Mainboard and electronic equipment

Abstract

The utility model provides a mainboard and electronic equipment, the mainboard comprises a board body, the board body comprises a base layer, a copper layer and a circuit structure printed on the surface of the copper layer, and the copper layer and the circuit structure are wrapped by the base layer to protect a corresponding circuit; a crystal is arranged on the surface of the board body and is conducted with the circuit structure; according to the invention, the copper layer corresponding to the periphery and the bottom of the crystal on the board body is precisely hollowed, and the ground pin snakelike wiring design is adopted, so that a good working environment is created for the crystal on the premise that the overall size of the board body is not increased, and the heat influence and electromagnetic interference of other circuit structures on the crystal are effectively reduced; therefore, stable operation of various functions of electronic equipment such as a smart watch is stably ensured, the product quality is remarkably improved, and the user experience is improved; and meanwhile, the light, thin and integrated development of corresponding electronic equipment such as an intelligent watch is effectively promoted.

Description

Technical Field

[0001] This application relates to the field of motherboard design technology, and further to a motherboard and electronic device. Background Technology

[0002] As is well known, crystals are components on the motherboard used to provide stable clock signals, ensure communication quality, and optimize power management. As the core component of motherboard timing control, their stability directly affects system performance and reliability.

[0003] In related technologies, the performance of crystals is affected by factors such as the surrounding structure and wiring methods. Temperature and electromagnetic interference can significantly impact their accuracy and stability. Therefore, optimizing the design of the crystal's surrounding structure and circuit layout on the motherboard, reducing the thermal impact and electromagnetic interference of surrounding circuits on the crystal, and improving its operation after installation in equipment will have a profound impact on the development of the motherboard industry and the improvement of the overall performance of related equipment. Utility Model Content

[0004] The purpose of this application is to provide a motherboard and electronic device that, through a reasonable layout design, reduces the thermal impact and electromagnetic interference of peripheral circuits on the crystal, ensures the operating performance of the motherboard after it is installed in the corresponding device, and improves the user experience.

[0005] The technical solution provided in this application is as follows:

[0006] On one hand, this application provides a motherboard, including:

[0007] The board includes a base layer, a copper layer, and a circuit structure, wherein the circuit structure is printed on the copper layer, and the base layer encapsulates the copper layer and the circuit structure.

[0008] A crystal is disposed on the surface of the plate and is connected to the circuit structure;

[0009] The plate body has a preset isolation area on the periphery corresponding to the crystal, and the preset isolation area only includes the base layer.

[0010] The motherboard provided in this application has a hollowed-out copper layer, so that only a base layer is provided within a preset range around the crystal, thereby forming a three-dimensional isolation area around the crystal. This reduces the heat conducted to the crystal by heat source devices around the crystal through the copper layer and reduces electromagnetic coupling interference generated by the surrounding circuit structure through the copper layer. This effectively improves the accuracy and stability of the crystal, enhances the stability and accuracy of the corresponding motherboard after it is installed in the corresponding device, and ensures that the corresponding device can operate smoothly and reliably, thus effectively improving the user experience.

[0011] In some embodiments, the preset isolation region is located within a radius of 0.5-1 mm around the crystal.

[0012] The motherboard provided in this application sets up an isolation area within a radius of 0.5-1mm around the crystal, which can effectively reduce the impact of heat sources and electromagnetic interference on the crystal, and also ensure the normal operation of other circuit structures on the motherboard. In this way, while improving the stability and accuracy of the crystal, the impact on other functional circuits on the motherboard is significantly reduced, effectively reducing the cost investment of enterprises in the design of this motherboard, which is conducive to cost reduction and efficiency improvement for enterprises.

[0013] In some embodiments, the area of ​​the plate corresponding to the bottom of the crystal includes only the base layer, and the crystal is disposed on the base layer.

[0014] The motherboard provided in this application does not have a copper layer or circuit structure in the motherboard area at the bottom of the crystal. It only uses the base layer to support the crystal, so as to provide a relatively independent and stable working environment for the crystal. This helps to further reduce heat conduction and electromagnetic interference from the bottom layer of the motherboard and effectively ensure the stability of crystal performance.

[0015] In some embodiments, the crystal has a GND pin, which is connected to the main ground line of the board via a ground pin trace;

[0016] Furthermore, one end of the ground pin connection to the main ground line of the board is positioned away from the crystal.

[0017] The motherboard provided in this application sets the ground pin lead-out terminal away from the crystal, increasing the distance between the crystal and other circuit structures, which helps to further reduce heat conduction and electromagnetic interference to the crystal from other circuit structures on the motherboard.

[0018] In some embodiments, the ground pin routing is located at the bottom of the crystal and is distributed in a continuous serpentine pattern corresponding to the size of the crystal.

[0019] The motherboard provided in this application features a serpentine routing pattern for the crystal ground pin at the bottom of the crystal. Optimizing the shape and position of this serpentine routing effectively increases the inductance of the ground pin, suppresses high-frequency electromagnetic interference signals, and improves the crystal's grounding stability, without affecting the normal signal transmission of other circuit structures on the board. Furthermore, the ground pin routing effectively absorbs and conducts heat from the crystal, enhancing its heat dissipation capabilities.

[0020] In some implementations, the width of the grounding pin wiring is 0.1-0.5 mm.

[0021] In some implementations, the bending radius of the grounding pin wiring is 0.1-0.5 mm.

[0022] In some embodiments, the crystal has signal lines through which the crystal conducts power to the chip in the circuit structure.

[0023] In some embodiments, the signal lines surrounding the crystal on the plate are provided with multiple ground lines.

[0024] The motherboard provided in this application grounds the signal lines of the crystal and shields the crystal circuit from interference with other circuits, thereby stabilizing and ensuring the frequency accuracy and stability of the crystal.

[0025] On the other hand, this application also provides an electronic device including any of the motherboards described above.

[0026] Compared with the prior art, the motherboard and electronic device provided in this application have at least one of the following advantages:

[0027] 1. This application innovatively designs the crystal's peripheral structure and wiring. Through precise copper layer hollowing and motherboard design, it creates a good working environment for the crystal without increasing the overall size of the motherboard. This effectively reduces the impact of heat-generating devices and surrounding circuit structures on the crystal's performance, improves the crystal's stability and accuracy, and facilitates the development of thinner and more integrated motherboards. At the same time, the use of a serpentine routing method for the crystal's ground pin ensures crystal performance while minimizing the impact on signal transmission of other circuit structures on the board, significantly reducing heat accumulation on the crystal, and effectively improving the overall performance of the corresponding motherboard.

[0028] 2. In this application, the crystal traces are grounded in a three-dimensional manner to further reduce the mutual interference between the crystal and other circuit structures. This helps to ensure the accuracy and stability of the crystal, thereby effectively ensuring the stable operation of the motherboard after it is installed in the corresponding equipment. The corresponding equipment operates smoothly and reliably, which helps to improve the user experience and maintain the company's image. Attached Figure Description

[0029] The optional implementation methods will be explained below in a clear and easy-to-understand manner, with reference to the accompanying drawings, to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of this solution.

[0030] Figure 1 This is a magnified view of a portion of the cutout area on the motherboard, which is the main feature of this application embodiment.

[0031] Figure 2 This is a partial enlarged view of the embodiment of the present application, which mainly illustrates the form of the hollow layer setting on the motherboard;

[0032] Figure 3 This is a magnified view of a portion of the embodiment of this application, which mainly illustrates the serpentine routing layer configuration on the motherboard.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1. Board body; 11. Base layer; 2. Crystal; 21. GND pin; 22. Ground pin trace; 23. Signal line; 3. Preset isolation area; 4. Isolation space; 5. Ground line. Detailed Implementation

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0036] To keep the drawings concise, each drawing only schematically shows the parts relevant to this application, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of the components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0037] In the electronics field, the crystal on the motherboard serves as the core clock source for digital circuits, and its performance directly affects the stability and accuracy of the system. Since its performance is greatly affected by factors such as temperature and electromagnetic interference, optimizing the design of the crystal's peripheral structure and circuit layout on the motherboard, reducing the thermal impact and electromagnetic interference of the peripheral circuits on the crystal, and improving the operation of the motherboard after it is installed in the device has become an important research direction in related industries.

[0038] For this, please refer to the accompanying drawings in the instruction manual. Figures 1 to 3 In one embodiment, a motherboard is provided, including a board body 1. Specifically, the board body 1 includes a base layer 11, a copper layer, and a circuit structure printed on the surface of the copper layer. The base layer 11 encloses the copper layer and the circuit structure. A crystal 2 is provided on the surface of the board body 1, and the crystal 2 conducts the circuit structure. Furthermore, after the copper layer on the board body 1 corresponding to the periphery of the crystal 2 is hollowed out, a preset isolation area 3 consisting only of the base layer 11 is formed around the crystal 2.

[0039] This copper layer cutout design creates a three-dimensional pre-defined isolation area 3 between the crystal 2 and the surrounding circuit structure. Since this pre-defined isolation area 3 covers key parts of the crystal 2 that may be affected by heat sources and prone to electromagnetic interference, the physical path of heat propagation is cut off by cutting out the copper layer, effectively reducing the heat conducted from the surrounding heat source circuit structure to the crystal 2. At the same time, it effectively reduces the electromagnetic coupling interference generated by the surrounding circuit structure through the copper layer, thereby effectively ensuring the accuracy and stability of the crystal 2. When this motherboard with the crystal 2 is applied to a specific device, it can effectively ensure the stable operation of various functions, significantly improving its product quality and user experience.

[0040] In one embodiment, specifically based on the above embodiments, this embodiment refers to... Figure 1 Centered on crystal 2, within a preset radius of 0.5-1mm around it, the copper layer on the surface and inside of board 1 is removed by etching, thus creating a preset isolation region 3. Through multiple experiments and analyses, it was found that removing the copper layer within this range can reduce the thermal impact and electromagnetic interference of surrounding circuit structures on crystal 2 while ensuring the normal operation of other circuit structures on board 1. Optionally, in this embodiment, the radius of the preset isolation region 3 around crystal 2 is 0.5mm, meaning the radial / width dimension of the preset isolation region 3 is 0.5mm, to stably reduce the thermal impact and electromagnetic interference of surrounding heat sources and circuit structures on crystal 2 through the copper layer.

[0041] Furthermore, refer to Figure 2 No other circuit structures are laid on the area corresponding to the bottom of the crystal 2 on the board 1, only the base layer 11 is included. The crystal 2 is placed on the corresponding base layer 11. That is, the copper layer on the board 1 corresponding to the bottom of the crystal 2 is also hollowed out, and the hollowed-out area is connected to the preset isolation area 3 around the crystal 2 to form a new isolation space 4. In this way, the crystal 2 is in a relatively independent and stable working environment, further improving its performance stability.

[0042] In the embodiments of this application, when manufacturing the motherboard, high-precision mechanical drilling and etching processes can be used to hollow out the multi-layer motherboard around and at the bottom of the crystal 2. It should be noted that the drilling process must strictly control the position and depth of the drilling to ensure that it does not penetrate other important circuit structures on the board 1. The etching process must ensure the flatness and edge precision of the hollowed-out area, accurately remove the copper layer in the hollowed-out area, and avoid introducing new interference factors due to process defects.

[0043] Reference Figures 1 to 3Crystal 2 has a GND pin 21 to conduct the main ground line of board 1. In this embodiment, the GND pin 21 is connected to the main ground line of board 1 through ground pin trace 22. Specifically, starting from the GND pin 21 of crystal 2, i.e., the ground pin, the trace is designed in a continuous serpentine shape and located at the bottom of crystal 2. This design effectively increases the inductance of the ground pin trace 22, suppresses high-frequency electromagnetic interference signals, improves the grounding stability of crystal 2, and at the same time, can fully absorb and conduct the heat of crystal 2, enhancing the heat dissipation effect of crystal 2.

[0044] In the embodiments of this application, the line width of the ground pin trace 22 can be set in the range of 0.1-0.5mm, and its bending radius is also set in the range of 0.1-0.5mm. In this embodiment, the line width and bending radius of the optional ground pin trace 22 can both be set to 0.1mm, and its total length is designed according to the specific position of the crystal 2 and the motherboard layout. Of course, its total length depends more on the size of the crystal 2.

[0045] In addition, to further reduce the heat conduction and electromagnetic interference of other circuit structures on the motherboard to the crystal 2, the lead-out end of the ground pin 22 is set away from the crystal 2, that is, the end of the ground pin 22 connected to the main ground line 5 of the board 1 is set away from the crystal 2.

[0046] Furthermore, the crystal 2 also has signal lines 23, through which the crystal 2 is connected to the chip in the circuit structure; for example, signal lines 23 include a first signal input line and a first signal output line; the chip in the circuit structure has a second signal input line and a second signal output line; wherein the second signal input line is connected to the first signal output line, and the second signal output line is connected to the first signal input line. In the embodiments of this application, the serpentine routing area of ​​the ground pin 22 does not exceed the coverage area of ​​the GND pin 21 and the signal lines 23.

[0047] Furthermore, in order to effectively shield the interference between the crystal 2 circuit and other circuits, multiple ground lines 5 are provided on the board 1 surrounding the signal lines 23 of the crystal 2. By performing three-dimensional grounding treatment on the signal lines 23 of the crystal 2, the anti-interference performance of the crystal 2 is effectively improved.

[0048] To ensure the completeness of the technical solution of this application, the following will further elaborate on the technical solution of this application by taking the above-mentioned motherboard applied to an electronic device as an example. In one embodiment, an electronic device is also provided, the electronic device including a smartwatch, the smartwatch using the motherboard described in any of the above embodiments to process various instructions, store data and realize communication and sensor functions.

[0049] Of course, the electronic devices may also include other smart hosts such as mobile phones and tablets.

[0050] The implementation principle of this embodiment is as follows: By precisely hollowing out the copper layer around and at the bottom of the crystal 2, and adopting a serpentine routing design for the ground pins, a good working environment is created for the crystal 2 without increasing the overall size of the motherboard. This effectively reduces the thermal impact and electromagnetic interference of other circuit structures on the crystal 2, ensuring the stable operation of various functions of smartwatches and other electronic devices, improving product quality, and enhancing user experience. Simultaneously, it facilitates the development of thinner and more integrated smartwatches and other electronic devices. Furthermore, due to the simplicity of the optimization method, the motherboard setup is convenient and cost-effective, which also helps enterprises reduce costs and increase efficiency.

[0051] It should be noted that the above embodiments can be freely combined as needed. The above descriptions are merely optional implementations of this application. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A motherboard, characterized in that, include; The board includes a base layer, a copper layer, and a circuit structure, wherein the circuit structure is printed on the copper layer, and the base layer encapsulates the copper layer and the circuit structure. A crystal is disposed on the surface of the plate and is connected to the circuit structure; The plate body has a preset isolation area on the periphery corresponding to the crystal, and the preset isolation area only includes the base layer.

2. A motherboard according to claim 1, characterized in that, The preset isolation area is located within a radius of 0.5-1 mm around the crystal.

3. A motherboard according to claim 1 or 2, characterized in that, The area of ​​the plate corresponding to the bottom of the crystal includes only the base layer, and the crystal is disposed on the base layer.

4. A motherboard according to claim 1 or 2, characterized in that, The crystal has a GND pin, which is connected to the main ground line of the board through a ground pin trace. Furthermore, one end of the ground pin connection to the main ground line of the board is positioned away from the crystal.

5. A motherboard according to claim 4, characterized in that, The ground pin traces are located at the bottom of the crystal and are distributed in a continuous serpentine pattern corresponding to the crystal size.

6. A motherboard according to claim 5, characterized in that, The width of the grounding pin wiring is 0.1-0.5mm.

7. A motherboard according to claim 5, characterized in that, The bending radius of the grounding pin wiring is 0.1-0.5mm.

8. A motherboard according to claim 1 or 2, characterized in that, The crystal has signal lines, and the crystal conducts power to the chip in the circuit structure through the signal lines.

9. A motherboard according to claim 8, characterized in that, The signal lines surrounding the crystal on the plate are provided with multiple ground lines.

10. An electronic device, characterized in that, Includes the motherboard described in any one of claims 1-9 above.

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