Semiconductor cleaning machine and semiconductor device processing equipment

Abstract

The utility model discloses a semiconductor cleaning machine and semiconductor device processing equipment, which comprises a liquid collecting tank, a vacuum adsorption component which is arranged at a seat body in the liquid collecting tank and is driven by a rotary driving mechanism to rotate, an upper cover which is fixed in position is arranged right above the liquid collecting tank, and a cleaning mechanism is arranged on the upper cover. A cleaning assembly of the cleaning mechanism is located below the upper cover and keeps a preset gap with the vacuum adsorption assembly, a side fence surrounding the periphery of the base is further arranged in the liquid collecting tank and connected with a lifter driving the side fence to ascend and descend, the lifter drives the side fence to be switched between the first height and the second height, and when the first height is larger than the second height, the second height is larger than the first height. The side enclosure is located below the cleaning assembly, and at the second height, a closed cleaning space is defined by the side enclosure, the upper cover and the liquid collecting groove. The upper cover with the fixed position is arranged, and the closed cleaning space is defined by the liftable side enclosure, the upper cover and the liquid collecting tank, so that the situation that the internal environment of equipment is affected by dirt splashing during cleaning is avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device processing, and in particular to semiconductor cleaning machines and semiconductor device processing equipment. Background Technology

[0002] When thinning semiconductor devices such as wafers, it is necessary to clean the thinned semiconductor devices.

[0003] Patent document with publication number CN115338717A discloses a thinning device integrating a cleaning component.

[0004] In this type of thinning equipment, the opening of the cleaning component is not covered. During cleaning, water, debris, and other dirt can easily splash, which has an adverse effect on the internal environment of the equipment. Utility Model Content

[0005] The purpose of this invention is to solve the above-mentioned problems in the prior art and to provide a semiconductor cleaning machine and semiconductor device processing equipment.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] A semiconductor cleaning machine includes a collection tank. A vacuum adsorption assembly driven to rotate by a rotary drive mechanism is installed at the base of the collection tank. A fixed-position top cover is installed directly above the collection tank. A cleaning mechanism is installed on the top cover. The cleaning component of the cleaning mechanism is located below the top cover and maintains a predetermined gap with the vacuum adsorption assembly. A side enclosure is also provided in the collection tank surrounding the base. The side enclosure is connected to a lifter that drives its raising and lowering. The lifter drives the side enclosure to switch between a first height and a second height. At the first height, the side enclosure is located below the cleaning assembly. At the second height, the side enclosure, the top cover, and the collection tank enclose a closed cleaning space. During cleaning, the cleaning assembly rotates within the cleaning space.

[0008] Preferably, the vacuum adsorption component is coaxially mounted on a rotating shaft, the rotating shaft is rotatably mounted on a magnetic fluid sealing device, the magnetic fluid sealing device is fixed at the base, and the rotating shaft is connected to a drive motor that drives its rotation.

[0009] Preferably, the magnetohydrodynamic sealing device is connected to the bottom of the upper end plate of the base, and the upper end plate is sealed to the inner wall of the tube of the base.

[0010] Preferably, a concentric convex ring is formed on the top of the upper end plate, and a sleeve is sealed to the rotating shaft, the sleeve being provided with an annular groove for the convex ring to be inserted.

[0011] Preferably, the outer shell of the magnetic fluid sealing device is provided with an air extraction nozzle, which communicates with the sealing cavity formed by the magnetic fluid sealing device and the rotating shaft. An air extraction channel is formed on the rotating shaft, one end of which is located on the side wall of the rotating shaft and communicates with the sealing cavity, and the other end of which extends to the top of the rotating shaft and communicates with the vacuum extraction channel of the vacuum adsorption assembly.

[0012] Preferably, the vacuum adsorption assembly includes a suction cup mounting base, on which the vacuum channel is provided, and a ceramic suction cup is provided in the mounting groove of the suction cup mounting base.

[0013] Preferably, the suction cup mounting base is connected to the rotating shaft via a shaft locking ring at its bottom.

[0014] Preferably, the cleaning mechanism uses a rotary cylinder to drive the cleaning assembly to rotate.

[0015] Preferably, the upper cover is further provided with an ion fan for blowing ion wind to the semiconductor devices on the vacuum adsorption assembly.

[0016] Semiconductor device processing equipment, including semiconductor cleaning machines as described in any of the above descriptions.

[0017] The advantages of this utility model's technical solution are mainly reflected in:

[0018] This invention features a fixed-position top cover, which, along with adjustable side barriers, encloses the top cover and collection tank to form a closed cleaning space. This prevents dirt and grime from splashing and affecting the internal environment of the equipment during cleaning. Furthermore, the top cover incorporates a cleaning mechanism and an ion fan. After cleaning by the mechanism, the side barriers can be opened, and the ion fan can then be used to remove static electricity. This effectively reduces the impact of water mist within the closed cleaning space during static removal, resulting in a better static elimination effect.

[0019] This invention uses a magnetic fluid sealing device to form a sealed cavity with a rotating shaft. This allows for the installation of an air extraction nozzle on the outer shell of the magnetic fluid sealing device to connect to a vacuum system for vacuuming, eliminating the need for a slip ring to connect to the vacuum system. This also facilitates the connection of the lower end of the rotating shaft to the drive motor, effectively simplifying the structure.

[0020] The suction cup mounting base of the vacuum adsorption assembly of this utility model is connected to the rotating shaft by a shaft locking ring, which can greatly facilitate the disassembly, maintenance and replacement of the vacuum adsorption assembly.

[0021] The matching structure of the upper end plate and the sleeve of this utility model can effectively reduce the risk of liquid intrusion into the magnetic fluid sealing device during cleaning, which is conducive to ensuring the reliable use of the magnetic fluid sealing device. Attached Figure Description

[0022] Figure 1 This is a cross-sectional view of the semiconductor cleaning machine of this utility model;

[0023] Figure 2 This is a perspective view of the semiconductor cleaning machine of this utility model;

[0024] Figure 3 yes Figure 1 A magnified view of a portion of the image;

[0025] Figure 4 This is a perspective view of the suction cup mounting base of this utility model;

[0026] Figure 5 This is a side view of the semiconductor cleaning machine of this utility model, wherein the side enclosure is at the second height. Detailed Implementation

[0027] The purpose, advantages, and features of this utility model will be illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of applying the technical solutions of this utility model, and all technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this utility model.

[0028] In the description of the solution, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] Example 1

[0030] The semiconductor cleaning machine disclosed in this utility model will now be described in conjunction with the accompanying drawings, as shown below. Figure 1 Appendix Figure 2As shown, it includes a collection tank 100, a vacuum adsorption assembly 300 driven to rotate by a rotary drive mechanism 200 at the base of the collection tank 100, a fixed top cover 400 above the collection tank 100, and a side enclosure 600 surrounding the collection tank 100. The side enclosure 600 is connected to a lifter 700 that drives its raising and lowering. The lifter 700 drives the side enclosure 600 to switch between a first height and a second height. At the first height, the side enclosure 600 is located below the cleaning assembly 510. At the second height, the side enclosure 600, the top cover 400, and the collection tank 100 form a closed cleaning space. A cleaning mechanism 500 is provided on the top cover 400. The cleaning assembly 510 of the cleaning mechanism 500 is located below the top cover 400 and maintains a predetermined gap with the vacuum adsorption assembly 300. During cleaning, the cleaning assembly 510 rotates within the cleaning space.

[0031] As attached Figure 1 As shown, the liquid collection tank 100 includes a base plate 110 and side plates 120 surrounding the base plate 110. A tube 130 is provided on the base plate 110. A through hole 111 is provided on the base plate 110 within the area enclosed by the tube 130. The through hole is concentric with the tube and its diameter is the same as the inner diameter of the tube. An upper end plate 140 is provided on the top of the tube 130. The upper end plate 140 is screwed to the top of the tube 130. The upper end plate 140 includes a lower protrusion 141 embedded in the tube 130. The side wall of the lower protrusion 141 is sealed to the inner wall of the tube 130 by a sealing ring. The upper end plate 140 and the tube 130 constitute the seat with the opening facing downward.

[0032] As attached Figure 1 As shown, a magnetohydrodynamic sealing device 800 is disposed at the bottom of the upper end plate 140 and located within the seat body. A rotating shaft 900 is rotatably disposed therethrough at the magnetohydrodynamic sealing device 800. The magnetohydrodynamic fluid at both ends of the magnetohydrodynamic sealing device 800 can cooperate with the rotating shaft 900 to form a sealed cavity 810. An air extraction nozzle 820 communicating with the sealed cavity 810 is disposed on the outer shell of the magnetohydrodynamic sealing device 800. An air extraction channel 910 is formed on the rotating shaft 900. One end of the air extraction channel 910 is located on the side wall of the rotating shaft 900 and communicates with the sealed cavity 810. The other end of the air extraction channel 910 extends to the top of the rotating shaft 900 and communicates with the vacuum extraction channel 310 of the vacuum adsorption assembly 300.

[0033] As attached Figure 3 Appendix Figure 4As shown, the vacuum adsorption assembly includes a suction cup mounting base 320. The suction cup mounting base 320 includes a mounting groove 321 and a shaft locking ring 322 concentrically disposed at the bottom of the mounting groove 321. A vacuum channel 310 is provided at the mounting groove 321. The vacuum channel 310 includes an inverted frustum-shaped hole 311. The upper end of the hole 311 communicates with an air extraction groove 312 at the bottom of the mounting groove 321. The air extraction groove 312 includes multiple circular grooves concentric with the hole 311 and multiple radial grooves connecting the hole and the circular grooves. A ceramic suction cup 330 is disposed within the mounting groove 321.

[0034] As attached Figure 1 As shown, the lower end of the hole 311 is concentric and connected to the insertion hole 323 at the bottom of the mounting groove 321. The rotating shaft 900 is inserted into the insertion hole 323, and the outer wall of the rotating shaft 900 is sealed to the inner wall of the insertion hole 323 by a sealing ring. The rotating shaft 900 passes through the central hole of the shaft locking ring 322, and the shaft locking ring 322 is fixed to the rotating shaft 900 by bolts and nuts.

[0035] During operation, the suction nozzle 820 is connected to a vacuum system (not shown in the figure), thereby generating an adsorption force on the top surface of the ceramic suction cup 330 through the sealed cavity 810, the suction channel 910, and the vacuum channel 310 to adsorb and fix the semiconductor device placed on the ceramic suction cup 330.

[0036] As attached Figure 1 As shown, the lower end of the rotating shaft 900 is connected to a drive motor 220 of a rotary drive mechanism 200 via a coupling 210. The drive motor 220 is mounted on a motor mount 230, which is screwed to the bottom of the base plate 110. During operation, the drive motor 220 drives the rotating shaft 900 to rotate, which in turn drives the vacuum adsorption assembly to rotate, thereby causing the semiconductor device to rotate.

[0037] As attached Figure 3 As shown, to prevent liquid from entering the magnetohydrodynamic sealing device 800 during cleaning, a concentric protruding ring 141 is formed on the top of the upper end plate 140. A sleeve 920 is sealed to the rotating shaft 900, and the sleeve 920 is provided with an annular groove 921 for the protruding ring 141 to be inserted. The sleeve 920 can be connected to the shaft via two set screws extending radially along the sleeve 920, and can also be screwed to the shaft locking ring 322. The top surface 143 of the upper end plate 140 can be configured as a conical surface sloping downwards from the center to the edge, thereby facilitating the flow of liquid from the top surface 143 of the upper end plate 140 to the outer edge. Furthermore, the rotating shaft is sealed to the through hole on the upper end plate through which the rotating shaft passes by a sealing ring.

[0038] The specific shape of the upper cover 400 can be adapted to the shape of the liquid collection tank and the side enclosure, and is not limited here. The top of the upper cover is provided with a connecting bracket 410 for connecting to an external fixing structure.

[0039] As attached Figure 1 Appendix Figure 2 As shown, the cleaning mechanism 500 uses a rotary cylinder 520 to drive the cleaning assembly 510 to rotate. The rotary cylinder 520 is fixed to the top of the upper cover 400, and its rotating disk is connected to a connecting arm 530 located below the upper cover 400. The lower end of the connecting arm 530 is connected to the cleaning assembly 510. The cleaning assembly 510 includes an adapter 511, which is L-shaped. A first medium channel and a second medium channel are formed on the adapter 511. One end of the first medium channel is connected to a jet pipe 512 that sprays air downwards at an angle, and the other end is connected to an air supply line (not shown in the figure). One end of the second medium channel is connected to a nozzle 513 that sprays liquid downwards at an angle, and the other end is connected to a liquid supply line (not shown in the figure). The jet pipe 512 and the nozzle 513 are located on the same side of the adapter 511, and the nozzle 513 is located on the side of the horizontal part of the adapter 511 that faces away from the vertical part of the adapter 511. During cleaning, the rotary cylinder 520 drives the connecting arm 530 to rotate, thereby driving the cleaning assembly 510 to rotate for cleaning.

[0040] As attached Figure 1 Appendix Figure 2 As shown, the upper cover 400 is also provided with an ion blower A00 for blowing ion wind to the semiconductor device on the vacuum adsorption assembly 300. The ion blower A00 is located above the upper cover 400 and the upper cover 400 is also provided with air blowing holes.

[0041] As attached Figure 1 Appendix Figure 2 As shown, the shape of the side enclosure 600 is adapted to the shape of the side plate 120. A connecting block 610 is provided on the outer wall of the vertical plate on the rear side of the side enclosure 600, located at its top. The connecting block 610 connects to the lifting device 700, which can be, for example, a cylinder, an electric cylinder, or other feasible device; no limitation is made here. Furthermore, an annular liquid receiving groove 620 is connected to the bottom of the side enclosure 600. The liquid receiving groove 620 surrounds the outer periphery of the pipe body 130 and maintains a gap with the pipe body 130.

[0042] When cleaning is required, the semiconductor device is first placed and fixed on the vacuum adsorption assembly. Then, the lifting device 700 raises the side enclosure 600 to a second height, thereby sealing the space between the upper cover 400 and the collection tank, as shown in the attached diagram. Figure 5As shown, cleaning can then be performed, and the cleaning components can be cleaned by water washing and / or air blowing. After the cleaning components are cleaned, the lifting device 700 lowers the side enclosure 600 to a first height, and the ion fan A00 blows ion air onto the semiconductor device to eliminate static electricity. After cleaning is completed, the semiconductor device is removed from the cleaning machine.

[0043] Example 2

[0044] This embodiment discloses a semiconductor device processing equipment, including the semiconductor cleaning machine described above.

[0045] This utility model has many other embodiments. All technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this utility model.

Claims

1. A semiconductor cleaning machine, comprising a liquid collection tank, wherein a vacuum adsorption assembly driven to rotate by a rotary drive mechanism is disposed at a base in the liquid collection tank, characterized in that: A fixed-position top cover is provided directly above the liquid collection tank. A side enclosure surrounding the outer perimeter of the base body is also provided in the liquid collection tank. The side enclosure is connected to a lifter that drives its raising and lowering. The lifter drives the side enclosure to switch between a first height and a second height. At the first height, the side enclosure is located below the cleaning component. At the second height, the side enclosure, the top cover, and the liquid collection tank form a closed cleaning space. A cleaning mechanism is provided on the top cover. The cleaning component of the cleaning mechanism is located below the top cover and maintains a predetermined gap with the vacuum adsorption component. During cleaning, the cleaning component rotates within the cleaning space.

2. The semiconductor cleaning machine according to claim 1, characterized in that: The vacuum adsorption component is coaxially mounted on the rotating shaft, which is rotatably mounted on the magnetic fluid sealing device. The magnetic fluid sealing device is fixed at the base, and the rotating shaft is connected to a drive motor that drives its rotation.

3. The semiconductor cleaning machine according to claim 2, characterized in that: The magnetohydrodynamic sealing device is connected to the bottom of the upper end plate of the base, and the upper end plate is sealed to the inner wall of the tube of the base.

4. The semiconductor cleaning machine according to claim 3, characterized in that: The top of the upper end plate has a concentric protruding ring, and a sleeve is sealed to the rotating shaft. The sleeve is provided with an annular groove for the protruding ring to be inserted.

5. The semiconductor cleaning machine according to claim 2, characterized in that: The magnetic fluid sealing device has an air extraction nozzle on its outer shell. The air extraction nozzle communicates with the sealing cavity formed by the magnetic fluid sealing device and the rotating shaft. An air extraction channel is formed on the rotating shaft. One end of the air extraction channel is located on the side wall of the rotating shaft and communicates with the sealing cavity. The other end of the air extraction channel extends to the top of the rotating shaft and communicates with the vacuum extraction channel of the vacuum adsorption assembly.

6. The semiconductor cleaning machine according to claim 5, characterized in that: The vacuum adsorption assembly includes a suction cup mounting base, on which the vacuum channel is provided, and a ceramic suction cup is provided in the mounting groove of the suction cup mounting base.

7. The semiconductor cleaning machine according to claim 6, characterized in that: The suction cup mounting base is connected to the rotating shaft via a shaft locking ring at its bottom.

8. The semiconductor cleaning machine according to claim 1, characterized in that: The cleaning mechanism uses a rotary cylinder to drive the cleaning components to rotate.

9. The semiconductor cleaning machine according to any one of claims 1-8, characterized in that: The upper cover is also equipped with an ion blower that blows ion wind to the semiconductor devices on the vacuum adsorption assembly.

10. Semiconductor device processing equipment, characterized in that: Including the semiconductor cleaning machine as described in any one of claims 1-9.

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