Semiconductor chip test probe

Abstract

The utility model relates to the technical field of semiconductor chips, in particular to a semiconductor chip test probe, which comprises an installation frame, a probe rod is inserted in an inner cavity of the installation frame, an installation sleeve is fixedly sleeved on the outer surface of the probe rod, the probe rod comprises a rod main body, an installation groove is arranged at the bottom of the rod main body, and the installation sleeve is fixedly sleeved on the installation groove. Limiting vertical grooves are formed in the left side and the right side of the bottom of an inner cavity of the mounting groove, connecting sliding grooves are formed in the tops of the limiting vertical grooves, positioning sliding grooves are formed in the inner sides of the bottoms of the connecting sliding grooves, and supporting springs are fixedly connected to the top of an inner cavity of the mounting groove. When the probe rod is damaged, the limiting clamping block is pushed inwards to move out of the limiting opening, the mounting frame is pulled forwards to separate the positioning insertion plate from the interior of the positioning insertion shell, the damaged probe rod is taken down and replaced, the positioning insertion plate is inserted into the positioning insertion shell and pushed forcibly, and the limiting clamping block is clamped into the limiting opening for positioning. Therefore, the single probe rod can be conveniently disassembled, assembled and replaced, and the replacement efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip technology, specifically to a semiconductor chip test probe. Background Technology

[0002] Semiconductor chips are miniature circuits that integrate a large number of electronic components on a semiconductor substrate through processes such as photolithography and etching. Semiconductor chip test probes are core components used for semiconductor testing. They are mainly used in chip design verification, wafer testing, and finished product testing. The probes are precisely connected to the chip pins or solder balls and the test equipment to achieve signal transmission, thereby detecting the product's continuity, current, function, and aging.

[0003] The publication number CN221804104U, entitled "A Semiconductor Chip Test Probe," includes a worktable with a support fixedly mounted on top. Research and analysis have revealed that while it enables the detection of different structures within the chip, thus saving testing time and increasing accuracy and efficiency, it still has the following drawbacks to some extent:

[0004] The probes cannot be disassembled. Once mounted on the mounting plate, the plate cannot be disassembled, making it difficult to remove individual probes. This hinders the replacement of damaged probes, impacting repair and replacement efficiency. Furthermore, the probe shaft and tip cannot be separated. Replacement requires replacing the entire probe; individual shaft or tip replacement is not possible, increasing replacement costs. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor chip test probe that is easy to disassemble, allows for quick replacement of individual probes, and facilitates the disassembly of probe components, thereby reducing replacement costs.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A semiconductor chip test probe includes a mounting frame, a probe rod inserted into the inner cavity of the mounting frame, and a mounting sleeve fixedly fitted on the outer surface of the probe rod; the probe rod includes a rod body, and a mounting groove is formed at the bottom of the rod body;

[0008] Limiting vertical grooves are provided on both the left and right sides of the bottom of the mounting groove. A connecting slide groove is provided at the top of the limiting vertical groove, and a positioning slide groove is provided on the inner side of the bottom of the connecting slide groove. A support spring is fixedly connected to the top of the mounting groove, and a probe head is inserted into the bottom of the mounting groove. Positioning insert plates and positioning insert shells are fixedly connected to both sides of the front and rear mounting frames, respectively.

[0009] Preferably, a limiting groove is provided on the inner side of the inner cavity of the mounting frame, and limiting protrusions are fused to both the front and rear sides of the mounting sleeve.

[0010] Preferably, a sliding push plate is fixedly connected to the bottom of the support spring, and limit blocks are welded to the top of both the front and rear sides of the probe head.

[0011] Preferably, a connecting seat is welded to the top of the probe rod, and mounting brackets are fixedly connected to the top of both the front and rear sides of the mounting frame.

[0012] Preferably, a limiting opening is provided on the outer side of the inner cavity of the positioning insert, and the front and rear connecting grooves are arranged diagonally.

[0013] Preferably, a limiting block is welded to the outer side of the positioning plate, and the outer side of the limiting block is chamfered.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. Push the limit block inward to move it out of the limit opening, pull the mounting frame forward to detach the positioning plate from the inside of the positioning housing, remove the damaged probe rod for replacement, insert the positioning plate into the positioning housing and push it forcefully, the limit block will lock into the limit opening for positioning, this facilitates the disassembly and replacement of individual probe rods and improves replacement efficiency.

[0016] 2. First, push the probe head upwards, then rotate it clockwise to move the limiting insert into the limiting vertical groove. Pull the probe head downwards to detach it from the mounting groove for replacement. This allows the probe head to be disassembled and replaced individually, reducing replacement costs. Attached Figure Description

[0017] Figure 1 This is an axonometric view of the structure of this utility model;

[0018] Figure 2 This is a right-side top-view axonometric view of the mounting frame of this utility model;

[0019] Figure 3 This is a cross-sectional axonometric view of the probe rod of this utility model;

[0020] Figure 4 This is an exploded view of a partial structure of this utility model.

[0021] In the diagram: 1. Mounting frame; 2. Probe head; 3. Probe rod; 4. Mounting bracket; 5. Connecting seat; 6. Positioning insert; 7. Positioning insert plate; 8. Limiting block; 9. Limiting opening; 10. Limiting slot; 11. Limiting protrusion; 12. Supporting spring; 13. Sliding push plate; 14. Mounting sleeve; 15. Limiting insert; 16. Rod body; 17. Mounting groove; 18. Connecting slide groove; 19. Positioning slide groove; 20. Limiting vertical groove. Detailed Implementation

[0022] Please see Figures 1-4 A semiconductor chip test probe includes a mounting frame 1, a probe rod 3 is inserted into the inner cavity of the mounting frame 1, a mounting sleeve 14 is fixedly sleeved on the outer surface of the probe rod 3, and the probe rod 3 includes a rod body 16, with a mounting groove 17 opened at the bottom of the rod body 16.

[0023] Limiting vertical grooves 20 are provided on both the left and right sides of the bottom of the mounting groove 17. A connecting slide groove 18 is provided at the top of the limiting vertical groove 20, and a positioning slide groove 19 is provided on the inner side of the bottom of the connecting slide groove 18. A support spring 12 is fixedly connected to the top of the mounting groove 17. By setting the support spring 12, the probe head 2 can be pushed tightly against the chip being tested by its own elastic force to ensure the accuracy of the test.

[0024] The bottom of the mounting slot 17 is fitted with a probe head 2, and the two sides of the front and rear mounting frames 1 are respectively fixedly connected with positioning plates 7 and positioning shells 6.

[0025] Please see Figure 2 and Figure 3 A limiting slot 10 is provided on the inner side of the inner cavity of the mounting frame 1. By setting the limiting slot 10, when the probe rod 3 is installed, the limiting protrusion 11 can be inserted into the limiting slot 10 to limit the probe rod 3 and prevent it from falling out of the mounting frame 1. The front and rear sides of the mounting sleeve 14 are welded with limiting protrusions 11.

[0026] Please see Figure 3 The bottom of the support spring 12 is fixedly connected to a sliding push plate 13. By setting the sliding push plate 13, the contact area with the probe head 2 can be increased, and the support is more stable. Limiting blocks 15 are welded to the top of both the front and rear sides of the probe head 2.

[0027] Please see Figure 1 The top of the probe rod 3 is welded with a connecting seat 5, and the top of the front and rear sides of the mounting frame 1 are fixedly connected with mounting brackets 4. By setting the mounting brackets 4, the mounting frame 1 can be easily fixedly installed on the testing equipment.

[0028] Please see Figure 2 and Figure 4 A limiting opening 9 is provided on the outer side of the inner cavity of the positioning insert 6, and two connecting grooves 18 are arranged diagonally.

[0029] Please see Figure 2 The positioning insert 7 is welded to the outer side of the limiting block 8. The positioning insert 7 is made of elastic plastic plate. The limiting block 8 has a chamfer on the outer side. By setting the chamfer, the positioning insert 7 can be easily and quickly inserted into the positioning insert 6.

[0030] In use, the connecting wires of the detection system are connected to the connector 5, and the mounting frame 1 is installed on the detection structure. The semiconductor chip is detected by the probe rod 3. When one of the probe rods 3 is damaged and needs to be replaced, the limiting blocks 8 on both sides of the corresponding mounting frame 1 are pushed inward to move it out of the limiting opening 9 and into the inner cavity of the positioning shell 6. Then, the front mounting frame 1 is pulled forward to disengage the positioning plate 7 from the inside of the positioning shell 6. The damaged probe rod 3 is then removed and replaced. After that, the positioning plates 7 on both sides are inserted into the positioning shell 6 and pushed forcefully. After they are fully inserted, the limiting blocks 8 are locked into the limiting opening 9 for positioning. This makes it convenient to disassemble and replace individual probe rods 3 and improves replacement efficiency.

[0031] When it is necessary to replace the probe head 2 separately, first push the probe head 2 upward so that the limiting blocks 15 on both sides of the probe head 2 move into the connecting slide grooves 18 on both sides. Then rotate clockwise so that the limiting blocks 15 move into the limiting vertical groove 20. Finally, pull the probe head 2 downward so that it is disengaged from the mounting groove 17.

[0032] When installing a new probe head 2, first align the limiting blocks 15 on both sides with the limiting vertical grooves 20 on both sides, then push them upwards to move them into the connecting slide groove 18. Then rotate them counterclockwise to the top of the positioning slide groove 19. At this time, the support spring 12 releases its elastic force to push the probe head 2 downwards so that the limiting blocks 15 are inserted into the positioning slide groove 19 for limiting. This allows the probe head 2 to be disassembled and replaced separately, reducing replacement costs.

[0033] In summary, this semiconductor chip test probe, through the coordinated use of the mounting frame 1, probe head 2, probe rod 3, positioning housing 6, positioning plate 7, support spring 12, connecting slide 18, positioning slide 19, and limiting vertical groove 20, solves the problems of inconvenient probe disassembly, affecting the efficiency of replacing individual probes, and the inability to disassemble the various components of the probe, thus increasing replacement costs.

Claims

1. A semiconductor chip test probe, characterized in that: The device includes a mounting frame (1), in which a probe rod (3) is inserted into the inner cavity of the mounting frame (1), and a mounting sleeve (14) is fixedly fitted on the outer surface of the probe rod (3); the probe rod (3) includes a rod body (16), and a mounting groove (17) is provided at the bottom of the rod body (16); Limiting vertical grooves (20) are provided on both the left and right sides of the bottom of the inner cavity of the mounting groove (17). A connecting slide groove (18) is provided at the top of the limiting vertical groove (20), and a positioning slide groove (19) is provided on the inner side of the bottom of the connecting slide groove (18). A support spring (12) is fixedly connected to the top of the inner cavity of the mounting groove (17), and a probe head (2) is inserted into the bottom of the mounting groove (17). Positioning insert plates (7) and positioning insert shells (6) are fixedly connected to the sides of the front and rear mounting frames (1), respectively.

2. A semiconductor chip test probe according to claim 1, characterized in that: The inner side of the inner cavity of the mounting frame (1) is provided with a limiting groove (10), and the front and rear sides of the mounting sleeve (14) are welded with limiting protrusions (11).

3. A semiconductor chip test probe according to claim 1, characterized in that: The bottom of the support spring (12) is fixedly connected to a sliding push plate (13), and the top of the front and rear sides of the probe head (2) are welded with limit plugs (15).

4. A semiconductor chip test probe according to claim 1, characterized in that: The probe rod (3) is welded with a connecting seat (5) at the top, and the mounting frame (1) is fixedly connected with mounting brackets (4) on the top of both the front and rear sides.

5. A semiconductor chip test probe according to claim 1, characterized in that: The positioning insert (6) has a limiting opening (9) on the outer side of its inner cavity, and two connecting grooves (18) are arranged diagonally.

6. A semiconductor chip test probe according to claim 1, characterized in that: A limiting block (8) is welded to the outside of the positioning plate (7), and the limiting block (8) has a chamfer on its outside.

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