SMT (Surface Mount Technology) device with dustproof structure

Abstract

The utility model discloses an SMT device with a dustproof structure, which comprises a conveying rail, an air blowing U-shaped cavity shell, an air return U-shaped cavity shell and an SMT main machine body, the conveying rail is arranged at a plate feed port of the SMT main machine body, the air blowing U-shaped cavity shell and the air return U-shaped cavity shell are clamped on the conveying rail, and the air blowing U-shaped cavity shell and the air return U-shaped cavity shell are arranged on the conveying rail. The air blowing U-shaped cavity shell and the air returning U-shaped cavity shell are connected together through a hose, an exhaust U-shaped cavity is formed in the air blowing U-shaped cavity shell, an air pump is installed on the outer side of the air blowing U-shaped cavity shell, a three-way pipe is installed at an air inlet of the air pump, an exhaust pipe is installed at an exhaust port of the air pump, and the air returning U-shaped cavity shell is connected with the air returning U-shaped cavity shell. The tail end of the exhaust pipe extends into the exhaust U-shaped cavity, and the three-way pipe is connected with the hose. The beneficial effects are that the dustproof and dedusting effect in the plate conveying process can be guaranteed, no dust enters the chip mounter main body, the dustproof effect is good, the dismounting is convenient, and the flexibility is high.

Description

Technical Field

[0001] This utility model relates to the field of surface mount technology (SMT) devices, and in particular to an SMT device with a dustproof structure. Background Technology

[0002] Existing electronic products are usually made by adding various electronic components such as capacitors and resistors to PCBs according to the designed circuit diagram. Therefore, all kinds of electrical appliances require various SMT surface mount technology (SMT) processing. The SMT surface mount body is generally equipped with a protective box, but dust is easy to accumulate during the transportation of the circuit board, and the dust on the original circuit board is not easy to remove. It enters the body along with the circuit board, thereby reducing the overall dust protection effect. Utility Model Content

[0003] The purpose of this invention is to provide an SMT placement device with a dustproof structure in order to solve the above-mentioned problems.

[0004] This utility model achieves the above objectives through the following technical solutions:

[0005] A dustproof SMT placement device includes a conveyor rail, an air blowing U-shaped cavity shell, a return air U-shaped cavity shell, and an SMT placement main body. The conveyor rail is installed at the board feed port of the SMT placement main body. The air blowing U-shaped cavity shell and the return air U-shaped cavity shell are clamped on the conveyor rail. The air blowing U-shaped cavity shell and the return air U-shaped cavity shell are connected together by a hose. The air blowing U-shaped cavity shell has an exhaust U-shaped cavity inside. An air pump is installed on the outside of the air blowing U-shaped cavity shell. A T-connector is installed at the air inlet of the air pump. An exhaust pipe is installed at the exhaust outlet of the air pump. The end of the exhaust pipe extends into the exhaust U-shaped cavity. The T-connector is connected to the hose. The inner wall of the groove of the air blowing U-shaped cavity shell has a plurality of exhaust holes. The return air U-shaped cavity shell has a return air U-shaped cavity inside. A dust filter layer is installed in the return air U-shaped cavity. The inner wall of the groove of the return air U-shaped cavity shell has a plurality of return air holes.

[0006] Furthermore, fixing ears are installed on the outer surfaces of both the blowing U-shaped cavity shell and the returning U-shaped cavity shell, and fixing ears are screwed onto the fixing ears.

[0007] Furthermore, a temperature sensor and a heating wire are installed inside the exhaust U-shaped cavity.

[0008] Furthermore, a protective cover is fixed to the outer side of the air pump, and the protective cover is provided with heat dissipation strip holes.

[0009] Furthermore, the cavity wall of the return air U-shaped cavity is provided with a pipe connection hole, and a pipe connector is installed on the pipe connection hole.

[0010] Furthermore, a controller is installed on the air-blowing U-shaped cavity shell, and the controller is communicatively connected to the temperature sensor and the heating wire, respectively.

[0011] Furthermore, the bottom shell wall of the return air U-shaped cavity is provided with a maintenance bottom door.

[0012] Furthermore, a plate conveyor belt is installed in the side rail groove of the conveyor rail via a conveyor pulley, and a motor is installed on the conveyor rail, with the motor connected to the conveyor pulley.

[0013] The beneficial effects are as follows: The SMT placement device with a dustproof structure described in this utility model can ensure the dustproof and dust removal effect during the board transportation process, so that no dust enters the placement machine body. It has a good dustproof effect, is easy to disassemble, and has high flexibility. Attached Figure Description

[0014] Figure 1 This is a structural diagram of an SMT placement device with a dustproof structure according to the present invention;

[0015] Figure 2 This is a diagram showing the internal structure of the U-shaped air-blowing cavity of an SMT placement device with a dustproof structure as described in this utility model;

[0016] Figure 3 This is a diagram showing the internal structure of the return air U-shaped cavity shell of an SMT placement device with a dustproof structure as described in this utility model.

[0017] The annotations in the attached figures are explained as follows:

[0018] 1. Conveyor rail; 2. Air blowing U-shaped cavity shell; 3. Air return U-shaped cavity shell; 4. Ear fixing bolt; 5. Air pump; 6. Motor; 7. Conveyor pulley; 8. Plate conveyor belt; 9. Controller; 10. Hoses; 11. Protective cover; 12. Exhaust U-shaped cavity; 13. Temperature sensor; 14. Heating wire; 15. Exhaust pipe; 16. T-pipe; 17. Exhaust port; 18. Air return port; 19. Dust filter layer; 20. Pipe connector; 21. Inspection bottom door. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings:

[0020] like Figures 1-3 As shown, an SMT placement device with a dustproof structure consists of a conveyor rail 1, an air blowing U-shaped cavity shell 2, an air return U-shaped cavity shell 3, and an SMT placement main body 22.

[0021] The SMT placement host body 22 is equipped with a conveyor rail 1 at the board feed port. The conveyor rail 1 is mainly used for conveying and feeding the circuit board. The SMT placement host body 22 is also equipped with common structures such as the component feed port and internal component placement, which are all public structures and will not be described in detail here.

[0022] The conveyor rail 1 is clamped with an air blowing U-shaped cavity shell 2 and an air return U-shaped cavity shell 3. There are two sets of air return U-shaped cavity shells 3, which are respectively placed on both sides of the air blowing U-shaped cavity shell 2. The air blowing U-shaped cavity shell 2 and the air return U-shaped cavity shell 3 are connected together by a hose 10.

[0023] The blowing U-shaped cavity shell 2 is provided with an exhaust U-shaped cavity 12. An air pump 5 is installed on the outside of the blowing U-shaped cavity shell 2. A three-way pipe 16 is installed at the air inlet of the air pump 5. An exhaust pipe 15 is installed at the air outlet of the air pump 5. The end of the exhaust pipe 15 extends into the exhaust U-shaped cavity 12. The three-way pipe 16 is connected to the hose 10. Several exhaust holes 17 are provided on the inner wall of the groove of the blowing U-shaped cavity shell 2 so that it can blow air from the top and bottom sides of the circuit board to remove dust.

[0024] The return air U-shaped cavity shell 3 is provided with a return air U-shaped cavity, and a dust filter layer 19 is provided inside the return air U-shaped cavity to filter the return air. Several return air holes 18 are provided on the inner wall of the groove of the return air U-shaped cavity shell 3.

[0025] like Figures 1-3 As shown, this utility model also discloses the following more optimized specific structures:

[0026] Both the blowing U-shaped cavity shell 2 and the returning U-shaped cavity shell 3 are equipped with fixing ears on their outer surfaces. The fixing ears are screwed with ear fixing bolts 4 for clamping onto the conveying rail 1.

[0027] A temperature sensor 13 and a heating wire 14 are installed inside the exhaust U-shaped cavity 12 to heat the exhaust gas, which facilitates the blowing away of dust on the circuit board and provides a good dust removal effect.

[0028] The outer side of the air pump 5 is covered with a protective cover 11, and the protective cover 11 is provided with heat dissipation strip holes.

[0029] The wall of the return air U-shaped cavity is provided with a pipe connection hole, and a pipe connector 20 is installed on the pipe connection hole for connecting the hose 10.

[0030] A controller 9 is installed on the air-blowing U-shaped cavity shell 2. The controller 9 is communicatively connected to the temperature sensor 13 and the heating wire 14.

[0031] The bottom wall of the return air U-shaped cavity shell 3 is provided with a maintenance bottom door 21 for disassembling and cleaning the dust filter layer 19.

[0032] A plate conveyor belt 8 is installed in the side rail groove of the conveyor rail 1 via a conveyor pulley 7. A motor 6 is installed on the conveyor rail 1, and the motor 6 is connected to the conveyor pulley 7.

[0033] like Figure 1-3 When the SMT placement device with dustproof structure shown is in use, the circuit board is transported by the board conveyor belt 8. When it is transported into the groove of the blowing U-shaped cavity shell 2, the gas with a certain temperature discharged from the exhaust hole 17 can blow the upper and lower sides of the circuit board at the same time, so that the dust is away from the circuit board and collected in the return air U-shaped cavity shell 3. The circuit board enters the SMT placement host body 22 for protective production.

[0034] It is clamped onto the track by ear fixing bolts 4, the distance is adjustable, it is easy to disassemble, it is suitable for dust removal of various tracks, and has a good dust prevention effect.

[0035] Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of this utility model as claimed.

Claims

1. An SMT placement device with a dustproof structure, characterized in that: The device includes a conveyor rail, a blowing U-shaped cavity shell, a return U-shaped cavity shell, and an SMT placement main unit. The conveyor rail is installed at the board feed port of the SMT placement main unit. The blowing U-shaped cavity shell and the return U-shaped cavity shell are clamped on the conveyor rail and connected together by a hose. The blowing U-shaped cavity shell has an exhaust U-shaped cavity inside. An air pump is installed on the outside of the blowing U-shaped cavity shell. A T-connector is installed at the air inlet of the air pump, and an exhaust pipe is installed at the air outlet of the air pump. The end of the exhaust pipe extends into the exhaust U-shaped cavity. The T-connector is connected to the hose. The inner wall of the groove of the blowing U-shaped cavity shell has several exhaust holes. The return U-shaped cavity shell has a return U-shaped cavity inside, with a dust filter layer inside. The inner wall of the groove of the return U-shaped cavity shell has several return holes.

2. The SMT placement device with a dustproof structure according to claim 1, characterized in that: Both the blowing U-shaped cavity shell and the returning U-shaped cavity shell are equipped with fixing ears on their outer surfaces, and fixing bolts are screwed onto the fixing ears.

3. The SMT placement device with a dustproof structure according to claim 1, characterized in that: A temperature sensor and a heating wire are installed inside the exhaust U-shaped cavity.

4. The SMT placement device with a dustproof structure according to claim 1, characterized in that: The air pump is covered with a protective cover, and the protective cover has heat dissipation holes.

5. The SMT placement device with a dustproof structure according to claim 1, characterized in that: The wall of the return air U-shaped cavity is provided with a pipe connection hole, and a pipe connector is installed on the pipe connection hole.

6. The SMT placement device with a dustproof structure according to claim 3, characterized in that: A controller is installed on the air-blowing U-shaped cavity shell, and the controller is communicatively connected to the temperature sensor and the heating wire.

7. The SMT placement device with a dustproof structure according to claim 1, characterized in that: The bottom wall of the return air U-shaped cavity shell is provided with a maintenance door.

8. The SMT placement device with a dustproof structure according to claim 1, characterized in that: A plate conveyor belt is installed in the side rail groove of the conveyor rail via a conveyor pulley. A motor is installed on the conveyor rail and the motor is connected to the conveyor pulley.

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