High-voltage box with novel high-voltage acquisition structure
By using conductive busbars to weld to circuit boards in high-voltage power distribution equipment, the problems of loose connections and plating damage caused by vibration were solved, thus achieving stability and reliability of high-voltage data acquisition.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU SOARWHALE GREEN TECH
- Filing Date
- 2025-04-08
- Publication Date
- 2026-04-28
AI Technical Summary
In existing high-voltage power distribution equipment, vibration causes problems such as loose connections and damage to the surface coating of high-voltage acquisition points.
Conductive busbars are used as high-voltage acquisition terminals and are connected to the circuit board by soldering instead of terminal plug-in connection, ensuring that the plating is not damaged under vibration and avoiding poor connection.
It effectively avoids damage to the coating on the contact surface caused by plugging and vibration, thus improving the stability and reliability of the connection.
Smart Images
Figure CN224176571U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of high-voltage power distribution technology, specifically relating to a high-voltage box with a novel high-voltage acquisition structure. Background Technology
[0002] In a vehicle's battery module, high-voltage power distribution equipment such as BDU (Battery Disconnect Unit), PDU (Power Distribution Unit), and BMU (Battery Management Unit) are typically required to manage the power distribution of the battery.
[0003] In the aforementioned high-voltage power distribution equipment, electrical control equipment such as fuses, contactors, pre-charge resistors, and shunts are typically installed to form a power distribution circuit for high-voltage power distribution. At the same time as high-voltage power distribution, it is necessary to collect voltage data at the target potential point in order to collect high-voltage data on the target device or target circuit and perform high-voltage monitoring.
[0004] However, most data acquisition devices use terminal plugging and unplugging to make electrical connections with the circuit. Due to the friction during plugging and unplugging, the surface plating of the terminal will be damaged. At the same time, the vibration generated by the vehicle during movement will also be transmitted to the plugging point, causing the connection to become loose and resulting in a poor connection. Furthermore, the vibration will cause friction on the plugging surface, damaging the surface plating of the contact surface. Utility Model Content
[0005] Purpose of the utility model: This application develops a high-voltage box with a novel high-voltage acquisition structure, aiming to solve the technical problems in the prior art where vibration causes intermittent connection and damage to the surface coating of the high-voltage acquisition point.
[0006] Technical solution: This application provides a high-voltage box with a novel high-voltage acquisition structure, comprising:
[0007] A housing having a chamber;
[0008] An electrical control device, which is connected to the housing and disposed in the cavity;
[0009] A circuit board, comprising a board body connected to the housing and disposed in the cavity; the board body having intersecting first direction, second direction and third direction, the board body extending along the plane formed by the first direction and the second direction; a high voltage acquisition circuit is disposed in the board body, and the board body has a connection hole extending along the third direction;
[0010] A first conductive busbar is connected to the housing and disposed in the cavity; the first conductive busbar is connected to the electrical control device and is disposed on the same side of the circuit board along the third direction;
[0011] The second conductive bus is disposed in the chamber and connected to the first conductive bus; the second conductive bus is connected to the high voltage acquisition circuit and passes through the connection hole.
[0012] A welding layer is provided, which is connected to the high-voltage acquisition circuit; the welding layer is disposed in the connection hole and is electrically connected to the second conductive bus and the high-voltage acquisition circuit.
[0013] In some embodiments, the circuit board further includes a conductive layer that covers the inner wall of the connection hole and is connected to the high-voltage acquisition circuit.
[0014] In some embodiments, the circuit board further includes a first protective layer, which is disposed on the inner wall of the conductive layer and electrically connected to the conductive layer.
[0015] In some embodiments, the circuit board further includes a second protective layer, which is disposed on the side of the board body along the third direction and at the opening of the connection hole, and is connected to the first protective layer;
[0016] Along the third direction, the second protective layer covers the side of the conductive layer.
[0017] In some embodiments, the solder layer includes a solder layer.
[0018] In some embodiments, the cross-sectional shape of the connecting hole is quadrilateral in a plane perpendicular to the third direction;
[0019] The quadrilateral includes:
[0020] Two straight edges are provided, and the two straight edges are spaced apart in the direction intersecting the extension direction of the straight edge;
[0021] The circular arc edge has two edges, and the openings of the two circular arc edges are arranged opposite each other.
[0022] In some embodiments, the two straight sides are arranged in parallel; the two arc sides are semicircles with the same radius.
[0023] In some embodiments, the connection hole is a through hole, and the second conductive bus extends through the connection hole.
[0024] In some embodiments, a third protective layer is provided on the outer surface of the second conductive bus.
[0025] In some embodiments, the first protective layer includes an organic coating layer, an immersion gold layer, an immersion silver layer, and / or an immersion tin layer;
[0026] The second protective layer includes an organic coating layer, an immersion gold layer, an immersion silver layer, and / or an immersion tin layer;
[0027] The third protective layer includes an organic coating layer, an immersion gold layer, an immersion silver layer, and / or an immersion tin layer.
[0028] Beneficial Effects: Compared with the prior art, the embodiments of this application provide a high-voltage box with a novel high-voltage acquisition structure, including a shell, an electrical control device, a circuit board, a first conductive bus, a second conductive bus, and a welding layer; wherein the shell serves as a mounting base and is provided with a cavity for accommodating other components; the electrical control device is connected to the shell and disposed in the cavity; the circuit board is connected to the shell and disposed in the cavity, and the circuit board is provided with a high-voltage acquisition circuit and a connection hole; the first conductive bus is connected to the shell and the electrical control device and disposed in the cavity, and is disposed on the same side of the conductive bus as the electrical control device; the second conductive bus is connected to the first conductive bus and disposed in the cavity, and the second conductive bus is connected to the high-voltage acquisition circuit and passes through the connection hole; the welding layer is connected to the high-voltage acquisition circuit and disposed in the connection hole, and is electrically connected to the second conductive bus and the high-voltage acquisition circuit. The high-voltage box with a novel high-voltage acquisition structure provided in this application connects a second conductive busbar as a high-voltage acquisition terminal to a first conductive busbar that connects to the electrical control devices to form a high-voltage power distribution circuit, thus completing high-voltage acquisition. Simultaneously, the second conductive busbar is inserted into a connection hole on the circuit board and fixed by a solder layer to transmit the acquired high-voltage electrical signal to the circuit board, completing the transmission of the high-voltage acquisition signal. This application uses a conductive busbar as the high-voltage acquisition terminal and connects the high-voltage acquisition terminal to the circuit board by soldering, replacing the terminal plug-in connection method. This prevents damage to the surface plating between contact surfaces due to plugging actions and vibrations, and avoids the problem of loose contact caused by vibrations. Attached Figure Description
[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0030] Figure 1 A partial cross-sectional perspective view of a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application;
[0031] Figure 2A partial cross-sectional perspective view of the circuit board in a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application;
[0032] Figure 3 for Figure 2 A magnified view of a section at point A in the middle;
[0033] Figure 4 A partial view of the connection hole on the side of the circuit board of the high-voltage box with a novel high-voltage acquisition structure provided in this application embodiment, in the third-dimensional direction away from the first conductive bar.
[0034] Reference numerals: 10, housing; 11, chamber; 20, electrical control device; 30, circuit board; 31, board body; 311, connecting hole; 32, conductive layer; 33, first protective layer; 34, second protective layer; 40, first conductive busbar; 50, second conductive busbar; 51, third protective layer; 60, solder layer; X, first direction; Y, second direction; Z, third direction. Detailed Implementation
[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0036] In a vehicle's battery module, high-voltage power distribution equipment such as BDU (Battery Disconnect Unit), PDU (Power Distribution Unit), and BMU (Battery Management Unit) are typically required to manage the power distribution of the battery.
[0037] In the aforementioned high-voltage power distribution equipment, electrical control equipment such as fuses, contactors, pre-charge resistors, and shunts are typically installed to form a power distribution circuit for high-voltage power distribution. At the same time as high-voltage power distribution, it is necessary to collect voltage data at the target potential point in order to collect high-voltage data on the target device or target circuit and perform high-voltage monitoring.
[0038] However, most data acquisition devices use terminal plugging and unplugging to make electrical connections with the circuit. Due to the friction during plugging and unplugging, the surface plating of the terminal will be damaged. At the same time, the vibration generated by the vehicle during movement will also be transmitted to the plugging point, causing the connection to become loose and resulting in a poor connection. Furthermore, the vibration will cause friction on the plugging surface, damaging the surface plating of the contact surface.
[0039] In view of this, embodiments of this application provide a high-voltage box with a novel high-voltage acquisition structure, including a housing 10, an electrical control device 20, a circuit board 30, a first conductive bus 40, a second conductive bus 50, and a welding layer 60; wherein the housing 10 serves as a mounting base and is provided with a chamber 11 for accommodating other components; the electrical control device 20 is connected to the housing 10 and disposed in the chamber 11; the circuit board 30 is connected to the housing 10 and disposed in the chamber 11, and the circuit board 30 is provided with a high-voltage acquisition circuit and a connection hole 311; the first conductive bus 40 is connected to the housing 10 and the electrical control device 20 and disposed in the chamber 11, and is disposed on the same side of the conductive bus as the electrical control device 20; the second conductive bus 50 is connected to the first conductive bus 40 and disposed in the chamber 11, and is also connected to the high-voltage acquisition circuit and passes through the connection hole 311; the welding layer 60 is connected to the high-voltage acquisition circuit and disposed in the connection hole 311, and is electrically connected to the second conductive bus 50 and the high-voltage acquisition circuit. The high-voltage box with a novel high-voltage acquisition structure provided in this application connects the second conductive bus 50 as a high-voltage acquisition terminal to the first conductive bus 40, which forms a high-voltage power distribution circuit with the electrical control device 20, to complete high-voltage acquisition. Simultaneously, the second conductive bus 50 passes through the connection hole 311 on the circuit board 30 and is fixed by the solder layer 60 to transmit the acquired high-voltage electrical signal to the circuit board 30, thus completing the transmission of the high-voltage acquisition signal. This application uses a conductive bus as the high-voltage acquisition terminal and connects the high-voltage acquisition terminal to the circuit board 30 by soldering, replacing the terminal plug-in connection method. This prevents damage to the surface plating between contact surfaces due to plugging actions or vibration, and also avoids the problem of loose contact caused by vibration.
[0040] In some embodiments, please refer to Figure 1 , Figure 1 This is a partial sectional perspective view of a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application. The housing 10 is an injection-molded plastic shell, which forms a cavity 11 for accommodating components after molding. When installing components, the components can be connected to the housing 10 and placed in the cavity 11.
[0041] In some embodiments, please refer to Figure 1 , Figure 1 This is a three-dimensional cross-sectional view of a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application. The electrical control device 20 is connected to the housing 10 and is disposed in the chamber 11.
[0042] In some embodiments, please refer to Figure 1 and Figure 2 , Figure 1 This is a partial sectional perspective view of a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application. Figure 2This is a partial cross-sectional perspective view of the circuit board in a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application. The circuit board 30 includes a plate body 31, which is connected to the housing 10 and disposed in the chamber 11. To facilitate the description of the relative positional relationship between components, this embodiment of the application introduces intersecting first direction X, second direction Y, and third direction Z in the plate body 31. The plate body 31 extends along the plane formed by the first direction X and the second direction Y. Specifically, the plate body 31 is a rectangular plate body 31, the first direction X is the length direction of the rectangular plate body 31, the second direction Y is the width direction of the rectangular plate body 31, and the third direction Z is the thickness direction of the rectangular plate body 31. It can be understood that the first direction X, the second direction Y, and the third direction Z are orthogonally arranged.
[0043] In some embodiments, a high-voltage acquisition circuit is provided in the board body 31. Specifically, the board body 31 is a PCB (Printed Circuit Board), and the high-voltage acquisition circuit in the board body 31 is laid in the board body 31 of the PCB board through copper foil as wires.
[0044] In some embodiments, please refer to Figures 1 to 3 , Figure 1 This is a partial sectional perspective view of a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application. Figure 2 This is a partial cross-sectional perspective view of the circuit board in a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application. Figure 3 for Figure 2 In the enlarged view at point A, the plate 31 has a connecting hole 311 extending along the third direction Z, i.e., the thickness direction of the plate 31. The inner wall of the connecting hole 311 includes the copper foil of the high voltage acquisition circuit, so that the second conductive bus 50 passes through the connecting hole 311 and is electrically connected to the copper foil of the high voltage acquisition circuit.
[0045] In some embodiments, please refer to Figure 3 , Figure 3 for Figure 2 The enlarged view at point A shows that the circuit board 30 also includes a conductive layer 32, which covers the inner wall of the connection hole 311 and is connected to the high-voltage acquisition circuit. Specifically, the conductive layer 32 is a pure copper layer, which is connected to the copper foil of the sampling circuit exposed in the inner wall of the connection hole 311. By covering the inner wall of the connection hole 311 with copper, the contact area of the conductive medium at the connection between the sampling circuit and the second conductive bus 50 is increased, thereby improving the stability and reliability of the electrical connection at the contact surface.
[0046] In some embodiments, please refer to Figure 3 , Figure 3 for Figure 2The enlarged view at point A shows that the circuit board 30 also includes a first protective layer 33. The first protective layer 33 is deposited on and seals the inner wall of the conductive layer 32, and is electrically connected to the inner wall of the conductive layer 32. Understandably, the conductive layer 32 is a pure copper layer. Since bare copper is easily oxidized and contaminated when exposed to air, the first protective layer 33 is applied to the surface of the bare copper as a protective film to isolate it from air, prevent the conductive layer 32 from participating in the soldering process, and prevent the conductive layer 32 from melting, deforming, or oxidizing, thus ensuring the performance of the conductive layer 32. Specifically, the first protective layer 33 includes an organic coating layer, an immersion gold layer, an immersion silver layer, and / or an immersion tin layer.
[0047] In some embodiments, please refer to Figure 3 , Figure 3 for Figure 2 In the enlarged view at point A, the circuit board 30 also includes a second protective layer 34. Along the third direction Z, i.e., the thickness direction of the board body 31, the second protective layer 34 covers the side of the board body 31 and is positioned at the opening of the connection hole 311, surrounding the edge of the opening of the connection hole 311. It is connected to the first protective layer 33 to cover the side of the conductive layer 32, sealing the side of the conductive layer 32 to isolate it from air, prevent the conductive layer 32 from participating in the soldering process, and prevent the conductive layer 32 from melting, deforming, or oxidizing, thus ensuring the performance of the conductive layer 32. Specifically, the second protective layer 34 includes an organic coating layer, an immersion gold layer, an immersion silver layer, and / or an immersion tin layer.
[0048] In some embodiments, please refer to Figure 1 , Figure 1 This is a cross-sectional perspective view of the high-voltage box with a novel high-voltage acquisition structure provided in this application embodiment. The first conductive bus 40 is connected to the housing 10 and disposed in the chamber 11, and is connected to the electrical control device 20, serving as a wire connecting the electrical control device 20 to form a high-voltage power distribution circuit. Simultaneously, to facilitate the connection between the electrical control device 20 and the first conductive bus 40, and to rationally plan the layout between components, the first conductive bus 40 and the electrical control device 20 are disposed on the same side of the circuit board 30 along the third direction Z, i.e., the thickness direction of the circuit board 30. Specifically, the first conductive bus 40 can be a copper bus or an aluminum bus.
[0049] In some embodiments, please refer to Figure 1 , Figure 1This is a cross-sectional perspective view of a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application. A second conductive bus 50 is disposed in the chamber 11 and welded to the first conductive bus 40. The second conductive bus 50 serves as a high-voltage acquisition terminal, acquiring the potential at the connection point between the second conductive bus 50 and the first conductive bus 40 to complete high-voltage acquisition. Specifically, the second conductive bus 50 can be a copper bus or an aluminum bus. A third protective layer 51 is provided on the outer surface of the second conductive bus 50 to isolate it from air, prevent the second conductive bus 50 from participating in the welding process, and prevent the conductive layer 32 from melting, deforming, or oxidizing, thus ensuring the performance of the conductive layer 32. The third protective layer 51 includes an organic coating layer, an immersion gold layer, an immersion silver layer, and / or an immersion tin layer.
[0050] In some embodiments, please refer to Figure 1 , Figure 1 This is a partial cross-sectional perspective view of a high-voltage box with a novel high-voltage acquisition structure provided in an embodiment of this application. The second conductive bus 50 passes through the connection hole 311 and is electrically connected to the copper foil of the high-voltage acquisition circuit on the inner wall of the connection hole 311, so as to transmit the acquired high-voltage signal to the high-voltage acquisition circuit. Specifically, the connection hole 311 is a through hole, and the second conductive bus 50 passes through the connection hole 311 and extends outwards, so as to maximize the connection area between the second conductive bus 50 and the connection hole 311, improve connection reliability, and enhance the stability of the electrical connection.
[0051] In some embodiments, please refer to Figure 1 , Figure 1 This is a cross-sectional perspective view of the high-voltage box with a novel high-voltage acquisition structure provided in this application embodiment. The solder layer 60 is connected to the high-voltage acquisition circuit and is disposed in the connection hole 311 to electrically connect with the copper foil of the high-voltage acquisition circuit in the inner wall of the connection hole 311, thus realizing the electrical connection between the solder layer 60 and the high-voltage acquisition circuit. Simultaneously, the solder layer 60 is connected to the second conductive bus 50, realizing the electrical connection between the second conductive bus 50 and the high-voltage acquisition circuit. Specifically, the solder layer 60 includes a solder layer. It can be understood that the solder layer 60 is generated by selective wave soldering to weld and fix the second conductive bus 50 in the connection hole 311, replacing the terminal plug-in connection method. This prevents damage to the surface plating between contact surfaces due to plugging actions or vibration, and avoids the problem of incomplete contact caused by vibration.
[0052] In some embodiments, please refer to Figure 4 , Figure 4This is a partial view of the circuit board of the high-voltage box with a novel high-voltage acquisition structure provided in this application embodiment, showing the connection hole 311 on the side away from the first conductive busbar in the third direction. In a plane perpendicular to the third direction Z, the cross-sectional shape of the connection hole 311 is quadrilateral. One set of two opposite sides of the quadrilateral are straight lines, and the other set of opposite sides are rounded edges. The two straight lines are spaced apart in the direction intersecting the extension direction of the straight lines, and the openings of the two rounded edges are opposite each other. Specifically, the quadrilateral is a unicircle. Understandably, the two straight lines are of the same length and are parallel. Along a direction perpendicular to the length direction of the straight lines, the two straight lines are aligned. Simultaneously, the two rounded edges are semicircles with the same radius. The four sides are connected sequentially to form a unicircle. Understandably, using rounded edges to connect with straight edges transforms the right angle at the connection point into a rounded corner, which reduces stress at the connection point, improves the reliability of the board 31 during manufacturing and use, and reduces the amount of soldering material used, thereby lowering costs.
[0053] Understandably, the high-voltage box with a novel high-voltage acquisition structure provided in the embodiments of this application includes a housing 10, an electrical control device 20, a circuit board 30, a first conductive bus 40, a second conductive bus 50, and a welding layer 60; wherein the housing 10 serves as a mounting base and is provided with a chamber 11 for accommodating other components; the electrical control device 20 is connected to the housing 10 and disposed in the chamber 11; the circuit board 30 is connected to the housing 10 and disposed in the chamber 11, and the circuit board 30 is provided with a high-voltage acquisition circuit and a connection hole 311; the first conductive bus 40 is connected to the housing 10 and the electrical control device 20 and disposed in the chamber 11, and is disposed on the same side of the conductive bus as the electrical control device 20; the second conductive bus 50 is connected to the first conductive bus 40 and disposed in the chamber 11, and is also connected to the high-voltage acquisition circuit and passes through the connection hole 311; the welding layer 60 is connected to the high-voltage acquisition circuit and disposed in the connection hole 311, and is electrically connected to the second conductive bus 50 and the high-voltage acquisition circuit. The high-voltage box with a novel high-voltage acquisition structure provided in this application connects the second conductive bus 50 as a high-voltage acquisition terminal to the first conductive bus 40, which forms a high-voltage power distribution circuit with the electrical control device 20, to complete high-voltage acquisition. Simultaneously, the second conductive bus 50 passes through a connection hole 311 on the circuit board 30 and is fixed by a solder layer 60 to transmit the acquired high-voltage electrical signal to the circuit board 30, thus completing the transmission of the high-voltage acquisition signal. This application uses a conductive bus as the high-voltage acquisition terminal and connects the high-voltage acquisition terminal to the circuit board 30 by soldering, replacing the terminal plug-in connection method. This prevents damage to the surface plating between contact surfaces due to plugging actions or vibration, and also avoids the problem of loose contact caused by vibration.
[0054] This application has provided a detailed description of a high-voltage box with a novel high-voltage acquisition structure according to the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A high-voltage box with a novel high-voltage acquisition structure, characterized in that, include: A housing (10) having a chamber (11); An electrical control device (20) is connected to the housing (10) and disposed in the chamber (11); A circuit board (30) includes a board body (31), which is connected to the housing (10) and disposed in the cavity (11); the board body (31) has a first direction (X), a second direction (Y) and a third direction (Z) that intersect and are disposed along the plane formed by the first direction (X) and the second direction (Y); a high voltage acquisition circuit is disposed in the board body (31), and the board body (31) has a connection hole (311) extending along the third direction (Z); A first conductive bus (40) is connected to the housing (10) and disposed in the chamber (11); the first conductive bus (40) is connected to the electrical control device (20) and is disposed along the third direction (Z); the first conductive bus (40) and the electrical control device (20) are disposed on the same side of the circuit board (30); The second conductive bus (50) is disposed in the chamber (11) and connected to the first conductive bus (40); the second conductive bus (50) is connected to the high voltage acquisition circuit and passes through the connection hole (311); A welding layer (60) is connected to the high-voltage acquisition circuit; the welding layer (60) is disposed in the connection hole (311) and electrically connected to the second conductive bus (50) and the high-voltage acquisition circuit.
2. The high-voltage box with a novel high-voltage acquisition structure according to claim 1, characterized in that, The circuit board (30) also includes a conductive layer (32), which is disposed on the inner wall of the connection hole (311) and connected to the high voltage acquisition circuit.
3. The high-voltage box with a novel high-voltage acquisition structure according to claim 2, characterized in that, The circuit board (30) further includes a first protective layer (33), which is disposed on the inner wall of the conductive layer (32) and electrically connected to the conductive layer (32).
4. The high-voltage box with a novel high-voltage acquisition structure according to claim 3, characterized in that, The circuit board (30) also includes a second protective layer (34). Along the third direction (Z), the second protective layer (34) covers the side of the board body (31) and is disposed at the opening of the connection hole (311), and is connected to the first protective layer (33). Along the third direction (Z), the second protective layer (34) covers the side of the conductive layer (32).
5. The high-voltage box with a novel high-voltage acquisition structure according to claim 1, characterized in that, The welding layer (60) includes a solder layer.
6. The high-voltage box with a novel high-voltage acquisition structure according to claim 1, characterized in that, In a plane perpendicular to the third direction (Z), the cross-sectional shape of the connecting hole (311) is quadrilateral; The quadrilateral includes: Two straight edges are provided, and the two straight edges are spaced apart in the direction intersecting the extension direction of the straight edge; The circular arc edge has two edges, and the openings of the two circular arc edges are arranged opposite each other.
7. The high-voltage box with a novel high-voltage acquisition structure according to claim 6, characterized in that, The two straight sides are arranged in parallel; the two arc sides are semicircles with the same radius.
8. The high-voltage box with a novel high-voltage acquisition structure according to claim 1, characterized in that, The connection hole (311) is a through hole, and the second conductive bus (50) passes through the connection hole (311) and extends out.
9. The high-voltage box with a novel high-voltage acquisition structure according to claim 4, characterized in that, The outer surface of the second conductive bus (50) is provided with a third protective layer (51).
10. The high-voltage box with a novel high-voltage acquisition structure according to claim 9, characterized in that, The first protective layer (33) includes an organic coating layer, an immersion gold layer, an immersion silver layer and / or an immersion tin layer; The second protective layer (34) includes an organic coating layer, an immersion gold layer, an immersion silver layer and / or an immersion tin layer; The third protective layer (51) includes an organic coating layer, an immersion gold layer, an immersion silver layer and / or an immersion tin layer.