Punching and leveling device for notebook computer cooling fins

By designing a transfer, positioning, punching, and leveling mechanism on the punching and leveling device for laptop heat sinks, rapid processing of heat sinks on the same main body is achieved, solving the problem of low efficiency caused by long positioning time and improving overall processing efficiency.

CN224157616UActive Publication Date: 2026-04-24HUZHOU ANLI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUZHOU ANLI TECH CO LTD
Filing Date
2025-05-10
Publication Date
2026-04-24

AI Technical Summary

Technical Problem

The stamping and leveling process of laptop heat sinks requires time to position the workpiece, resulting in low processing efficiency.

Method used

Design a punching and leveling device for a laptop heatsink, including a transfer mechanism, a positioning mechanism, a punching mechanism and a leveling mechanism. The heatsink is positioned, punched and leveled sequentially on the same main body to reduce positioning and transfer time.

Benefits of technology

By reducing the number of positioning and transfer operations, the processing efficiency of heat sinks was improved, and the processing time in the same batch was shortened, thus improving overall efficiency.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model relates to a punching and leveling device for notebook cooling fins, the punching and leveling device for the notebook cooling fins comprises a main body, a transfer mechanism, a positioning mechanism, a punching mechanism and a leveling mechanism, the positioning mechanism, the punching mechanism and the leveling mechanism are sequentially arranged on the main body along the processing direction of the cooling fins; the transferring mechanism is arranged on the main body and used for transferring the cooling fins, the transferring mechanism can transfer the cooling fins on the positioning mechanism to the punching mechanism, and the transferring mechanism can transfer the cooling fins on the punching mechanism to the leveling mechanism. The transfer mechanism can transfer the cooling fins on the leveling mechanism out. The machining method has the effect of improving the machining efficiency.
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Description

Technical Field

[0001] This application relates to the technical field of punching equipment, and in particular to a punching and leveling device for a notebook heat sink. Background Technology

[0002] During the manufacturing process, heat sinks need to be punched using stamping equipment.

[0003] During the stamping process, laptop heat sinks may warp and deform in certain areas. To ensure product quality, the deformed heat sinks need to be transferred to a leveling machine for leveling.

[0004] In order to ensure product uniformity, the workpiece needs to be positioned during the stamping and leveling process. However, adjusting the position of the workpiece to achieve positioning takes a certain amount of time, which increases the processing time of the heat sink and reduces the processing efficiency. Utility Model Content

[0005] To improve processing efficiency, this application provides a punching and leveling device for notebook heat sinks.

[0006] This application provides a punching and leveling device for a notebook heatsink, which adopts the following technical solution:

[0007] A punching and leveling device for a laptop heat sink includes a main body, a transfer mechanism, a positioning mechanism, a punching mechanism, and a leveling mechanism. The positioning mechanism, the punching mechanism, and the leveling mechanism are sequentially arranged on the main body along the heat sink processing direction. The transfer mechanism is arranged on the main body for transferring the heat sink. The transfer mechanism can transfer the heat sink on the positioning mechanism to the punching mechanism, the transfer mechanism can transfer the heat sink on the punching mechanism to the leveling mechanism, and the transfer mechanism can transfer the heat sink on the leveling mechanism out.

[0008] By adopting the above technical solution, the heat sink to be processed is placed on the positioning mechanism, which positions the heat sink. Then, the transfer mechanism transfers the positioned heat sink to the punching mechanism for punching. Next, the transfer mechanism transfers the punched heat sink to the leveling mechanism for leveling. Finally, the transfer mechanism transfers the leveled heat sink out. Therefore, the punching and leveling device provided in this application enables the heat sink to be punched and leveled on the same body, thereby reducing the number of positioning operations and the transfer time, and thus improving processing efficiency.

[0009] Optionally, a support block is provided on one side of the main body, and the transfer mechanism includes a first cylinder, a first lifting block, a moving block, a connecting block, a suction cup, and a drive assembly. The cylinder body of the first cylinder is disposed on the support block, the first lifting block is disposed on the piston rod of the first cylinder, the moving block is slidably disposed on the first lifting block through the drive assembly, the connecting block is disposed on the moving block, and the suction cup is disposed on the connecting block.

[0010] By adopting the above technical solution, the suction cup adsorbs the heat sink, the drive component is activated, the drive component drives the moving block to move the first lifting block, the connecting block on the moving block drives the suction cup to move, and the suction cup drives the heat sink to move; the first cylinder is activated, the piston rod of the first cylinder drives the first lifting block to rise and fall, the moving block on the first lifting block drives the suction cup to rise and fall through the connecting block, and the suction cup drives the heat sink to rise and fall; the set transfer mechanism has a simple structure and is easy to operate.

[0011] Optionally, the positioning mechanism includes a first fixing block, a first positioning block, a second cylinder, and a second positioning block. The first fixing block is disposed on the main body, and there are two first positioning blocks, both of which are disposed on the first fixing block. There are two second cylinders, and the cylinder bodies of both second cylinders are disposed on the first fixing block. A second positioning block is connected to the piston rod of each second cylinder. Both the first positioning blocks and the two second positioning blocks abut against the sidewall of the heat sink.

[0012] By adopting the above technical solution, after the heat sink is located on the first fixed block, the two second cylinders are activated. The piston rods of the second cylinders drive the second positioning blocks to move, and the two second positioning blocks push the heat sink to move. When both the two first positioning blocks and the two second positioning blocks are in contact with the heat sink, it indicates that the position of the heat sink has been adjusted. After the position of the heat sink is adjusted, the second cylinders are activated again so that the second positioning blocks no longer contact the heat sink, which facilitates the transfer of the subsequent transfer mechanism.

[0013] Optionally, the punching mechanism includes a second fixed block, a third cylinder, a second lifting block, an upper die, a third fixed block, and a lower die. The second fixed block is disposed on the main body, the cylinder body of the third cylinder is disposed on the second fixed block, and the second lifting block is disposed on the piston rod of the third cylinder. The upper die is disposed on the second lifting block, the third fixed block is disposed on the main body, and the lower die is disposed on the third fixed block and located below the upper die.

[0014] By adopting the above technical solution, the transfer mechanism transfers the positioned heat sink to the lower mold, and then the third cylinder is activated. The piston rod of the third cylinder drives the second lifting block to move towards the heat sink. The second lifting block drives the upper mold to move, so that the upper mold punches the heat sink located on the lower mold.

[0015] Optionally, the leveling mechanism includes a first leveling block, a second leveling block, and a fourth fixing block. The first leveling block is disposed on the second lifting block. The fourth fixing block is disposed on the main body, and the second leveling block is disposed on the fourth fixing block and located directly below the first leveling block.

[0016] By adopting the above technical solution, the transfer mechanism transfers the punched heat sink to the second leveling block. When the lifting block drives the upper die to move, the lifting block will drive the first leveling block to move. In this way, when the upper die punches the heat sink located on the lower die, the first leveling block will level the heat sink located on the second leveling block. Therefore, while the leveling mechanism is performing a leveling operation on one heat sink, another heat sink is being punched. This can shorten the processing time of the same batch of heat sinks and improve the overall efficiency.

[0017] Optionally, the main body is provided with two cleaning mechanisms. Each cleaning mechanism includes a fifth fixing block, a fourth cylinder, an adjusting block, and a cleaning block. The fifth fixing block is disposed on the main body, the cylinder body of the fourth cylinder is disposed on the fifth fixing block, and the adjusting block is disposed on the piston rod of the fourth cylinder. The cleaning blocks are disposed on both sides of the adjusting block. Two cleaning blocks in one of the cleaning mechanisms clean the upper mold and the lower mold, while two cleaning blocks in the other cleaning mechanism clean the first leveling block and the second leveling block.

[0018] By adopting the above technical solution, when no heat sink is located on the lower mold and the second leveling block, there is a certain distance between the upper mold and the lower mold, and a certain distance between the first leveling block and the second leveling block. The fourth cylinder is activated, and its piston rod drives the adjusting block to move. The adjusting block drives the cleaning block to move, causing one cleaning block in one cleaning mechanism to contact the upper mold and the other cleaning block to contact the lower mold, thus cleaning the upper and lower molds. Similarly, one cleaning block in another cleaning mechanism contacts the first leveling block and the other cleaning block to contact the second leveling block, thus cleaning the first and second leveling blocks. The cleaning mechanisms can clean the upper mold, lower mold, first leveling block, and second leveling block, reducing the phenomenon of poor heat sink processing quality due to the presence of foreign objects.

[0019] Optionally, the cleaning block is provided with an installation mechanism, which includes an installation block and an installation component. The cleaning block is disposed on the installation block, and the installation component is disposed on the adjustment block and connected to the installation block.

[0020] By adopting the above technical solution, the mounting block with the cleaning block is installed on the cleaning block through the mounting component. After the cleaning block has been used for a certain period of time, it is easy to replace the cleaning block, thereby ensuring the cleaning effect of the cleaning mechanism.

[0021] Optionally, the mounting assembly includes a locking block and a mounting bolt. The locking block is disposed on the mounting block, and the adjusting block has a locking groove for engaging with the locking block. The mounting bolt passes through the mounting block and is threadedly connected to the adjusting block.

[0022] By adopting the above technical solution, the card block is engaged with the card slot, and the mounting block abuts against the adjusting block; then the mounting bolt passes through the mounting block and is threadedly connected to the adjusting block, thereby fixing the mounting block on the adjusting block; the set mounting component has a simple structure and is easy to operate.

[0023] Optionally, the adjusting block is provided with a reinforcing mechanism, the reinforcing mechanism including a reinforcing block and an adjusting component, the reinforcing block is slidably disposed on the adjusting block, and the locking block is provided with a reinforcing groove for engaging with the reinforcing block; the adjusting component is disposed on the adjusting block and connected to the reinforcing block.

[0024] By adopting the above technical solution, when the mounting block abuts against the adjusting block, the adjusting component drives the reinforcing block to move towards the locking block and engage with the reinforcing groove on the locking block; the set reinforcing mechanism can improve the stability of the mounting block on the adjusting block.

[0025] Optionally, the adjustment assembly includes an adjustment shaft, an adjustment gear, and an adjustment rack. The adjustment shaft is rotatably mounted on the adjustment block, the adjustment gear is keyed to the adjustment shaft, and the adjustment rack is mounted on the reinforcing block and meshes with the adjustment gear.

[0026] By adopting the above technical solution, the adjusting shaft drives the adjusting gear to rotate, and the adjusting rack meshing with the adjusting gear will drive the reinforcing block to move. The set adjusting component has a simple structure and is easy to operate.

[0027] In summary, this application includes at least one of the following beneficial technical effects:

[0028] 1. The punching and leveling device provided in this application enables the heat sink to be punched and leveled on the same body, thereby reducing the number of positioning operations and transfer time, and thus improving processing efficiency;

[0029] 2. While the leveling mechanism is leveling one heat sink, another heat sink is being punched. This can shorten the processing time for the same batch of heat sinks and improve overall efficiency. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the punching and leveling device for a notebook heat sink in an embodiment of this application.

[0031] Figure 2 This is a schematic diagram of the transfer mechanism in the embodiments of this application;

[0032] Figure 3 This is a schematic diagram of the positioning mechanism in the embodiments of this application;

[0033] Figure 4 This is a schematic diagram of the leveling mechanism in the embodiments of this application;

[0034] Figure 5 This is a schematic diagram of the cleaning mechanism in the embodiments of this application;

[0035] Figure 6 This is a schematic diagram of the reinforcement mechanism in the embodiments of this application.

[0036] Reference numerals: 11. Main body; 12. Support block; 13. Loading rack; 14. Transfer rack; 15. Robotic arm; 16. Unloading rack; 2. Transfer mechanism; 21. First cylinder; 22. First lifting block; 23. Moving block; 24. Connecting block; 25. Suction cup; 26. Drive assembly; 3. Positioning mechanism; 31. First fixing block; 32. First positioning block; 33. Second cylinder; 34. Second positioning block; 4. Punching mechanism; 41. Second fixing block; 42. Third cylinder; 43. Second lifting block; 44. Upper die; 45. 46. ​​Lower mold; 5. Leveling mechanism; 51. First leveling block; 52. Second leveling block; 53. Fourth fixed block; 6. Cleaning mechanism; 61. Fifth fixed block; 62. Fourth cylinder; 63. Adjusting block; 631. Slot; 64. Cleaning block; 65. Air blowing pipe; 7. Installation mechanism; 71. Installation block; 72. Installation component; 721. Slot; 722. Installation bolt; 8. Reinforcing mechanism; 81. Reinforcing block; 82. Adjusting component; 821. Adjusting shaft; 822. Adjusting gear; 823. Adjusting rack. Detailed Implementation

[0037] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0038] This application discloses a punching and leveling device for a laptop heatsink.

[0039] refer to Figure 1A punching and leveling device for a laptop heatsink includes a main body 11. A transfer frame 14 is placed at the feeding end of the main body 11, and a robot arm 15 is mounted on the transfer frame 14. A loading rack 13 is placed on one side of the transfer frame 14. A unloading rack 16 is placed at the discharge end of the main body 11. Conveyor belts are rotatably connected to both the loading rack 13 and the unloading rack 16. A positioning mechanism 3, a punching mechanism 4, and a leveling mechanism 5 are sequentially arranged on the main body 11 along the direction from the transfer frame 14 to the discharge rack. A support block 12 is placed on one side of the main body 11, and a transfer mechanism 2 is mounted on the support block 12.

[0040] The heat sink to be processed is placed on the conveyor belt of the loading rack 13, and then the heat sink is conveyed to the side near the transfer rack 14. The robot arm 15 transfers the heat sink to the positioning mechanism 3. Then the transfer mechanism 2 transfers the heat sink in the positioning mechanism 3 to the punching mechanism 4 for punching. The punched heat sink is then transferred to the leveling mechanism 5 for leveling through the transfer mechanism 2. The leveled heat sink is then transferred to the conveyor belt of the unloading rack 16 through the transfer mechanism 2.

[0041] refer to Figure 1 and Figure 2 The transfer mechanism 2 includes a first cylinder 21, the cylinder body of which is fixedly connected to the support block 12. A first lifting block 22 is connected to the piston rod of the first cylinder 21. A drive assembly 26 is provided on the first lifting block 22. In this embodiment, the drive assembly 26 can be a linear motor module or an electric cylinder. A moving block 23 is connected to the drive assembly 26. Multiple connecting blocks 24 are fixedly connected to the moving block 23, and each connecting block 24 is provided with a suction cup 25. Taking the drive assembly 26 as a linear motor module as an example, the housing of the linear motor module is fixed to the first lifting block 22, and the mover of the linear motor module is connected to the moving block 23.

[0042] The first cylinder 21 is started, and the piston rod of the first cylinder 21 drives the first lifting block 22 to move. The first lifting block 22 drives the drive assembly 26 to move up and down. The drive assembly 26 is started, and the drive assembly 26 drives the moving block 23 to move. The moving block 23 drives the connecting block 24 to move. The connecting block 24 drives the suction cup 25 to move.

[0043] refer to Figure 1 and Figure 3The positioning mechanism 3 includes a first fixing block 31 fixedly connected to the feed end of the main body 11. Two first positioning blocks 32 are fixedly connected to the first fixing block 31, and the two first positioning blocks 32 are perpendicular to each other. Two second cylinders 33 are provided on the first fixing block 31. The cylinder body of the second cylinder 33 is fixedly connected to the first fixing block 31. A second positioning block 34 is connected to the piston rod of each second cylinder 33. The two second positioning blocks 34 are perpendicular to each other, and one of the second positioning blocks 34 is perpendicular to one of the first positioning blocks 32 and parallel to the other first positioning block 32. The two first positioning blocks 32 and the two second positioning blocks 34 form a positioning space.

[0044] The robotic arm 15 transfers the heat sink to be processed onto the first fixed block 31 in the positioning space; then, the second cylinder 33 is activated, and the piston rod of the second cylinder 33 drives the second positioning block 34 to move; when the two second positioning blocks 34 move, they push the heat sink to move, so that the two first positioning blocks 32 and the two second positioning blocks 34 all abut against the side wall of the heat sink. Then, the second cylinder 33 is activated again, causing the second positioning blocks 34 to move away from the heat sink, so that the suction cup 25 on the connecting block 24 can transfer the heat sink.

[0045] refer to Figure 1 and Figure 4 The punching mechanism 4 includes a second fixed block 41 integrally mounted on the support block 12. A third cylinder 42 is mounted on the second fixed block 41. The cylinder body of the third cylinder 42 is fixed on the second fixed block 41. A second lifting block 43 is connected to the piston rod of the third cylinder 42. An upper die 44 is fixedly connected to the second lifting block 43. A third fixed block 45 is fixedly connected to the main body 11 directly below the upper die 44. A lower die 46 is fixedly connected to the third fixed block 45. Waste holes are provided on the lower die 46, the third fixed block 45, and the main body 11.

[0046] The suction cup 25 transfers the heat sink to be punched onto the lower die 46. The third cylinder 42 is activated, and the piston rod of the third cylinder 42 moves. The lifting block drives the upper die 44 to move closer to the lower die 46, so that the upper die 44 punches the heat sink located on the lower die 46. The punched waste material falls into the waste material hole.

[0047] refer to Figure 1 and Figure 4 The leveling mechanism 5 includes a first leveling block 51 fixedly connected to the lifting block, a fourth fixing block 53 fixedly connected to the main body 11 that is being lowered by the first leveling block 51, and a second leveling block 52 fixedly connected to the fourth fixing block 53.

[0048] The suction cup 25 transfers the heat sink, which is located on the lower mold 46 and has been punched, to the second leveling block 52. When the lifting block moves, it will drive the first leveling block 51 to move. When both the first leveling block 51 and the second leveling block 52 are in contact with the heat sink, the heat sink will be leveled.

[0049] refer to Figure 1 and Figure 5 Two cleaning mechanisms 6 are provided on the main body 11. One cleaning mechanism 6 corresponds to the lower mold 46, and the other cleaning mechanism 6 corresponds to the second leveling block 52. The cleaning mechanism 6 includes a fifth fixing block 61 fixedly connected to the main body 11. A fourth cylinder 62 is provided on the fifth fixing block 61. The cylinder body of the fourth cylinder 62 is fixed to the fifth fixing block 61. An adjusting block 63 is connected to the piston rod of the fourth cylinder 62. Cleaning blocks 64 are provided on both sides of the adjusting block 63. The two cleaning blocks 64 in the cleaning mechanism 6 corresponding to the lower mold 46 can abut against the upper mold 44 and the lower mold 46, respectively. The two cleaning blocks 64 in the cleaning mechanism 6 corresponding to the second leveling block 52 can abut against the first leveling block 51 and the second leveling block 52, respectively. An air cavity is provided on the adjusting block 63, and an air blowing pipe 65 communicating with the air cavity is connected to the adjusting block 63. A first air nozzle and a second air nozzle communicating with the air cavity are connected to the adjusting block 63. The first air nozzle on the adjusting block 63 corresponding to the lower mold 46 can blow air onto the lower mold 46 to clean the lower mold 46, and the second air nozzle can blow air onto the upper mold 44 to clean the upper mold 44. The first air nozzle on the adjusting block 63 corresponding to the second leveling block 52 can blow air onto the second leveling block 52 to clean the lower mold 46, and the second air nozzle can blow air onto the first leveling block 51 to clean the upper mold 44.

[0050] The two cleaning mechanisms 6 are divided into a first cleaning mechanism 6 and a second cleaning mechanism 6. The first cleaning mechanism 6 corresponds to the lower mold 46, and the second cleaning mechanism 6 corresponds to the second leveling block 52. The fourth cylinder 62 is activated, and the piston rod of the fourth cylinder 62 drives the adjusting block 63 to move. The adjusting block 63 drives the two cleaning blocks 64 to move. In the first cleaning mechanism 6, one cleaning block 64 abuts against the upper mold 44 and the other cleaning block 64 abuts against the lower mold 46, thus cleaning the upper mold 44 and the lower mold 46. In the second cleaning mechanism 6, one cleaning block 64 abuts against the first leveling block 51 and the other cleaning block 64 abuts against the second leveling block 52, thus cleaning the first leveling block 51 and the second leveling block 52.

[0051] refer to Figure 5 and Figure 6The adjusting block 63 has slots 631 on both sides. The cleaning block 64 is provided with an installation mechanism 7, which includes an installation block 71 fixedly connected to the cleaning block 64. The installation block 71 is provided with an installation component 72, which includes a locking block 721 fixedly connected to the installation block 71 and engaging with the slots 631 on the adjusting block 63. The installation block 71 is provided with an installation bolt 722, which passes through the installation block 71 and is threadedly connected to the adjusting block 63.

[0052] First, engage the locking block 721 with the locking slot 631 on the adjusting block 63, and make the mounting block 71 abut against the adjusting block 63. Then, make the mounting bolt 722 pass through the mounting block 71 and thread it onto the adjusting block 63 to fix the mounting block 71 onto the adjusting block 63.

[0053] refer to Figure 5 and Figure 6 The adjusting block 63 has an adjusting cavity communicating with the slot 631. A reinforcing mechanism 8 is provided on the adjusting block 63, including a reinforcing block 81 slidably connected within the adjusting cavity, and a reinforcing groove on the slot 721 engaging with the reinforcing block 81. An adjusting assembly 82 is provided on the adjusting block 63, including an adjusting shaft 821 rotatably connected to the adjusting block 63. One end of the adjusting shaft 821 is located within the adjusting cavity, and an adjusting gear 822 is keyed to the adjusting shaft 821 within the adjusting cavity. An adjusting rack 823, meshing with the adjusting gear 822, is integrally provided on the reinforcing block 81.

[0054] When the mounting block 71 abuts against the adjusting block 63, the adjusting shaft 821 is rotated. The adjusting shaft 821 drives the adjusting gear 822 to rotate, the adjusting gear 822 drives the adjusting rack 823 to move, and the adjusting rack 823 drives the reinforcing block 81 to move, so that the reinforcing block 81 engages with the reinforcing groove on the locking block 721.

[0055] The implementation principle of the punching and leveling device for a notebook heat sink according to an embodiment of this application is as follows: the heat sink to be processed is placed on the conveyor belt of the loading rack 13, and then the heat sink is conveyed to the side near the transfer rack 14. The robot arm 15 transfers the heat sink to the positioning space formed by two first positioning blocks 32 and two second positioning blocks 34; then the second cylinder 33 is activated so that the two first positioning blocks 32 and the two second positioning blocks 34 all abut against the heat sink; after the two first positioning blocks 32 abut against the heat sink, the second cylinder 33 is activated so that the second positioning blocks 34 move away from the heat sink.

[0056] The first cylinder 21 and drive assembly 26 are activated, causing the suction cup 25 on one of the connecting blocks 24 of the moving block 23 to transfer the positioned heat sink to the lower mold 46. Then, the third cylinder 42 is activated, causing the upper mold 44 to punch the heat sink located on the lower mold 46. Next, the first cylinder 21 and drive assembly 26 are activated again, causing the suction cup 25 on another connecting block 24 of the moving block 23 to transfer the punched heat sink located on the lower mold 46 to the second leveling block 52. As each suction cup 25 transfers the heat sink to the second leveling block 52, another suction cup 25 will transfer the heat sink to the lower mold 46. Thus, when the lifting block drives the upper mold 44 to move, causing the upper mold 44 to punch the heat sink, the lifting block will drive the first leveling block 51 to move, causing the first leveling block 51 and the second leveling block 52 to perform a leveling operation on the heat sink. Then, the first cylinder 21 and the drive assembly 26 are started, so that the suction cups 25 on the other connecting blocks 24 on the moving block 23 transfer the heat sink that is located on the second leveling block 52 and leveled to the conveyor belt of the unloading rack 16; when one suction cup 25 transfers the heat sink to the conveyor belt of the unloading rack 16, another suction cup 25 will transfer the heat sink to the second leveling block 52.

[0057] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A punching and leveling device for a laptop heatsink, characterized in that, The device includes a main body (11), a transfer mechanism (2), a positioning mechanism (3), a punching mechanism (4), and a leveling mechanism (5). The positioning mechanism (3), the punching mechanism (4), and the leveling mechanism (5) are sequentially arranged on the main body (11) along the heat sink processing direction. The transfer mechanism (2) is arranged on the main body (11) for transferring the heat sink. The transfer mechanism (2) can transfer the heat sink on the positioning mechanism (3) to the punching mechanism (4), the transfer mechanism (2) can transfer the heat sink on the punching mechanism (4) to the leveling mechanism (5), and the transfer mechanism (2) can transfer the heat sink on the leveling mechanism (5) out.

2. The punching and leveling device for a notebook heat sink according to claim 1, characterized in that, The main body (11) is provided with a support block (12) on one side. The transfer mechanism (2) includes a first cylinder (21), a first lifting block (22), a moving block (23), a connecting block (24), a suction cup (25), and a drive assembly (26). The cylinder body of the first cylinder (21) is provided on the support block (12). The first lifting block (22) is provided on the piston rod of the first cylinder (21). The moving block (23) is slidably provided on the first lifting block (22) through the drive assembly (26). The connecting block (24) is provided on the moving block (23). The suction cup (25) is provided on the connecting block (24).

3. The punching and leveling device for a notebook heatsink according to claim 1, characterized in that, The positioning mechanism (3) includes a first fixing block (31), a first positioning block (32), a second cylinder (33), and a second positioning block (34). The first fixing block (31) is disposed on the main body (11). There are two first positioning blocks (32), and both first positioning blocks (32) are disposed on the first fixing block (31). There are two second cylinders (33), and the cylinder bodies of both second cylinders (33) are disposed on the first fixing block (31). The piston rod of each second cylinder (33) is connected to the second positioning block (34). Both the two first positioning blocks (32) and the two second positioning blocks (34) abut against the side wall of the heat sink.

4. The punching and leveling device for a notebook heat sink according to claim 1, characterized in that, The punching mechanism (4) includes a second fixed block (41), a third cylinder (42), a second lifting block (43), an upper die (44), a third fixed block (45), and a lower die (46). The second fixed block (41) is disposed on the main body (11), the cylinder body of the third cylinder (42) is disposed on the second fixed block (41), and the second lifting block (43) is disposed on the piston rod of the third cylinder (42). The upper die (44) is disposed on the second lifting block (43), the third fixed block (45) is disposed on the main body (11), and the lower die (46) is disposed on the third fixed block (45) and located below the upper die (44).

5. The punching and leveling device for a notebook heat sink according to claim 4, characterized in that, The leveling mechanism (5) includes a first leveling block (51), a second leveling block (52) and a fourth fixing block (53). The first leveling block (51) is disposed on the second lifting block (43). The fourth fixing block (53) is disposed on the main body (11). The second leveling block (52) is disposed on the fourth fixing block (53) and located directly below the first leveling block (51).

6. The punching and leveling device for a notebook heat sink according to claim 5, characterized in that, Two cleaning mechanisms (6) are provided on the main body (11). The cleaning mechanism (6) includes a fifth fixing block (61), a fourth cylinder (62), an adjusting block (63), and a cleaning block (64). The fifth fixing block (61) is provided on the main body (11). The cylinder body of the fourth cylinder (62) is provided on the fifth fixing block (61). The adjusting block (63) is provided on the piston rod of the fourth cylinder (62). The cleaning blocks (64) are provided on both sides of the adjusting block (63). Two of the cleaning blocks (64) in one of the cleaning mechanisms (6) clean the upper mold (44) and the lower mold (46). Two of the cleaning blocks (64) in the other cleaning mechanism (6) clean the first leveling block (51) and the second leveling block (52).

7. The punching and leveling device for a notebook heat sink according to claim 6, characterized in that, The cleaning block (64) is provided with an installation mechanism (7), which includes an installation block (71) and an installation component (72). The cleaning block (64) is disposed on the installation block (71), and the installation component (72) is disposed on the adjustment block (63) and connected to the installation block (71).

8. The punching and leveling device for a notebook heatsink according to claim 7, characterized in that, The mounting assembly (72) includes a locking block (721) and a mounting bolt (722). The locking block (721) is disposed on the mounting block (71), and the adjusting block (63) has a locking groove (631) that engages with the locking block (721). The mounting bolt (722) passes through the mounting block (71) and is threadedly connected to the adjusting block (63).

9. The punching and leveling device for a notebook heat sink according to claim 8, characterized in that, The adjusting block (63) is provided with a reinforcing mechanism (8), which includes a reinforcing block (81) and an adjusting component (82). The reinforcing block (81) is slidably disposed on the adjusting block (63), and the locking block (721) is provided with a reinforcing groove that engages with the reinforcing block (81). The adjusting component (82) is disposed on the adjusting block (63) and connected to the reinforcing block (81).

10. The punching and leveling device for a notebook heat sink according to claim 9, characterized in that, The adjustment assembly (82) includes an adjustment shaft (821), an adjustment gear (822), and an adjustment rack (823). The adjustment shaft (821) is rotatably mounted on the adjustment block (63). The adjustment gear (822) is keyed to the adjustment shaft (821). The adjustment rack (823) is mounted on the reinforcing block (81) and meshes with the adjustment gear (822).