Built-in layered heat dissipation structure of photovoltaic inverter

Abstract

The utility model discloses a built-in layered heat dissipation structure of a photovoltaic inverter, a first heat dissipation space layer is formed between a first circuit board and an inverter box body, a second heat dissipation space layer is formed between a second circuit board and a tray, and two opposite ends of the tray are respectively provided with a first fan and a second fan. The first fan and the second fan are relatively staggered, the first fan is provided with a first air outlet end opposite to the first heat dissipation space layer and a second air outlet end opposite to the second heat dissipation space layer, and the second fan is located in the first heat dissipation space layer. According to the utility model, the formation of layered differential heat dissipation air flow channels can be realized, and the heat dissipation air flow channels are relatively balanced by utilizing the convection and shunting layout of the two fans. Interaction between the two layers of heat dissipation spaces is met, the internal temperature of the inverter can be balanced, stable operation of the inverter is maintained, and the effective service life of the inverter is prolonged. The heat dissipation structure is compact and ingenious in layout, the cost is effectively controlled, and the heat dissipation effect is remarkable.

Description

Technical Field

[0001] This utility model relates to a built-in layered heat dissipation structure for a photovoltaic inverter, belonging to the technical field of photovoltaic inverter heat dissipation and heat dissipation channel design. Background Technology

[0002] With the increasing demand for photovoltaic inverters and intensifying competition, the size of the machine has become a crucial consideration, while the requirements for its safety and stability are also rising. Internal heat dissipation is an extremely critical technology for photovoltaic inverters. The internal PCBA contains many heat-generating components, and poor airflow from the internal fan can lead to excessively high localized temperatures, severely impacting the inverter's lifespan.

[0003] Photovoltaic inverters typically employ a single-layer circuit board design. Heat dissipation is usually achieved by creating heat dissipation pathways within the enclosure that target the space between the single-layer circuit board. However, as the functionality and intelligence of photovoltaic inverters expand, while maintaining a smaller size, a structure with alternating double-layer circuit boards has emerged. This type of inverter creates two separate, partitioned spaces. Traditionally, each partition requires an independent cooling fan and flow path, increasing the cost of the heat dissipation mechanism. Furthermore, the lack of connection between the two partitions leads to poor heat dissipation uniformity, potentially causing localized overheating and impacting the inverter's lifespan. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of the existing technology and to propose a built-in layered heat dissipation structure for photovoltaic inverters, which addresses the problems of high cost and poor heat dissipation uniformity caused by the independent layout of traditional double-layered heat dissipation mechanisms.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A built-in layered heat dissipation structure for a photovoltaic inverter, the photovoltaic inverter including an inverter housing and a first circuit board and a second circuit board disposed at intervals within the inverter housing;

[0007] The inverter housing has a tray located between the first circuit board and the second circuit board to support the first circuit board. A first heat dissipation space layer is formed between the first circuit board and the inverter housing, and the components on the first circuit board are located in the first heat dissipation space layer. A second heat dissipation space layer is formed between the second circuit board and the tray, and the components on the second circuit board are located in the second heat dissipation space layer.

[0008] The tray is provided with a first fan and a second fan at its two opposite ends. The first fan and the second fan are offset from each other. The first fan has a first air outlet opposite to the first heat dissipation space layer and a second air outlet opposite to the second heat dissipation space layer. The second fan is located inside the first heat dissipation space layer.

[0009] Preferably, the first circuit board is provided with a first air duct partition located in the first heat dissipation space, and the first air duct partition, the first circuit board, and the inverter housing form an air outlet guide channel that cooperates with the first air outlet end.

[0010] Preferably, the free end of the first air duct baffle is connected to the first fan.

[0011] Preferably, there is a gap between the first circuit board and the tray, and the tray is provided with a first cutout portion that matches the position of the first air outlet and a second cutout portion that matches the position of the air outlet of the second fan.

[0012] Preferably, the tray is provided with a second air duct baffle located in the second heat dissipation space for rotating and guiding the airflow direction of the first air outlet.

[0013] Preferably, the air outlet direction of the second fan has an offset angle that deviates from the direction of the first fan.

[0014] Preferably, the first circuit board and / or the second circuit board are provided with onboard heat sinks.

[0015] The beneficial effects of this utility model are mainly reflected in:

[0016] 1. It can achieve the formation of layered and differentiated heat dissipation airflow channels. By utilizing the convection and diversion layout of two fans, the heat dissipation airflow channels are formed in a more balanced manner.

[0017] 2. It satisfies the interaction between the two heat dissipation spaces, which can balance the internal temperature of the inverter, maintain the stable operation of the inverter, and improve the effective service life of the inverter.

[0018] 3. The heat dissipation structure is compact and ingenious, effectively controlling costs and achieving significant heat dissipation. Attached Figure Description

[0019] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0020] Figure 1 This is a schematic diagram of the built-in layered heat dissipation structure of a photovoltaic inverter according to the present invention.

[0021] Figure 2 This is an exploded structural diagram of the built-in layered heat dissipation structure of a photovoltaic inverter according to this utility model.

[0022] Figure 3 This is a schematic diagram of the airflow path within the first heat dissipation space layer of the built-in layered heat dissipation structure of a photovoltaic inverter according to this utility model.

[0023] Figure 4 This is a schematic diagram of the airflow path within the second heat dissipation space layer of the built-in layered heat dissipation structure of a photovoltaic inverter according to this utility model. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant utility model and not intended to limit the utility model. Furthermore, it should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in the present application can be combined with each other.

[0026] This utility model provides a built-in layered heat dissipation structure for a photovoltaic inverter, such as Figures 1 to 4 As shown, the photovoltaic inverter includes an inverter housing 100 and a first circuit board 1 and a second circuit board 2 disposed at intervals within the inverter housing.

[0027] The inverter housing 100 has a tray 3 located between the first circuit board 1 and the second circuit board 2 for supporting the first circuit board 1. A first heat dissipation space layer 4 is formed between the first circuit board 1 and the inverter housing. The components on the first circuit board 1 are located in the first heat dissipation space layer 4. A second heat dissipation space layer 5 is formed between the second circuit board 2 and the tray 3. The components on the second circuit board 2 are located in the second heat dissipation space layer 5.

[0028] The tray 3 is provided with a first fan 6 and a second fan 7 on its two opposite ends. The first fan 6 and the second fan 7 are offset relative to each other. The first fan 6 has a first air outlet 61 opposite to the first heat dissipation space layer and a second air outlet 62 opposite to the second heat dissipation space layer. The second fan is located inside the first heat dissipation space layer.

[0029] Detailed implementation process and principle explanation:

[0030] During heat dissipation operations, the first heat dissipation space layer 4 and the second heat dissipation space layer 5 respectively form heat dissipation airflow channels.

[0031] like Figure 3 As shown, within the first heat dissipation space layer 4, the first air outlet 61 forms a staggered heat dissipation airflow direction toward the second fan 7, while the air outlet 70 of the second fan 7 forms a staggered heat dissipation airflow direction toward the first air outlet 61, and there is a certain convection gap between the two, thus achieving a bidirectional heat dissipation airflow path, allowing the components on the first circuit board 1 to be well cooled. It should be noted that the inverter housing 100 has an air inlet end that is positioned opposite to the first fan, an air inlet and outlet end that are positioned opposite to the second fan, and an air outlet end that is opposite to the air outlet direction of the second fan.

[0032] In the bidirectional flow path, the first fan draws in air from the inlet end and exits air from the inlet and outlet ends; the second fan draws in air from the inlet and outlet ends and exits air from the outlet end.

[0033] like Figure 4 As shown, within the second heat dissipation space layer 5, the second air outlet 62 forms a U-shaped heat dissipation airflow channel to dissipate heat from the components on the second circuit board 2.

[0034] The first fan draws in air from the inlet end, circulates it in a U-shape, and then exhausts it from the outlet end.

[0035] In this way, by using two fans to form a layered distribution, and by using the two air outlets of the first fan 6 to target the two heat dissipation space layers respectively, a double-layered heat dissipation channel is formed, which makes the heat dissipation effect more balanced.

[0036] In one specific embodiment, a first air duct partition 8 is provided on the first circuit board and located in the first heat dissipation space. An air outlet guide channel is formed between the first air duct partition, the first circuit board, and the inverter housing, which is in sync with the first air outlet end.

[0037] Specifically, because the first air outlet 61 and the air outlet 70 of the second fan 7 are staggered in their convection distribution, the first air duct baffle 8 can form an air outlet guiding channel that directs the airflow from the first air outlet 61. This reduces the relative wind resistance interference between the staggered air outlets and makes the relative flow path smoother. Components located within the air outlet guiding channel achieve better heat exchange and heat dissipation.

[0038] In one specific embodiment, the free end of the first air duct baffle is connected to the first fan.

[0039] Normally, the first fan is fixed to the inner wall of the inverter housing 100 or its bracket. The first fan is connected to the first air duct partition, which makes the relative locking position more stable and secure, and at the same time makes the airflow guidance effect of the first air duct partition on the first air outlet better.

[0040] In one specific embodiment, a gap is left between the first circuit board 1 and the tray 3. The tray 3 is provided with a first hollow part 31 that matches the position of the first air outlet and a second hollow part 32 that matches the position of the air outlet of the second fan.

[0041] Specifically, the first heat dissipation space layer 4 and the second heat dissipation space layer 5 have a certain mutual air resistance effect. The first hollow part 31 and the second hollow part 32 can realize the interaction of the heat dissipation airflow path in the first heat dissipation space layer 4 and the second heat dissipation space layer 5. That is, the first hollow part 31 can realize the formation of the heat dissipation airflow path of the first air outlet end into the second heat dissipation space layer 5, and the second hollow part 32 can realize the formation of the heat dissipation airflow path of the second fan outlet end into the second heat dissipation space layer 5. In this way, the interaction balance of heat dissipation of the two heat dissipation space layers is satisfied.

[0042] In one specific embodiment, the tray 3 is provided with a second air duct partition 9 located in the second heat dissipation space for rotating and guiding the airflow direction of the first air outlet.

[0043] like Figure 4 As shown, its U-shaped heat dissipation airflow path is formed based on the box wall panel. The second air duct partition 9 can achieve a certain airflow guidance, making its rotating airflow smoother and its turning smoother, thus reducing kinetic energy loss.

[0044] In one specific embodiment, such as Figure 3 As shown, the air outlet direction of the second fan has an offset angle that deviates from the direction of the first fan.

[0045] This design makes the first and second fans work together more reliably, reduces the impact of airflow between the two, and creates a more stable cooling airflow path.

[0046] In one specific embodiment, the first circuit board 1 and / or the second circuit board 2 are provided with onboard heat sinks 10.

[0047] The heat sink 10 on the carrier board can improve heat exchange efficiency, making the heat dissipation effect more significant.

[0048] As described above, this invention enables the formation of layered, differentiated heat dissipation airflow channels. Utilizing the convection and splitting arrangement of two fans, the heat dissipation airflow channels are formed in a relatively balanced manner. This satisfies the interaction between the two heat dissipation spaces, balances the internal temperature of the inverter, maintains stable inverter operation, and extends the effective lifespan of the inverter. The heat dissipation structure layout is compact and ingenious, effectively controlling costs and achieving significant heat dissipation results.

[0049] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent in such process, method, article, or apparatus / device.

[0050] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A built-in layered heat dissipation structure for a photovoltaic inverter, the photovoltaic inverter comprising an inverter housing and a first circuit board and a second circuit board disposed at intervals within the inverter housing, characterized in that: The inverter housing has a tray located between the first circuit board and the second circuit board to support the first circuit board. A first heat dissipation space layer is formed between the first circuit board and the inverter housing, and the components on the first circuit board are located in the first heat dissipation space layer. A second heat dissipation space layer is formed between the second circuit board and the tray, and the components on the second circuit board are located in the second heat dissipation space layer. The tray is provided with a first fan and a second fan at its two opposite ends. The first fan and the second fan are offset from each other. The first fan has a first air outlet opposite to the first heat dissipation space layer and a second air outlet opposite to the second heat dissipation space layer. The second fan is located inside the first heat dissipation space layer.

2. The built-in layered heat dissipation structure of a photovoltaic inverter according to claim 1, characterized in that: The first circuit board is provided with a first air duct partition located in the first heat dissipation space. The first air duct partition, the first circuit board, and the inverter housing form an air outlet guide channel that cooperates with the first air outlet end.

3. The built-in layered heat dissipation structure of a photovoltaic inverter according to claim 2, characterized in that: The free end of the first air duct baffle is connected to the first fan.

4. The built-in layered heat dissipation structure of a photovoltaic inverter according to claim 1, characterized in that: A gap is left between the first circuit board and the tray. The tray is provided with a first cutout portion that matches the position of the first air outlet and a second cutout portion that matches the position of the air outlet of the second fan.

5. The built-in layered heat dissipation structure of a photovoltaic inverter according to claim 1, characterized in that: The tray is provided with a second air duct baffle located in the second heat dissipation space for rotating and guiding the airflow direction of the first air outlet.

6. The built-in layered heat dissipation structure of a photovoltaic inverter according to claim 1, characterized in that: The air outlet direction of the second fan has an offset angle that deviates from that of the first fan.

7. The built-in layered heat dissipation structure of a photovoltaic inverter according to any one of claims 1-6, characterized in that: The first circuit board and / or the second circuit board are provided with onboard heat sinks.

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