extends into the second cooling channel.

[0009] In one embodiment of this application, the first heat dissipation component includes a plurality of heat dissipation columns, the cross-section of which is one of a circle, an ellipse, a rhombus, a boat shape, and a teardrop shape.

[0010] In one embodiment of this application, the bottom wall of the housing includes a bottom wall body and a bottom mounting plate. The bottom wall body and the bottom mounting plate are detachably and sealingly fitted to form the third cooling channel. The bottom wall body is provided with a second heat dissipation component, which extends into the third cooling channel.

[0011] In one embodiment of this application, baffles are alternately provided on both sides of the bottom wall body and / or the bottom mounting plate along the direction from the first end to the second end of the third cooling channel, so that the third cooling channel forms a meandering structure. The second heat dissipation component includes multiple sets of heat dissipation plates, and each set of heat dissipation plates is arranged at intervals along the extension direction of the third cooling channel.

[0012] In one embodiment of this application, a thermally conductive silicone pad is provided between the copper busbar of the bus capacitor and the side wall of the housing.

[0013] In one embodiment of this application, the cooling structure further includes a liquid inlet channel, a first end of which is connected to the end of the first cooling channel away from the second cooling channel, and a second end of which extends to the side wall or bottom wall of the housing and forms a liquid inlet.

[0014] In one embodiment of this application, the third cooling channel extends to the side wall or bottom wall of the housing and forms a liquid outlet.

[0015] An electrical device, wherein the electrical device is provided with a cooling structure as described in any of the above claims.

[0016] As can be seen from the above technical solution, this utility model discloses a cooling structure for use in electrical equipment. The electrical equipment includes a housing, a power module, and a bus capacitor. The cooling structure includes a first cooling channel, a second cooling channel, and a third cooling channel connected in sequence. The power module and the bottom wall of the housing form the first cooling channel. The second cooling channel is formed inside the side wall of the housing, and the third cooling channel is formed inside the bottom wall of the housing. The copper busbar of the bus capacitor is thermally connected to the side wall of the housing at the location corresponding to the second cooling channel, and the main body of the bus capacitor is thermally connected to the bottom wall of the housing at the location corresponding to the third cooling channel.

[0017] During application, the coolant flows sequentially through the first cooling channel, the second cooling channel, and the third cooling channel. The space on the bottom and side walls of the housing is used to dissipate heat from the copper busbars of the power module and the main body of the bus capacitor, respectively. This ensures the heat dissipation effect of the power module and the bus capacitor, and avoids excessive internal temperature of the electrical equipment, which could adversely affect the overall performance and reliability of the electrical equipment. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the structure of the housing with a cooling structure provided in an embodiment of this utility model;

[0020] Figure 2 A top view of a housing with a cooling structure provided for an embodiment of this utility model;

[0021] Figure 3 A side view of a housing with a cooling structure provided for an embodiment of this utility model;

[0022] Figure 4 A bottom view of a housing with a cooling structure provided for an embodiment of this utility model;

[0023] Figure 5 A partial structural schematic diagram of the first cooling channel of the cooling structure provided in an embodiment of this utility model;

[0024] Figure 6 A bottom view of the power module of the cooling structure provided in an embodiment of this utility model;

[0025] Figure 7 A cross-sectional view of the second cooling channel of the cooling structure provided in an embodiment of this utility model;

[0026] Figure 8 A schematic diagram of the internal structure of the second cooling channel of the cooling structure provided in an embodiment of this utility model;

[0027] Figure 9 A partial structural diagram of the cooling structure provided in the embodiment of this utility model at the third cooling channel;

[0028] Figure 10 A schematic diagram of the internal structure of the third cooling channel of the cooling structure provided in an embodiment of this utility model;

[0029] Figure 11 A schematic diagram of the liquid inlet channel of the cooling structure provided in this embodiment of the utility model.

[0030] In the picture:

[0031] 1 is the housing; 110 is the side wall; 111 is the main body of the side wall; 112 is the side mounting plate; 120 is the bottom wall; 121 is the main body of the bottom wall; 122 is the bottom mounting plate; 2 is the liquid inlet; 3 is the liquid outlet; 4 is the power module; 5 is the bus capacitor; 501 is the main body of the bus capacitor; 502 is the copper busbar of the bus capacitor; 6 is the pin-tooth water-cooled plate; 7 is the first cooling channel; 710 is the groove; 720 is the inlet; 730 is the outlet; 8 is the second cooling channel; 9 is the heat dissipation column; 10 is the thermally conductive silicone pad; 11 is the third cooling channel; 12 is the baffle; 13 is the heat dissipation plate; 14 is the liquid inlet channel. Detailed Implementation

[0032] One of the core features of this invention is to provide a cooling structure. The design of this cooling structure enables it to cool and dissipate heat from the power modules and bus capacitors in electrical equipment, thereby improving the overall performance and reliability of the electrical equipment.

[0033] Another core aspect of this invention is to provide an electrical device based on the aforementioned cooling structure.

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Please see Figures 1 to 10 This utility model discloses a cooling structure for use in electrical equipment. The electrical equipment includes a housing 1, a power module 4, and a bus capacitor 5. The cooling structure includes a first cooling channel 7, a second cooling channel 8, and a third cooling channel 11 connected in sequence.

[0036] The power module 4 and the bottom wall 120 of the housing 1 form a first cooling channel 7. The end of the first cooling channel 7 away from the second cooling channel 8 is connected to the liquid inlet 2. The second cooling channel 8 is formed in the side wall 110 of the housing 1. The third cooling channel 11 is formed in the bottom wall 120 of the housing 1. The end of the third cooling channel 11 away from the second cooling channel 8 is connected to the liquid outlet 3. The copper busbar 502 of the bus capacitor 5 is thermally connected to the side wall 110 of the housing 1 at the position corresponding to the second cooling channel 8. The main body 501 of the bus capacitor 5 is thermally connected to the bottom wall 120 of the housing 1 at the position corresponding to the third cooling channel 11.

[0037] Compared with the prior art, the cooling structure provided in this embodiment of the utility model allows the coolant to flow sequentially through the first cooling channel 7, the second cooling channel 8, and the third cooling channel 11. The space between the bottom wall 120 and the side wall 110 of the housing 1 is used to dissipate heat from the power module 4, the copper busbar 502 of the bus capacitor 5, and the main body 501 of the bus capacitor 5, respectively. This ensures the heat dissipation effect of the power module 4 and the bus capacitor 5, and avoids excessively high internal temperature of the electrical equipment, which could adversely affect the overall performance and reliability of the electrical equipment.

[0038] To improve the heat dissipation and cooling efficiency of the power module 4, in one embodiment of this application, such as... Figure 5 and Figure 6 As shown, the power module 4 is provided with a pin-tooth water-cooled plate 6 located in the first cooling channel 7. The pin-tooth water-cooled plate 6 includes a plate body and densely arranged pins on the plate body. The pins extend into the first cooling channel 7. The cross-sectional shape of the pins includes, but is not limited to, circles, rhombuses, rectangles, and ellipses. Through the pin-tooth water-cooled plate 6, the contact area between the power module 4 and the coolant can be increased, accelerating the heat exchange between the heat generated by the power module 4 during operation and the coolant, thereby improving the heat dissipation efficiency of the power module 4.

[0039] To further optimize the above technical solution, in one embodiment of this application, since the first cooling channel 7 is formed by the housing 1 and the power module 4, in order to facilitate the formation of the first cooling channel 7 on the housing 1, a groove 710 is provided on the surface of the housing 1 for mounting the power module 4. The two ends of the groove 710 are respectively provided with downwardly extending channels, which serve as the inlet 720 and outlet 730 of the first cooling channel 7. The cross-sectional shape and size of the groove 710 are adapted to the shape and size of the power module 4.

[0040] To facilitate the formation of the second cooling channel 8, in one embodiment of this application, such as Figure 3 , Figure 7 and Figure 8As shown, the sidewall 110 with the second cooling channel 8 includes a sidewall body 111 and a side mounting plate 112. The sidewall body 111 and the side mounting plate 112 are detachably and sealed together to form the second cooling channel 8. A first heat dissipation component is provided on the sidewall body 111. The first heat dissipation component extends into the second cooling channel 8. The first heat dissipation component can turbulent the cooling liquid in the second cooling channel 8 and increase the heat exchange area between the sidewall body 111 and the cooling liquid, thereby improving the heat dissipation effect of the copper busbar 502 of the bus capacitor 5 that is in contact with the sidewall body 111.

[0041] Specifically, such as Figure 8 As shown, in one embodiment of this application, the first heat dissipation component includes a plurality of heat dissipation columns 9. The cross-section of the heat dissipation column 9 is one of the following: circular, elliptical, rhomboid, boat-shaped, and teardrop-shaped. It should be noted that the heat dissipation column 9 is only a preferred embodiment provided by this application. The first heat dissipation component is not limited to a columnar structure. The first heat dissipation component can also be a plate-fin structure or a combination of a plate-fin structure and a columnar structure, as long as it can play a turbulence effect on the cooling liquid and increase the heat exchange area between the side wall body 111 and the cooling liquid. There is no limitation here.

[0042] like Figure 4 , Figure 9 and Figure 10 As shown, the bottom wall 120 of the housing 1 includes a bottom wall body 121 and a bottom mounting plate 122. The bottom wall body 121 and the bottom mounting plate 122 are detachably and sealed together to form a third cooling channel 11. The bottom wall body 121 is provided with a second heat dissipation component, which extends into the third cooling channel 11. The second heat dissipation component can turbulent the cooling liquid in the third cooling channel 11 and increase the heat exchange area between the bottom wall body 121 and the cooling liquid, thereby improving the heat dissipation effect of the main body 501 of the bus capacitor 5 that is in contact with the bottom wall body 121.

[0043] like Figure 10 As shown, in one embodiment of this application, baffles 12 are alternately spaced on both sides of the bottom wall body 121 and / or bottom mounting plate 122 along the direction from the first end to the second end of the third cooling channel 11, so that the third cooling channel 11 forms a meandering structure, increasing the length of the third cooling channel 11, prolonging the residence time of the cooling liquid in the third cooling channel 11, and enhancing heat exchange. Correspondingly, the second heat dissipation component includes multiple sets of heat dissipation plates 13, each set of heat dissipation plates 13 including at least two heat dissipation plates 13 arranged side by side at intervals, such as... Figure 10As shown, some of the heat sinks 13 in the heat sink 13 groups are straight plates. At the bend of the third cooling channel 11, the heat sinks 13 in the heat sink 13 groups are bent plates that match the shape of the bend of the third cooling channel 11. Each group of heat sinks 13 is arranged at intervals along the extension direction of the third cooling channel 11. The multiple heat sinks 13 groups not only have a turbulence effect on the cooling liquid, but also increase the heat exchange area between the bottom wall body 121 and the cooling liquid, and enhance the cooling effect on the body 501 of the bus capacitor 5. Of course, the second heat sink is not limited to the above structure. The second heat sink can also adopt other structures, such as a columnar structure or a combination of a columnar structure and a plate fin structure.

[0044] To further optimize the above technical solution, in one embodiment of this application, a thermally conductive silicone pad 10 is provided between the copper busbar 502 of the bus capacitor 5 and the side wall 110 of the housing 1 to remove air between the copper busbar 502 of the bus capacitor 5 and the side wall 110 of the housing 1, thereby further increasing the heat exchange efficiency and improving the cooling effect.

[0045] The cooling structure also includes a liquid inlet channel 14. The first end of the liquid inlet channel 14 is connected to the end of the first cooling channel 7 furthest from the second cooling channel 8. Depending on the structure of the electrical equipment, and for ease of connection to the coolant circulation system and installation of the electrical equipment, the second end of the liquid inlet channel 14 can extend to the side wall 110 or bottom wall 120 of the housing 1 and form a liquid inlet 2. Figure 11 As shown, in one specific embodiment of this application, the second end of the liquid inlet channel 14 extends to the side wall 110 of the housing 1, which is in a different direction from the side mounting plate 112.

[0046] The third cooling channel 11 can extend to the side wall 110 or bottom wall 120 of the housing 1 and form a liquid outlet 3, such as Figure 1 and Figure 9 As shown, in one embodiment of this application, the third cooling channel 11 extends to the bottom wall 120 of the housing 1.

[0047] This application also provides an electrical device with a cooling structure as described in the above embodiments. The electrical device includes, but is not limited to, a motor controller and a converter. Since the electrical device adopts the cooling structure in the above embodiments, the technical effect of the electrical device can be referred to the above embodiments.

[0048] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0049] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. Cooling structure for an electrical device, the electrical device comprising a housing (1), a power module (4) and a bus capacitor (5), characterized in that The cooling structure includes a first cooling channel (7), a second cooling channel (8), and a third cooling channel (11) connected in sequence. The power module (4) and the bottom wall (120) of the housing (1) form the first cooling channel (7). The second cooling channel (8) is formed in the side wall (110) of the housing (1). The third cooling channel (11) is formed in the bottom wall (120) of the housing (1). The copper busbar (502) of the bus capacitor (5) is thermally connected to the side wall (110) of the housing (1) at the position corresponding to the second cooling channel (8). The main body (501) of the bus capacitor (5) is thermally connected to the bottom wall (120) of the housing (1) at the position corresponding to the third cooling channel (11).

2. The cooling structure according to claim 1, characterized by The power module (4) is provided with a needle-tooth water-cooled plate (6) located in the first cooling channel (7).

3. The cooling structure according to claim 1, characterized by The sidewall (110) provided with the second cooling channel (8) includes a sidewall body (111) and a side mounting plate (112). The sidewall body (111) and the side mounting plate (112) are detachably and sealed together to form the second cooling channel (8). The sidewall body (111) is provided with a first heat dissipation component, which extends into the second cooling channel (8).

4. The cooling structure according to claim 3, characterized by The first heat dissipation component includes a plurality of heat dissipation columns (9), and the cross-section of the heat dissipation column (9) is one of the following: circular, elliptical, rhomboid, boat-shaped and teardrop-shaped.

5. The cooling structure according to claim 1, characterized by The bottom wall (120) of the housing (1) includes a bottom wall body (121) and a bottom mounting plate (122). The bottom wall body (121) and the bottom mounting plate (122) are detachably and sealed together to form the third cooling channel (11). The bottom wall body (121) is provided with a second heat dissipation component, which extends into the third cooling channel (11).

6. The cooling structure according to claim 5, characterized by The bottom wall body (121) and / or the bottom mounting plate (122) are alternately provided with baffles (12) on both sides of the third cooling channel (11) from the first end to the second end, so that the third cooling channel (11) forms a meandering structure. The second heat dissipation component includes multiple sets of heat dissipation plates (13), and each set of heat dissipation plates (13) is arranged at intervals along the extension direction of the third cooling channel (11).

7. The cooling structure according to claim 1, characterized by A thermally conductive silicone pad (10) is provided between the copper busbar (502) of the bus capacitor (5) and the side wall (110) of the housing (1).

8. The cooling structure according to claim 1, characterized by The cooling structure further includes a liquid inlet channel (14), the first end of which is connected to the end of the first cooling channel (7) away from the second cooling channel (8), and the second end of which extends to the side wall (110) or bottom wall (120) of the housing (1) and forms a liquid inlet (2).

9. The cooling structure according to claim 1, characterized by The third cooling channel (11) extends to the side wall (110) or bottom wall (120) of the housing (1) and forms a liquid outlet (3).

10. An electrical device, characterized by The electrical equipment is provided with a cooling structure as described in any one of claims 1-9.

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