Hydrogen atomic clock temperature control system

Abstract

The embodiment of the utility model provides a hydrogen atomic clock temperature control system. The system comprises at least one temperature control subsystem, and the temperature control subsystem comprises a control module, a temperature detection module and a temperature adjusting module. The temperature detection module is arranged on the outer side of a microwave resonant cavity of the hydrogen atomic clock, and the temperature detection module is used for collecting the temperature of the microwave resonant cavity; the temperature adjusting module comprises a refrigerating unit and a heating unit; the refrigerating unit and the heating unit are arranged on the outer side of the microwave resonant cavity; the refrigeration unit is used for cooling the microwave resonant cavity; the heating unit is used for heating the microwave resonant cavity; the control module is electrically connected with the refrigeration unit, the heating unit and the temperature detection module. The control module is used for adjusting the temperature of the microwave resonant cavity through the refrigerating unit or the heating unit. According to the hydrogen atomic clock temperature control system provided by the embodiment of the utility model, the limitation that the existing hydrogen atomic clock temperature control system only has a one-way heating function but lacks a refrigeration function is solved, and rapid adjustment and stable maintenance of the temperature are realized.

Description

Technical Field

[0001] This utility model relates to the field of temperature control technology, and in particular to a temperature control system for a hydrogen atomic clock. Background Technology

[0002] A hydrogen atomic clock is a high-precision timing device based on the energy level transition frequency of hydrogen atoms. With its extremely high stability and accuracy, it plays a key role in fields with extremely stringent time accuracy requirements, such as satellite navigation, astronomical observation, quantum communication, and radio astronomy.

[0003] Hydrogen atomic clocks have extremely high requirements for temperature environment. Their core components, such as microwave resonant cavities, need to operate within an extremely stable narrow temperature range. Current technologies typically rely on active heating and passive heat dissipation for temperature control.

[0004] However, existing hydrogen atomic clocks have significant drawbacks when faced with fluctuations in ambient temperature or internal thermal disturbances. They cannot cope with rising ambient temperatures, as high temperatures significantly exacerbate the thermal motion of hydrogen atoms, directly causing frequency drift in energy level transitions and leading to a decrease in timing accuracy. Utility Model Content

[0005] This utility model provides a hydrogen atomic clock temperature control system to regulate the operating temperature of the hydrogen atomic clock.

[0006] This utility model provides a temperature control system for a hydrogen atomic clock, including at least one temperature control subsystem, which includes a control module, a temperature detection module, and a temperature adjustment module.

[0007] The temperature detection module is located on the outside of the microwave resonant cavity of the hydrogen atomic clock. The temperature detection module is used to collect the temperature of the microwave resonant cavity.

[0008] The temperature control module includes a cooling unit and a heating unit; the cooling unit and the heating unit are located on the outside of the microwave resonant cavity; the cooling unit is used to cool the microwave resonant cavity; the heating unit is used to heat the microwave resonant cavity.

[0009] The control module is electrically connected to the cooling unit, heating unit, and temperature detection module, respectively; the control module is used to adjust the temperature of the microwave resonant cavity through the cooling unit or heating unit.

[0010] Optionally, the temperature control subsystem has a heat preservation mode and a temperature adjustment mode;

[0011] The control module is configured as follows in heat preservation mode:

[0012] When the temperature of the microwave resonant cavity is higher than the upper limit T1 of the first preset temperature range, the cooling unit is controlled to cool the microwave resonant cavity.

[0013] When the temperature of the microwave resonant cavity is lower than the lower limit T2 of the first preset temperature range, the heating unit is controlled to heat the microwave resonant cavity.

[0014] The control module is configured as follows in temperature control mode:

[0015] The target temperature regulation power is calculated based on the difference between the temperature of the microwave resonant cavity and the target adjustment temperature T3.

[0016] When the temperature of the microwave resonant cavity is higher than the upper limit T4 of the second preset temperature range, the cooling unit is controlled to adjust the power to cool the microwave resonant cavity according to the target temperature.

[0017] When the temperature of the microwave resonant cavity is lower than the lower limit T5 of the second preset temperature range, the heating unit controls the heating unit to adjust the power to heat the microwave resonant cavity according to the target temperature.

[0018] Optionally, the hydrogen atomic clock temperature control system includes a heat preservation stage and a temperature adjustment stage;

[0019] During the heat preservation phase, the hydrogen atomic clock temperature control system includes at least one temperature control subsystem in heat preservation mode;

[0020] During the temperature adjustment phase, the hydrogen atomic clock temperature control system includes at least one temperature control subsystem in heat preservation mode and at least one temperature control subsystem in temperature adjustment mode.

[0021] Optionally, the microwave resonant cavity includes at least two temperature control regions; each temperature control region corresponds one-to-one with a temperature control subsystem; at least one of the preset temperature range and the target adjustment temperature of different temperature control subsystems is different.

[0022] Optionally, the hydrogen atomic clock temperature control system includes at least one first temperature control subsystem and at least one second temperature control subsystem;

[0023] The microwave resonant cavity includes a first heat-insulating cavity, a second heat-insulating cavity, and a third heat-insulating cavity, which are coaxially nested from the inside to the outside.

[0024] The first temperature control subsystem is used to regulate the temperature between the first insulation cavity and the second insulation cavity;

[0025] The second temperature control subsystem is used to regulate the temperature between the second and third insulation chambers;

[0026] The temperature detection module in the first temperature control subsystem is located between the first insulation cavity and the second insulation cavity, and is used to detect the temperature between the first insulation cavity and the second insulation cavity.

[0027] The temperature detection module in the second temperature control subsystem is located between the second insulation cavity and the third insulation cavity, and is used to detect the temperature between the second insulation cavity and the third insulation cavity.

[0028] Optionally, in at least one first temperature control subsystem and at least one second temperature control subsystem, the temperature regulation module of at least one temperature control subsystem includes only a heating unit.

[0029] Optionally, the microwave resonant cavity includes at least three temperature control regions; each temperature control region corresponds one-to-one with a temperature control subsystem; at least one of the preset temperature range and the target adjustment temperature of the different temperature control subsystems is different.

[0030] At least one first temperature control subsystem is included between the first insulation cavity and the second insulation cavity, corresponding to at least one temperature control zone;

[0031] The second insulation cavity and the third insulation cavity include at least two second temperature control subsystems corresponding to at least two temperature control zones;

[0032] During the temperature adjustment phase, the hydrogen atomic clock temperature control system includes at least one second temperature control subsystem in heat preservation mode and at least one first temperature control subsystem in temperature adjustment mode.

[0033] Optionally, the hydrogen atomic clock temperature control system also includes a power supply; the temperature detection module includes a thermistor; and the control module includes a first resistor, a second resistor, a third resistor, and a differential amplifier.

[0034] One end of the first resistor is connected to the power supply, and the other end of the first resistor is connected to the thermistor, with the connection node being the first connection node. The other end of the thermistor is grounded. One end of the second resistor is connected to the power supply, and the other end of the second resistor is connected to the third resistor, with the connection node being the second connection node. The other end of the third resistor is grounded. The first comparator terminal of the differential amplifier is connected to the first connection point, and the second comparator terminal of the differential amplifier is connected to the second connection point.

[0035] The differential amplifier outputs a deviation voltage when the resistance values ​​of the thermistor and the first resistor are not equal; the deviation voltage serves as the temperature signal of the microwave resonant cavity.

[0036] Optionally, the heating unit includes components and a heating structure, the components including a first switching diode, a first operational amplifier circuit and a first power amplifier;

[0037] The positive terminal of the first switching diode is connected to the control module, the negative terminal of the first switching diode is connected to the positive terminal of the first operational amplifier circuit, the negative terminal of the first operational amplifier is connected to the positive terminal of the first power amplifier, and the negative terminal of the first power amplifier is connected to the heating unit.

[0038] The cooling unit includes components and a cooling structure. The components include a second switching diode, a second operational amplifier circuit, and a second power amplifier.

[0039] The positive terminal of the second switching diode is connected to the control module, the negative terminal of the second switching diode is connected to the positive terminal of the second operational amplifier circuit, the positive terminal of the second operational amplifier is connected to the positive terminal of the second power amplifier, and the negative terminal of the second power amplifier is connected to the cooling unit.

[0040] Optionally, the heating structure is a heating wire, which is arranged on the outside of the microwave resonant cavity by means of two wires being wound in opposite directions.

[0041] Optionally, the cooling structure includes a semiconductor cooler, a cooling pipe, and a cooling medium. The cooling pipe is wound around the outside of the microwave resonant cavity, and the cooling medium is contained in the cooling pipe. The semiconductor cooler is used to reduce the temperature of the cooling medium, and the cooling medium exchanges heat with the microwave resonant cavity to reduce the temperature of the microwave resonant cavity.

[0042] This invention provides a temperature control system for a hydrogen atomic clock, including at least one temperature control subsystem. The temperature control subsystem includes a control module, a temperature detection module, and a temperature regulation module. The temperature detection module is used to acquire the temperature of the microwave resonant cavity. A cooling unit is used to cool the microwave resonant cavity, and a heating unit is used to heat the microwave resonant cavity. The two work together to achieve rapid temperature regulation and stable maintenance. This overcomes the limitation of existing hydrogen atomic clock temperature control systems that only have unidirectional heating functionality and lack cooling functionality, thus achieving rapid temperature regulation and stable maintenance. Attached Figure Description

[0043] Figure 1 A schematic diagram of a hydrogen atomic clock temperature control system provided in an embodiment of this utility model;

[0044] Figure 2 A schematic diagram of the structure of a microwave resonant cavity provided in an embodiment of this utility model;

[0045] Figure 3 A schematic diagram of the circuit structure of a temperature control subsystem provided in an embodiment of this utility model. Detailed Implementation

[0046] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not the entire structure.

[0047] This utility model provides a temperature control system for a hydrogen atomic clock. Figure 1 This is a schematic diagram of the structure of a hydrogen atomic clock temperature control system provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of a microwave resonant cavity provided for an embodiment of the present invention.

[0048] like Figures 1-2 As shown, the hydrogen atomic clock temperature control system includes at least one temperature control subsystem, which includes a control module 10, a temperature detection module 20, and a temperature adjustment module 30.

[0049] The temperature detection module 20 is located outside the microwave resonant cavity 40 of the hydrogen atomic clock. The temperature detection module 20 is used to collect the temperature of the microwave resonant cavity 40.

[0050] The temperature regulation module 30 includes a cooling unit 31 and a heating unit 32; the cooling unit 31 and the heating unit 32 are disposed on the outside of the microwave resonant cavity 40; the cooling unit 31 is used to cool down the microwave resonant cavity 40; the heating unit 32 is used to heat the microwave resonant cavity 40.

[0051] The control module 10 is electrically connected to the cooling unit 31, the heating unit 32, and the temperature detection module 20, respectively; the control module 10 is used to adjust the temperature of the microwave resonant cavity 40 through the cooling unit 31 or the heating unit 32.

[0052] Specifically, during operation, the temperature detection module 20 collects the temperature of the microwave resonant cavity 40 in real time and transmits the data to the control module 10. The control module 10 has a preset temperature range for the microwave resonant cavity 40, which is based on the operating temperature T0 and the floating accuracy ΔT is determined.

[0053] For example, the preset operating temperature T0 can be set between 263.15K and 338.15K (-10 to 65℃) depending on the model of the hydrogen atom maser and the ambient temperature of the application scenario. The fluctuation accuracy can be adjusted within the range of ±0.01K to ±5K according to actual needs. If the preset operating temperature T0 = 320.65K (47.5℃) and the fluctuation accuracy ΔT = 2.5K, then the preset temperature range is 318.15 to 323.15K.

[0054] During the temperature maintenance phase, the temperature detection module 20 continuously monitors temperature changes, and the control module 10 fine-tunes the working status of the cooling unit 31 and the heating unit 32 based on real-time temperature data to stabilize the temperature.

[0055] Specifically, when the temperature data fed back by the temperature detection module 20 shows that the temperature of the microwave resonant cavity 40 deviates from the preset temperature range, the control module 10 controls the temperature adjustment module 30 to restore the temperature to the preset temperature range. If the current temperature is higher than the upper limit of the preset temperature range, the control module 10 sends a command to the cooling unit 31 to start the cooling function and cool down the microwave resonant cavity 40; if the current temperature is lower than the lower limit of the preset temperature range, the control module 10 controls the heating unit 32 to start working and heat the microwave resonant cavity 40.

[0056] For example, in an application scenario with higher precision requirements, such as to obtain atomic excitation accuracy of less than 1×10-15, the control module 10 will further enhance the control precision, so that the temperature stability of the preset temperature range is less than 7×10-3K and the temperature gradient is ≤0.05K, thus ensuring the high-precision timing of the hydrogen atomic clock.

[0057] The hydrogen atomic clock also includes a startup phase during its use, during which the temperature of the resonant cavity of the hydrogen atomic clock is gradually adjusted from the ambient temperature to the operating temperature range.

[0058] During the startup phase, the control module 10 precisely regulates the working intensity of the cooling unit 31 and the heating unit 32 to ensure that the temperature change (temperature gradient) per unit time does not exceed ±0.5K.

[0059] It should be noted that the hydrogen atomic clock provided in this embodiment of the present invention has a composite temperature control scheme of a cooling unit 31 and a heating unit 32. Therefore, compared with a hydrogen atomic clock temperature control system that only has a unidirectional heating function but lacks a cooling function, the working temperature and working temperature range of the hydrogen atomic clock can be set near the ambient temperature, thereby achieving the purpose of rapid start-up.

[0060] This invention provides a temperature control system for a hydrogen atomic clock, including at least one temperature control subsystem. The temperature control subsystem includes a control module, a temperature detection module, and a temperature regulation module. The temperature detection module is used to acquire the temperature of the microwave resonant cavity. A cooling unit is used to cool the microwave resonant cavity, and a heating unit is used to heat the microwave resonant cavity. The two work together to achieve rapid temperature regulation and stable maintenance. This overcomes the limitation of existing hydrogen atomic clock temperature control systems that only have unidirectional heating functionality and lack cooling functionality, thus achieving rapid temperature regulation and stable maintenance.

[0061] Optionally, the temperature control subsystem has a heat preservation mode and a temperature adjustment mode, with different preset temperature ranges and temperature stability. In temperature adjustment mode, the main task of the temperature control subsystem is to adjust the current microwave resonant cavity to a second preset temperature range along a preset temperature gradient. After the temperature of the microwave resonant cavity reaches the second preset temperature range for a period of time, the temperature control subsystem switches from temperature adjustment mode to heat preservation mode. In heat preservation mode, the main task of the temperature control subsystem is to provide a stable temperature environment for the outside of the microwave resonant cavity. Therefore, compared with temperature adjustment mode, heat preservation mode has a smaller preset temperature range, higher temperature stability, and smaller fluctuation accuracy ΔT.

[0062] In heat preservation mode, control module 10 is configured as follows:

[0063] When the temperature of the microwave resonant cavity 40 is higher than the upper limit T1 of the first preset temperature range, the cooling unit 31 is controlled to cool down the microwave resonant cavity 40.

[0064] When the temperature of the microwave resonant cavity 40 is lower than the lower limit T2 of the first preset temperature range, the heating unit 32 is controlled to heat the microwave resonant cavity 40.

[0065] The upper limit T1 of the first preset temperature range can be understood as the working temperature T0 + the floating accuracy △T; the lower limit T2 of the first preset temperature range can be understood as the working temperature T0 - the floating accuracy △T; the heat preservation mode can be understood as adjusting to maintain the temperature when the temperature deviates from the preset range.

[0066] Specifically, in the heat preservation mode, the temperature control subsystem uses the temperature detection module 20 to collect the temperature of the microwave resonant cavity 40 in real time and transmits the data to the control module 10. The control module 10 has a preset first temperature range [T1, T2] for the microwave resonant cavity 40. The control module 10 controls the temperature adjustment module 30 to restore the temperature to the preset temperature range. If the current temperature is higher than the upper limit T1 of the first preset temperature range, the control module 10 sends a command to the cooling unit 31 to activate the cooling function and cool the microwave resonant cavity 40; if the current temperature is lower than the lower limit T2 of the first preset temperature range, the control module 10 controls the heating unit 32 to start working and heat the microwave resonant cavity 40.

[0067] In temperature control mode, control module 10 is configured as follows:

[0068] The target temperature regulation power is calculated based on the difference between the temperature of the microwave resonant cavity 40 and the target adjustment temperature T3.

[0069] When the temperature of the microwave resonant cavity 40 is higher than the upper limit T4 of the second preset temperature range, the cooling unit 31 is controlled to adjust the power to cool the microwave resonant cavity 40 according to the target temperature.

[0070] When the temperature of the microwave resonant cavity 40 is lower than the lower limit T5 of the second preset temperature range, the heating unit 32 adjusts the power to heat the microwave resonant cavity 40 according to the target temperature.

[0071] The target temperature adjustment power can be understood as being set based on the current hydrogen atomic clock's ability to withstand temperature changes; the temperature adjustment mode can be understood as actively adjusting the target temperature according to a preset power.

[0072] Specifically, in temperature adjustment mode, the temperature control subsystem determines the target adjustment temperature T3 based on the working state of the hydrogen atomic clock and environmental parameters, calculates the difference between the current temperature and T3, and calculates the upper limit T4 and the lower limit T5 of the second preset temperature range based on the floating accuracy ΔT. After considering the cavity temperature fluctuations caused by thermal inertia and heat conduction, the temperature of the microwave resonant cavity 40 is adjusted with the target temperature adjustment power to ensure that the temperature of the microwave resonant cavity 40 is ultimately within the second preset temperature range [T4, T5].

[0073] For example, during the startup phase of the hydrogen atomic clock, if the room temperature is 25° (i.e., the temperature of the microwave resonant cavity 40 is 25°), the frequency of the microwave resonant cavity is 1.420 GHz, the corresponding operating temperature is 27.5° (i.e., the target adjustment temperature T3 = 27.5°), and the floating accuracy is ΔT = ±0.5°, then the control module 10 enters the temperature adjustment mode.

[0074] First, obtain the current temperature and the floating accuracy ΔT, calculate the second preset temperature range of 27°C to 28°C, and calculate the difference between the current temperature and the target adjustment temperature T3 (27.5°C) as +2.5°C (heating is required). Based on the system's heat capacity, heat conduction characteristics, and the temperature change tolerance of the hydrogen atomic clock cavity, calculate the required target temperature regulation power, such as 50W.

[0075] Then, the microwave resonant cavity 40 is continuously heated with power adjusted to the target temperature, so that it enters the second preset temperature range with a temperature change curve as smooth as possible.

[0076] Optionally, the hydrogen atomic clock temperature control system includes a heat preservation stage and a temperature adjustment stage;

[0077] During the heat preservation phase, the hydrogen atomic clock temperature control system includes at least one temperature control subsystem in heat preservation mode;

[0078] During the temperature adjustment phase, the hydrogen atomic clock temperature control system includes at least one temperature control subsystem in heat preservation mode and at least one temperature control subsystem in temperature adjustment mode.

[0079] Specifically, the system may include multiple temperature control subsystems. During the heat preservation phase of the hydrogen atomic clock's temperature control system, at least one temperature control subsystem operates in heat preservation mode based on the difference between the current temperature and the target adjustment temperature, while some subsystems may be in temperature adjustment mode. The core objective of this phase is to maintain the microwave resonant cavity as a whole or its key areas within an extremely stable and narrowly fluctuating temperature environment (i.e., the first preset temperature range [T1, T2]), in order to minimize the impact of temperature fluctuations on atomic transition frequencies and ensure the long-term frequency stability of the hydrogen atomic clock. All subsystems in heat preservation mode work independently or collaboratively, monitoring the temperature of their respective areas and fine-tuning them when a temperature deviation from their preset narrow range is detected, bringing the temperature back to the set range.

[0080] During the temperature adjustment phase of the hydrogen atomic clock, such as during startup, the hydrogen atomic clock temperature control system employs a more complex hybrid heating mode strategy: at least one temperature control subsystem is placed in temperature adjustment mode. This subsystem actively and uniformly changes the temperature of its assigned area, moving towards the target adjustment temperature T3 according to a preset temperature gradient (or power calculated based on the temperature difference), and ultimately stabilizing within a relatively wide second preset temperature range [T4, T5]. Simultaneously, at least one temperature control subsystem remains in or switches to a heat preservation mode, providing local thermal environment stability or thermal boundary control for the temperature adjustment area. For example, heat preservation of the sides or bottom of the microwave resonant cavity can reduce the impact of external thermal interference on the core temperature adjustment process, or prevent excessive heat loss / inflow to / from non-target areas, improving temperature adjustment efficiency and protecting the structure.

[0081] Optionally, the microwave resonant cavity 40 includes at least two temperature control regions; each temperature control region corresponds to a temperature control subsystem; at least one of the preset temperature range and the target adjustment temperature of different temperature control subsystems is different.

[0082] Specifically, the temperature control region can be understood as different physical or functional areas on the microwave resonant cavity 40, such as the top, sides, and bottom. In applications requiring higher precision, these regions can be further subdivided into more sub-regions. Due to differences in thermal conductivity, environmental exposure, distance from the core working area, and structural function, the sensitivity to temperature changes and the required control precision may vary among different regions. Therefore, different temperature control regions are handled by different temperature control subsystems, and at least one of the preset temperature range and target adjustment temperature differs between the different temperature control subsystems.

[0083] By dividing the microwave resonant cavity 40 into multiple temperature control zones at different locations, local temperature control and heating compensation adjustment are formed for each zone. By adopting a non-uniform heating arrangement, high-precision temperature control of different zones is achieved, making the temperature distribution of the entire microwave resonant cavity 40 more uniform and the overall temperature difference smaller.

[0084] Continue to refer to Figure 2 In an optional embodiment, the hydrogen atomic clock temperature control system includes at least one first temperature control subsystem and at least one second temperature control subsystem;

[0085] The microwave resonant cavity 40 includes a first heat insulation cavity 41, a second heat insulation cavity 42 and a third heat insulation cavity 43, which are coaxially arranged from the inside to the outside.

[0086] The first temperature control subsystem is used to regulate the temperature between the first insulation cavity 41 and the second insulation cavity 42;

[0087] The second temperature control subsystem is used to regulate the temperature between the second insulation chamber 42 and the third insulation chamber 43;

[0088] The temperature detection module 20 in the first temperature control subsystem is located between the first insulation cavity 41 and the second insulation cavity 42, and is used to detect the temperature between the first insulation cavity 41 and the second insulation cavity 42. The temperature detection module 20 in the second temperature control subsystem is located between the second insulation cavity 42 and the third insulation cavity 43, and is used to detect the temperature between the second insulation cavity 42 and the third insulation cavity 43.

[0089] Specifically, the microwave resonant cavity 40 includes a first heat insulation cavity 41, a second heat insulation cavity 42, and a third heat insulation cavity 43, which are coaxially arranged from the inside out. Among them, the third heat insulation cavity 43, as the outermost heat insulation layer, is mainly responsible for isolating external environmental temperature fluctuations; the second heat insulation cavity 42, as the middle buffer layer, plays a role in heat transfer transition and stabilizing the internal environment; the first heat insulation cavity 41 contains an atomic storage bubble 44, which is the core region where hydrogen atom transitions occur and has the highest requirements for temperature stability.

[0090] For example, the second temperature control subsystem is located on the outermost layer and is used to establish a relatively stable temperature barrier on the outermost side of the resonant cavity, effectively isolating the effects of ambient temperature fluctuations on the interior. In this mode, it maintains the temperature of the interlayer region between the second insulation cavity 42 and the third insulation cavity 43 within a preset range.

[0091] The first temperature control subsystem is located in the inner layer closer to the core and is used for more precise temperature control. It strictly maintains the temperature within a narrower preset temperature range, providing an extremely stable operating temperature environment for the atomic storage bubble 44. This makes the overall temperature control system faster, more precise, and more stable in temperature maintenance.

[0092] Optionally, in at least one first temperature control subsystem and at least one second temperature control subsystem, the temperature regulation module of at least one temperature control subsystem includes only the heating unit 32.

[0093] Specifically, the temperature control system of the hydrogen atomic clock includes at least one first temperature control subsystem (inner layer) and at least one second temperature control subsystem (outer layer). At least one of the inner and outer layers has both heating and cooling capabilities to meet the most basic temperature regulation requirements.

[0094] For example, an inner-layer temperature control subsystem (such as the first temperature control subsystem) typically needs to maintain a high temperature state and is equipped with only a heating unit 31, while an outer-layer temperature control subsystem (such as the second temperature control subsystem) needs to cope with changes in ambient temperature and is equipped with both a heating unit 31 and a cooling unit 32. Conversely, the core components of a hydrogen atomic clock are located in the innermost layer and require the most precise temperature control; therefore, the inner-layer temperature control subsystem (such as the first temperature control subsystem) is equipped with both a heating unit 31 and a cooling unit 32. In most application scenarios, it is more common for the ambient temperature to be lower than the system's target temperature, so the outer-layer temperature control subsystem (such as the second temperature control subsystem) is equipped with only a heating unit 31 to simplify the system structure.

[0095] Optionally, the microwave resonant cavity 40 includes at least two temperature control regions; each temperature control region corresponds to a temperature control subsystem; at least one of the preset temperature range and the target adjustment temperature of different temperature control subsystems is different.

[0096] At least one first temperature control subsystem is included between the first heat insulation cavity 41 and the second heat insulation cavity 42, corresponding to at least one temperature control area;

[0097] At least two second temperature control subsystems corresponding to at least two temperature control zones are included between the second insulation cavity 42 and the third insulation cavity 43;

[0098] During the temperature adjustment phase, the hydrogen atomic clock temperature control system includes at least one second temperature control subsystem in heat preservation mode and at least one first temperature control subsystem in temperature adjustment mode.

[0099] Specifically, the microwave resonant cavity 40 is divided into at least three temperature control regions, wherein the inner layer includes at least one first temperature control subsystem corresponding to at least one temperature control region, and the outer layer includes at least two second temperature control subsystems corresponding to at least two temperature control regions.

[0100] During the temperature adjustment phase, the hydrogen atomic clock temperature control system employs a more complex hybrid heating strategy: at least one first temperature control subsystem (located in the inner layer of the microwave resonant cavity 40) is placed in temperature adjustment mode. This subsystem actively and uniformly changes the temperature of the core region of the microwave resonant cavity 40, adjusting it towards the target temperature according to a preset temperature gradient (or power calculated based on the temperature difference), and ultimately stabilizing it within the preset temperature range. Simultaneously, at least one second temperature control subsystem (located in the outer layer of the microwave resonant cavity 40) remains in or switches to a heat preservation mode, providing local thermal environment stability or thermal boundary control for the temperature adjustment area. For example, heat preservation of the sides or bottom of the microwave resonant cavity can reduce the impact of external thermal interference on the core temperature adjustment process, or prevent excessive heat loss / inflow to / from non-target areas, improving temperature adjustment efficiency and protecting the structure.

[0101] For example, in one specific embodiment, the hydrogen atomic clock temperature control system employs a dual-layer precision temperature control system, with five independent temperature control subsystems controlling the inner and outer furnace control zones. Specifically, this involves five independent temperature control circuits for the upper and lower parts of the outer furnace, and the upper, middle, and lower parts of the inner furnace of the microwave resonant cavity 40. The temperature of the middle and lower parts of the inner furnace of the microwave resonant cavity 40 is continuously adjustable from 45 to 55°C, with a stability of 0.001°C. The upper, middle, and lower parts of the outer furnace provide a stable temperature environment for the microwave resonant cavity 40, with a stability of 0.01°C.

[0102] Optionally, the hydrogen atomic clock temperature control system also includes a power supply; the temperature detection module 20 includes a thermistor Rn; and the control module 10 includes a first resistor R1, a second resistor R2, a third resistor R3, and a differential amplifier A1.

[0103] One end of the first resistor R1 is connected to the power supply VIN, and the other end of the first resistor R1 is connected to the thermistor Rn, with the connection node being the first connection node. The other end of the thermistor Rn is grounded. One end of the second resistor R2 is connected to the power supply VIN, and the other end of the second resistor R2 is connected to the third resistor R3, with the connection node being the second connection node. The other end of the third resistor R3 is grounded to GND. The first comparator terminal of the differential amplifier A1 is connected to the first connection node, and the second comparator terminal of the differential amplifier A1 is connected to the second connection node.

[0104] Among them, when the resistance values ​​of the thermistor Rn and the first resistor R1 are not equal, the differential amplifier A1 outputs a deviation voltage; the deviation voltage serves as the temperature signal of the microwave resonant cavity 40.

[0105] Specifically, the first resistor R1, the second resistor R2, the third resistor R3, and the thermistor Rn form a Wheatstone bridge. The Wheatstone bridge is used in the circuit to detect the resistance change of the thermistor, thereby indirectly measuring the temperature.

[0106] For example, the first resistor R1, the second resistor R2, the third resistor R3, and the thermistor Rn form a Wheatstone bridge. R2 and R3 have the same resistance value. The thermistor Rn is attached to the surface of the microwave resonant cavity, and its resistance changes with temperature. Rn, together with R1, forms one arm of the bridge, while R2 and R3 form the other arm. The two ends of the differential amplifier A1 are connected to the midpoints of the two arms respectively to acquire the voltage difference signal.

[0107] When the thermistor Rn and the first resistor R1 have the same value, the bridge is balanced. When the temperature of the microwave resonant cavity changes, the resistance of the thermistor Rn changes, causing the bridge to become unbalanced. The differential amplifier A1 outputs a voltage signal corresponding to the temperature deviation. This signal is processed and drives the temperature regulation module 30 to adjust the cavity temperature. For example, when the temperature is lower than the target value, the thermistor Rn is greater than R1, the bridge outputs a positive deviation voltage, and the heating unit 32 is triggered; conversely, when the temperature is higher than the target value, the cooling unit 31 is activated or the heating power of the heating unit 32 is reduced, thereby achieving stable control of the microwave resonant cavity temperature.

[0108] Optionally, the heating unit 32 includes components and a heating structure, the components including a first switching diode D1, a first operational amplifier circuit A2 and a first power amplifier A3;

[0109] The positive terminal of the first switching diode D1 is connected to the control module 10, the negative terminal of the first switching diode D1 is connected to the positive terminal of the first operational amplifier circuit A2, the negative terminal of the first operational amplifier A2 is connected to the positive terminal of the first power amplifier A3, and the negative terminal of the first power amplifier A3 is connected to the heating unit 32.

[0110] The cooling unit 31 includes components and a cooling structure. The components include a second switching diode D2, a second operational amplifier circuit A4, and a second power amplifier A5.

[0111] The positive terminal of the second switching diode D2 is connected to the control module 10, the negative terminal of the second switching diode D2 is connected to the positive terminal of the second operational amplifier circuit A4, the positive terminal of the second operational amplifier A4 is connected to the positive terminal of the second power amplifier A5, and the negative terminal of the second power amplifier A5 is connected to the cooling unit 31.

[0112] Specifically, when the bridge outputs a positive deviation voltage, it indicates that the temperature is lower than the target temperature. At this time, the signal output by the control module 10 is forward-biased by the first switching diode D1, enters the first operational amplifier circuit A2 for amplification, and then drives the heating structure of the heating unit 32 to start heating through the first power amplifier A3, thereby increasing the temperature of the microwave resonant cavity.

[0113] When the bridge outputs a negative deviation voltage, it indicates that the temperature is higher than the ambient temperature. At this time, the signal output by the control module 10 is forward-biased by the second switching diode D2, enters the second operational amplifier circuit A4 for amplification, and then drives the cooling structure of the cooling unit 31 to start cooling through the second power amplifier A5, thereby reducing the temperature of the microwave resonant cavity; or the heating power of the heating unit 32 is reduced through the control logic to achieve temperature regulation.

[0114] It should be noted that the operational amplifier is used to amplify the weak deviation voltage signal output by the bridge circuit to a suitable amplitude (e.g., from millivolts to volts), solving the problem of insufficient differential voltage signal strength. The power amplifier, based on the output signal of the operational amplifier, further converts the voltage signal into the driving signal required to drive the heating or cooling structure, ensuring that the heating or cooling unit can actually perform temperature regulation.

[0115] Optionally, the heating structure is a heating wire 33, which is arranged on the outside of the microwave resonant cavity 40 by means of double-wire reverse winding.

[0116] Specifically, two heating wires are wound side-by-side in opposite directions around the outside of the resonant cavity. When energized, they generate magnetic fields in opposite directions, which cancel each other out. This prevents the alternating magnetic field generated by the current from interfering with the atomic transition process within the resonant cavity and achieves uniform heating. Furthermore, magnetic shielding layers, such as permalloy shields, can be used to further reduce magnetic field interference.

[0117] When the microwave resonant cavity 40 includes a multi-layered heat-insulating cavity structure, such as a first heat-insulating cavity 41, a second heat-insulating cavity 42, and a third heat-insulating cavity 43, a set of heating wires is arranged between the first heat-insulating cavity 41 and the second heat-insulating cavity 42. This set of heating wires is used for precise temperature control of the inner core region (such as the third heat-insulating cavity 43 where the atomic transition cavity is located). Another set of heating wires is arranged between the second heat-insulating cavity 42 and the third heat-insulating cavity 43. This set of heating wires is mainly used to control the temperature of the outer environment, such as maintaining the base temperature of the outer furnace, forming a primary thermal barrier to reduce the impact of external temperature fluctuations on the internal region.

[0118] Optionally, the cooling structure includes a semiconductor cooler 34, a cooling pipe 35, and a cooling medium. The cooling pipe 35 is wound around the outside of the microwave resonant cavity 40, and the cooling medium is contained in the cooling pipe 35. The semiconductor cooler 34 is used to reduce the temperature of the cooling medium. The cooling medium exchanges heat with the microwave resonant cavity 40 to reduce the temperature of the microwave resonant cavity 40.

[0119] Specifically, the cooling structure employs semiconductor refrigeration. The cooling pipe 35 is spirally wound and attached to the outer surface of the microwave resonant cavity 40, with a cooling medium circulating inside as a heat transfer carrier. When the low-temperature medium flows through the pipe wound around the outside of the resonant cavity, it undergoes efficient heat exchange with the microwave resonant cavity 40, absorbing heat from the cavity and thus cooling the microwave resonant cavity 40.

[0120] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A temperature control system for a hydrogen atomic clock, characterized in that, It includes at least one temperature control subsystem, which includes a control module, a temperature detection module, and a temperature regulation module; The temperature detection module is located outside the microwave resonant cavity of the hydrogen atomic clock, and the temperature detection module is used to collect the temperature of the microwave resonant cavity. The temperature regulation module includes a cooling unit and a heating unit; the cooling unit and the heating unit are disposed outside the microwave resonant cavity; the cooling unit is used to cool the microwave resonant cavity; the heating unit is used to heat the microwave resonant cavity. The control module is electrically connected to the cooling unit, the heating unit, and the temperature detection module, respectively; the control module is used to adjust the temperature of the microwave resonant cavity through the cooling unit or the heating unit.

2. The hydrogen atomic clock temperature control system according to claim 1, characterized in that, The temperature control subsystem has a heat preservation mode and a temperature adjustment mode; The control module is configured in the heat preservation mode as follows: When the temperature of the microwave resonant cavity is higher than the upper limit T1 of the first preset temperature range, the cooling unit is controlled to cool the microwave resonant cavity. When the temperature of the microwave resonant cavity is lower than the lower limit T2 of the first preset temperature range, the heating unit is controlled to heat the microwave resonant cavity. The control module is configured in the temperature control mode as follows: The target temperature regulation power is calculated based on the difference between the temperature of the microwave resonant cavity and the target adjustment temperature T3. When the temperature of the microwave resonant cavity is higher than the upper limit T4 of the second preset temperature range, the cooling unit is controlled to adjust the power to cool the microwave resonant cavity according to the target temperature. When the temperature of the microwave resonant cavity is lower than the lower limit T5 of the second preset temperature range, the heating unit is controlled to adjust the power to heat the microwave resonant cavity according to the target temperature.

3. The hydrogen atomic clock temperature control system according to claim 2, characterized in that, The hydrogen atomic clock temperature control system includes a heat preservation stage and a temperature adjustment stage; During the heat preservation phase, the hydrogen atomic clock temperature control system includes at least one temperature control subsystem in the heat preservation mode; During the temperature adjustment phase, the hydrogen atomic clock temperature control system includes at least one temperature control subsystem in the heat preservation mode and at least one temperature control subsystem in the temperature adjustment mode.

4. The hydrogen atomic clock temperature control system according to claim 2, characterized in that, The microwave resonant cavity includes at least two temperature control regions; each temperature control region corresponds one-to-one with a temperature control subsystem; at least one of the preset temperature range and the target adjustment temperature differs between different temperature control subsystems.

5. The hydrogen atomic clock temperature control system according to claim 2, characterized in that, The hydrogen atomic clock temperature control system includes at least one first temperature control subsystem and at least one second temperature control subsystem; The microwave resonant cavity includes a first heat-insulating cavity, a second heat-insulating cavity, and a third heat-insulating cavity, which are coaxially nested from the inside to the outside. The first temperature control subsystem is used to regulate the temperature between the first insulation cavity and the second insulation cavity; The second temperature control subsystem is used to regulate the temperature between the second insulation cavity and the third insulation cavity; The temperature detection module in the first temperature control subsystem is located between the first insulation cavity and the second insulation cavity, and is used to detect the temperature between the first insulation cavity and the second insulation cavity. The temperature detection module in the second temperature control subsystem is located between the second insulation cavity and the third insulation cavity, and is used to detect the temperature between the second insulation cavity and the third insulation cavity.

6. The hydrogen atomic clock temperature control system according to claim 5, characterized in that, The microwave resonant cavity includes at least three temperature control regions; each temperature control region corresponds to a temperature control subsystem; at least one of the preset temperature range and the target adjustment temperature differs among the different temperature control subsystems. At least one of the first temperature control subsystems is included between the first insulation cavity and the second insulation cavity, corresponding to at least one of the temperature control zones; The second insulation cavity and the third insulation cavity include at least two second temperature control subsystems corresponding to at least two temperature control zones; During the temperature adjustment phase, the hydrogen atomic clock temperature control system includes at least one second temperature control subsystem in a heat preservation mode and at least one first temperature control subsystem in a temperature adjustment mode.

7. The hydrogen atomic clock temperature control system according to claim 5, characterized in that, In the at least one first temperature control subsystem and the at least one second temperature control subsystem, the temperature regulation module of the at least one temperature control subsystem includes only the heating unit.

8. The hydrogen atomic clock temperature control system according to claim 1, characterized in that, The hydrogen atomic clock temperature control system also includes a power supply; the temperature detection module includes a thermistor; the control module includes a first resistor, a second resistor, a third resistor, and a differential amplifier. One end of the first resistor is connected to the power supply, and the other end of the first resistor is connected to the thermistor, with the connection node being the first connection node. The other end of the thermistor is grounded. One end of the second resistor is connected to the power supply, and the other end of the second resistor is connected to the third resistor, with the connection node being the second connection node. The other end of the third resistor is grounded. The first comparator terminal of the differential amplifier is connected to the first connection node, and the second comparator terminal of the differential amplifier is connected to the second connection node. The differential amplifier outputs a deviation voltage when the resistance values ​​of the thermistor and the first resistor are not equal; the deviation voltage serves as the temperature signal of the microwave resonant cavity.

9. The hydrogen atomic clock temperature control system according to claim 1, characterized in that, The heating unit includes components and a heating structure, and the components include a first switching diode, a first operational amplifier circuit, and a first power amplifier. The positive terminal of the first switching diode is connected to the control module, the negative terminal of the first switching diode is connected to the positive terminal of the first operational amplifier circuit, the negative terminal of the first operational amplifier circuit is connected to the positive terminal of the first power amplifier, and the negative terminal of the first power amplifier is connected to the heating unit. The refrigeration unit includes components and a refrigeration structure. The components include a second switching diode, a second operational amplifier circuit, and a second power amplifier. The positive terminal of the second switching diode is connected to the control module, the negative terminal of the second switching diode is connected to the positive terminal of the second operational amplifier circuit, the positive terminal of the second operational amplifier circuit is connected to the positive terminal of the second power amplifier, and the negative terminal of the second power amplifier is connected to the cooling unit.

10. The hydrogen atomic clock temperature control system according to claim 9, characterized in that, The heating structure is a heating wire, which is arranged on the outside of the microwave resonant cavity by means of two wires being wound in opposite directions.

11. The hydrogen atomic clock temperature control system according to claim 9, characterized in that, The cooling structure includes a semiconductor cooler, a cooling pipe, and a cooling medium. The cooling pipe is wound around the outside of the microwave resonant cavity, and the cooling medium is contained in the cooling pipe. The semiconductor cooler is used to reduce the temperature of the cooling medium. The cooling medium exchanges heat with the microwave resonant cavity to reduce the temperature of the microwave resonant cavity.

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