Printed circuit board solder paste printing device

Abstract

The utility model discloses a solder paste printing device for a printed circuit board, which belongs to the field of printed circuit board production equipment and comprises a base component, a steel mesh component, a workbench mechanism and a scraper mechanism, a Z-axis component comprises a motor, a lead screw and a bottom plate, an X-axis component comprises a workbench, and the motor drives the lead screw to rotate and drives the bottom plate and the workbench to move up and down. The scraper mechanism comprises a scraper frame, a first air cylinder, a second air cylinder, a first scraper assembly and a second scraper assembly, the first scraper assembly and the second scraper assembly are oppositely arranged on the scraper frame, the distances between the first scraper assembly and the steel mesh are not equal, and the first air cylinder drives the scraper frame to move in the first direction so that the first scraper assembly can conduct through printing on the circuit board; the second air cylinder drives the scraper frame to move in the second direction so that the second scraper assembly can scrape redundant solder paste on the surface of the steel mesh back to the initial position. The device assists in removing redundant solder paste on the surface of the steel mesh, pollution is reduced, and meanwhile the solder paste is repeatedly utilized to reduce the production cost.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board production equipment, and in particular to a printed circuit board solder paste printing device. Background Technology

[0002] A solder paste printer is a device used to apply solder paste to the solder joints on a circuit board. It typically consists of a stencil, a squeegee, and other components. During printing, the stencil is placed on the circuit board, and the squeegee spreads the solder paste evenly across the stencil. The solder paste is then pressed through the stencil by the pressure of the squeegee and printed onto the circuit board.

[0003] In the existing technology, after the squeegee completes one solder paste printing, solder paste remains on the surface of the stencil, which can easily lead to contamination, affect subsequent processes of the circuit board, and fail to guarantee the final quality of the circuit board. Moreover, if the solder paste is removed directly, it will result in waste of solder paste and increase production costs. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a printed circuit board solder paste printing device that helps to remove excess solder paste from the surface of the stencil, reduces pollution, and allows for the reuse of solder paste to reduce production costs.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A solder paste printing apparatus for printed circuit boards includes a base assembly, a stencil assembly, a worktable mechanism, and a squeegee mechanism. The base assembly includes a base, side plates, and a support. The worktable mechanism includes a Z-axis assembly and an X-axis assembly. The Z-axis assembly includes a motor, a lead screw, and a base plate. The lead screw is vertically mounted on the base, and the base plate is mounted on the lead screw. The X-axis assembly includes a worktable connected to the base plate for placing the circuit board. The motor drives the lead screw to rotate, thereby moving the base plate and the worktable up and down. The stencil assembly includes a mounting frame and a stencil. The mounting frame is mounted on the support, and the stencil is mounted on the mounting frame and located within the support. Above the workbench, the scraper mechanism includes a scraper holder, a first cylinder, a second cylinder, a first scraper assembly, and a second scraper assembly. The scraper holder is mounted on the side plate. The first and second scraper assemblies are arranged opposite each other on the scraper holder, and the distances between them and the stencil are not equal. The first cylinder is located at one end of the side plate and drives the scraper holder to move in a first direction, so that the first scraper assembly applies solder paste onto the circuit board. The second cylinder is located at the other end of the side plate and drives the scraper holder to move in a second direction, so that the second scraper assembly scrapes excess solder paste from the surface of the stencil back to the starting position. The first and second directions are opposite.

[0007] Furthermore, the printed circuit board solder paste printing device also includes a Y-axis assembly, the motor is a first motor, the lead screw is a first lead screw, the X-axis assembly also includes a second motor and a second lead screw, the Y-axis assembly includes a third motor, a third lead screw and a support plate, the third motor and the third lead screw are mounted on the base plate, the support plate is mounted on the third lead screw, the second motor and the second lead screw are mounted on the support plate, and the worktable is mounted on the second lead screw.

[0008] Furthermore, the X-axis assembly includes two first guide rails and two first sliders, and the Y-axis assembly includes two second guide rails and two second sliders. The two second guide rails are arranged parallel to each other on the base plate, and the length direction of the second guide rails is parallel to the axial direction of the third lead screw. A second slider is slidably mounted on each second guide rail, and the support plate is fixedly connected to the second slider. The two first guide rails are arranged parallel to each other on the support plate, and the length direction of the first guide rails is parallel to the axial direction of the second lead screw. A first slider is slidably mounted on each first guide rail, and the worktable is fixedly connected to the first slider.

[0009] Furthermore, the first scraper assembly includes a third cylinder and a first scraper, the first scraper being coated with solder paste, and the third cylinder driving the first scraper to move up and down to approach the stencil; the second scraper assembly includes a fourth cylinder and a second scraper, the fourth cylinder driving the second scraper to move up and down to approach the stencil.

[0010] Furthermore, the blade angle of the first scraper is 45° to 60°, and the blade angle of the second scraper is 60° to 75°.

[0011] Compared to existing technologies, this utility model's printed circuit board solder paste printing device includes a base assembly, a stencil assembly, a worktable mechanism, and a scraper mechanism. The worktable mechanism includes a Z-axis assembly and an X-axis assembly. The Z-axis assembly includes a motor, a lead screw, and a base plate. The lead screw is vertically mounted on the base, and the base plate is mounted on the lead screw. The X-axis assembly includes a worktable connected to the base plate for placing the circuit board. The motor drives the lead screw to rotate, thereby moving the base plate and the worktable up and down. The stencil assembly includes a mounting frame and a stencil. The mounting frame is mounted on a support, and the stencil is mounted on the mounting frame and located at... Above the workbench, the squeegee mechanism includes a squeegee holder, a first cylinder, a second cylinder, a first squeegee assembly, and a second squeegee assembly. The squeegee holder is mounted on a side plate. The first and second squeegee assemblies are positioned opposite each other on the squeegee holder, with unequal distances between them and the stencil. The first cylinder is located at one end of the side plate and drives the squeegee holder to move in a first direction, causing the first squeegee assembly to apply solder paste onto the circuit board. The second cylinder is located at the other end of the side plate and drives the squeegee holder to move in a second direction, causing the second squeegee assembly to scrape excess solder paste from the stencil surface back to its starting position. This application assists in removing excess solder paste from the stencil surface, reducing contamination, while also allowing for the reuse of solder paste to reduce production costs. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the printed circuit board solder paste printing device of this utility model;

[0013] Figure 2 for Figure 1 Axial perspective sectional view of a printed circuit board solder paste printing device;

[0014] Figure 3 for Figure 1 A partial structural diagram of a solder paste printing device for printed circuit boards;

[0015] Figure 4 for Figure 1 A schematic diagram of the X-axis assembly of a printed circuit board solder paste printing device;

[0016] Figure 5 for Figure 1 A schematic diagram of the Y-axis assembly of a printed circuit board solder paste printing device.

[0017] In the diagram: 10. Base assembly; 11. Base; 12. Side plate; 13. Bracket; 20. Worktable mechanism; 21. Z-axis assembly; 211. First motor; 212. First lead screw; 213. Base plate; 22. X-axis assembly; 221. Second motor; 222. Second lead screw; 223. Worktable; 224. First guide rail; 225. First slider; 23. Y-axis assembly; 231. Third motor; 232. Third lead screw; 233. Support plate; 234. Second guide rail; 235. Second slider; 30. Steel mesh assembly; 31. Mounting bracket; 32. Steel mesh; 40. Scraper mechanism; 41. Scraper holder; 42. First cylinder; 43. Second cylinder; 44. First scraper assembly; 441. Third cylinder; 442. First scraper; 45. Second scraper assembly; 451. Fourth cylinder; 452. Second scraper. Detailed Implementation

[0018] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Figures 1-5The present invention relates to a solder paste printing device for printed circuit boards, comprising a base assembly 10, a worktable mechanism 20, a stencil assembly 30, and a scraper mechanism 40.

[0022] In this embodiment:

[0023] The base assembly 10 includes a base 11, side plates 12, and brackets 13. The two side plates 12 are mounted vertically on the base 11, and the multiple brackets 13 are mounted vertically on the base 11 and located between the two side plates 12 for mounting the mounting brackets 31 in the steel mesh assembly 30.

[0024] The worktable mechanism 20 includes a Z-axis assembly 21, an X-axis assembly 22, and a Y-axis assembly 23.

[0025] Z-axis assembly 21 includes a first motor 211, a first lead screw 212, and a base plate 213. The first lead screw 212 is vertically mounted on the base 11, and the base plate 213 is mounted on the first lead screw 212. The first motor 211 drives the first lead screw 212 to rotate and drives the base plate 213 to move up and down.

[0026] Y-axis assembly 23 includes a third motor 231, a third lead screw 232, a support plate 233, two second guide rails 234, and two second sliders 235.

[0027] The third motor 231 and the third lead screw 232 are mounted on the base plate 213, and the support plate 233 is mounted on the third lead screw 232. The third motor 231 drives the third lead screw 232 to rotate and drives the support plate 233 to move left and right.

[0028] Two second guide rails 234 are arranged parallel to each other on the base plate 213. The length direction of the second guide rail 234 is parallel to the axial direction of the third lead screw 232. A second slider 235 is slidably installed on each second guide rail 234. The support plate 233 is fixedly connected to the second slider 235.

[0029] The X-axis assembly 22 includes a second motor 221, a second lead screw 222, a worktable 223, two first guide rails 224, and two first sliders 225.

[0030] The second motor 221 and the second lead screw 222 are mounted on the support plate 233. The second motor 221 drives the second lead screw 222 to rotate and drives the worktable 223 to move back and forth.

[0031] Two first guide rails 224 are arranged parallel to each other on the support plate 233. The length direction of the first guide rail 224 is parallel to the axial direction of the second lead screw 222. A first slider 225 is slidably installed on each first guide rail 224.

[0032] The worktable 223 is mounted on the second lead screw 222 and fixedly connected to the first slider 225. The worktable 223 is used to place the circuit board. Through the above settings, this application achieves high-precision positioning and high-rigidity movement, meeting the requirements of PCB printing for positional accuracy and stability.

[0033] The stencil assembly 30 includes a mounting frame 31 and a stencil 32. The mounting frame 31 is mounted on the bracket 13, and the stencil 32 is mounted on the mounting frame 31 and located above the workbench 223.

[0034] The scraper mechanism 40 includes a scraper holder 41, a first cylinder 42, a second cylinder 43, a first scraper assembly 44, and a second scraper assembly 45.

[0035] The scraper holder 41 is mounted on the side plate 12. The first scraper assembly 44 and the second scraper assembly 45 are arranged opposite each other on the scraper holder 41 and the distances between them and the steel mesh 32 are not equal, so that they can perform different functions.

[0036] The first cylinder 42 is located at one end of the side plate 12 and drives the scraper holder 41 to move in the first direction, so that the first scraper assembly 44 will spray solder paste onto the circuit board.

[0037] The second cylinder 43 is located at the other end of the side plate 12 and drives the scraper holder 41 to move in the second direction, so that the second scraper assembly 45 scrapes the excess solder paste on the surface of the stencil 32 back to the starting position. This application assists in removing excess solder paste from the surface of the stencil 32, reducing contamination, while reusing the solder paste to reduce production costs. In this embodiment, the first direction and the second direction are opposite, and the first direction is parallel to the axial direction of the third lead screw 232.

[0038] The first scraper assembly 44 includes a third cylinder 441 and a first scraper 442. The first scraper 442 is coated with solder paste. The third cylinder 441 drives the first scraper 442 to move up and down to approach the stencil 32. In this embodiment, the first scraper 442 is typically made of metal (such as stainless steel) or hard plastic, and the blade angle of the first scraper 442 is 45° to 60°.

[0039] The second scraper assembly 45 includes a fourth cylinder 451 and a second scraper 452. The fourth cylinder 451 drives the second scraper 452 to move up and down to approach the steel mesh 32. The material of the second scraper 452 is similar to that of the first scraper 442, but the blade angle of the second scraper 452 is 60° to 75°, which is gentler to reduce resistance during scraping.

[0040] In use, the printed circuit board is first placed on the worktable 223, and the stencil 32 is mounted on the mounting bracket 31. Then, the first motor 211 drives the first lead screw 212 to rotate, causing the base plate 213 and the worktable 223 to move upwards towards the stencil 32. Next, the first cylinder 42 drives the squeegee holder 41 to move in the first direction, extruding solder paste onto the circuit board. After printing, the second cylinder 43 drives the squeegee holder 41 to move in the second direction, scraping excess solder paste from the surface of the stencil 32 back to its starting position. This application assists in removing excess solder paste from the surface of the stencil 32, reducing contamination, while reusing solder paste to reduce production costs. Through the Z-axis assembly 21, X-axis assembly 22, and Y-axis assembly 23, this application achieves high-precision positioning and high-rigidity movement, meeting the positional accuracy and stability requirements of PCB printing.

[0041] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A solder paste printing apparatus for printed circuit boards, comprising a base assembly (10) and a stencil assembly (30), characterized in that: It also includes a worktable mechanism (20) and a scraper mechanism (40). The base assembly (10) includes a base (11), a side plate (12), and a bracket (13). The worktable mechanism (20) includes a Z-axis assembly (21) and an X-axis assembly (22). The Z-axis assembly (21) includes a motor, a lead screw, and a base plate (213). The lead screw is vertically mounted on the base (11), and the base plate (213) is mounted on the lead screw. The X-axis assembly (22) includes a worktable (223), which is connected to the base plate (213) and is used to place the circuit board. The motor drives the lead screw to rotate and moves the base plate (213) and the worktable (223) up and down. The stencil assembly (30) includes a mounting frame (31) and a stencil (32). The mounting frame (31) is mounted on the bracket (13), and the stencil (32) is mounted on the mounting frame (31) and located on the worktable. Above the platform (223), the scraper mechanism (40) includes a scraper holder (41), a first cylinder (42), a second cylinder (43), a first scraper assembly (44), and a second scraper assembly (45). The scraper holder (41) is mounted on the side plate (12). The first scraper assembly (44) and the second scraper assembly (45) are arranged opposite to each other on the scraper holder (41) and the distances between them and the stencil (32) are not equal. The first cylinder (42) is located at one end of the side plate (12) and drives the scraper holder (41) to move in a first direction so that the first scraper assembly (44) will print solder paste onto the circuit board. The second cylinder (43) is located at the other end of the side plate (12) and drives the scraper holder (41) to move in a second direction so that the second scraper assembly (45) will scrape the excess solder paste on the surface of the stencil (32) back to the starting position. The first direction and the second direction are opposite.

2. The printed circuit board solder paste printing apparatus according to claim 1, characterized in that: The printed circuit board solder paste printing device also includes a Y-axis assembly (23), the motor is a first motor (211), the lead screw is a first lead screw (212), the X-axis assembly (22) also includes a second motor (221) and a second lead screw (222), the Y-axis assembly (23) includes a third motor (231), a third lead screw (232), and a support plate (233), the third motor (231) and the third lead screw (232) are mounted on the base plate (213), the support plate (233) is mounted on the third lead screw (232), the second motor (221) and the second lead screw (222) are mounted on the support plate (233), and the worktable (223) is mounted on the second lead screw (222).

3. The printed circuit board solder paste printing apparatus according to claim 2, characterized in that: The X-axis assembly (22) further includes two first guide rails (224) and two first sliders (225). The Y-axis assembly (23) includes two second guide rails (234) and two second sliders (235). The two second guide rails (234) are arranged parallel to each other on the base plate (213). The length direction of the second guide rails (234) is parallel to the axial direction of the third lead screw (232). A second slider (235) is slidably mounted on each second guide rail (234). The support plate (233) is fixedly connected to the second slider (235). The two first guide rails (224) are arranged parallel to each other on the support plate (233). The length direction of the first guide rails (224) is parallel to the axial direction of the second lead screw (222). A first slider (225) is slidably mounted on each first guide rail (224). The worktable (223) is fixedly connected to the first slider (225).

4. The printed circuit board solder paste printing apparatus according to claim 1, characterized in that: The first scraper assembly (44) includes a third cylinder (441) and a first scraper (442). The first scraper (442) is coated with solder paste. The third cylinder (441) drives the first scraper (442) to move up and down to approach the stencil (32). The second scraper assembly (45) includes a fourth cylinder (451) and a second scraper (452). The fourth cylinder (451) drives the second scraper (452) to move up and down to approach the stencil (32).

5. The printed circuit board solder paste printing apparatus according to claim 4, characterized in that: The blade angle of the first scraper (442) is 45° to 60°, and the blade angle of the second scraper (452) is 60° to 75°.

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