Heat dissipation mechanism of data processing server

Abstract

The utility model provides a data processing server heat dissipation mechanism which comprises a main shell, electronic fluorinated liquid is poured into the inner side of the main shell, the inner side of the main shell is connected with a mounting plate in a sliding mode, and a server mainboard is fixedly installed on the top side of the mounting plate through a fastener. The whole server mainboard is immersed in the electronic fluorination liquid; and two groups of connecting grooves are symmetrically formed in each of the two sides of the mounting plate, two groups of connecting rods are fixedly mounted on each of the two sides of the inner wall of the main shell, and the four groups of connecting grooves are slidably connected with the four groups of connecting rods correspondingly. Through cooperation of the main shell and the electronic fluorination liquid, the server mainboard soaked in the electronic fluorination liquid can be cooled, the server mainboard is kept in a low-temperature state all the time, the situation that a cooling fan directly blows the server mainboard for cooling is avoided, and the cooling efficiency of a product is improved.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology, and more specifically, it relates to a heat dissipation mechanism for a data processing server. Background Technology

[0002] A data processing server is a server specifically designed to process large amounts of data. It is frequently used in large data centers, research institutions, financial institutions, and other fields to handle complex data calculations, analysis, and simulations.

[0003] When using servers, heat dissipation is necessary to prevent the internal electrical components from overheating. Currently, heat dissipation for these components typically involves direct contact with air, followed by cooling fans that circulate air around them. However, this method is ineffective and slow in practice, failing to achieve rapid cooling. Therefore, this paper researches and improves upon existing structures and their shortcomings to provide a data processing server heat dissipation mechanism with greater practical value. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a heat dissipation mechanism for a data processing server, which is achieved by the following specific technical means:

[0005] A data processing server heat dissipation mechanism includes a main housing, the inner side of which is filled with an electronic fluorinated liquid. A mounting plate is slidably connected to the inner side of the main housing, and a server motherboard is fixedly mounted on the top side of the mounting plate using fasteners. The server motherboard is entirely immersed in the electronic fluorinated liquid. Two sets of connecting grooves are symmetrically arranged on both sides of the mounting plate. Two sets of connecting rods are fixedly mounted on both sides of the inner wall of the main housing, and the four sets of connecting grooves are slidably connected to the four sets of connecting rods. Magnets are fixedly embedded in the four corners of the bottom side of the inner wall of the main housing. Four sets of connecting seats are fixedly mounted on the bottom side of the mounting plate corresponding to the four sets of magnets. Magnets are fixedly mounted on the inner side of each of the four sets of connecting seats, and the four sets of magnets attract each other. Multiple sets of connecting holes are provided on one side of the main housing, and wiring mechanisms are fixedly mounted on the inner side of each of the multiple sets of connecting holes.

[0006] Furthermore, two sets of handles are symmetrically fixed to the top side of the mounting plate by fasteners.

[0007] Furthermore, through holes are provided on both sides of the main housing, and the horizontal height of both sets of through holes is lower than the highest liquid level of the electronic fluorinated liquid; cooling pipes are connected to both sets of through holes, and one-way inlet valves and one-way outlet valves are fixedly installed on the inner side of one end of each set of cooling pipes; a pump is installed on one side of the main housing, and the other ends of the two sets of cooling pipes are fixedly connected to the output end and input end of the pump, respectively.

[0008] Furthermore, multiple sets of heat dissipation fins are fixedly installed at equal intervals on the outer side of the cooling pipe, and a cooling fan is installed on one side of the main housing, with the exhaust side of the cooling fan corresponding to the heat dissipation fins.

[0009] Furthermore, a first fixing bracket and a second fixing bracket are fixedly installed on one side of the main housing. The top side of the first fixing bracket is fixedly connected to the cooling fan by fasteners, and the first fixing bracket is provided with a ventilation port corresponding to the cooling fan. The top side of the second fixing bracket is fixedly connected to the bottom side of the pump by fasteners.

[0010] Furthermore, a top cover is rotatably connected to the top side of the main housing via a hinge, and a latch is fixedly installed on the top cover. A buckle is fixedly installed on one side of the main housing corresponding to the latch.

[0011] Furthermore, a mounting groove is provided on the top side of the main housing, and a sealing ring is fixedly bonded in the mounting groove.

[0012] Furthermore, the wiring mechanism includes a fixed base connected to the inner side of the connection hole. Both ends of the inner wall of the fixed base are fixedly connected to a wiring female base. The two sets of wiring female bases are connected by a wire. One side of the wiring female base abuts against one side of the inner wall of the main housing and is fixedly bonded with a sealing ring. One end of the wiring female base passes through the connection hole and is threaded with a nut.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. This utility model, through the cooperation of the main shell and the electronic fluorinated liquid, can cool down the server motherboard immersed in the electronic fluorinated liquid and keep the server motherboard at a low temperature at all times, avoiding the need to use a cooling fan to directly blow heat onto the server motherboard, thus increasing the heat dissipation efficiency of the product.

[0015] 2. This utility model, through the cooperation of magnet one and magnet two, can stably connect the mounting plate to the main housing, preventing the mounting plate from shifting. Through the cooperation of the handle and the mounting plate, the mounting plate and the server motherboard can be easily picked up and removed, so as to facilitate maintenance personnel to maintain and repair the server motherboard, thus increasing the practicality of the product. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0017] Figure 2 This is a schematic diagram of the server motherboard installation according to this utility model.

[0018] Figure 3 This is a schematic diagram of the cooling fan structure of this utility model.

[0019] Figure 4 This is a schematic diagram of the mounting plate structure of this utility model.

[0020] Figure 5 This is a schematic diagram of the connecting seat and magnet of this utility model.

[0021] Figure 6 This is a schematic diagram of the wiring mechanism of this utility model.

[0022] In the diagram, the correspondence between component names and drawing numbers is as follows:

[0023] 1. Main casing; 2. Mounting plate; 3. Server motherboard; 4. Cooling pipe; 5. Heat sink fins; 6. Cooling fan; 7. Sealing ring one; 8. Handle; 9. Connecting groove; 10. Connecting rod; 11. Magnet one; 12. Magnet two; 13. Mounting bracket one; 14. Mounting bracket two; 15. Pump; 16. Mounting base; 17. Wiring female socket; 18. Sealing ring two; 19. Nut; 20. Top cover; 21. Lock; 22. Buckle. Detailed Implementation

[0024] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0025] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Example:

[0028] As attached Figure 1 To be continued Figure 6 As shown:

[0029] This utility model provides a heat dissipation mechanism for a data processing server, including a main housing 1. An electronic fluorinated liquid is poured into the inner side of the main housing 1. A mounting plate 2 is slidably connected to the inner side of the main housing 1. A server motherboard 3 is fixedly mounted on the top side of the mounting plate 2 by fasteners. The server motherboard 3 is entirely immersed in the electronic fluorinated liquid. Two sets of connecting grooves 9 are symmetrically arranged on both sides of the mounting plate 2. Two sets of connecting rods 10 are fixedly installed on both sides of the inner wall of the main housing 1. The four sets of connecting grooves 9 are slidably connected to the four sets of connecting rods 10. Magnets 11 are fixedly embedded in the four corners of the bottom side of the inner wall of the main housing 1. Four sets of connecting seats are fixedly installed on the bottom side of the mounting plate 2 corresponding to the four sets of magnets 11. Magnets 22 are fixedly installed on the inner side of the four sets of connecting seats, and the four sets of magnets 212 are attracted to the four sets of magnets 11. Multiple sets of connecting holes are provided on one side of the main housing 1, and wiring mechanisms are fixedly installed on the inner side of the multiple sets of connecting holes.

[0030] Two sets of handles 8 are symmetrically fixed to the top side of the mounting plate 2 by fasteners, which can make it easy to remove the mounting plate 2 and the server motherboard 3 from the main housing 1.

[0031] The main housing 1 has through holes on both sides, and the horizontal height of both sets of through holes is lower than the highest liquid level of the electronic fluorinated liquid. Cooling pipes 4 are connected to both sets of through holes. One-way inlet valve and one-way outlet valve are fixedly installed on the inner side of one end of each set of cooling pipes 4. A pump 15 is installed on one side of the main housing 1. The other ends of the two sets of cooling pipes 4 are fixedly connected to the output end and input end of the pump 15, respectively. This allows the electronic fluorinated liquid in the main housing 1 to be cooled, thereby increasing the cooling efficiency of the product.

[0032] The cooling pipe 4 has multiple sets of heat dissipation fins 5 fixedly installed at equal intervals on its outer side. A cooling fan 6 is installed on one side of the main housing 1. The air outlet side of the cooling fan 6 is set corresponding to the heat dissipation fins 5, which can accelerate the cooling speed of the electronic fluorinated liquid.

[0033] The main housing 1 is fixedly installed with a first fixing bracket 13 and a second fixing bracket 14 on one side. The top side of the first fixing bracket 13 is fixedly connected to the cooling fan 6 by fasteners, which can provide stable support for the cooling fan 6. The first fixing bracket 13 is provided with a ventilation port corresponding to the cooling fan 6. The top side of the second fixing bracket 14 is fixedly connected to the bottom side of the pump 15 by fasteners, which can provide stable support for the pump 15.

[0034] The main housing 1 is connected to a top cover 20 via a hinge on its top side. A latch 21 is fixedly installed on the top cover 20. A buckle 22 is fixedly installed on one side of the main housing 1 corresponding to the latch 21, which can realize the convenient fixation of the top cover 20 on the main housing 1.

[0035] The main housing 1 has a mounting groove on its top side, and a sealing ring 7 is fixedly bonded in the mounting groove to prevent the electronic fluorinated liquid from escaping from the junction of the top cover 20 and the main housing 1 after boiling and vaporizing, thus preventing the waste of the electronic fluorinated liquid.

[0036] The wiring mechanism includes a fixed base 16 connected to the inner side of the connection hole. Both ends of the inner wall of the fixed base 16 are fixedly connected to a female connector 17. The two sets of female connectors 17 are connected by wires, and the data lines required by the server motherboard 3 can be connected to one set of female connectors 17. The female connector 17 closer to the inner side of the main housing 1 is connected to the data lines of the server motherboard 3, thereby realizing the data transmission of the server motherboard 3. One side of the female connector 17 abuts against one side of the inner wall of the main housing 1 and is fixedly bonded with a sealing ring 18. One end of the female connector 17 passes through the connection hole and is threaded with a nut 19 to prevent the electronic fluorinated liquid from leaking from the connection hole to the outside of the main housing 1, which would lead to waste of electronic fluorinated liquid or cause environmental pollution.

[0037] The working principle of this embodiment is as follows: When the heat dissipation mechanism is required, the cooling fan 6 and pump 15 in the product are connected to an external power supply and control unit. First, the mounting plate 2 and the server motherboard 3 are placed in a suitable position using the handle 8. At this time, magnet 11 and magnet 212 attract each other, and the server motherboard 3 is immersed in the electronic fluorinated liquid. The power cord and data cord of the server motherboard 3 are connected to the wiring female connector 17 near the inner side of the main housing 1. Another set of wiring female connectors 17 are connected to the data cord and power cord required by the server motherboard 3. Then, the top cover 20 is closed, and the latch 22 is connected to the lock 21. The server motherboard 3 is then put into use. The electronic fluorinated liquid dissipates heat from the server motherboard 3. At the same time, the pump 15 is started to draw the electronic fluorinated liquid into the cooling pipe 4 for circulation. The cooling fan 6 is started to increase the airflow speed around the heat dissipation fins 5 to cool the electronic fluorinated liquid. This process is repeated to continuously dissipate heat from the server motherboard 3.

[0038] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A heat dissipation mechanism for a data processing server, comprising a main housing (1), characterized in that: The inner side of the main housing (1) is filled with electronic fluorinated liquid. A mounting plate (2) is slidably connected to the inner side of the main housing (1). A server motherboard (3) is fixedly mounted on the top side of the mounting plate (2) by fasteners. The server motherboard (3) is completely immersed in the electronic fluorinated liquid. Two sets of connecting grooves (9) are symmetrically provided on both sides of the mounting plate (2). Two sets of connecting rods (10) are fixedly installed on both sides of the inner wall of the main housing (1). The four sets of connecting grooves (9) are respectively connected to the four sets of connecting rods. (10) Sliding connection; Magnets 1 (11) are fixedly embedded on the four corners of the bottom side of the inner wall of the main housing (1), and four sets of connecting seats are fixedly installed on the bottom side of the mounting plate (2) corresponding to the four sets of magnets 1 (11). Magnets 2 (12) are fixedly installed on the inner side of the four sets of connecting seats, and the four sets of magnets 2 (12) are attracted to each other with the four sets of magnets 1 (11); Multiple sets of connecting holes are provided on one side of the main housing (1), and wiring mechanisms are fixedly installed on the inner side of the multiple sets of connecting holes.

2. The heat dissipation mechanism for the data processing server as described in claim 1, characterized in that: Two sets of handles (8) are symmetrically fixed on the top side of the mounting plate (2) by fasteners.

3. The data processing server heat dissipation mechanism as described in claim 1, characterized in that: Both sides of the main housing (1) are provided with through holes, and the horizontal height of both sets of through holes is lower than the highest liquid level of the electronic fluorinated liquid; both sets of through holes are connected to cooling pipes (4), and one-way inlet valves and one-way outlet valves are fixedly installed on the inner side of one end of each set of cooling pipes (4); a pump (15) is installed on one side of the main housing (1), and the other ends of the two sets of cooling pipes (4) are fixedly connected to the output end and input end of the pump (15) respectively.

4. The data processing server heat dissipation mechanism as described in claim 3, characterized in that: Multiple sets of heat dissipation fins (5) are fixedly installed at equal intervals on the outer side of the cooling pipe (4). A cooling fan (6) is installed on one side of the main housing (1), and the air outlet side of the cooling fan (6) is set corresponding to the heat dissipation fins (5).

5. The data processing server heat dissipation mechanism as described in claim 4, characterized in that: A first fixing bracket (13) and a second fixing bracket (14) are fixedly installed on one side of the main housing (1). The top side of the first fixing bracket (13) is fixedly connected to the cooling fan (6) by fasteners, and the first fixing bracket (13) is provided with a ventilation port corresponding to the cooling fan (6). The top side of the second fixing bracket (14) is fixedly connected to the bottom side of the pump (15) by fasteners.

6. The heat dissipation mechanism for the data processing server as described in claim 1, characterized in that: A top cover (20) is rotatably connected to the top side of the main housing (1) via a hinge. A latch (21) is fixedly installed on the top cover (20), and a buckle (22) is fixedly installed on one side of the main housing (1) corresponding to the latch (21).

7. The heat dissipation mechanism for the data processing server as described in claim 1, characterized in that: The main housing (1) has a mounting groove on its top side, and a sealing ring (7) is fixedly bonded in the mounting groove.

8. The heat dissipation mechanism for the data processing server as described in claim 1, characterized in that: The wiring mechanism includes a fixed base (16) connected to the inside of the connection hole. Both ends of the inner wall of the fixed base (16) are fixedly connected to a wiring female base (17). The two sets of wiring female bases (17) are connected by wires. One side of the wiring female base (17) abuts against one side of the inner wall of the main housing (1) and is fixedly bonded with a sealing ring (18). One end of the wiring female base (17) passes through the connection hole and is threaded with a nut (19).

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