Anti-counter current diode device
By using snap-fit components and a thermal pad structure, the problem of separating the anti-reverse current diode device from the heat sink is solved, enabling rapid repair and replacement, improving heat dissipation efficiency, and preventing overheating.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG DUKEN ELECTRIC CO LTD
- Filing Date
- 2025-03-27
- Publication Date
- 2026-04-28
AI Technical Summary
Traditional reverse current protection diode devices are difficult to separate from heat sinks, making maintenance and replacement inconvenient.
It adopts a snap-fit assembly and thermal pad structure, which enables quick installation and removal through the snap-fit assembly, and improves heat dissipation efficiency by utilizing the thermal pad and fan.
It enables rapid repair and replacement of reverse current protection diode devices, improves heat dissipation efficiency, and prevents performance degradation or damage caused by overheating.
Smart Images

Figure CN224178603U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of diode technology, and in particular to a reverse current protection diode device. Background Technology
[0002] A reverse current protection diode is a semiconductor device used in circuits to prevent reverse current flow. Its core function is to protect the circuit from damage by reverse current through unidirectional conductivity. By combining mechanical structure and electrical characteristics, the reverse current protection diode achieves low-cost and high-reliability reverse current protection and is widely used in various scenarios that require power supply protection.
[0003] Traditional reverse current protection diode devices are typically attached to the surface of a heat sink using thermally conductive adhesive for heat dissipation. Separating the diode from the heat sink is difficult, causing inconvenience for operators in maintaining and replacing the reverse current protection diode device. Utility Model Content
[0004] To overcome the above shortcomings, this utility model provides a reverse current protection diode device, which aims to improve the problem that traditional reverse current protection diode devices are difficult to separate from heat sinks.
[0005] To achieve the above objectives, the present invention provides the following technical solution:
[0006] A reverse current protection diode device includes a reverse current protection diode body. An anode interface is provided on the upper right surface of the reverse current protection diode body, and a cathode interface is provided on the upper left surface of the reverse current protection diode body. A side plate is fixedly connected to the outer wall of the reverse current protection diode body, and a housing is fixedly connected to the lower surface of the side plate. A snap-fit assembly is provided inside the housing, and fixing holes are provided on both the left and right sides of the reverse current protection diode body.
[0007] Preferably, the buckle assembly includes a buckle base, the outer wall of which is fixedly connected to the inside of the housing, the inner wall of which has a buckle groove, the inside of which has a buckle plate, the outer wall of which has a buckle post, and the outer wall of which is disposed on the inner wall of the fixing hole.
[0008] Preferably, a rotating ring is rotatably connected to the lower outer wall of the housing, and a sliding groove is provided on the inner wall of the rotating ring. The outer wall of the card plate is fixedly connected to the inner wall of the card groove through the sliding groove.
[0009] Preferably, the outer wall of the anti-reverse diode body is provided with heat dissipation holes, a thermal pad is fixedly connected to the lower surface of the anti-reverse diode body, and a heat dissipation component is provided on the lower surface of the pin.
[0010] Preferably, the heat dissipation component includes a heat sink, the upper surface of which is fixedly connected to the lower surface of the pin, and a fan is fixedly connected to the outer wall of the heat sink.
[0011] Preferably, the thermal pad is made of silicone.
[0012] Preferably, the lower surface of the thermal pad is fixedly connected to the upper surface of the heat sink.
[0013] Preferably, the upper outer wall of the locking pin is disposed inside the housing.
[0014] This utility model has the following beneficial effects:
[0015] 1. In this utility model, the locking pin is inserted into the inside of the fixing hole and enters the housing through the fixing hole. The housing and the rotating ring are connected. Then, the rotating ring is rotated to align the locking slot and the sliding groove. The locking plate slides into the inner wall of the locking slot through the sliding groove. Then, the rotating ring is rotated to make the locking slot and the sliding groove misaligned to fix the locking pin. This allows the operator to quickly install and disassemble the anti-reverse diode body, which is convenient for the operator to maintain and replace the anti-reverse current diode device.
[0016] 2. In this utility model, air circulation is achieved through heat dissipation holes to prevent heat accumulation inside the anti-reverse diode body. At the same time, a thermal pad is used to transfer the surface heat of the anti-reverse diode body to the heat sink, and the fan is activated to enhance the heat dissipation of the heat sink. This can improve the heat dissipation efficiency and prevent the anti-reverse diode body from degrading or being damaged due to overheating. Attached Figure Description
[0017] Figure 1 This is a three-dimensional structural diagram of an anti-reverse current diode device proposed in this utility model;
[0018] Figure 2 This is a partial structural diagram of the housing of an anti-reverse current diode device proposed in this utility model;
[0019] Figure 3 This is a partial structural diagram of the mounting bracket for an anti-reverse current diode device proposed in this utility model;
[0020] Figure 4 This is a partial structural diagram of the thermal pad of the anti-reverse current diode device proposed in this utility model.
[0021] Legend:
[0022] 1. Anti-reverse diode body; 2. Anode interface; 3. Cathode interface; 4. Side plate; 5. Housing; 6. Card holder; 7. Card slot; 8. Rotary ring; 9. Slide groove; 10. Card plate; 11. Card post; 12. Fixing hole; 13. Heat dissipation hole; 14. Thermal pad; 15. Heat sink; 16. Fan. Detailed Implementation
[0023] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0024] Reference Figures 1-3 An embodiment of this utility model is provided: a reverse current protection diode device, including a reverse current protection diode body 1, an anode interface 2 is provided on the upper right surface of the reverse current protection diode body 1, a cathode interface 3 is provided on the upper left surface of the reverse current protection diode body 1, a side plate 4 is fixedly connected to the outer wall of the reverse current protection diode body 1, a housing 5 is fixedly connected to the lower surface of the side plate 4, a buckle assembly is provided inside the housing 5, and fixing holes 12 are provided on both the left and right sides of the reverse current protection diode body 1.
[0025] Specifically, the anti-reverse diode body 1 is used to prevent current from flowing in the opposite direction, the anode interface 2 is used to connect the positive wire, the cathode interface 3 is used to connect the negative wire, the anti-reverse diode body 1 is used to fix the side plate 4, the side plate 4 is used to fix the housing 5, and the anti-reverse diode body 1 has a fixing hole 12 to fix the anti-reverse diode body 1.
[0026] Reference Figures 2-4 The buckle assembly includes a buckle seat 6, the outer wall of which is fixedly connected to the inside of the housing 5. The inner wall of the buckle seat 6 is provided with a buckle groove 7. A buckle plate 10 is provided inside the buckle seat 6. A buckle post 11 is fixedly connected to the outer wall of the buckle plate 10. The outer wall of the buckle post 11 is located on the inner wall of the fixing hole 12. A rotating ring 8 is rotatably connected to the lower outer wall of the housing 5. A sliding groove 9 is provided on the inner wall of the rotating ring 8. The outer wall of the buckle plate 10 is fixedly connected to the inner wall of the buckle groove 7 through the sliding groove 9.
[0027] Specifically, the housing 5 is used to fix the card holder 6. The card holder 6 has a card groove 7 to fix the card plate 10. The card holder 6 is used to hold the card plate 10. The card plate 10 is used to fix the card post 11. The fixing hole 12 is used for the insertion of the card post 11. The housing 5 supports the rotation of the rotating ring 8. The rotating ring 8 has a sliding groove 9 to support the card plate 10 to slide into the inner wall of the card groove 7 for fixation. This allows the operator to quickly install and remove the anti-reverse diode body 1, which is convenient for the operator to maintain and replace the anti-reverse current diode device.
[0028] Reference Figure 1 The outer wall of the anti-reverse diode body 1 is provided with heat dissipation holes 13. A thermal pad 14 is fixedly connected to the lower surface of the anti-reverse diode body 1. A heat dissipation assembly is provided on the lower surface of the pin 11. The heat dissipation assembly includes a heat sink 15. The upper surface of the heat sink 15 is fixedly connected to the lower surface of the pin 11. A fan 16 is fixedly connected to the outer wall of the heat sink 15. The thermal pad 14 is made of silicone material. The lower surface of the thermal pad 14 is fixedly connected to the upper surface of the heat sink 15. The upper outer wall of the pin 11 is located inside the housing 5.
[0029] Specifically, the anti-reverse diode body 1 has heat dissipation holes 13 for air circulation to prevent heat buildup inside the anti-reverse diode body 1. The anti-reverse diode body 1 is used to fix the thermal pad 14, which is made of silicone and has high thermal conductivity. It is used to transfer the heat of the anti-reverse diode body 1 to the heat sink 15. The heat sink 15 is used for heat dissipation and is used to fix the fan 16. The fan 16 is an existing structure and is mainly used to enhance the heat dissipation of the heat sink 15, thereby improving the heat dissipation efficiency and preventing the anti-reverse diode body 1 from degrading or being damaged due to overheating.
[0030] Working principle: When the reverse current protection diode device is needed, first insert the locking pin 11 into the fixing hole 12, and then into the housing 5 through the fixing hole 12. The housing 5 is connected to the rotating ring 8. Then rotate the rotating ring 8 to align the locking slot 7 and the sliding groove 9. The locking plate 10 slides into the inner wall of the locking slot 7 through the sliding groove 9. Then rotate the rotating ring 8 to misalign the locking slot 7 and the sliding groove 9 to fix the locking pin 11 inside the housing 5. This allows the operator to quickly install and remove the reverse current protection diode body 1, which is convenient for the operator to maintain and replace the reverse current protection diode device. When the reverse current protection diode body 1 is running, the heat dissipation hole 13 allows air to circulate, preventing heat accumulation inside the reverse current protection diode body 1. At the same time, the heat conduction pad 14 transfers the surface heat of the reverse current protection diode body 1 to the heat sink 15. The fan 16 is turned on to enhance the heat dissipation of the heat sink 15, thereby improving the heat dissipation efficiency and preventing the reverse current protection diode body 1 from degrading or being damaged due to overheating.
[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A reverse current protection diode device, comprising a reverse current protection diode body (1), characterized in that: An anode interface (2) is provided on the upper right surface of the anti-reverse diode body (1), and a cathode interface (3) is provided on the upper left surface of the anti-reverse diode body (1). A side plate (4) is fixedly connected to the outer wall of the anti-reverse diode body (1), and a housing (5) is fixedly connected to the lower surface of the side plate (4). A snap-fit assembly is provided inside the housing (5), and fixing holes (12) are provided on both the left and right sides of the anti-reverse diode body (1).
2. The reverse current protection diode device according to claim 1, characterized in that: The buckle assembly includes a buckle seat (6), the outer wall of which is fixedly connected to the inside of the housing (5). The inner wall of the buckle seat (6) is provided with a buckle groove (7). The buckle seat (6) is provided with a buckle plate (10) inside. The outer wall of the buckle plate (10) is fixedly connected with a buckle post (11), and the outer wall of the buckle post (11) is provided on the inner wall of the fixing hole (12).
3. The reverse current protection diode device according to claim 2, characterized in that: The lower outer wall of the housing (5) is rotatably connected to a rotating ring (8), and the inner wall of the rotating ring (8) is provided with a sliding groove (9). The outer wall of the card plate (10) is fixedly connected to the inner wall of the card slot (7) through the sliding groove (9).
4. The reverse current protection diode device according to claim 2, characterized in that: The outer wall of the anti-reverse diode body (1) is provided with heat dissipation holes (13), the lower surface of the anti-reverse diode body (1) is fixedly connected with a heat-conducting pad (14), and the lower surface of the locking post (11) is provided with a heat dissipation component.
5. The reverse current protection diode device according to claim 4, characterized in that: The heat dissipation assembly includes a heat sink (15), the upper surface of which is fixedly connected to the lower surface of the pin (11), and a fan (16) is fixedly connected to the outer wall of the heat sink (15).
6. The reverse current protection diode device according to claim 4, characterized in that: The thermal pad (14) is made of silicone.
7. The reverse current protection diode device according to claim 5, characterized in that: The lower surface of the thermal pad (14) is fixedly connected to the upper surface of the heat sink (15).
8. The reverse current protection diode device according to claim 2, characterized in that: The upper outer wall of the locking pin (11) is located inside the housing (5).