Vehicle-mounted electronic equipment
By using a combination of elastic components and an ultra-thin thermally conductive layer between the chip and the heat sink, the assembly tolerance problem between the chip and the heat sink was solved, resulting in a more efficient heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DALIAN NEUSOFT ZHIHANG TECH CO LTD
- Filing Date
- 2025-04-30
- Publication Date
- 2026-04-24
AI Technical Summary
In the existing technology, there are tolerance issues in the assembly of chips and heat sinks, which leads to an increase in the thickness of the thermal conductive layer and reduces the heat dissipation efficiency of the chip.
A combination of elastic components and an ultra-thin thermal conductive layer is adopted. The elastic components absorb the assembly tolerances of the circuit board, chip and heat sink, the thickness of the thermal conductive layer is reduced, the tightness between the heat sink and the chip is improved, and the thermal resistance is reduced.
It effectively reduces the physical gap between the heat sink and the chip, improves heat dissipation efficiency, reduces the temperature difference at both ends of the heat-conducting layer, and improves the heat dissipation performance of the chip.
Smart Images
Figure CN224165016U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of heat dissipation technology, and more specifically, to an in-vehicle electronic device. Background Technology
[0002] With the rapid development of automotive domain control, intelligent driving, and multimedia industries, the demands on the computing power of main chips are increasing, leading to a corresponding increase in the heat generated by the chips. To prevent chip overload from affecting product performance, external heat sinks are needed for heat dissipation. However, if the heat sink is installed too tightly, there is a risk of damaging the chip; if the installation is too loose, the heat sink may not be able to make contact with the chip, resulting in insufficient heat conduction.
[0003] Currently, to ensure a tight fit between the chip and the heatsink, materials such as thermal pads and thermal gels are generally used to directly absorb the tolerances. However, in such solutions, the tolerances between the chip and the heatsink still exist. Furthermore, using thermal pads and thermal gels to directly absorb the tolerances can result in an excessively thick thermal conductive layer, which can also reduce the rate at which heat from the chip is transferred to the heatsink. Utility Model Content
[0004] The purpose of this disclosure is to provide an automotive electronic device that can reduce the thickness of the thermal conductive layer and improve the tightness of its fit with the chip, thereby improving the chip's heat dissipation efficiency.
[0005] To achieve the above objectives, this disclosure provides an in-vehicle electronic device, comprising:
[0006] Circuit board with chips installed;
[0007] heat sink;
[0008] The mounting body has a receiving cavity for accommodating the heat sink, the heat sink is fixedly disposed in the receiving cavity, and an opening is provided on one side of the mounting body. The circuit board is disposed on the side of the mounting body with the opening, so that the heat sink faces the chip at the opening.
[0009] An elastic element is disposed in the receiving cavity and abuts against the side of the heat sink opposite to the chip;
[0010] A thermally conductive layer is also provided on the side of the chip facing the heat sink. The thermally conductive layer is attached to the heat sink and the thickness of the thermally conductive layer is less than 0.5 mm.
[0011] Optionally, the thickness of the thermally conductive layer is no greater than 0.1 mm.
[0012] Optionally, the mounting body includes a frame body and a cover plate detachably mounted on the frame body, wherein the opening is provided on the side of the frame body opposite to the cover plate, and the elastic element is fixedly mounted on the cover plate.
[0013] Optionally, the mounting body has two oppositely arranged sidewalls, the heat sink is disposed between the two sidewalls, and the heat sink is connected to the two sidewalls respectively.
[0014] Optionally, a first fixing hole is provided on the side wall, and a second fixing hole is provided on the radiator corresponding to the first fixing hole. The radiator and the mounting body are connected by fasteners passing through the first fixing hole and the second fixing hole.
[0015] Optionally, a groove is provided on the side wall, and a guide block is provided on the radiator to cooperate with the groove. One end of the groove extends to the edge of the side wall to form a groove opening, so that when the radiator enters the mounting body from the opening, the guide block enters the groove through the groove opening.
[0016] Optionally, the first fixing hole is an elongated hole, and the extension direction of the elongated hole is the same as the extension direction of the groove.
[0017] Optionally, the first fixing holes are symmetrically arranged on both sides of the slide.
[0018] Optionally, the mounting body has connecting arms for supporting the cover plate, two connecting arms are respectively connected to corresponding side walls, the connecting arms are provided with slots, and the cover plate is limited between the slots of the two connecting arms.
[0019] Optionally, the elastic element is a gasket made of foamed or rubber material.
[0020] With the above technical solution, the heat sink is set in the mounting body, and an elastic element that can abut against the heat sink is set on the side of the mounting body away from the chip. The elastic deformation of the elastic element absorbs the assembly tolerance of the circuit board, chip and heat sink, which can effectively reduce the physical gap between the heat sink and the chip, improve the tightness of the fit between the heat sink and the chip, reduce the thickness of the heat-conducting layer set between the heat sink and the chip, reduce the thermal resistance, thereby reducing the temperature difference at both ends of the heat-conducting layer and improving the heat dissipation efficiency.
[0021] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description
[0022] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:
[0023] Figure 1 This is an exploded view of an in-vehicle electronic device according to one embodiment of the present disclosure.
[0024] Figure 2 This is a side view of an in-vehicle electronic device according to one embodiment of the present disclosure.
[0025] Figure 3 yes Figure 2 A sectional view along direction A based on the base.
[0026] Figure 4 This is a schematic diagram of a mounting body (with the cover removed) in an in-vehicle electronic device according to one embodiment of the present disclosure.
[0027] Figure 5 yes Figure 4 A sectional view along direction B based on the base.
[0028] Explanation of reference numerals in the attached figures
[0029] 1-Circuit board; 2-Chip; 3-Heat sink; 31-Second fixing hole; 32-Guide block; 4-Mounting body; 40-Opening; 41-Cover plate; 42-Side wall; 421-First fixing hole; 422-Slide groove; 4221-Slide groove opening; 43-Bottom wall; 44-Connecting arm; 441-Slot; 5-Elastic element; 6-Fastener. Detailed Implementation
[0030] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.
[0031] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" are defined in relation to the outline of the corresponding components. The terms "first," "second," etc., are used to distinguish different components and are not sequential or significant. Furthermore, in the following description, when referring to the accompanying drawings, unless otherwise explained, the same reference numerals in different drawings denote the same or similar elements.
[0032] According to one embodiment of this disclosure, such as Figures 1 to 5As shown, an in-vehicle electronic device is provided, including a circuit board 1 on which a chip 2 is mounted, a heat sink 3, a mounting body 4, and an elastic member 5. The mounting body 4 has a receiving cavity for accommodating the heat sink 3, which is fixedly disposed within the receiving cavity. An opening 40 is provided on one side of the mounting body 4, and the circuit board 1 is disposed on the side of the mounting body 4 with the opening 40, so that the heat sink 3 faces the chip 2 at the opening 40. The elastic member 5 is disposed in the receiving cavity and abuts against the side of the heat sink 3 facing away from the chip 2. A thermally conductive layer is also provided on the side of the chip 2 facing the heat sink 3, and the thermally conductive layer is in contact with the heat sink 3. The thickness of the thermally conductive layer is 0.5 mm, for example, 0.4 mm, 0.3 mm, or 0.2 mm.
[0033] Through the above technical solution, the heat sink 3 is set in the mounting body 4, and the side of the mounting body 4 away from the chip 2 is provided with an elastic element 5 that can abut against the heat sink 3. The elastic deformation of the elastic element 5 absorbs the assembly tolerance of the circuit board 1, the chip 2 and the heat sink 3, which can effectively reduce the physical gap between the heat sink 3 and the chip 2, improve the tightness of the fit between the heat sink 3 and the chip 2, reduce the thickness of the heat-conducting layer between the heat sink 3 and the chip 2, reduce the thermal resistance, thereby reducing the temperature difference at both ends of the heat-conducting layer and improving the heat dissipation efficiency.
[0034] It should be noted that, preferably, the thickness of the thermal conductive layer is no greater than 0.1 mm, for example, 0.05 mm, 0.08 mm, 0.1 mm, etc. The thermal conductive layer can be a thermally conductive filler material, specifically, it can be a thermally conductive gel, thermally conductive patch, or thermally conductive grease, etc., and this disclosure does not limit it. The thermal conductive layer can reduce the roughness of the contact surface between the heat sink 3 and the chip 2, improve the heat dissipation effect, and 0.1 mm is much lower than the existing thermal conductive layer thickness (0.5 mm-1 mm), so it will not affect the tightness of the contact between the heat sink 3 and the chip 2. After the vehicle electronic device is installed, the thickness of the thermal conductive layer can be closer to 0 after being squeezed by the elastic element 5, which can effectively reduce thermal resistance and accelerate heat conduction. Experiments have shown that when the thickness of the thermal conductive layer is no greater than 0.1 mm, due to the extremely thin thermal conductive layer, the temperatures on both sides of the thermal conductive layer, namely the contact surfaces between the heat sink 3 and the thermal conductive layer, and the contact surfaces between the chip 2 and the thermal conductive layer, are similar, so that the temperature difference does not exceed 0.8℃. Currently, in industry-standard installation solutions for heat sink 3 and chip 2, due to assembly tolerances, the gap between heat sink 3 and chip 2 is mostly between 0.5-1mm, and the minimum temperature difference between the two sides of the heat-conducting layer is about 6℃. Therefore, by placing the elastic element 5 and the heat-conducting layer on opposite sides of the heat sink 3, the thickness of the heat-conducting layer is no more than 0.1mm, even with the elastic element 5 absorbing the tolerances. The temperature difference between its two sides is significantly lower than the existing 6℃ temperature difference. Furthermore, the heat sink 3 can also include a concave frame and multiple spaced heat dissipation fins arranged within the concave frame. The elastic element 5 can abut against some of the heat dissipation fins, allowing the bottom of the concave frame to contact the chip 2, thus increasing the contact area between the heat sink 3 and chip 2.
[0035] Furthermore, such as Figures 1 to 3 As shown, the mounting body 4 includes a frame body and a cover plate 41 detachably mounted on the frame body. An opening 40 is provided on the side of the frame body opposite to the cover plate 41, wherein an elastic element 5 is fixedly mounted on the cover plate 41. By fixing the elastic element 5 to the cover plate 41, displacement of the elastic element 5 during installation or use is prevented, reducing the risk of decreased heat dissipation due to displacement of the elastic element 5, and ensuring that the elastic element 5 is always in the correct position to provide stable elastic force. Furthermore, the detachable nature of the cover plate 41 facilitates the assembly and maintenance of in-vehicle electronic equipment, and users can easily replace the elastic element 5 or perform other maintenance operations as needed. The elastic element 5 can be screwed or snapped onto the cover plate 41, or it can be bonded to the cover plate 41 when the elastic element 5 is made of the foamed or rubber material mentioned below; this disclosure does not limit this.
[0036] According to one embodiment of this disclosure, such as Figures 1 to 5As shown, the mounting body 4 has two oppositely arranged side walls 42, and the radiator 3 is disposed between the two side walls 42, with the radiator 3 connected to each of the two side walls 42. Here, the side of the frame body opposite to the cover plate 41 mentioned above can be the bottom wall 43 of the mounting body 4, with the opening 40 disposed on the bottom wall 43, and the two side walls 42 can be connected to the bottom wall 43 respectively. The mounting body 4 is fixedly connected to the radiator 3 from opposite sides, enhancing the connection strength between the radiator 3 and the mounting body 4, avoiding loosening of the connection due to vibration or thermal stress, and improving the firmness of the connection between the two.
[0037] Furthermore, such as Figure 1 , Figure 2 and Figure 5 As shown, a first fixing hole 421 can be provided on the side wall 42, and a second fixing hole 31 corresponding to the first fixing hole 421 is provided on the radiator 3. The radiator 3 and the mounting body 4 are connected by fasteners 6 passing through the first fixing hole 421 and the second fixing hole 31 to further improve the firmness and stability of the connection. In addition, the fasteners 6 can be bolts or screws. The threaded installation method allows users to adjust the connection tightness between the radiator 3 and the mounting body 4 as needed to adapt to different working conditions.
[0038] Furthermore, such as Figures 1 to 5 As shown, a groove 422 can also be provided on the side wall 42, and a guide block 32 that cooperates with the groove 422 is provided on the radiator 3. One end of the groove 422 extends to the edge of the side wall 42 to form a groove opening 4221, so that when the radiator 3 enters the mounting body 4 from the opening 40, the guide block 32 enters the groove 422 through the groove opening 4221. This can effectively simplify the installation process of vehicle electronic equipment. The user only needs to insert the radiator 3 into the groove 422 through the guide block 32 and fix both sides, which is not only simple to operate but also saves installation time. At the same time, the cooperation between the guide block 32 and the groove 422 ensures that the radiator 3 will not shift during the installation process, improving the accuracy of the installation.
[0039] Specifically, such as Figure 3 and Figure 5 As shown, the groove opening 4221 can be located at the end of the side wall 42 near the opening 40, so that the heat sink 3 can be installed into the mounting body 4 from the opening 40 side. The groove opening 4221 can also be located at the end of the side wall 42 near the cover plate 41, so that the heat sink 3 can be installed into the mounting body 4 from the cover plate 41 side. Depending on the installation of other components, when there is insufficient installation space, in order to avoid other components, the extension direction of the groove 422 can also be oblique relative to the extension direction of the side wall 42. This disclosure does not limit this.
[0040] Furthermore, such as Figure 1 , Figure 2 and Figure 5 As shown, the first fixing hole 421 can be an elongated hole, and the extension direction of the elongated hole is the same as the extension direction of the slide groove 422. The setting of the elongated hole allows the radiator 3 to have a certain adjustment space during installation, which not only improves the probability of misfit with the second fixing hole 31 and avoids the problem of poor fit caused by processing error or installation error, but also improves the adaptability of vehicle electronic equipment, enabling it to adapt to radiators 3 of different sizes or shapes.
[0041] According to one embodiment of this disclosure, such as Figure 1 , Figure 2 and Figure 5 As shown, first fixing holes 421 are symmetrically arranged on both sides of the slide groove 422. The screw connection on both sides of the slide groove enhances the fixing strength. Fasteners 6 are used on both sides of the slide groove 422 to fix the radiator 3 to the mounting body 4, enhancing the overall fixing strength of the vehicle electronic equipment, improving the stability of the radiator 3 in the mounting body 4, and avoiding connection loosening problems caused by vibration or thermal stress.
[0042] According to one embodiment of this disclosure, such as Figures 1 to 4 As shown, the mounting body 4 has connecting arms 44 for supporting the cover plate 41. Two connecting arms 44 are respectively connected to corresponding side walls 42. The connecting arms 44 are provided with slots 441. The cover plate 41 is positioned between the slots 441 of the two connecting arms 44, so that the upper surface of the cover plate 41 is flush with the upper surface of the connecting arms 44 after placement. Here, the cover plate 41 can be glued and fixed in the slots 441; this disclosure does not limit this.
[0043] Regarding the elastic element 5, it can be a spring or a metal sheet, or it can be a gasket made of foam or rubber. Foam and rubber materials possess a certain degree of elasticity and heat resistance, ensuring not only tight contact between the heat sink 3 and the chip 2, but also maintaining stable performance under high-temperature conditions. When specifically selecting foam and rubber materials, the rebound force at the maximum design compression can be calculated based on different materials and the size of the automotive electronic device, to minimize damage to the chip 2. Furthermore, foam and rubber materials also have good shock absorption effects, reducing friction between the heat sink 3 and the chip 2 caused by vibration, thus extending the service life of the automotive electronic device.
[0044] In the installation process of the vehicle-mounted electronic device disclosed herein, such as a vehicle-mounted T-BOX, the heat sink 3 is first installed into the slide groove 422 through the slide groove opening 4221. Then, an extremely thin thermally conductive layer is coated on the surface of the chip 2 that needs to contact the heat sink 3 to fill the tiny gaps caused by the roughness of the contact area between the chip 2 and the heat sink 3. After the thermally conductive layer is coated, the circuit board 1 is then assembled so that the upper surface of the chip 2 contacts the bottom of the heat sink 3. At this time, the heat sink 3 will contact the chip 2 due to its own weight. Subsequently, the elastic element 5 is attached to the corresponding position of the cover plate 41. Finally, the cover plate 41 with the attached elastic element 5 is assembled onto the mounting body 4. The elastic element 5 is deformed by the compression of the heat sink 3, generating a rebound force so that the bottom of the heat sink 3 can make close contact with the thermally conductive layer on the surface of the chip 2. The extremely thin thermally conductive layer is further thinned under pressure, thereby reducing the thermal resistance between the heat sink 3 and the chip 2 in actual use and improving the heat dissipation performance of the chip 2. At this point, fastener 6 is used to secure the device, ensuring the overall assembly strength of the vehicle's electronic equipment.
[0045] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.
[0046] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.
[0047] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.
Claims
1. A vehicle-mounted electronic device, characterized in that, include: Circuit board with chips installed; heat sink; The mounting body has a receiving cavity for accommodating the heat sink, the heat sink is fixedly disposed in the receiving cavity, and an opening is provided on one side of the mounting body. The circuit board is disposed on the side of the mounting body with the opening, so that the heat sink faces the chip at the opening. An elastic element is disposed in the receiving cavity and abuts against the side of the heat sink opposite to the chip; A thermally conductive layer is also provided on the side of the chip facing the heat sink. The thermally conductive layer is attached to the heat sink and the thickness of the thermally conductive layer is less than 0.5 mm.
2. The vehicle-mounted electronic device according to claim 1, characterized in that, The thickness of the thermally conductive layer is no greater than 0.1 mm.
3. The vehicle-mounted electronic device according to claim 1, characterized in that, The mounting body includes a frame body and a cover plate that is detachably mounted on the frame body. The frame body has an opening on the side opposite to the cover plate, wherein the elastic element is fixedly mounted on the cover plate.
4. The vehicle-mounted electronic device according to claim 3, characterized in that, The mounting body has two oppositely arranged side walls, and the heat sink is disposed between the two side walls and connected to the two side walls respectively.
5. The vehicle-mounted electronic device according to claim 4, characterized in that, A first fixing hole is provided on the side wall, and a second fixing hole is provided on the radiator corresponding to the first fixing hole. The radiator and the mounting body are connected by fasteners passing through the first fixing hole and the second fixing hole.
6. The vehicle-mounted electronic device according to claim 5, characterized in that, A sliding groove is provided on the side wall, and a guide block that cooperates with the sliding groove is provided on the radiator. One end of the sliding groove extends to the edge of the side wall to form a sliding groove opening, so that when the radiator enters the mounting body through the opening, the guide block enters the sliding groove through the sliding groove opening.
7. The vehicle-mounted electronic device according to claim 6, characterized in that, The first fixing hole is an elongated hole, and the extension direction of the elongated hole is the same as the extension direction of the groove.
8. The vehicle-mounted electronic device according to claim 6, characterized in that, The first fixing holes are symmetrically arranged on both sides of the slide.
9. The vehicle-mounted electronic device according to claim 4, characterized in that, The mounting body has connecting arms for supporting the cover plate. The two connecting arms are respectively connected to the corresponding side walls. The connecting arms are provided with slots, and the cover plate is limited between the slots of the two connecting arms.
10. The vehicle-mounted electronic device according to claim 1, characterized in that, The elastic element is a gasket made of foamed or rubber material.