Packaging and gluing mechanism for LED lamp bead chip

Abstract

The utility model relates to the technical field of gluing mechanisms, and discloses an LED lamp bead chip packaging gluing mechanism which comprises a workbench, the upper end of the workbench is fixedly connected with a grooved block, the inner wall of the grooved block is slidably connected with a movable arm, the inner wall of the grooved block is rotatably connected with a lead screw, the lead screw is in threaded connection with the movable arm, and the movable arm is connected with a movable rod. By arranging the glue loading assembly, when different glue bodies need to be used quickly, a worker loads the different required glue bodies into areas defined by a partition plate and a glue loading barrel, when the glue bodies are used, the worker finds corresponding operation rods for controlling the glue bodies to flow, and the glue bodies are loaded into the glue loading barrel through the glue loading assembly. When the glue dispensing device is used, the square bolt is pulled out, then the operating rod is rotated, the bottom plate is turned over, glue flows into the mounting block and then flows into the glue dispensing head, gluing operation can be carried out, and the effect of improving the gluing efficiency as much as possible is achieved.

Description

Technical Field

[0001] This utility model relates to the technical field of gluing mechanisms, and in particular to a gluing mechanism for packaging LED lamp bead chips. Background Technology

[0002] The gluing mechanism is used for gluing LED lamp chip during packaging. The gluing mechanism consists of a worktable, a slotted block, a lead screw, a motor, a moving arm, a cylinder group, a mounting block, a dispensing head, and a gluing cylinder. When using the gluing mechanism, the worker places the LED lamp chip on the worktable to perform the packaging process.

[0003] The inventors found in their daily work that when using the glue applicator, because the glue filling mechanism can only hold one type of glue at a time, it is generally necessary to disassemble the glue filling tube and replace it with the glue filling tube that needs to be used when other glues are needed. This wastes a lot of time and may result in low glue application efficiency. Utility Model Content

[0004] The purpose of this invention is to provide an encapsulation and gluing mechanism for LED lamp bead chips, aiming to solve the problems in the prior art.

[0005] This utility model is implemented as follows: an LED chip encapsulation and gluing mechanism includes a worktable, a grooved block fixedly connected to the upper end of the worktable, a movable arm slidably connected to the inner wall of the grooved block, a lead screw rotatably connected to the inner wall of the grooved block, the lead screw being threadedly connected to the movable arm, a motor mounted on the left end of the grooved block, the output end of the motor being fixed to the lead screw, a first cylinder mounted on the upper end of the movable arm, an installation block fixedly connected to the output end of the first cylinder, the installation block sliding on the inner wall of the movable arm, a dispensing head fixedly connected to the lower end of the installation block, and a gluing assembly with switchable glue solution provided on the upper end of the installation block.

[0006] Preferably, the glue filling assembly includes a glue filling cylinder fixedly connected to the upper end of the mounting block, a partition plate fixedly connected to the inner wall of the glue filling cylinder, and a bottom plate provided on the inner wall of the glue filling cylinder;

[0007] A sealing ring is fixedly connected to the surface of the base plate. An operating rod is rotatably connected to the arc surface of the glue-filling cylinder. The operating rod is fixed to the base plate. A square pin is inserted into the right end of the operating rod and is inserted into the glue-filling cylinder. A torsion spring is fixedly connected to the left end of the operating rod, and the other end of the torsion spring is fixed to the glue-filling cylinder.

[0008] Preferably, the upper end of the glue-filling cylinder is provided with a mounting cover, and the lower end of the mounting cover is provided with a piston.

[0009] Preferably, a second cylinder is mounted on the upper end of the mounting cover, and the output end of the second cylinder is fixed to the piston.

[0010] Preferably, the upper end of the worktable is provided with a fixing component for pressing and stabilizing the LED beads.

[0011] Preferably, the fixing component includes a pressure frame disposed on the upper end of the worktable, and a slide rod is slidably inserted into the upper end of the pressure frame, the slide rod being fixed to the worktable.

[0012] Preferably, a threaded rod is threadedly inserted into the upper end of the pressure frame, and the threaded rod is rotatably connected to the worktable.

[0013] Preferably, a circular pin is inserted into the upper end of the threaded rod, and a plurality of evenly distributed positioning grooves are opened at the upper end of the pressure frame.

[0014] Preferably, the positioning groove and the circular pin are adapted to each other, and a rubber pad is fixedly connected to the lower end of the pressure frame.

[0015] The beneficial effects of this utility model's disclosed LED chip encapsulation and gluing mechanism are as follows: By setting up a gluing assembly, when different adhesives are needed quickly, workers can load different required adhesives into the area enclosed by a partition plate and a gluing cylinder. When using the adhesive, the worker locates the corresponding operating lever controlling the adhesive flow, first removes the square pin, and then rotates the operating lever to flip the base plate, allowing the adhesive to flow into the mounting block and then into the dispensing head for gluing. This maximizes gluing efficiency and solves the problem that because the gluing assembly can only hold one type of adhesive at a time, it is generally necessary to disassemble the gluing cylinder and replace it with the one containing the required adhesive when other adhesives are needed, which wastes a lot of time and may result in low gluing efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an LED chip encapsulation and gluing mechanism provided in an embodiment of this utility model;

[0017] Figure 2 This is a schematic diagram of the glue tube of an LED lamp bead chip encapsulation and gluing mechanism provided in an embodiment of this utility model;

[0018] Figure 3 This is a schematic diagram of the inside of the glue tube of an LED lamp bead chip encapsulation and gluing mechanism provided in an embodiment of this utility model;

[0019] Figure 4 This is a schematic diagram of the fixing component of an LED lamp bead chip encapsulation and gluing mechanism provided in an embodiment of this utility model;

[0020] Figure 5 This is a three-dimensional schematic diagram of the pressing frame of an LED lamp bead chip encapsulation and gluing mechanism provided in an embodiment of this utility model.

[0021] Marker explanation:

[0022] 1. Workbench; 2. Glue filling assembly; 3. Fixing assembly; 4. Grooved block; 5. Motor; 6. Lead screw; 7. Moving arm; 8. First cylinder; 9. Mounting block; 10. Dispensing head;

[0023] 21. Glue cartridge; 22. Divider plate; 23. Base plate; 24. Operating lever; 25. Square pin; 26. Torsion spring; 27. Mounting cover; 28. Second cylinder; 29. ​​Piston;

[0024] 31. Pressure frame; 32. Slide rod; 33. Threaded rod; 34. Circular pin; 35. Positioning groove; 36. Rubber pad. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0026] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this utility model. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0027] The implementation of this utility model will be described in detail below with reference to specific embodiments.

[0028] In this embodiment:

[0029] Reference Figure 1 The diagram shows a preferred embodiment of the present invention.

[0030] The LED chip encapsulation and gluing mechanism of this embodiment includes a worktable 1. A grooved block 4 is fixedly connected to the upper end of the worktable 1. A movable arm 7 is slidably connected to the inner wall of the grooved block 4. A lead screw 6 is rotatably connected to the inner wall of the grooved block 4. The lead screw 6 is threadedly connected to the movable arm 7. A motor 5 is installed at the left end of the grooved block 4. The output end of the motor 5 is fixed to the lead screw 6. A first cylinder 8 is installed at the upper end of the movable arm 7. An installation block 9 is fixedly connected to the output end of the first cylinder 8. The installation block 9 slides on the inner wall of the movable arm 7. A dispensing head 10 is fixedly connected to the lower end of the installation block 9. A fixing component 3 for pressing and stabilizing the LED chips is provided at the upper end of the worktable 1. A glue dispensing component 2 with switchable glue solution is provided at the upper end of the installation block 9.

[0031] The following section will explain the specific setup and function of the glue-filling component 2 and the fixing component 3.

[0032] Reference Figure 2 and Figure 3 as well as Figure 4 As shown in this embodiment: the glue dispensing assembly 2 includes a glue dispensing cylinder 21 fixedly connected to the upper end of the mounting block 9. A partition plate 22 is fixedly connected to the inner wall of the glue dispensing cylinder 21, and a bottom plate 23 is provided on the inner wall of the glue dispensing cylinder 21. A sealing ring is fixedly connected to the surface of the bottom plate 23. An operating rod 24 is rotatably connected to the arc surface of the glue dispensing cylinder 21. The operating rod 24 and the bottom plate 23 are fixed. A square pin 25 is inserted into the right end of the operating rod 24 and is inserted into the glue dispensing cylinder 21. By setting up the glue dispensing assembly 2, when different glues need to be used quickly, the worker loads the different required glues into the area enclosed by the partition plate 22 and the glue dispensing cylinder 21. When using the glue, the worker finds the corresponding operating rod 24 that controls the flow of the glue, first pulls out the square pin 25, and then rotates the operating rod 24 to flip the bottom plate 23, so that the glue flows into the interior of the mounting block 9 and then into the dispensing head 10. This allows for the application of adhesive, thereby maximizing adhesive application efficiency. A torsion spring 26 is fixedly connected to the left end of the operating lever 24, and the other end of the torsion spring 26 is fixed to the glue cylinder 21. By setting the torsion spring 26, after the worker pulls out the square pin 25, the torsion spring 26 drives the operating lever 24 to reset, causing the base plate 23 to reset to the open state, allowing the adhesive to flow out. An installation cover 27 is set at the upper end of the glue cylinder 21, and a piston 29 is set at the lower end of the installation cover 27. By setting the installation cover 27 and the piston 29, the worker inserts the installation cover 27 into the glue cylinder 21 and then fixes it with screws. Then, through the drive mechanism, the piston 29 is pushed, thereby assisting in pushing the adhesive to flow out. A second cylinder 28 is installed at the upper end of the installation cover 27, and the output end of the second cylinder 28 is fixed to the piston 29. Activating the second cylinder 28 above the corresponding adhesive causes the piston 29 to be pushed.

[0033] Reference Figure 5As shown in this embodiment: the fixing component 3 includes a pressure frame 31 disposed on the upper end of the workbench 1. A slide rod 32 is slidably inserted into the upper end of the pressure frame 31. The slide rod 32 is fixed to the workbench 1. The worker places the LED chip under the pressure frame 31. Through the downward moving mechanism, the pressure frame 31 moves up and down on the slide rod 32, pressing the pressure frame 31 onto the LED chip, thereby achieving the effect of fixing the LED chip as much as possible. A threaded rod 33 is threadedly inserted into the upper end of the pressure frame 31. The threaded rod 33 is rotatably connected to the workbench 1. The worker rotates... The threaded rod 33 allows the pressure frame 31 to move up and down the slide rod 32. A circular pin 34 is inserted into the upper end of the threaded rod 33. The upper end of the pressure frame 31 has multiple evenly distributed positioning grooves 35. After the worker rotates the threaded rod 33, the worker inserts the circular pin 34 into the positioning groove 35. The surface of the circular pin 34 is provided with protrusions, which fix the threaded rod 33. The positioning groove 35 and the circular pin 34 are compatible. A rubber pad 36 is fixedly connected to the lower end of the pressure frame 31. By setting the rubber pad 36, the pressure frame 31 is prevented from directly contacting the LED chip.

[0034] Working Principle: When using the gluing mechanism, the worker places the LED chip on the worktable 1, starts the motor 5, causing the lead screw 6 to rotate, which moves the moving arm 7 within the grooved block 4. Then, the first cylinder 8 is activated, causing the mounting block 9 to descend, allowing the dispensing head 10 to dispense glue onto the LED chip for the encapsulation process. When different glues are needed quickly, the worker loads the required glues into the area enclosed by the partition plate 22 and the glue container 21. When using the glue, the worker locates the corresponding operating lever 24 that controls the glue flow, first removes the square pin 25, and then rotates the operating lever 24, causing the base plate 23 to flip, allowing the glue to flow into the mounting block 9 and then into the dispensing head 10 for gluing. This maximizes gluing efficiency. A torsion spring 26 is also included to facilitate this process after the worker removes the square pin 25. The torsion spring 26 drives the operating lever 24 to reset, causing the base plate 23 to reset to the open state, allowing the colloid to flow out. By setting the mounting cover 27 and the piston 29, the worker inserts the mounting cover 27 into the colloid cylinder 21 and then fixes it with screws. Then, the second cylinder 28 above the colloid is activated, causing the piston 29 to be pushed, thereby assisting in pushing the colloid to flow out. The worker places the LED chip under the pressure frame 31. The worker rotates the threaded rod 33, causing the pressure frame 31 to move up and down the slide rod 32, so that the pressure frame 31 is pressed on the LED chip, thereby achieving the effect of fixing the LED chip as much as possible. After the worker rotates the threaded rod 33, the worker inserts the circular pin 34 into the positioning groove 35. The surface of the circular pin 34 is provided with protrusions, thereby fixing the threaded rod 33. By setting the rubber pad 36, the pressure frame 31 is prevented from directly contacting the LED chip.

[0035] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An LED chip encapsulation and gluing mechanism, comprising a worktable, characterized in that, A grooved block is fixedly connected to the upper end of the workbench. A movable arm is slidably connected to the inner wall of the grooved block. A lead screw is rotatably connected to the inner wall of the grooved block. The lead screw is threadedly connected to the movable arm. A motor is installed at the left end of the grooved block. The output end of the motor is fixed to the lead screw. A first cylinder is installed at the upper end of the movable arm. An installation block is fixedly connected to the output end of the first cylinder. The installation block slides on the inner wall of the movable arm. A glue dispensing head is fixedly connected to the lower end of the installation block. A glue dispensing assembly with switchable glue solution is provided at the upper end of the installation block.

2. The LED chip encapsulation and gluing mechanism as described in claim 1, characterized in that, The glue filling assembly includes a glue filling cylinder fixedly connected to the upper end of the mounting block, a partition plate fixedly connected to the inner wall of the glue filling cylinder, and a bottom plate provided on the inner wall of the glue filling cylinder; A sealing ring is fixedly connected to the surface of the base plate. An operating rod is rotatably connected to the arc surface of the glue-filling cylinder. The operating rod is fixed to the base plate. A square pin is inserted into the right end of the operating rod and is inserted into the glue-filling cylinder. A torsion spring is fixedly connected to the left end of the operating rod, and the other end of the torsion spring is fixed to the glue-filling cylinder.

3. The encapsulation and gluing mechanism for an LED lamp bead chip as described in claim 2, characterized in that, The upper end of the glue-filling cylinder is provided with a mounting cover, and the lower end of the mounting cover is provided with a piston.

4. The encapsulation and gluing mechanism for an LED lamp bead chip as described in claim 3, characterized in that, A second cylinder is installed on the upper end of the mounting cover, and the output end of the second cylinder is fixed to the piston.

5. The encapsulation and gluing mechanism for an LED lamp bead chip as described in claim 4, characterized in that, The upper part of the workbench is equipped with a fixing component for pressing LED beads to secure them.

6. The encapsulation and gluing mechanism for an LED lamp bead chip as described in claim 5, characterized in that, The fixing component includes a pressure frame disposed on the upper end of the worktable, and a slide rod is slidably inserted into the upper end of the pressure frame, the slide rod being fixed to the worktable.

7. The encapsulation and gluing mechanism for an LED lamp bead chip as described in claim 6, characterized in that, A threaded rod is threadedly inserted into the upper end of the pressure frame, and the threaded rod is rotatably connected to the worktable.

8. The encapsulation and gluing mechanism for an LED lamp bead chip as described in claim 7, characterized in that, A circular pin is inserted into the upper end of the threaded rod, and multiple evenly distributed positioning grooves are opened at the upper end of the pressure frame.

9. The encapsulation and gluing mechanism for an LED lamp bead chip as described in claim 8, characterized in that, The positioning groove and the circular pin are compatible, and a rubber pad is fixedly connected to the lower end of the pressure frame.

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