Intermediate frequency radiation unit and oscillator assembly

Abstract

The utility model relates to the technical field of communication, in particular to an intermediate frequency radiation unit and oscillator assembly, which comprises a PCB (printed circuit board), the PCB comprises a substrate and two protective layers, and the two protective layers respectively cover the front and back surfaces of the substrate; the radiation oscillator is arranged on one side of the front surface of the PCB, the radiation oscillator comprises a positive electrode oscillator and a negative electrode oscillator, and coupling areas of the positive electrode oscillator and the negative electrode oscillator intersect; the bonding pad is arranged on one side of the reverse side of the PCB, the bonding pad comprises a feed bonding pad and a feed ground bonding pad, the feed bonding pad, the PCB and the positive pole oscillator are respectively and correspondingly provided with a plurality of first through holes, and the feed ground bonding pad, the PCB and the negative pole oscillator are respectively and correspondingly provided with a plurality of second through holes; and the copper foil layer is arranged on one side of the reverse side of the PCB. According to the intermediate frequency radiation unit disclosed by the invention, the integration level of a feed network is improved, and the miniaturization of the intermediate frequency radiation unit is realized while the frequency band bandwidth is ensured.

Description

Technical Field

[0001] This utility model relates to the field of communication technology, and in particular to a medium-frequency radiating unit and an oscillator assembly. Background Technology

[0002] With the development of the new generation of mobile communication 5G technology, the requirements for the integration and miniaturization of the oscillator assembly have also increased. In particular, in the PCB radiating unit of the existing oscillator assembly, when a frequency of 600MHz or higher is required, the area of ​​the substrate is relatively large, which will affect the assembly of the oscillator assembly. In addition, the PCB radiating unit currently mainly adopts the single-sided substrate copper-clad trace method, which has a relatively narrow frequency bandwidth.

[0003] It is evident that existing technologies still need improvement and enhancement. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a mid-frequency radiating unit and an oscillator assembly to solve the problem that the existing oscillator assembly cannot meet the requirements of miniaturization and frequency band bandwidth limitation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A mid-frequency radiating unit, comprising:

[0007] A PCB board, the PCB board comprising a substrate and two protective layers, the two protective layers respectively covering the front and back surfaces of the substrate;

[0008] A radiating oscillator is disposed on one side of the front side of the PCB board. The radiating oscillator includes a positive pole oscillator and a negative pole oscillator, and the coupling regions of the positive pole oscillator and the negative pole oscillator intersect.

[0009] The pads are located on the reverse side of the PCB board. The pads include power feed pads and ground feed pads. The power feed pads, the PCB board, and the positive electrode oscillator are respectively provided with a plurality of first through holes. The ground feed pads, the PCB board, and the negative electrode oscillator are respectively provided with a plurality of second through holes.

[0010] A copper foil layer is disposed on the reverse side of the PCB board.

[0011] As described above, in a mid-frequency radiating unit, the positive electrode includes two positive electrode units and a positive electrode coupling region. The two positive electrode units are arranged opposite each other along any diagonal direction of the PCB board. The positive electrode coupling region connects the two positive electrode units. The negative electrode includes two negative electrode units and a negative electrode coupling region. The two negative electrode units are arranged opposite each other along another diagonal direction of the PCB board. The negative electrode coupling region connects the two negative electrode units. The positive electrode coupling region and the negative electrode coupling region intersect.

[0012] As described above, in a mid-frequency radiating unit, the positive electrode coupling region includes a first groove and a positive electrode feed plate. The first groove and the positive electrode feed plate are respectively disposed on opposite sides of the two positive electrode oscillator units. One end of the positive electrode feed plate is inserted into the first groove. A plurality of first through holes are sequentially arranged around the edge of the first groove. The positive electrode feed plate, the PCB board, and the feed pad are respectively provided with positive electrode soldering points.

[0013] As described above, in a mid-frequency radiating unit, the negative electrode coupling region includes a second groove, a first negative electrode feed piece, and a second negative electrode feed piece. The second groove is disposed on one end of any negative electrode oscillator unit near the other negative electrode oscillator unit. The first negative electrode feed piece is disposed on the front side of the PCB board and inserted into the second groove. The second negative electrode feed piece is disposed on the back side of the PCB board. A plurality of second through holes are sequentially arranged around the edge of the second groove. The first negative electrode feed piece, the PCB board, and the ground pad are respectively provided with negative electrode soldering points. The first negative electrode feed piece, the PCB board, and the second negative electrode feed piece are respectively provided with third through holes. The second negative electrode feed piece, the PCB board, and the other negative electrode oscillator unit are respectively provided with fourth through holes.

[0014] As described above, in a mid-frequency radiation unit, both of the two positive pole oscillators and both of the two negative pole oscillators are rhomboid structures.

[0015] As described above, in a mid-frequency radiation unit, each of the positive electrode oscillators has a fifth through hole in the middle, each of the positive electrode oscillators has a first notch on both sides, each of the negative electrode oscillators has a sixth through hole in the middle, and each of the negative electrode oscillators has a second notch on both sides. The fifth through hole and the sixth through hole are both in the shape of an "8".

[0016] As described above, in a mid-frequency radiating unit, the copper foil layer includes four first copper foil sheets and two second copper foil sheets. The four first copper foil sheets are arranged sequentially around the central axis of the PCB board, and the two second copper foil sheets are respectively disposed on both sides of the PCB board.

[0017] This utility model also discloses a transducer assembly, including a housing, a base, two isolation columns, an impedance matching plate, and an intermediate frequency radiation unit as described above. The base, the two isolation columns, the impedance matching plate, and the intermediate frequency radiation unit are all disposed inside the housing. The intermediate frequency radiation unit is mounted on the base. The two isolation columns are respectively disposed on the side of the intermediate frequency radiation unit facing away from the base. The impedance matching plate is mounted on the two isolation columns.

[0018] Beneficial effects:

[0019] This utility model discloses a mid-frequency radiating unit, including a PCB board, a radiating element, pads, and a copper foil layer. The PCB board includes a substrate and two protective layers. The radiating element is disposed on one side of the front of the PCB board and includes a positive electrode and a negative electrode. The pads are disposed on the back of the PCB board and include a power supply pad and a ground electrode pad. The protective layer is an solder mask. The substrate provides mechanical support and electrical insulation. The protective layer prevents oxidation, mechanical damage, or environmental interference, shields electromagnetic interference, and reduces frequency drift. The positive electrode and the negative electrode are disposed on the front side of the PCB board. On one side of the front of the CB board, the positive and negative poles form a specific electromagnetic field distribution, which is beneficial for signal transmission and reception. The power feed pad is set corresponding to the positive pole, and the ground feed pad is set corresponding to the negative pole. The first through hole realizes the electrical connection between the power feed pad and the positive pole, and the second through hole realizes the electrical connection between the ground feed pad and the negative pole. The integration of the power feed is higher. The copper foil layer adjusts the VSWR and intermodulation of the intermediate frequency radiation unit. The intermediate frequency radiation unit disclosed in this application improves the integration of the power feed network and ensures the bandwidth of the frequency band while realizing the miniaturization of the intermediate frequency radiation unit. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the intermediate frequency radiation unit provided by this utility model;

[0021] Figure 2 A structural schematic diagram of the intermediate frequency radiation unit provided by this utility model from another angle;

[0022] Figure 3 This is a schematic diagram of the oscillator assembly provided by this utility model;

[0023] Reference numerals: 1. PCB board; 11. Substrate; 12. Protective layer; 2. Radiating oscillator; 21. Positive oscillator; 211. Positive oscillator unit; 212. Positive coupling region; 213. First groove; 214. Positive feed plate; 215. Positive solder joint; 216. Fifth through hole; 217. First notch; 22. Negative oscillator; 221. Negative oscillator unit; 222. Negative coupling region; 223. Second groove; 224. 225. First negative electrode feed piece; 226. Second negative electrode feed piece; 227. Negative electrode solder joint; 228. Third through hole; 229. Fourth through hole; 220. Sixth through hole; 221. Second notch; 3. Pad; 31. Feed pad; 32. Ground pad; 4. Copper foil layer; 41. First copper foil sheet; 42. Second copper foil sheet; 5. First through hole; 6. Second through hole; 7. Outer shell; 8. Base; 9. Isolation post; 10. Impedance matching plate. Detailed Implementation

[0024] This utility model provides a medium-frequency radiation unit and an oscillator assembly. To make the purpose, technical solution and effects of this utility model clearer and more explicit, the following describes this utility model in further detail with reference to the accompanying drawings and embodiments.

[0025] In the description of this utility model, it should be understood that the terms "top" and other terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and should not be construed as limiting this utility model; in addition, the terms "installation" and "connection" should be interpreted broadly, and those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] like Figure 1-3 As shown in the figure, this application provides an intermediate frequency radiating element, comprising:

[0027] PCB board 1, the PCB board 1 includes a substrate 11 and two protective layers 12, the two protective layers 12 respectively covering the front and back surfaces of the substrate 11;

[0028] A radiating oscillator 2 is disposed on one side of the front side of the PCB board 1. The radiating oscillator 2 includes a positive pole oscillator 21 and a negative pole oscillator 22, and the coupling regions of the positive pole oscillator 21 and the negative pole oscillator 22 intersect.

[0029] The pad 3 is located on the reverse side of the PCB board 1. The pad 3 includes a power supply pad 31 and a ground supply pad 32. The power supply pad 31, the PCB board 1 and the positive electrode oscillator 21 are respectively provided with a plurality of first through holes 5. The ground supply pad 32, the PCB board 1 and the negative electrode oscillator 22 are respectively provided with a plurality of second through holes 6.

[0030] Copper foil layer 4 is disposed on the reverse side of the PCB board 1.

[0031] This utility model discloses a mid-frequency radiating unit, including a PCB board 1, a radiating vibrator 2, pads 3, and a copper foil layer 4. The PCB board 1 includes a substrate 11 and two protective layers 12. The radiating vibrator 2 is disposed on one side of the front of the PCB board 1, and the radiating vibrator 2 includes a positive electrode vibrator 21 and a negative electrode vibrator 22. The pads 3 are disposed on the back side of the PCB board 1, and the pads 3 include a power feed pad 31 and a ground feed pad 32. The protective layer 12 is a green solder mask layer. The substrate 11 provides mechanical support and electrical insulation. The protective layer 12 prevents oxidation, mechanical damage or environmental interference, shields electromagnetic interference, and reduces frequency drift. The positive electrode vibrator 21 and the negative electrode vibrator 22 are disposed on the front side of the PCB board 1. On one side of the front of the PCB board 1, the positive electrode oscillator 21 and the negative electrode oscillator 22 form a specific electromagnetic field distribution, which is beneficial for signal transmission and reception. The power supply pad 31 is set corresponding to the positive electrode oscillator 21, and the ground pad 32 is set corresponding to the negative electrode oscillator 22. The power supply pad 31 and the positive electrode oscillator 21 are electrically connected through the first through hole 5, and the ground pad 32 and the negative electrode oscillator 22 are electrically connected through the second through hole 6. The integration of the power supply is higher. The copper foil layer 4 adjusts the standing wave ratio and intermodulation of the intermediate frequency radiation unit. The intermediate frequency radiation unit disclosed in this application improves the integration of the power supply network and ensures the bandwidth of the frequency band while realizing the miniaturization of the intermediate frequency radiation unit.

[0032] The positive electrode oscillator 21 includes two positive electrode oscillator units 211 and a positive electrode coupling region 212. The two positive electrode oscillator units 211 are arranged opposite each other along any diagonal direction of the PCB board 1. The positive electrode coupling region 212 connects the two positive electrode oscillator units 211. The negative electrode oscillator 22 includes two negative electrode oscillator units 221 and a negative electrode coupling region 222. The two negative electrode oscillator units 221 are arranged opposite each other along the other diagonal direction of the PCB board 1. The negative electrode coupling region 222 connects the two negative electrode oscillator units 221. The positive electrode coupling region 212 and the negative electrode coupling region 222 intersect, that is, the two positive electrode oscillator units 211 and the two negative electrode oscillator units 221 are arranged around the center of the PCB board 1, which expands the effective radiation area of ​​the radiating oscillator 2. Furthermore, the intersecting arrangement of the positive electrode coupling region 212 and the negative electrode coupling region 222 optimizes the current distribution, enhances the electromagnetic coupling effect, and improves the signal transmission and reception capabilities.

[0033] The positive coupling region 212 includes a first groove 213 and a positive feed plate 214. The first groove 213 and the positive feed plate 214 are respectively disposed on opposite sides of the two positive oscillator units 211. One end of the positive feed plate 214 is inserted into the first groove 213. A plurality of first through holes 5 are arranged sequentially around the edge of the first groove 213. The positive feed plate 214, the PCB board 1 and the feed pad 31 are respectively provided with positive solder points 215. The positive solder points 215 realize the electrical connection between the positive feed plate 214 and the feed pad 31. The plurality of first through holes 5 realize the electrical connection between the feed pad 31 and any of the positive oscillator units 211, thereby improving the reliability of the electrical connection and reducing the loss during signal transmission.

[0034] The negative electrode coupling region 222 includes a second groove 223, a first negative electrode feed piece 224, and a second negative electrode feed piece 225. The second groove 223 is disposed on one end of any negative electrode oscillator unit 221 near the other negative electrode oscillator unit 221. The first negative electrode feed piece 224 is disposed on the front side of the PCB board 1 and inserted into the second groove 223. The second negative electrode feed piece 225 is disposed on the back side of the PCB board 1. A plurality of second through holes 6 are arranged sequentially around the edge of the second groove 223. The first negative electrode feed piece 224, the PCB board 1, and the ground pad 32 are respectively provided with negative electrode solder points 226. The first negative electrode feed piece 224, the PCB board 1, and the second negative electrode feed piece 225 are respectively provided with third through holes 227. The second negative electrode feed piece 225, the PCB board 1, and the other negative electrode coupling region 225 are respectively provided with third through holes 227. Each of the polarity oscillator units 221 is provided with a fourth through hole 228. The electrical connection between any of the negative polarity oscillator units 221 and the ground pad 32 is realized through multiple second through holes 6. The negative polarity solder point 226 realizes the electrical connection between the first negative polarity feed piece 224 and the ground pad 32. The third through hole 227 realizes the electrical connection between the first negative polarity feed piece 224 and the second negative polarity feed piece 225. The fourth through hole 228 realizes the electrical connection between the second negative polarity feed piece 225 and another negative polarity oscillator unit 221. That is, by setting the second negative polarity feed piece 225 on the reverse side of the PCB board 1, the coupling areas of the positive polarity coupling area 212 and the negative polarity coupling area 222 intersect, avoiding excessive coupling area between the positive polarity oscillator unit 211 and the negative polarity oscillator unit 221, which would affect the frequency, thus ensuring the performance of the intermediate frequency radiation unit.

[0035] Both positive electrode oscillator units 211 and both negative electrode oscillator units 221 are rhomboid structures, which allows the radiating oscillator 2 to cover the PCB board 2 as much as possible, while avoiding excessive overlap between the positive electrode oscillator 21 and the negative electrode oscillator 22. This optimizes the radiation pattern of the oscillator assembly, giving it stronger signal transmission and reception capabilities in a specific direction, and improving the directivity and gain of the oscillator assembly.

[0036] Each positive electrode oscillator unit 211 has a fifth through hole 216 in the middle and a first notch 217 on both sides. Each negative electrode oscillator unit 221 has a sixth through hole 229 in the middle and a second notch 220 on both sides. The fifth through hole 216 and the sixth through hole 229 are both "8" shaped. The fifth through hole 216, the first notch 217, the sixth through hole 229 and the second notch 220 are set to reduce the area of ​​the positive electrode oscillator unit 211 and the negative electrode oscillator unit 221 to adjust the standing wave and improve the adaptability of the intermediate frequency radiation unit to different frequency signals.

[0037] The copper foil layer 4 includes four first copper foil sheets 41 and two second copper foil sheets 42. The four first copper foil sheets 41 are arranged sequentially around the central axis of the PCB board 1, and the two second copper foil sheets 42 are respectively arranged on both sides of the PCB board 1. This can effectively shield external interference signals, reduce crosstalk between signals, adjust the standing wave ratio, ensure the frequency band bandwidth, improve electrical performance, and enhance signal transmission capability.

[0038] This utility model also discloses a transducer assembly, including a housing 7, a base 8, two isolation pillars 9, an impedance matching plate 10, and an intermediate frequency radiation unit as described above. The base 8, the two isolation pillars 9, the impedance matching plate 10, and the intermediate frequency radiation unit are all disposed within the housing 7. The intermediate frequency radiation unit is mounted on the base 8. The two isolation pillars 9 are respectively disposed on the side of the intermediate frequency radiation unit facing away from the base 8. The impedance matching plate 10 is mounted on the two isolation pillars 9. The impedance matching plate 10 is a high-frequency standing wave adjustment plate, which can better match the transducer assembly with the external circuit, reduce signal reflection, improve signal transmission efficiency, and thus improve the performance of the entire transducer assembly.

[0039] It is understood that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of this utility model, and all such substitutions or changes should fall within the protection scope of this utility model.

Claims

1. A mid-frequency radiating unit, characterized in that, include: PCB board (1), the PCB board (1) includes a substrate (11) and two protective layers (12), the two protective layers (12) respectively cover the front and back surfaces of the substrate (11); A radiating oscillator (2) is disposed on one side of the front side of the PCB board (1). The radiating oscillator (2) includes a positive pole oscillator (21) and a negative pole oscillator (22). The coupling regions of the positive pole oscillator (21) and the negative pole oscillator (22) intersect. The pad (3) is located on the reverse side of the PCB board (1). The pad (3) includes a power supply pad (31) and a ground supply pad (32). The power supply pad (31), the PCB board (1) and the positive electrode oscillator (21) are respectively provided with a plurality of first through holes (5). The ground supply pad (32), the PCB board (1) and the negative electrode oscillator (22) are respectively provided with a plurality of second through holes (6). A copper foil layer (4) is disposed on the reverse side of the PCB board (1).

2. The intermediate frequency radiating unit according to claim 1, characterized in that, The positive pole oscillator (21) includes two positive pole oscillator units (211) and a positive pole coupling region (212). The two positive pole oscillator units (211) are arranged opposite each other along any diagonal direction of the PCB board (1). The positive pole coupling region (212) connects the two positive pole oscillator units (211). The negative pole oscillator (22) includes two negative pole oscillator units (221) and a negative pole coupling region (222). The two negative pole oscillator units (221) are arranged opposite each other along the other diagonal direction of the PCB board (1). The negative pole coupling region (222) connects the two negative pole oscillator units (221). The positive pole coupling region (212) and the negative pole coupling region (222) intersect.

3. The intermediate frequency radiating unit according to claim 2, characterized in that, The positive coupling region (212) includes a first groove (213) and a positive feed plate (214). The first groove (213) and the positive feed plate (214) are respectively disposed on opposite sides of the two positive oscillator units (211). One end of the positive feed plate (214) is inserted into the first groove (213). A plurality of first through holes (5) are arranged sequentially around the edge of the first groove (213). The positive feed plate (214), the PCB board (1) and the feed pad (31) are respectively provided with positive solder points (215).

4. A mid-frequency radiating unit according to claim 2, characterized in that, The negative electrode coupling region (222) includes a second groove (223), a first negative electrode feed piece (224), and a second negative electrode feed piece (225). The second groove (223) is located on one end of any negative electrode oscillator unit (221) near the other negative electrode oscillator unit (221). The first negative electrode feed piece (224) is located on the front side of the PCB board (1) and inserted into the second groove (223). The second negative electrode feed piece (225) is located on the back side of the PCB board (1). Multiple second electrodes are connected... Holes (6) are arranged sequentially around the edge of the second groove (223). The first negative electrode feed piece (224), the PCB board (1) and the ground pad (32) are respectively provided with negative electrode soldering points (226). The first negative electrode feed piece (224), the PCB board (1) and the second negative electrode feed piece (225) are respectively provided with third through holes (227). The second negative electrode feed piece (225), the PCB board (1) and the other negative electrode oscillator unit (221) are respectively provided with fourth through holes (228).

5. A mid-frequency radiating unit according to claim 2, characterized in that, Both of the positive pole oscillator units (211) and the two negative pole oscillator units (221) are rhomboid structures.

6. A mid-frequency radiating unit according to claim 2, characterized in that, Each positive electrode oscillator unit (211) has a fifth through hole (216) in the middle, and each positive electrode oscillator unit (211) has a first notch (217) on both sides. Each negative electrode oscillator unit (221) has a sixth through hole (229) in the middle, and each negative electrode oscillator unit (221) has a second notch (220) on both sides. The fifth through hole (216) and the sixth through hole (229) are both "8" shaped.

7. A mid-frequency radiating unit according to claim 1, characterized in that, The copper foil layer (4) includes four first copper foil sheets (41) and two second copper foil sheets (42). The four first copper foil sheets (41) are arranged around the central axis of the PCB board (1) in sequence, and the two second copper foil sheets (42) are respectively arranged on both sides of the PCB board (1).

8. An oscillator assembly, characterized in that, The device includes a housing (7), a base (8), two isolation pillars (9), an impedance matching plate (10), and an intermediate frequency radiation unit as described in any one of claims 1-7. The base (8), the two isolation pillars (9), the impedance matching plate (10), and the intermediate frequency radiation unit are all disposed inside the housing (7). The intermediate frequency radiation unit is mounted on the base (8). The two isolation pillars (9) are respectively disposed on the side of the intermediate frequency radiation unit facing away from the base (8). The impedance matching plate (10) is mounted on the two isolation pillars (9).

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