Temperature control bottled water with refrigerating and heating functions

Abstract

The temperature control bottled water comprises a bottle body, a plurality of supporting strips are annularly distributed at the bottom end of the bottle body at equal intervals, and heat dissipation holes are formed in the bottom of the bottle body; a power supply assembly is installed at the bottom end in the bottle body, the semiconductor chilling plate is electrically connected to the power supply assembly, the power supply assembly supplies power to the semiconductor chilling plate, the refrigeration face of the semiconductor chilling plate is attached to the lower portion of the heat conduction piece, the heat conduction piece is cooled through heat transfer, then the heat conduction piece transfers heat to water in the bottle body, and therefore the refrigeration effect is achieved. And the heat dissipation mechanism rapidly dissipates heat generated by the heating surface of the semiconductor chilling plate, so that the working efficiency of the heat conducting plate is kept. And heat discharged by the heat dissipation mechanism is discharged from the heat dissipation holes. The power supply assembly avoiding the heat dissipation holes can optimize the heat dissipation performance, the power supply assembly is combined into the bottle body, the utilization rate of the internal space of the bottle body is improved, and the bottle is compact in structure and easy to carry and use.

Description

Technical Field

[0001] This utility model belongs to the field of temperature-controlled bottled water technology, specifically relating to a temperature-controlled bottled water with cooling and heating functions. Background Technology

[0002] In daily life, bottled water is needed to replenish the body's water requirements and prevent dehydration. Patent publication number CN219258060U discloses a drinking water bottle that is easy to identify and distinguish. It includes a bottle body and a cap. The bottle body is covered with a packaging sticker, which includes an instruction sticker and a label sticker for users to make unique markings. The instruction sticker can be used to explain the product, promote it, and explain how to use the label sticker. The label sticker allows users to make unique markings, which differ from user to user, making it easy to distinguish drinking water bottles from each other. Furthermore, this drinking water bottle has a simple structure, allowing users to easily and quickly make markings with a low probability of repetition and high recognizability. This prevents users from mistakenly taking the wrong bottle, avoids the risk of cross-infection, and also avoids water waste.

[0003] The existing technical solutions described above have the following drawbacks: the bottled water lacks either cooling or heating functions, resulting in certain limitations in its use. Furthermore, common heating devices require a power source to heat the water, and cooling devices such as refrigerators require the bottled water to be taken out of the refrigerator to be consumed cold. Regardless of whether the water is hot or cold, heat loss occurs during transport, causing the water to cool to room temperature. Therefore, the bottled water cannot be heated or cooled for drinking as needed. Utility Model Content

[0004] The purpose of this invention is to provide a temperature-controlled bottled water with cooling and heating functions to solve the cooling and heating problems of bottled water when carried in the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A temperature-controlled bottled water device with cooling and heating functions includes a bottle body with several support strips evenly distributed in a ring at the bottom. The bottom of the bottle body has heat dissipation holes. A sealing ring is installed inside the bottle body, and a heat-conducting sheet is fixedly attached below the sealing ring. A thermoelectric cooling chip is fixedly attached below the heat-conducting sheet, and a heat dissipation mechanism is attached below the thermoelectric cooling chip. The thermoelectric cooling chip has a cooling surface and a heating surface. A power supply component is installed at the bottom inside the bottle body, avoiding the heat dissipation holes.

[0007] Furthermore, the heat dissipation mechanism includes a heat sink, which is attached to one side of the semiconductor cooling chip. Several fins are distributed in a ring on the surface of the heat sink, and a fan is installed at the center of the heat sink.

[0008] Furthermore, the power supply component includes a battery and a circuit board. The battery is installed at the bottom of the bottle, and a circuit board is connected above the battery. One end of the circuit board is provided with a charging port, and the circuit board is electrically connected to a semiconductor cooling chip.

[0009] Furthermore, the battery is made with an arc-shaped structure, and the battery has three equally spaced components distributed around the heat dissipation holes. The circuit board is made with a ring structure.

[0010] Furthermore, the support strips extend to the outer wall and bottom of the bottle, and ventilation grooves are provided between the support strips on the outer wall of the bottle; the charging port extends into the ventilation grooves and protrudes from the bottle.

[0011] Furthermore, three raised blocks are evenly spaced around the support strip at the bottom of the bottle. These raised blocks elevate the bottom of the bottle, providing more space for the heat dissipation vents and thus further improving the heat dissipation effect of the heat dissipation mechanism.

[0012] Furthermore, the heating surface of the semiconductor cooling chip is in contact with the heat-conducting sheet.

[0013] Furthermore, the circuit board has a current commutation circuit, which is used to change the direction of the current in the semiconductor cooling chip.

[0014] The technical solution of this utility model has the following beneficial effects:

[0015] 1. The thermoelectric cooler is electrically connected to the power supply component, which supplies power to the thermoelectric cooler. The cooling surface of the thermoelectric cooler is attached to the underside of the heat-conducting plate. The heat-conducting plate is cooled through heat transfer, and then the heat-conducting plate transfers the heat to the water inside the bottle, thereby achieving the cooling effect.

[0016] 2. The heating surface of the thermoelectric cooler is attached to the heat dissipation mechanism, which rapidly dissipates the heat generated by the heating surface of the thermoelectric cooler to maintain the working efficiency of the heat-conducting plate. The heat dissipated by the heat dissipation mechanism is discharged through the heat dissipation holes.

[0017] 3. By avoiding the heat dissipation holes, the power supply components can optimize heat dissipation performance. The power supply components are integrated into the inside of the bottle, which improves the utilization of the internal space of the bottle. The structure is compact and easy to carry and use. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0019] Figure 1 This is a schematic diagram of the overall bottom structure of this utility model.

[0020] Figure 2This is a schematic diagram of the overall structure of this utility model.

[0021] Figure 3 This is an internal cross-sectional view of the present invention.

[0022] Figure 4 This is an enlarged view of section A of this utility model.

[0023] Figure 5 This is a partial cross-sectional view of the present invention.

[0024] Figure 6 This is an exploded view of the heat dissipation mechanism of this utility model.

[0025] Figure 7 This is a diagram of the battery mounting structure of this utility model.

[0026] Reference numerals: 10. Bottle body; 11. Support bar; 12. Ventilation slot; 13. Heat dissipation hole; 20. Sealing ring; 21. Heat-conducting plate; 22. Semiconductor cooling plate; 23. Heat sink; 24. Fin; 25. Fan; 26. Battery; 27. Circuit board; 28. Charging port; 30. Elevating block. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0028] Example 1:

[0029] refer to Figure 1 A temperature-controlled bottled water with cooling and heating functions includes a bottle body 10, and several support strips 11 are distributed equidistantly in a ring at the bottom of the bottle body 10; the support strips 11 can strengthen the bottom of the bottle body 10, and at the same time, the support strips 11 play a role in supporting and balancing the bottle body 10.

[0030] refer to Figures 2-5The bottle body 10 has a sealing ring 20 installed inside, a heat-conducting plate 21 fixed below the sealing ring 20, a thermoelectric cooler 22 fixed below the heat-conducting plate 21, a heat dissipation mechanism below the thermoelectric cooler 22, and heat dissipation holes 13 at the bottom of the bottle body 10. A power supply assembly is installed at the bottom of the bottle body 10. The thermoelectric cooler 22 has a cooling surface and a heating surface. The thermoelectric cooler 22 is also called a thermocouple or Peltier effect device. The Peltier effect refers to the phenomenon where heat transfer occurs between the two ends of a thermocouple when a direct current passes through it, which is composed of two semiconductor materials with different conductivity (usually N-type and P-type semiconductors). Specifically, when current passes through, one end of the thermocouple absorbs heat (cold end) and the other end releases heat (hot end), thereby achieving heat transfer and temperature regulation. The thermoelectric cooler 22 can adjust the cooling or heating effect by controlling the direction and magnitude of the current.

[0031] In the above scheme, the sealing ring 20 divides the bottle body 10 into an upper part and a lower part. The upper part is used to store water, and the lower part is the cooling and heat dissipation part. The sealing ring 20 prevents water from entering the cooling and heat dissipation part. The thermoelectric cooler 22 is electrically connected to the power supply component, which supplies power to the thermoelectric cooler 22. The cooling surface of the thermoelectric cooler 22 is attached to the underside of the heat-conducting plate 21, cooling the heat-conducting plate 21 through heat transfer. The heat-conducting plate 21 then transfers heat to the water inside the bottle body 10, thereby achieving the cooling effect. The heating surface of the thermoelectric cooler 22 is attached to the heat dissipation mechanism, which quickly dissipates the heat generated by the heating surface of the thermoelectric cooler 22 to maintain the working efficiency of the heat-conducting plate 21. The heat dissipated by the heat dissipation mechanism is discharged through the heat dissipation hole 13 (note that the support bar 11 can raise the distance between the bottom of the bottle body 10 and the ground, thereby facilitating the exhaust of the heat dissipation mechanism through the heat dissipation hole 13).

[0032] Further reference Figures 2-5 The heat dissipation mechanism includes a heat sink 23, which is attached to one side of the semiconductor cooling chip 22. Several fins 24 are distributed in a ring on the surface of the heat sink 23, and a fan 25 is installed in the center of the heat sink 23.

[0033] In a further embodiment, the heat sink 23 absorbs the heat generated by the heating surface of the thermoelectric cooler 22, and the heat generated by the heat sink 23 is quickly removed by the fan 25, thereby achieving the purpose of cooling; the air exhausted by the fan 25 is discharged through the heat dissipation holes 13. The fins 24 greatly increase the heat dissipation area, allowing more heat to be dissipated into the air through thermal conduction and convection, which helps to improve heat dissipation efficiency and reduce the temperature of the device. The fan 25 is located in the center of the heat sink 23 and can generate directional airflow, allowing air to pass through the gaps between the fins 24 more effectively and remove more heat. This design optimizes the airflow path and improves heat dissipation performance (it is worth noting that thermal grease is used to fill the gaps between the thermal conductive pad 21, the thermoelectric cooler 22, and the heat sink 23).

[0034] Further reference Figure 3 and Figure 6 The power supply component avoids the heat dissipation hole 13. The power supply component includes a battery 26 and a circuit board 27. The battery 26 is installed at the bottom of the bottle body 10, and the circuit board 27 is connected above the battery 26. One end of the circuit board 27 has a charging port 28, and the circuit board 27 is electrically connected to the thermoelectric cooler 22. The battery 26 is powered through the charging port 28, and the battery 26 provides power to the thermoelectric cooler 22. The circuit board 27 has a control switch, which activates the thermoelectric cooler 22 to start working. By avoiding the heat dissipation hole 13, the power supply component optimizes heat dissipation performance. Integrating the power supply component inside the bottle body 10 improves the utilization of the internal space of the bottle body 10, resulting in a compact structure that is easy to carry and use.

[0035] Further reference Figure 5 and Figure 6 The battery 26 is made of an arc-shaped structure and has three equidistantly distributed heat dissipation holes 13 around it. The circuit board 27 is made of a ring structure.

[0036] In a further embodiment, the three batteries 26 are connected by wires. The arc-shaped structure of the batteries 26 can improve the utilization of the internal space of the bottle body 10, making the whole device more compact. The ring-shaped circuit board 27 and the arc-shaped battery 26 avoid the heat dissipation hole 13 and will not affect the heat dissipation function of the entire heat dissipation mechanism.

[0037] Example 2 (in conjunction with Example 1):

[0038] refer to Figures 4-7 The support strip 11 extends to the outer wall and bottom of the bottle body 10, and ventilation slots 12 are provided between the support strips 11 on the outer wall of the bottle body 10. The ventilation slots 12 can enhance the heat dissipation of the heat dissipation mechanism, and the side air intake can improve the heat dissipation effect of the fins 24.

[0039] Further reference Figure 1 , Figure 2 and Figure 5 The charging port 28 extends into the ventilation slot 12 and protrudes from the bottle body 10. The charging port 28 protrudes from the outer periphery of the bottle body 10 at the ventilation slot 12, allowing for convenient direct charging from the charging port 28.

[0040] Further reference Figure 1 Three raised blocks 30 are evenly spaced around the support strip 11 at the bottom of the bottle body 10. The raised blocks 30 can raise the bottom of the bottle body 10, giving the heat dissipation holes 13 more space for heat dissipation, thereby further improving the heat dissipation effect of the heat dissipation mechanism.

[0041] In summary, in both Example 1 and Example 2, only the cooling mode is the only working mode.

[0042] Example 3:

[0043] This embodiment combines with Embodiment 1: the heating surface of the semiconductor cooling chip 22 contacts the heat-conducting sheet 21. When the semiconductor cooling chip 22 is in heating mode, the additional heat dissipation mechanism is removed; powered by the battery 26, the heating surface of the semiconductor cooling chip 22 generates heat and transfers it to the heat-conducting sheet 21, which can directly heat the liquid inside the bottle body 10 (note that: this embodiment only has one working mode, the heating mode).

[0044] Example 4:

[0045] This embodiment, in conjunction with Embodiment 1, shows that the circuit board 27 has a current commutation circuit, which is used to change the direction of the current in the semiconductor cooling chip 22.

[0046] In the above scheme, the current direction of the semiconductor cooling chip 22 is changed, and the heating surface comes into contact with the heat-conducting plate 21, thereby heating the solution inside the bottle 10. The current direction is changed again, and the cooling surface comes into contact with the heat-conducting plate 21, thereby cooling the solution inside the bottle 10 (in this embodiment, the function of cooling or heating is achieved by changing the current direction of the semiconductor cooling chip 22).

[0047] Note the current commutation circuit: it includes a switch and a control circuit. The switch is used to manually or automatically control the on / off state of the circuit and the switching of the current direction. In practical applications, the switch can be a mechanical switch or an electronic switch. The control circuit is used to generate and regulate control signals to achieve precise control of the current direction.

[0048] The specific implementation process of this utility model is as follows:

[0049] Single cooling mode: Battery 26 provides power to the thermoelectric cooler 22. A control switch on circuit board 27 activates the thermoelectric cooler 22. The cooling surface of the thermoelectric cooler 22 is attached to the underside of the heat-conducting plate 21, cooling the plate through heat transfer. The heat is then transferred from the heat-conducting plate 21 to the water inside the bottle 10, achieving a cooling effect. Heat sink 23 absorbs the heat generated by the heating surface of the thermoelectric cooler 22 and is quickly dissipated by fan 25, achieving cooling. The air exhausted by fan 25 is discharged through heat dissipation holes 13.

[0050] Single heating mode: The additional heat dissipation mechanism is removed; powered by the battery 26, the heating surface of the semiconductor cooling chip 22 generates heat and transfers it to the heat conduction plate 21 to directly heat the liquid inside the bottle body 10.

[0051] Cooling and heating modes: When the current direction of the semiconductor cooling chip 22 is changed, the heating surface contacts the heat-conducting plate 21, thereby heating the solution inside the bottle 10. When the current direction is changed again, the cooling surface contacts the heat-conducting plate 21, thereby cooling the solution inside the bottle 10.

[0052] The above embodiments are merely exemplary models of this utility model and are not intended to limit this utility model. The scope of protection of this utility model is defined by the claims. Various modifications or equivalent substitutions can be made to this utility model within its substance and scope of protection. Such modifications or equivalent substitutions should also be considered to fall within the scope of protection of this utility model.

[0053] In the description of this utility model, it should be noted that the terms "inner," "front," "rear," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the attached circle, or the orientation or positional relationship commonly used when the utility model product is in use. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, these terms indicating orientation or positional relationship should not be construed as limitations on this utility model.

[0054] In the description of this utility model, it should be further noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, these terms can refer to a fixed connection, a detachable connection, or an integral connection between components; they can also refer to a mechanical connection or an electrical connection; or they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

Claims

1. A temperature-controlled bottled water with cooling and heating functions, characterized in that: Includes a bottle body (10), with several support strips (11) distributed equidistantly in a ring at the bottom end of the bottle body (10), and heat dissipation holes (13) provided at the bottom of the bottle body (10). A sealing ring (20) is installed inside the bottle body (10). A heat-conducting sheet (21) is attached and fixed below the sealing ring (20). A semiconductor cooling chip (22) is attached and fixed below the heat-conducting sheet (21). A heat dissipation mechanism is attached below the semiconductor cooling chip (22). The semiconductor cooling chip (22) is divided into a cooling surface and a heating surface. A power supply component is installed at the bottom of the inside of the bottle body (10), and the power supply component avoids the heat dissipation hole (13). The power supply assembly includes a battery (26) and a circuit board (27). The battery (26) is installed at the bottom of the bottle (10). The circuit board (27) is connected above the battery (26). One end of the circuit board (27) is provided with a charging port (28). The circuit board (27) is electrically connected to the semiconductor cooling chip (22). The battery (26) is made of an arc-shaped structure. The battery (26) has three equidistantly distributed heat dissipation holes (13) around it. The circuit board (27) is made of a ring structure.

2. The temperature-controlled bottled water with cooling and heating functions according to claim 1, characterized in that: The heat dissipation mechanism includes a heat sink (23), which is attached to one side of a semiconductor cooling chip (22). Several fins (24) are distributed in a ring on the surface of the heat sink (23), and a fan (25) is installed in the center of the heat sink (23).

3. The temperature-controlled bottled water with cooling and heating functions according to claim 1, characterized in that: The support bar (11) extends to the outer wall of the bottle body (10) and the bottom of the bottle body (10), and a ventilation groove (12) is provided between the support bars (11) on the outer wall of the bottle body (10); the charging port (28) extends into the ventilation groove (12) and protrudes from the bottle body (10).

4. A temperature-controlled bottled water system with cooling and heating functions according to claim 1, characterized in that: Three raised blocks (30) are equidistantly arranged around the support strip (11) at the bottom of the bottle body (10).

5. A temperature-controlled bottled water device with cooling and heating functions according to claim 1, characterized in that: The heating surface of the semiconductor cooling chip (22) is in contact with the heat-conducting chip (21).

6. A temperature-controlled bottled water device with cooling and heating functions according to claim 1, characterized in that: The circuit board (27) has a current commutation circuit, which is used to change the current direction of the semiconductor cooling chip (22).

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