Sensor test system and semiconductor process equipment

Abstract

The utility model relates to a sensor testing system and semiconductor process equipment. The sensor testing system comprises a low-voltage testing unit, a high-voltage testing unit, a negative-voltage testing unit and a temperature testing unit. The testing device has the advantages that by arranging the low-pressure testing unit and the high-pressure testing unit, a low-pressure pressure sensor and an ultrahigh-pressure pressure sensor can be tested, so that pressure performance parameters of the sensors are tested, and diversity of testing varieties of the sensors is realized; the negative pressure test unit is communicated with the low pressure test unit and the high pressure test unit, so that a negative pressure condition can be provided for the test of the pressure sensor, and the test diversity is improved; by arranging the temperature testing unit, the temperature testing unit can enable the constant-temperature medium to pass through the sensor to be tested so as to simulate the actual use condition, so that the temperature performance parameters of the sensor are tested.

Description

Technical Field

[0001] This utility model relates to the field of sensor detection technology, and in particular to a sensor testing system and semiconductor process equipment. Background Technology

[0002] In the semiconductor industry, pressure sensors are widely used in gas and liquid conveying equipment. The requirements for pressure sensors vary depending on the different gases requiring different pressure regulation and the varying operating temperatures.

[0003] Existing technologies for testing sensors employ constant pressure and constant temperature testing equipment. This allows for the adjustment of pressure to test sensors within different pressure ranges, and the adjustment of ambient temperature to test the performance of pressure sensors at different temperatures.

[0004] However, existing technologies cannot test the parameters of sensors under negative pressure. Furthermore, in actual semiconductor production, sensors generally deal with environmental conditions of different medium temperatures and different flow media. However, the existing technologies that control environmental pressure and temperature through constant pressure and constant temperature testing equipment do not conform to the environmental conditions in actual semiconductor production, meaning that the testing conditions do not conform to the actual semiconductor production conditions.

[0005] Currently, no effective solutions have been proposed for the problems existing in related technologies, such as the inability to test the parameters of sensors under negative pressure environments and the fact that the detection conditions do not meet the actual semiconductor production conditions. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies by providing a sensor testing system and semiconductor process equipment, thereby solving problems such as the inability to test the parameters of sensors under negative pressure environments and the fact that the testing conditions do not meet the actual semiconductor production conditions.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0008] In a first aspect, this utility model provides a sensor testing system, comprising:

[0009] A low-pressure testing unit, which, together with a first low-pressure gas source, is used to perform low-pressure testing on the sensor sample;

[0010] A high-pressure testing unit, which is connected to a high-pressure gas source, is used to perform high-pressure testing on the sensor sample;

[0011] A negative pressure testing unit is connected to the low pressure testing unit, the high pressure testing unit, the exhaust gas treatment equipment, and the power air source, respectively, and is used to perform low pressure testing on the sensor sample;

[0012] A temperature testing unit is connected to a second low-pressure gas source and an exhaust gas treatment device, respectively, and is used to test the temperature of the sensor sample.

[0013] In some embodiments, the low-voltage test unit includes:

[0014] A first gas input element is connected to a first low-pressure gas source and is used to deliver a first low-pressure gas.

[0015] A first pressure regulating element is disposed on the first gas input element and is used to regulate the pressure inside the first gas input element;

[0016] A plurality of first test disk elements are respectively connected to the first gas input element for connecting the sensor sample and performing low-pressure testing on the sensor sample.

[0017] In some embodiments, the high-voltage testing unit includes:

[0018] The second gas input element is connected to a high-pressure gas source and is used to deliver high-pressure gas;

[0019] The second pressure regulating element is connected to the second gas input element and is used to regulate the pressure inside the second gas input element;

[0020] A plurality of second test disk elements are connected to the second gas input element respectively, for connecting the sensor sample and performing high-pressure testing on the sensor sample.

[0021] In some embodiments, the negative pressure testing unit includes:

[0022] A first gas output element is connected to the low-pressure test unit and the high-pressure test unit respectively, and is used to deliver exhaust gas;

[0023] The second gas output element is connected to the high-pressure testing unit and is used to deliver exhaust gas;

[0024] A third gas output element, which is connected to the second gas output element, is used to transport waste gas;

[0025] A vacuum element, which is connected to the third gas output element, is used to create a vacuum negative pressure at the end of the third gas output element;

[0026] A third gas input element is connected to the vacuum element and is used to provide power gas to the vacuum element;

[0027] The fourth gas output element is connected to the vacuum element and the waste gas treatment equipment respectively, and is used to transport waste gas.

[0028] In some embodiments, the temperature testing unit includes:

[0029] A fourth gas input element is connected to a second low-pressure gas source and is used to deliver the second low-pressure gas.

[0030] A third pressure regulating element is disposed on the fourth gas input element and is used to regulate the pressure inside the fourth gas input element;

[0031] A fifth gas input element, which is connected to the fourth gas input element, is used to deliver a second low-pressure gas;

[0032] A plurality of third test disk elements, each of which is connected to the fifth gas input element, are used to connect to the sensor sample and perform temperature testing on the sensor sample;

[0033] A fifth gas output element is connected to the fifth gas input element and the waste gas treatment equipment, respectively, and is used to output waste gas.

[0034] A temperature regulating element is provided for partial insertion of the fifth gas input element to regulate the internal temperature of the fifth gas input element.

[0035] In some embodiments, the negative pressure testing unit further includes:

[0036] A sixth gas output element, which is connected to the first gas output element and the third gas output element respectively, is used to transport waste gas;

[0037] A fourth pressure regulating element is disposed on the third gas output element and is used to regulate the pressure inside the third gas output element.

[0038] In some of these embodiments, it also includes:

[0039] A gas circulation unit is provided in the temperature testing unit to enable the self-circulation of gas within the temperature testing unit.

[0040] In some embodiments, the gas circulation unit includes:

[0041] A gas circulation pipeline component, which is connected to the temperature testing unit, is used to deliver a second low-pressure gas;

[0042] A gas circulation element is disposed in the gas circulation pipeline element and is used to drive the gas circulation flow within the gas circulation pipeline element and the temperature testing unit.

[0043] In some of these embodiments, it also includes:

[0044] A safety protection unit, which covers the low-pressure test unit and the high-pressure test unit, is used to prevent gas leakage.

[0045] Secondly, this utility model also provides a semiconductor process apparatus, comprising:

[0046] The sensor testing system as described in the first aspect.

[0047] In some of these embodiments, it also includes:

[0048] A first gas supply system is connected to the low-pressure test unit of the sensor test system and is used to supply a first low-pressure gas to the low-pressure test unit.

[0049] The second gas supply system is connected to the high-voltage test unit of the sensor test system and is used to supply high-pressure gas to the high-voltage test unit.

[0050] A third gas supply system is connected to the negative pressure test unit of the sensor test system and is used to provide power gas to the negative pressure test unit.

[0051] A fourth gas supply system, which is connected to the temperature testing unit of the sensor testing system, is used to provide a second low-pressure gas to the temperature testing unit;

[0052] An exhaust gas treatment system is connected to the negative pressure testing unit and temperature testing unit of the sensor testing system, and is used to treat exhaust gas.

[0053] The present invention adopts the above technical solution and has the following technical effects compared with the prior art:

[0054] This invention relates to a sensor testing system and semiconductor process equipment. By setting up a low-pressure testing unit and a high-pressure testing unit, it can test low-pressure sensors and ultra-high-pressure sensors to test the pressure performance parameters of the sensors, thereby achieving diversity in sensor testing. By connecting the negative pressure testing unit with the low-pressure and high-pressure testing units, negative pressure conditions can be provided for the testing of pressure sensors, further enhancing the diversity of testing. By setting up a temperature testing unit, a constant-temperature medium can be passed through the sensor under test to simulate actual usage conditions, thereby achieving the testing of the sensor's temperature performance parameters. Attached Figure Description

[0055] Figure 1 This is a schematic diagram (a) of a sensor testing system according to an embodiment of the present utility model;

[0056] Figure 2 This is a schematic diagram (a) of the low-pressure test unit, high-pressure test unit, negative-pressure test unit and temperature test unit according to an embodiment of the present utility model;

[0057] Figure 3 This is a schematic diagram (II) of the negative pressure testing unit according to an embodiment of the present utility model;

[0058] Figure 4 This is a schematic diagram (II) of a sensor testing system according to an embodiment of the present utility model;

[0059] Figure 5 This is a schematic diagram of a gas circulation unit according to an embodiment of the present utility model;

[0060] Figure 6 This is a schematic diagram (III) of a sensor testing system according to an embodiment of the present invention.

[0061] The reference numerals in the attached figures are as follows: 100, low-pressure test unit; 101, first pressure regulating element; 102, first test plate element; 103, first control element; 104, second control element; 105, third control element; 106, first pressure monitoring element;

[0062] 200. High-pressure testing unit; 201. Second pressure regulating element; 202. Second test plate element; 203. Fourth control element; 204. Fifth control element; 205. Sixth control element; 206. Seventh control element; 207. Second pressure monitoring element;

[0063] 300. Negative pressure testing unit; 301. Vacuum element; 302. Eighth control element; 303. Ninth control element; 304. First unidirectional element; 305. Fourth pressure regulating element; 306. Fourteenth control element; 307. Fifth pressure monitoring element;

[0064] 400. Temperature testing unit; 401. Third pressure regulating element; 402. Third test plate element; 403. Temperature adjustment element; 404. Tenth control element; 405. Eleventh control element; 406. Twelfth control element; 407. Second unidirectional element; 408. Thirteenth control element; 409. Third pressure monitoring element; 410. Fourth pressure monitoring element;

[0065] 500. Gas circulation unit; 501. Gas circulation element; 502. Fifteenth control element; 503. Sixteenth control element; 600. Safety protection unit. Detailed Implementation

[0066] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application.

[0067] Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without any inventive effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, any changes to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0068] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0069] Example 1

[0070] This embodiment relates to the sensor testing system of this utility model.

[0071] An illustrative embodiment of this utility model, such as Figure 1As shown, a sensor testing system includes a low-pressure testing unit 100, a high-pressure testing unit 200, a negative-pressure testing unit 300, and a temperature testing unit 400. The low-pressure testing unit 100 is connected to a first low-pressure gas source and is used to perform low-pressure testing on the sensor sample; the high-pressure testing unit 200 is connected to a high-pressure gas source and is used to perform high-pressure testing on the sensor sample; the negative-pressure testing unit 300 is connected to the low-pressure testing unit 100, the high-pressure testing unit 200, an exhaust gas treatment device, and a power gas source, and is used to perform low-pressure testing on the sensor sample; the temperature testing unit 400 is connected to a second low-pressure gas source and the exhaust gas treatment device, and is used to perform temperature testing on the sensor sample.

[0072] It should be noted that the first end and the second end in this utility model are the two ends in its length direction, respectively.

[0073] It should be noted that the first low-pressure gas source includes, but is not limited to, a low-pressure nitrogen source.

[0074] It should be noted that high-pressure gas sources include, but are not limited to, high-pressure nitrogen sources.

[0075] It should be noted that the power source includes, but is not limited to, compressed air and nitrogen.

[0076] It should be noted that the second low-pressure gas source includes, but is not limited to, a low-pressure nitrogen source.

[0077] like Figure 2 As shown, the low-pressure testing unit 100 includes a first gas input element, a first pressure regulating element 101, and a plurality of first test disk elements 102. The first gas input element is connected to a first low-pressure gas source and is used to supply the first low-pressure gas; the first pressure regulating element 101 is disposed on the first gas input element and is used to regulate the pressure inside the first gas input element; the plurality of first test disk elements 102 are respectively connected to the first gas input element and are used to connect to the sensor sample and perform low-pressure testing on the sensor sample.

[0078] Specifically, the first end of the first gas input element is connected to the first low-pressure gas source, and the second end of the first gas input element is connected to the negative pressure detection unit.

[0079] In some of these embodiments, the first gas input element includes, but is not limited to, a stainless steel tube.

[0080] In some of these embodiments, the first pressure regulating element 101 includes, but is not limited to, a pressure regulating valve.

[0081] Specifically, there are four first test disk elements 102, and each of the four first test disk elements 102 is connected to a first gas input element.

[0082] In some embodiments, the number of first test disk elements 102 may be 3, 5, etc., that is, the number of first test disk elements 102 can be set according to actual needs, and no further restrictions are imposed here.

[0083] Furthermore, the low-pressure testing unit 100 also includes a first control element 103, a second control element 104, and several third control elements 105. The first control element 103 is disposed on the first gas input element and located upstream of the first pressure regulating element 101, and is used to control the flow between the first gas input element and the first low-pressure gas source. The second control element 104 is disposed on the first gas input element and located downstream of the first pressure regulating element 101, and is used to control the flow between the first gas input element and the first test disk element 102. The several third control elements 105 are respectively disposed on corresponding first test disk elements 102, and are used to control the flow between the first gas input element and the first test disk element 102.

[0084] Specifically, there are four third control elements 105, and the four third control elements 105 are respectively set on the corresponding first test disk element 102.

[0085] It should be noted that the number of the third control element 105 is matched with the number of the first test disk element 102; it should be understood that the number of the third control element 105 is the same as the number of the first test disk element 102.

[0086] In some of these embodiments, the first control element 103, the second control element 104, and the third control element 105 include, but are not limited to, a manual diaphragm valve.

[0087] Furthermore, the low-pressure testing unit 100 also includes a first pressure monitoring element 106. The first pressure monitoring element 106 is connected to the first gas input element and is used to monitor the pressure inside the first gas input element.

[0088] Specifically, the connection between the first pressure monitoring element 106 and the first gas input element is located downstream of the first pressure regulating element 101 and upstream of the second control element 104.

[0089] In some of these embodiments, the first pressure monitoring element 106 includes, but is not limited to, a digital pressure gauge.

[0090] like Figure 2As shown, the high-pressure testing unit 200 includes a second gas input element, a second pressure regulating element 201, and a plurality of second test disk elements 202. The second gas input element is connected to a high-pressure gas source and is used to deliver high-pressure gas; the second pressure regulating element 201 is connected to the second gas input element and is used to regulate the internal pressure of the second gas input element; the plurality of second test disk elements 202 are respectively connected to the second gas input element and are used to connect to the sensor sample and perform high-pressure testing on the sensor sample.

[0091] Specifically, the first end of the second gas input element is connected to the second low-pressure gas source, and the second end of the second gas input element is connected to the negative pressure test unit 300.

[0092] In some of these embodiments, the second gas input element includes, but is not limited to, a stainless steel tube.

[0093] In some of these embodiments, the second pressure regulating element 201 includes, but is not limited to, a manual booster.

[0094] Specifically, there are four second test disk elements 202, and each of the four second test disk elements 202 is connected to the second end of the second gas input element.

[0095] In some embodiments, the number of second test disk elements 202 may also be 3, 5, etc., that is, the number of second test disk elements 202 can be set according to actual needs, and no further restrictions are imposed here.

[0096] Furthermore, the high-voltage testing unit 200 also includes a fourth control element 203, a fifth control element 204, a sixth control element 205, and several seventh control elements 206. Specifically, the fourth control element 203 is disposed on the second gas input element and located upstream of the second pressure regulating element 201, and is used to control the flow between the second gas input element and the high-pressure gas source; the fifth control element 204 is disposed on the second gas input element and located downstream of the second pressure regulating element 201, and is used to control the flow between the second gas input element; the sixth control element 205 is disposed on the second gas input element and located downstream of the fifth control element 204, and is used to control the flow between the second gas input element and the second test disk element 202; and the several seventh control elements 206 are respectively disposed on corresponding second test disk elements 202, and are used to control the flow between the second gas input element and the second test disk element 202.

[0097] Specifically, there are four seventh control elements 206, and the four seventh control elements 206 are respectively set on the corresponding second test disk element 202.

[0098] It should be noted that the number of the seventh control element 206 is matched with the number of the second test panel elements 202; it should be understood that the number of the seventh control element 206 is the same as the number of the second test panel elements 202.

[0099] In some of these embodiments, the fourth control element 203, the fifth control element 204, the sixth control element 205, and the seventh control element 206 include, but are not limited to, manual diaphragm valves.

[0100] Furthermore, the high-pressure testing unit 200 also includes a second pressure monitoring element 207. The second pressure monitoring element 207 is connected to the second gas input element and is used to monitor the pressure inside the second gas input element.

[0101] Specifically, the connection between the second pressure monitoring element 207 and the second gas input element is located downstream of the fifth control element 204 and upstream of the sixth control element 205.

[0102] In some of these embodiments, the second pressure monitoring element 207 includes, but is not limited to, a digital pressure gauge.

[0103] like Figure 2 As shown, the negative pressure testing unit 300 includes a first gas output element, a second gas output element, a third gas output element, a vacuum element 301, a third gas input element, and a fourth gas output element. The first gas output element is connected to both the low-pressure testing unit 100 and the high-pressure testing unit 200, and is used to transport exhaust gas. The second gas output element is connected to the high-pressure testing unit 200, and is used to transport exhaust gas. The third gas output element is connected to the second gas output element, and is used to transport exhaust gas. The vacuum element 301 is connected to the third gas output element, and is used to create a vacuum negative pressure at the end of the third gas output element. The third gas input element is connected to the vacuum element 301, and is used to provide power gas to the vacuum element 301. The fourth gas output element is connected to both the vacuum element 301 and the exhaust gas treatment equipment, and is used to transport exhaust gas.

[0104] Specifically, the first end of the first gas output element is connected to the second end of the first gas input element, and the second end of the first gas output element is connected to the second end of the second gas input element.

[0105] Specifically, the first end of the second gas output element is connected to the second gas input element, and the second end of the second gas output element is connected to the first end of the third gas input element.

[0106] Specifically, the first end of the third gas output element is connected to the second end of the second gas output element, and the second end of the third gas output element is connected to the vacuum element 301.

[0107] Specifically, the first end of the third gas input element is connected to the power gas source, and the second end of the third gas input element is connected to the vacuum element 301.

[0108] Specifically, the first end of the fourth gas output element is connected to the vacuum element 301, and the second end of the fourth gas output element is connected to the waste gas treatment equipment.

[0109] In some embodiments, the first gas output element, the second gas output element, the third gas output element, the third gas input element, and the fourth gas output element include, but are not limited to, stainless steel tubes.

[0110] In some of these embodiments, vacuum element 301 includes, but is not limited to, a Venturi vacuum pump.

[0111] Furthermore, the negative pressure testing unit 300 also includes an eighth control element 302, a ninth control element 303, and a first unidirectional element 304. The eighth control element 302 is disposed on the first gas output element and is used to control the flow of gas through the first gas output element; the ninth control element 303 is disposed on the second gas output element and is used to control the flow of gas through the second gas output element; the first unidirectional element 304 is disposed on the third gas output element and is used to ensure unidirectional gas flow within the second gas output element.

[0112] In some of these embodiments, the eighth control element 302 and the ninth control element 303 include, but are not limited to, manual diaphragm valves.

[0113] In some of these embodiments, the first one-way element 304 includes, but is not limited to, a one-way valve.

[0114] like Figure 2 As shown, the temperature testing unit 400 includes a fourth gas input element, a third pressure regulating element 401, a fifth gas input element, several third test plate elements 402, a fifth gas output element, and a temperature regulating element 403. The fourth gas input element is connected to a second low-pressure gas source and is used to supply the second low-pressure gas; the third pressure regulating element 401 is disposed on the fourth gas input element and is used to regulate the internal pressure of the fourth gas input element; the fifth gas input element is connected to the fourth gas input element and is used to supply the second low-pressure gas; the several third test plate elements 402 are respectively connected to the fifth gas input element and are used to connect to the sensor sample and perform temperature testing on the sensor sample; the fifth gas output element is respectively connected to the fifth gas input element and the waste gas treatment equipment and is used to output waste gas; the temperature regulating element 403 is used to allow partial insertion into the fifth gas input element and to regulate the internal temperature of the fifth gas input element.

[0115] Specifically, the first end of the fourth gas input element is connected to the second low-pressure gas source, and the second end of the fourth gas input element is connected to the fifth gas input element.

[0116] Specifically, the first end of the fifth gas input element is connected to the second end of the fourth gas input element, and the second end of the fifth gas input element is connected to the fifth gas output element.

[0117] It should be noted that the fifth gas input element is partially coiled inside the temperature regulating element 403.

[0118] Specifically, the first end of the fifth gas output element is connected to the second end of the fifth gas input element, and the second end of the fifth gas output element is connected to the waste gas treatment equipment.

[0119] In some of these embodiments, the fourth gas input element, the fifth gas input element, and the fifth gas output element include, but are not limited to, stainless steel tubes and heat pipes.

[0120] Specifically, there are eight third test disk elements 402, and each of the eight third test disk elements 402 is connected to the fifth gas input element. The connection between the third test disk elements 402 and the fifth gas input element is located downstream of the temperature regulating element 403.

[0121] In some embodiments, the number of third test disk elements 402 may also be 6, 10, etc., that is, the number of third test disk elements 402 can be set according to actual needs, and no further restrictions are imposed here.

[0122] In some of these embodiments, the third pressure regulating element 401 includes, but is not limited to, a pressure regulating valve.

[0123] Specifically, the temperature regulating element 403 can regulate the temperature of the gas inside the fifth gas input element through heat conduction.

[0124] In some of these embodiments, the temperature regulating element 403 includes, but is not limited to, a constant temperature water bath and a heating block.

[0125] It should be noted that the temperature regulating element 403 is a heating block, and its temperature regulation range is 20℃~100℃.

[0126] It should be noted that the temperature regulating element 403 is a constant temperature water bath, and its temperature regulation range is -30℃ to 100℃.

[0127] Furthermore, the temperature testing unit 400 also includes a tenth control element 404, an eleventh control element 405, several twelfth control elements 406, a second unidirectional element 407, and a thirteenth control element 408. Specifically, the tenth control element 404 is disposed on the fourth gas input element and located upstream of the third pressure regulating element 401, used to control the flow between the fourth gas input element and the second low-pressure gas source; the eleventh control element 405 is disposed on the fourth gas input element and located downstream of the third pressure regulating element 401, used to control the flow between the fourth gas input element and the fifth gas input element; several twelfth control elements 406 are respectively disposed on corresponding third test plate elements 402, used to control the flow between the fifth gas input element and the third test plate element 402; the second unidirectional element 407 is disposed on the fifth gas output element, used to enable unidirectional gas flow inside the fifth gas output element; and the thirteenth control element 408 is disposed on the fifth gas output element and located downstream of the second unidirectional element 407, used to control the flow between the fifth gas output element and the waste gas treatment equipment.

[0128] In some of these embodiments, the tenth control element 404, the eleventh control element 405, the twelfth control element 406, and the thirteenth control element 408 include, but are not limited to, manual diaphragm valves.

[0129] In some of these embodiments, the second one-way element 407 includes, but is not limited to, a one-way valve.

[0130] Furthermore, the temperature testing unit 400 also includes a third pressure monitoring element 409 and a fourth pressure monitoring element 410. The third pressure monitoring element 409 is connected to a fourth gas input element and is used to monitor the pressure inside the fourth gas input element; the fourth pressure monitoring element 410 is connected to a fifth gas input element and is used to monitor the pressure inside the fifth gas input element.

[0131] Specifically, the connection between the third pressure monitoring element 409 and the fourth gas input element is located downstream of the third pressure regulating element 401 and upstream of the eleventh control element 405.

[0132] In some of these embodiments, the third pressure monitoring element 409 and the fourth pressure monitoring element 410 include, but are not limited to, pressure sensors and digital pressure gauges.

[0133] The usage method of this embodiment is as follows:

[0134] (I) Low-voltage test

[0135] In actual work, the staff installed the sensor sample on the first test plate element 102, and then manually turned on the first control element 103 to allow the first low-pressure gas to flow into the first gas input element.

[0136] The staff turned on the first pressure regulating element 101 to adjust the gas pressure inside the first gas input element, so that the gas pressure met the test requirements.

[0137] When the value displayed by the first pressure monitoring element 106 meets the requirements, the operator manually turns on the second control element 104 and the corresponding third control element 105, so that the first low-pressure gas in the first gas input element flows to the first test plate element 102 to realize the test operation of the sensor sample.

[0138] (II) High Voltage Test

[0139] In actual operation, the staff installed the sensor sample on the second test plate element 202. Then, the staff manually turned on the fourth control element 203, so that high-pressure gas flowed into the second gas input element.

[0140] The staff adjusts the gas pressure inside the second gas input element through the second pressure regulating element 201 and the manual booster.

[0141] The staff manually activates the fifth control element 204, allowing the gas inside the second gas input element to flow to the second pressure monitoring element 207. If the gas pressure monitored by the second pressure monitoring element 207 meets the standard, the sixth control element 205 and the seventh control element 206 are activated, allowing the high-pressure gas to flow to the second test plate element 202, so as to realize the testing operation of the sensor sample.

[0142] (III) Negative Pressure Test

[0143] In actual operation, the staff closes the second control element 104 and the sixth control element 205, and opens the eighth control element 302, the ninth control element 303, and the vacuum element 301, thereby creating a vacuum negative pressure at the second end of the third gas output element, which can then vent the gas inside the first gas input element, the second gas input element, the first gas output element, the second gas output element, and the third gas output element.

[0144] The staff activates the third control element 105 and the seventh control element 206, thereby enabling negative pressure testing of the sensor sample.

[0145] (iv) Temperature test

[0146] In actual work, the staff installed the sensor sample on the third test plate element 402. Then, the staff manually turned on the tenth control element 404, so that the second low-pressure gas flowed into the fourth gas input element.

[0147] The staff activated the third pressure regulating element 401 to adjust the gas pressure inside the fourth gas input element, so that the gas pressure met the test requirements.

[0148] The staff observes the value of the third pressure monitoring element 409. If the third pressure monitoring element 409 meets the standard, the staff activates the eleventh control element 405 to connect the fourth gas input element and the fifth gas input element.

[0149] The staff observes the value of the fourth pressure monitoring element 410. If the fourth pressure monitoring element 410 meets the standard, the staff activates the twelfth control element 406, so that the second low-pressure gas can flow to the third test plate element 402 to realize the test operation of the sensor sample.

[0150] After the test is completed, the staff manually activates the thirteenth control element 408, and the gas after the test can flow to the waste gas treatment equipment through the fifth gas output element.

[0151] The advantages of this embodiment are that by setting up low-pressure and high-pressure test units, low-pressure and ultra-high-pressure sensors can be tested to measure the pressure performance parameters of the sensors, thus achieving diversity in sensor testing. By connecting the negative-pressure test unit with the low-pressure and high-pressure test units, negative-pressure conditions can be provided for the testing of pressure sensors, further enhancing the diversity of testing. By setting up a temperature test unit, a constant-temperature medium can be passed through the sensor under test to simulate actual usage conditions, thereby enabling the testing of the sensor's temperature performance parameters.

[0152] Example 2

[0153] This embodiment is a modified embodiment of embodiment 1.

[0154] like Figure 3 As shown, the negative pressure testing unit 300 also includes a sixth gas output element and a fourth pressure regulating element 305. The sixth gas output element is connected to the first gas output element and the third gas output element respectively, and is used to transport exhaust gas; the fourth pressure regulating element 305 is disposed on the third gas output element and is used to regulate the pressure inside the third gas output element.

[0155] Specifically, the first end of the sixth gas output element is connected to the first gas output element, and the second end of the sixth gas output element is connected to the first end of the third gas output element.

[0156] It should be noted that the connection point between the first end of the sixth gas output element and the first gas output element is located upstream of the eighth control element 302.

[0157] In some of these embodiments, the sixth gas output element includes, but is not limited to, a stainless steel tube.

[0158] Specifically, the fourth pressure regulating element 305 is on the sixth gas output element and is located upstream of the first unidirectional element 304.

[0159] In some of these embodiments, the fourth pressure regulating element 305 includes, but is not limited to, a pressure regulating valve.

[0160] Furthermore, the negative pressure testing unit 300 also includes a fourteenth control element 306. The fourteenth control element 306 is disposed on the sixth gas output element and is used to control the flow through the sixth gas output element.

[0161] In some of these embodiments, the fourteenth control element 306 includes, but is not limited to, a manual diaphragm valve.

[0162] Furthermore, the negative pressure testing unit 300 also includes a fifth pressure monitoring element 307. The fifth pressure monitoring element 307 is connected to the third gas output element and is used to monitor the pressure inside the third gas output element.

[0163] Specifically, the connection point between the fifth pressure monitoring element 307 and the third gas output element is located upstream of the first one-way element 304 and downstream of the fourth pressure regulating element 305.

[0164] In some of these embodiments, the fifth pressure monitoring element 307 includes, but is not limited to, a pressure sensor.

[0165] The usage method of this embodiment is as follows:

[0166] In actual operation, the staff closes the second control element 104 and the sixth control element 205, and opens the ninth control element 303, the fourteenth control element 306, and the vacuum element 301, thereby creating a vacuum negative pressure at the second end of the third gas output element in the vacuum element 301, which in turn allows the gas from the first gas input element, the second gas input element, the sixth gas output element, and the second gas output element to be discharged to the third gas output element.

[0167] The staff activated the fourth pressure regulating element 305, which regulated the gas in the third gas output element and discharged the regulated gas to the waste gas treatment equipment.

[0168] The staff activates the third control element 105 and the seventh control element 206, thereby enabling negative pressure testing of the sensor sample.

[0169] The advantage of this embodiment is that by separating the vacuum exhaust sections of the low-pressure test unit and the high-pressure test unit into high and low pressure sections, the efficiency of vacuum exhaust is improved.

[0170] Example 3

[0171] This embodiment is a modified embodiment of Embodiments 1 and 2.

[0172] like Figure 4 As shown, a sensor testing system further includes a gas circulation unit 500. The gas circulation unit 500 is disposed within the temperature testing unit 400 and is used to achieve self-circulation of gas within the temperature testing unit 400.

[0173] like Figure 5 As shown, the gas circulation unit 500 includes a gas circulation pipeline element and a gas circulation element 501. The gas circulation pipeline element is connected to the temperature testing unit 400 and is used to transport a second low-pressure gas; the gas circulation element 501 is disposed in the gas circulation pipeline element and is used to drive the gas circulation flow within the gas circulation pipeline element and the temperature testing unit 400.

[0174] Specifically, the first end of the gas circulation pipeline element is connected to the fifth gas output element, and the connection between the first end of the gas circulation pipeline element and the fifth gas output element is located downstream of the second one-way element 407 and upstream of the thirteenth control element 408. The second end of the gas circulation pipeline element is connected to the fourth gas input element, and the connection between the second end of the gas circulation pipeline element and the fourth gas input element is located downstream of the tenth control element 404 and upstream of the third pressure regulating element 401.

[0175] In some of these embodiments, the gas circulation piping components include, but are not limited to, stainless steel pipes.

[0176] In some of these embodiments, the gas circulation element 501 includes, but is not limited to, a gas circulation pump.

[0177] Furthermore, the gas circulation unit 500 also includes a fifteenth control element 502 and a sixteenth control element 503. The fifteenth control element 502 is disposed on the gas circulation pipeline element and located upstream of the gas circulation element 501, and is used to control the flow between the temperature testing unit 400 and the gas circulation pipeline element. The sixteenth control element 503 is disposed on the gas circulation pipeline element and located downstream of the gas circulation element 501, and is used to control the flow between the gas circulation pipeline element and the temperature testing unit 400.

[0178] In some embodiments, the fifteenth control element 502 and the sixteenth control element 503 include, but are not limited to, manual diaphragm valves.

[0179] The usage method of this embodiment is as follows:

[0180] In actual operation, when testing the temperature of the sensor, the operator can manually activate the fifteenth control element 502, the sixteenth control element 503, and the gas circulation element 501, so that the second low-pressure gas can circulate through the fourth gas input element, the fifth gas input element, the fifth gas output element, and the gas circulation pipeline element, thereby simulating the working environment of the sensor in actual use.

[0181] The advantage of this embodiment is that by adding a gas circulation unit, the working environment of the sensor in actual use can be simulated, thereby improving the test accuracy; in addition, the consumption of the second low-pressure gas can be reduced, thus lowering the test cost.

[0182] Example 4

[0183] This embodiment is a modified embodiment of embodiments 1 to 3.

[0184] like Figure 6 As shown, a sensor testing system includes a safety protection unit 600. The safety protection unit 600 covers a low-pressure testing unit 100 and a high-pressure testing unit 200 to prevent gas leakage.

[0185] In some of these embodiments, the installation protection unit includes, but is not limited to, an explosion-proof enclosure.

[0186] It should be noted that the safety protection unit 600 can prevent personal injury caused by high-pressure gas in the event of a high-pressure gas leak, thereby improving safety in actual use.

[0187] The usage method and advantages of this embodiment are the same as those of Embodiments 1 to 3, and will not be repeated here.

[0188] Example 5

[0189] This embodiment relates to semiconductor process equipment of this utility model.

[0190] A semiconductor process apparatus includes a sensor testing system as described in Examples 1 to 4.

[0191] Furthermore, the semiconductor process equipment also includes a first gas supply system, a second gas supply system, a third gas supply system, a fourth gas supply system, and an exhaust gas treatment system. The first gas supply system is connected to the low-pressure testing unit 100 of the sensor testing system and supplies a first low-pressure gas to the low-pressure testing unit 100; the second gas supply system is connected to the high-pressure testing unit 200 of the sensor testing system and supplies high-pressure gas to the high-pressure testing unit 200; the third gas supply system is connected to the negative-pressure testing unit 300 of the sensor testing system and provides motive gas to the negative-pressure testing unit 300; the fourth gas supply system is connected to the temperature testing unit 400 of the sensor testing system and provides a second low-pressure gas to the temperature testing unit 400; the exhaust gas treatment system is connected to both the negative-pressure testing unit 300 and the temperature testing unit 400 of the sensor testing system and is used to treat the exhaust gas.

[0192] Specifically, the first gas supply system is connected to the first end of the first gas input element.

[0193] Specifically, the second gas supply system is connected to the first end of the second gas input element.

[0194] Specifically, the third gas supply system is connected to the first end of the third gas input element.

[0195] Specifically, the fourth gas supply system is connected to the first end of the fourth gas input element.

[0196] Specifically, the exhaust gas treatment system is connected to the second end of the fourth gas output element.

[0197] The usage method and advantages of this embodiment are the same as those of Embodiments 1 to 3, and will not be repeated here.

[0198] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0199] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A sensor testing system, characterized in that, include: A low-pressure testing unit, which, together with a first low-pressure gas source, is used to perform low-pressure testing on the sensor sample; A high-pressure testing unit, which is connected to a high-pressure gas source, is used to perform high-pressure testing on the sensor sample; A negative pressure testing unit is connected to the low pressure testing unit, the high pressure testing unit, the exhaust gas treatment equipment, and the power air source, respectively, and is used to perform low pressure testing on the sensor sample; A temperature testing unit is connected to a second low-pressure gas source and an exhaust gas treatment device, respectively, and is used to test the temperature of the sensor sample.

2. The sensor testing system according to claim 1, characterized in that, The low-voltage testing unit includes: A first gas input element is connected to a first low-pressure gas source and is used to deliver a first low-pressure gas. A first pressure regulating element is disposed on the first gas input element and is used to regulate the pressure inside the first gas input element; A plurality of first test disk elements, each connected to a first gas input element, are used to connect to a sensor sample and perform low-pressure testing on the sensor sample; and / or The high-voltage testing unit includes: The second gas input element is connected to a high-pressure gas source and is used to deliver high-pressure gas; The second pressure regulating element is connected to the second gas input element and is used to regulate the pressure inside the second gas input element; A plurality of second test disk elements, each connected to a second gas input element, are used to connect to the sensor sample and perform high-pressure testing on the sensor sample; and / or The negative pressure testing unit includes: A first gas output element is connected to the low-pressure test unit and the high-pressure test unit respectively, and is used to deliver exhaust gas; The second gas output element is connected to the high-pressure testing unit and is used to deliver exhaust gas; A third gas output element, which is connected to the second gas output element, is used to transport waste gas; A vacuum element, which is connected to the third gas output element, is used to create a vacuum negative pressure at the end of the third gas output element; A third gas input element is connected to the vacuum element and is used to provide power gas to the vacuum element; A fourth gas output element, which is connected to the vacuum element and the waste gas treatment equipment respectively, is used to transport waste gas; and / or The temperature testing unit includes: A fourth gas input element is connected to a second low-pressure gas source and is used to deliver the second low-pressure gas. A third pressure regulating element is disposed on the fourth gas input element and is used to regulate the pressure inside the fourth gas input element; A fifth gas input element, which is connected to the fourth gas input element, is used to deliver a second low-pressure gas; A plurality of third test disk elements, each of which is connected to the fifth gas input element, are used to connect to the sensor sample and perform temperature testing on the sensor sample; A fifth gas output element is connected to the fifth gas input element and the waste gas treatment equipment, respectively, and is used to output waste gas. A temperature regulating element is provided for partial insertion of the fifth gas input element to regulate the internal temperature of the fifth gas input element.

3. The sensor testing system according to claim 2, characterized in that, The negative pressure testing unit also includes: A sixth gas output element, which is connected to the first gas output element and the third gas output element respectively, is used to transport waste gas; A fourth pressure regulating element is disposed on the third gas output element and is used to regulate the pressure inside the third gas output element.

4. The sensor testing system according to claim 2, characterized in that, The low-voltage testing unit also includes: A first control element is disposed on the first gas input element and located upstream of the first pressure regulating element, and is used to control the flow between the first gas input element and the first low-pressure gas source; A second control element is disposed on the first gas input element and located downstream of the first pressure regulating element, and is used to control the flow of the first gas input element; A plurality of third control elements, each disposed on a corresponding first test disk element, are used to control the flow between the first gas input element and the first test disk element; and / or The high-voltage testing unit also includes: A fourth control element is disposed on the second gas input element and located upstream of the second pressure regulating element, and is used to control the flow between the second gas input element and the high-pressure gas source; A fifth control element is disposed on the second gas input element and located downstream of the second pressure regulating element, and is used to control the flow of the second gas input element; A sixth control element is disposed on the second gas input element and located downstream of the fifth control element, and is used to control the flow of the second gas input element; A plurality of seventh control elements, each disposed on a corresponding second test disk element, are used to control the flow between the second gas input element and the second test disk element; and / or The negative pressure testing unit also includes: An eighth control element is disposed on the first gas output element and is used to control the flow of the first gas output element; A ninth control element is disposed on the second gas output element and is used to control the flow of the second gas output element; A first unidirectional element, disposed on the third gas output element, is used to enable unidirectional gas flow inside the second gas output element; and / or The temperature testing unit also includes: The tenth control element is disposed on the fourth gas input element and located upstream of the third pressure regulating element, and is used to control the flow between the fourth gas input element and the second low-pressure gas source; The eleventh control element is disposed on the fourth gas input element and located downstream of the third pressure regulating element, and is used to control the flow between the fourth gas input element and the fifth gas input element; A plurality of twelfth control elements are respectively disposed on the corresponding third test disk elements, for controlling the flow between the fifth gas input element and the third test disk elements; The second unidirectional element is disposed on the fifth gas output element and is used to enable the gas inside the fifth gas output element to flow in one direction. The thirteenth control element is disposed on the fifth gas output element and located downstream of the second unidirectional element, and is used to control the flow between the fifth gas output element and the waste gas treatment equipment.

5. The sensor testing system according to claim 3, characterized in that, The negative pressure testing unit also includes: The fourteenth control element is disposed on the sixth gas output element and is used to control the flow of the sixth gas output element.

6. The sensor testing system according to claim 2, characterized in that, The low-voltage testing unit also includes: A first pressure monitoring element, connected to the first gas input element, is used to monitor the pressure inside the first gas input element; and / or The high-voltage testing unit also includes: A second pressure monitoring element, connected to the second gas input element, is used to monitor the pressure inside the second gas input element; and / or The temperature testing unit also includes: A third pressure monitoring element, which is connected to the fourth gas input element, is used to monitor the pressure inside the fourth gas input element; A fourth pressure monitoring element, which is connected to the fifth gas input element, is used to monitor the pressure inside the fifth gas input element; and / or The negative pressure testing unit also includes: A fifth pressure monitoring element, which is connected to the third gas output element, is used to monitor the pressure inside the third gas output element.

7. The sensor testing system according to claim 1, characterized in that, Also includes: A gas circulation unit is provided in the temperature testing unit to realize the self-circulation of gas within the temperature testing unit; and / or A safety protection unit, which covers the low-pressure test unit and the high-pressure test unit, is used to prevent gas leakage.

8. The sensor testing system according to claim 7, characterized in that, The gas circulation unit includes: A gas circulation pipeline component, which is connected to the temperature testing unit, is used to deliver a second low-pressure gas; A gas circulation element is disposed in the gas circulation pipeline element and is used to drive the gas circulation flow within the gas circulation pipeline element and the temperature testing unit.

9. The sensor testing system according to claim 8, characterized in that, The gas circulation unit further includes: The fifteenth control element is disposed on the gas circulation pipeline element and located upstream of the gas circulation element, and is used to control the flow between the temperature testing unit and the gas circulation pipeline element; The sixteenth control element is disposed in the gas circulation pipeline element and located downstream of the gas circulation element, and is used to control the flow between the gas circulation pipeline element and the temperature testing unit.

10. A semiconductor process apparatus, characterized in that, include: The sensor testing system as described in any one of claims 1 to 9.

11. The semiconductor process equipment according to claim 10, characterized in that, Also includes: A first gas supply system is connected to the low-pressure test unit of the sensor test system and is used to supply a first low-pressure gas to the low-pressure test unit. The second gas supply system is connected to the high-voltage test unit of the sensor test system and is used to supply high-pressure gas to the high-voltage test unit. A third gas supply system is connected to the negative pressure test unit of the sensor test system and is used to provide power gas to the negative pressure test unit. A fourth gas supply system, which is connected to the temperature testing unit of the sensor testing system, is used to provide a second low-pressure gas to the temperature testing unit; An exhaust gas treatment system is connected to the negative pressure testing unit and temperature testing unit of the sensor testing system, and is used to treat exhaust gas.

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