Vehicle-mounted flat plate high-precision module heat dissipation structure
By introducing a heat-dissipating copper block and thermally conductive silicone into the high-precision vehicle module, the problem of insufficient heat dissipation performance of the module is solved, achieving more efficient heat conduction and improved stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN CONGPING TECH CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-04-28
Smart Images
Figure CN224178504U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the structure of vehicle-mounted equipment, and in particular to a heat dissipation structure for a high-precision vehicle-mounted tablet module used in medium-sized electronic products for industrial and agricultural applications. Background Technology
[0002] The high-precision module of the in-vehicle tablet is generally installed on the side facing the motherboard screen, while the heat sink of the whole device is usually on the back. Changgui Design fills the gap between the chip and the motherboard with thermally conductive silicone, but the motherboard is a layered composite structure composed of FR4 and copper foil, with a poor Z-axis thermal conductivity of 0.3W / (m·K).
[0003] At present, electronic products used in industry and agriculture have high power consumption, high performance, and high temperature operation are common. High-precision modules also generate a lot of heat, so the heat dissipation performance of the products is required. Therefore, thermal design is needed for vehicle-mounted high-precision modules. Summary of the Invention
[0004] To solve the above-mentioned technical problems, this utility model provides a heat dissipation structure for a high-precision module of a vehicle-mounted tablet. The heat dissipation copper block passes through the motherboard and is connected to the high-precision module chip by thermally conductive silicone, so as to realize Z-direction heat conduction of the high-precision module and dissipate heat through the heat dissipation component.
[0005] The technical solution adopted by this utility model to solve its technical problem is:
[0006] A heat dissipation structure for a vehicle-mounted tablet high-precision module mainly consists of a display module, a front shell assembly, a high-precision module, a motherboard assembly, a rear shell assembly, and a heat dissipation assembly.
[0007] The display module is located above the front cover assembly and is fixed and sealed with foam adhesive. The high-precision module is located above the motherboard and is fixed to the motherboard assembly's surface-mount nuts with screws. The motherboard assembly is located above the rear cover and is fixed with screws.
[0008] The heat dissipation component is located on the back of the rear housing assembly and is fixed by screws. The heat dissipation component includes an external aluminum component and a thermally conductive copper block. The external aluminum component is limited by the shape of the thermally conductive copper block and is fixed by soldering with solder paste.
[0009] The motherboard assembly includes a main PCB board and surface mount nuts. The surface mount nuts are assembled by being positioned and fixed by soldering through a center hole in the main PCB board. The main PCB board has openings at the high-precision module locations, and heat dissipation components extend into these openings via copper blocks, connecting to the high-precision module chips via thermally conductive silicone for rapid heat conduction.
[0010] Furthermore, the high-precision module is fixed by four surface-mount nuts on the motherboard, thereby increasing the thermal conductive silicone bonding effect and eliminating air between the high-precision module chip and the heat dissipation component.
[0011] Furthermore, the high-precision module is in direct contact with the air through a heat dissipation component, reducing the heat propagation path.
[0012] Furthermore, the high-precision module is supported by patch nuts, which disperses the stress points of the high-precision module chip, increases the impact resistance of the high-precision module, thereby further reducing the risk of the high-precision module falling off and enhancing the heat dissipation stability of the high-precision module.
[0013] The beneficial effects of this utility model are:
[0014] This high-precision module utilizes a heat sink to conduct heat, reducing the heat propagation path and improving overall thermal conductivity. The high-precision module is secured to the motherboard with four screws, mitigating the risk of loosening due to external impacts and enhancing the module's heat dissipation stability. The high-precision module's structure facilitates easy assembly, disassembly, and maintenance. Attached Figure Description
[0015] The technical solution and beneficial effects of this utility model will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.
[0016] Figure 1 This is a complete drawing of the present invention.
[0017] Figure 2 This is a schematic diagram of the overall structure of this utility model.
[0018] Figure 3 This is a schematic diagram of a practical high-precision module.
[0019] Figure 4 This is a schematic diagram of a practical motherboard component casing.
[0020] Figure 5 This is a front view of this practical heat dissipation component.
[0021] Figure 6 This is a schematic diagram of the reverse side of this practical heat dissipation component.
[0022] Figure 7 This is a cross-sectional view of the overall structure of this utility model.
[0023] The main components shown in the diagram consist of: display module 100, front shell assembly 200, high-precision module 300, motherboard assembly 400, rear shell assembly 500, and heat dissipation assembly 600.
[0024] High-precision module 300: high-precision module screw hole 310, high-precision module chip 320.
[0025] Motherboard component 400 description: SMD nut 410, high-precision module chip hole 420.
[0026] Description of heat dissipation component 600: thermally conductive copper block 610, heat dissipation screw hole 620, heat dissipation aluminum component 630, heat dissipation decorative component 640. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. The described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0028] like Figures 1 to 2 As shown, the assembly process of this utility model is as follows: First, assemble the display module 100 onto the front shell assembly 200, and hold it under pressure for 15 seconds using a fixture. Then, install the high-precision module 300 onto the mainboard assembly 400 and secure it with screws. Next, install the heat dissipation assembly 600 onto the rear shell assembly 500 and secure it with screws. Then, assemble the mainboard assembly 400 with the high-precision module 300 installed onto the rear shell assembly 500 and secure it with screws. Finally, install the front shell assembly 200 with the display module 100 assembled onto the rear shell assembly 500 and secure it with screws, thus completing the overall assembly of the vehicle-mounted tablet 001.
[0029] like Figure 3 As shown, the high-precision module chip 320 is SMT fixed on the high-precision module 300 board frame.
[0030] like Figure 4 As shown, the patch nut 410 is assembled and fixed by welding through the center hole of the main PCB board of the main board assembly 400.
[0031] like Figure 5 As shown, the thermally conductive copper block 610 is fixed to the heat dissipation aluminum component 630 by soldering with solder paste.
[0032] like Figures 5 to 7 As shown, the heat dissipation decorative part 640 is assembled with the heat dissipation aluminum part 630 by means of its shape and is locked and fixed to the rear shell assembly 500 by means of screws passing through the screw holes 620 of the heat dissipation part.
[0033] like Figures 2 to 7 As shown, the high-precision module 300 is located above the motherboard assembly 400 and is locked onto the motherboard assembly 400 patch nut 410 through the high-precision module screw hole 310.
[0034] The heat dissipation component 600 is assembled with the rear shell component 500 by the shape of the heat dissipation decorative part 640 and is locked and fixed by the heat dissipation component screw holes 620.
[0035] The heat dissipation component 600 has a thermally conductive copper block 610 that penetrates into the high-precision module chip hole 420 of the motherboard component 400 and is connected to the high-precision module chip 320 of the high-precision module 300 by means of thermally conductive silicone, thereby conducting heat quickly.
[0036] The high-precision module 300 is fixed by four patch nuts 410 on the motherboard assembly 400, thereby forming a pressing plane, increasing the pressing effect of the thermally conductive silicone, and realizing rapid heat transfer.
[0037] The high-precision module 200 is supported by four patch nuts 410, which disperses the stress points of the high-precision module chip 320, increases the shock resistance of the high-precision module 300, thereby further reducing the risk of the high-precision module 300 falling off and enhancing the heat dissipation stability of the high-precision module chip 320.
[0038] The high-precision module 300 is in direct contact with the air through the heat dissipation component 600 and the heat dissipation aluminum part 630, which reduces the heat propagation path.
[0039] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A heat dissipation structure for a vehicle-mounted tablet high-precision module, mainly composed of a display module, a front shell assembly, a high-precision module, a motherboard assembly, a rear shell assembly, and a heat dissipation assembly, characterized in that: The display module is located above the front shell assembly and is fixed and sealed by foam adhesive. The high-precision module is located above the motherboard and is fixed to the surface mount nuts of the motherboard assembly by screws. The motherboard assembly is located above the rear shell and is fixed by screws. The heat dissipation assembly is located on the back of the rear shell assembly and is fixed by screws. The heat dissipation assembly includes an external aluminum component and a thermally conductive copper block. The external aluminum component is limited by the shape of the thermally conductive copper block and is fixed by solder paste. The motherboard assembly includes a main PCB board and surface mount nuts. The surface mount nuts are assembled by being limited by the center hole of the main PCB board and fixed by soldering. The main PCB board has an opening at the location of the high-precision module, and the heat dissipation assembly extends into it through the copper block and is connected to the high-precision module chip by thermally conductive silicone.
2. The heat dissipation structure for a vehicle-mounted tablet high-precision module according to claim 1, characterized in that: The high-precision module is fixed by four surface-mount nuts on the motherboard.
3. The heat dissipation structure for a vehicle-mounted tablet high-precision module according to claim 1, characterized in that: The high-precision module is in direct contact with the air through a heat dissipation component.
4. The heat dissipation structure for a vehicle-mounted tablet high-precision module according to claim 2, characterized in that: The high-precision module is supported by patch nuts, which distributes the stress points of the high-precision module chip.