Sand blasting shielding protection device for wafer bearing table in semiconductor manufacturing process

Abstract

The utility model belongs to the technical field of semiconductor manufacture procedures, and relates to a semiconductor manufacture procedure wafer bearing table sand blasting shielding protection device. Comprising a shielding cover plate (1), a shielding chuck (2) and a device base (3), the shape and the size of the inner edge of the shielding chuck (2) are equal to the shape and the size of the outer edge of the shielding cover plate (1), base positioning holes (4) are formed in the device base (3), and cover plate positioning columns (5) are arranged on the shielding cover plate (1). The semiconductor process wafer bearing table sand blasting shielding protection device is simple in structure, sand blasting shielding of a non-processing area of the wafer bearing table is guaranteed, and it is guaranteed that only the area needing sand blasting is processed.

Description

A semiconductor wafer stage sandblasting shielding protection device Technical Field

[0001] This utility model belongs to the field of semiconductor process technology, and more specifically, it relates to a sandblasting and shielding protection device for a semiconductor process wafer stage. Background Technology

[0002] In semiconductor manufacturing, physical vapor deposition (PVD) involves sputtering the desired metal onto the surface of a wafer stage. During SiO2 deposition, it's desirable for SiO2 to be deposited only on the corresponding surface of the wafer stage, thus requiring masking of other areas. For example, the central sandblasting and arc-blasting areas of the wafer stage are treated with abrasive materials, while the edge sandblasting areas are treated separately. These two processes need to be performed separately. Existing technologies cannot reliably mask areas according to actual needs. Current technologies primarily use sandblasting tape to protect areas that don't require sandblasting. However, for irregularly shaped components, applying tape is inconvenient for employees, the tape is easily broken by the abrasive during sandblasting, causing component contamination, and adhesive residue is easily left on the component surface when the tape is removed.

[0003] Existing technology includes a technology entitled "A Wafer Sandblasting Machine" with publication number "CN111843860A," which provides a wafer sandblasting machine and relates to the field of wafer processing. This wafer sandblasting machine includes a main body and a sandblasting tank. Rotating rods are movably connected to both inner side walls of the main body via bearings. An adjusting box is fixedly connected to one end of each rotating rod. A movable plate is installed inside the adjusting box, and a connecting rod is fixedly connected to the side wall of the movable plate. A first motor is fixedly connected to the bottom of the adjusting box, and a first rotating shaft is fixedly connected to the output end of the first motor. An adjusting wheel is fixedly connected to the top of the first rotating shaft. Second motors are fixedly connected to the top of the main body and near both sides. Through the design of the separation mechanism, this sandblasting machine can effectively screen sand and large pieces of gravel during use, avoiding interference with subsequent sandblasting processes and the generation of large amounts of dust, and facilitating the collection of sand and gravel. However, this technology does not address the technical problems and solutions of this application. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide a semiconductor process wafer stage sandblasting shielding protection device that is simple in structure, ensures sandblasting shielding of non-processed areas of the wafer stage, and ensures that only the areas requiring sandblasting are processed, in order to address the shortcomings of the existing technology.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] This utility model is a sandblasting and shielding protection device for a semiconductor process wafer stage, including a shielding cover plate, a shielding clamp, and a device base. The inner shape and size of the shielding clamp are equal to the outer shape and size of the shielding cover plate. The device base is provided with a base positioning hole, and the shielding cover plate is provided with a cover plate positioning post.

[0007] The shielding cover is circular, and the shielding clamp is annular, with the inner diameter of the shielding clamp being equal to the outer diameter of the shielding cover.

[0008] The device base has a circular structure, and the outer diameter of the device base is equal to the outer diameter of the shielding chuck.

[0009] The shielding clamp is provided with multiple edge positioning posts, which are spaced apart around the circumference of the shielding clamp. The base of the device is provided with multiple edge positioning holes spaced apart.

[0010] The base positioning hole is located at the center of the device base, and the cover plate positioning post is located at the center of the cover plate.

[0011] The wafer stage has multiple edge through holes near its edge, a central through hole at its center, a central sandblasting and arc welding area at the center of its surface, and an edge sandblasting area around its outer ring.

[0012] The central sandblasting and arc welding area has a circular structure, and the diameter of the central sandblasting and arc welding area is equal to the outer diameter of the shielding chuck.

[0013] The edge sandblasting area has a ring structure. The inner diameter of the edge sandblasting area is equal to the inner diameter of the shielding chuck, and the outer diameter of the edge sandblasting area is equal to the outer diameter of the shielding chuck.

[0014] The shielding cover, shielding clamp, and device base are all made of steel.

[0015] The working principle and beneficial effects of this utility model are as follows:

[0016] The semiconductor process wafer stage sandblasting masking protection device described in this utility model is structurally configured with a masking cover, a masking clamp, and a device base, each corresponding to the model and size of the wafer stage to be masked. The protection device is used in pairs to achieve the masking protection effect. Application scenario 1: When edge sandblasting is required, the masking cover and device base are used together. The wafer stage is placed on the device base, and then the masking cover is fastened onto the wafer stage. The cover's positioning post passes through the center hole of the wafer stage and is inserted into the positioning hole of the device base, ensuring reliable positioning of the masking cover, device base, and wafer stage. The masking cover reliably masks the central sandblasting and arc spraying areas, while the edge sandblasting areas are exposed, allowing for sandblasting treatment of these areas. Use Case 2: When sandblasting and arc welding treatment are required for the central sandblasting and arc welding areas, the shielding chuck is combined with the device base, the wafer stage is placed on the device base, and then the shielding chuck is fastened onto the wafer stage. The positioning post on the edge of the chuck passes through the through hole on the edge of the wafer stage and is inserted into the positioning hole on the edge of the device base. This achieves reliable positioning of the shielding chuck, the device base, and the wafer stage. The shielding chuck reliably shields the edge sandblasting area, while the central sandblasting and arc welding area is exposed, allowing for sandblasting and arc welding treatment of the central sandblasting and arc welding area. With the device of this invention, it is no longer necessary to use sandblasting tape to protect the parts of the wafer stage that do not require sandblasting. For irregularly shaped wafer stage components, using tape is not only inconvenient to operate, but the tape is also easily broken by the sandblasting material, causing localized contamination of the wafer stage product. Furthermore, adhesive residue is easily left on the surface of the wafer stage product when the tape is removed. This device completely changes the traditional method of sandblasting tape masking protection, using a contour-following protective device to directly fill the areas that need protection, avoiding the problems of adhesive residue and ink marks. Moreover, the device of this invention requires low operator skill and is suitable for mass production. Attached Figure Description

[0017] The following is a brief explanation of the contents depicted in the accompanying drawings and the markings therein:

[0018] Figure 1 is a schematic diagram of the structure of the wafer support stage of this utility model;

[0019] Figure 2 is a schematic diagram of the structure of the shielding cover and device base of the semiconductor process wafer stage sandblasting shielding protection device described in this utility model before they are combined.

[0020] Figure 3 is a schematic diagram of the structure of the shielding clamp and device base of the semiconductor process wafer stage sandblasting shielding protection device described in this utility model before combination.

[0021] The labels in the attached diagram are as follows: 1. Shielding cover plate; 2. Shielding chuck; 3. Device base; 4. Base positioning hole; 5. Cover plate positioning post; 6. Chuck edge positioning post; 7. Wafer stage; 8. Wafer stage edge through hole; 9. Wafer stage center through hole; 10. Central sandblasting and arc spraying area; 11. Edge sandblasting area; 12. Base edge positioning hole. Detailed Implementation

[0022] The following description, with reference to the accompanying drawings, provides a more detailed explanation of the specific embodiments of this utility model, including the shape and structure of each component, the relative positions and connections between the parts, the functions and working principles of each part:

[0023] As shown in Figures 1-3, this utility model is a sandblasting masking protection device for a semiconductor process wafer stage, including a masking cover plate 1, a masking clamp 2, and a device base 3. The inner shape and size of the masking clamp 2 are equal to the outer shape and size of the masking cover plate 1. The device base 3 is provided with a base positioning hole 4, and the masking cover plate 1 is provided with a cover plate positioning post 5. This structure addresses the shortcomings of the prior art by proposing an improved technical solution. In the structural setup, the masking cover plate 1, the masking clamp 2, and the device base 3 are respectively positioned, corresponding to the model and size of the wafer stage product to be masked. The protection device is used in pairs to achieve the masking protection effect. Use Case 1: When the edge sandblasting area 11 needs to be sandblasted, the shielding cover 1 is used in combination with the device base 3. The wafer stage 7 is placed on the device base 3, and then the shielding cover 1 is fastened to the wafer stage 7. The cover positioning post 5 passes through the center hole of the wafer stage 7 and is inserted into the base positioning hole 4 of the device base 3, so as to achieve reliable positioning of the shielding cover 1, the device base 3, and the wafer stage 7. The shielding cover 1 reliably shields the central sandblasting and arc spraying area 10, while the edge sandblasting area 11 is exposed, and the edge sandblasting area 11 can be sandblasted. Use Case 2: When the central sandblasting and arc welding area 10 needs to be sandblasted and arc welded, the shielding chuck 2 is combined with the device base 3, the wafer stage 7 is placed on the device base 3, and then the shielding chuck 2 is fastened onto the wafer stage 7. The positioning post 6 on the edge of the chuck passes through the wafer stage edge through hole 12 of the wafer stage 7 and is inserted into the positioning hole 4 on the base edge of the device base 3, so as to achieve reliable positioning of the shielding chuck 2, the device base 3, and the wafer stage 7. The shielding chuck 2 reliably shields the edge sandblasting area 11, while the central sandblasting and arc welding area 10 is exposed, so that the central sandblasting and arc welding area 10 can be sandblasted and arc welded. With the device of this invention, it is no longer necessary to use sandblasting tape to protect the non-sandblasted areas of the wafer stage. For irregularly shaped wafer stage components, using tape is not only inconvenient but also prone to breakage by the sand during sandblasting, causing localized contamination of the wafer stage product. Furthermore, adhesive residue is easily left on the wafer stage surface when the tape is removed. This device completely changes the traditional sandblasting tape masking protection method, using a contour-following protective device to directly fill the areas requiring protection, avoiding the problems of adhesive residue and ink marks. Moreover, the device requires low operator skill and is suitable for mass production. This device can be used for masking protection in both sandblasting and arc welding processes, offering versatility and convenience. The semiconductor process wafer stage sandblasting masking protection device described in this invention has a simple structure, ensuring sandblasting masking of non-processed areas of the wafer stage, ensuring that only the areas requiring sandblasting are treated.

[0024] The shielding cover 1 is circular, and the shielding clamp 2 is annular, with the inner diameter of the clamp 2 equal to the outer diameter of the cover 1. The device base 3 is also circular, with the outer diameter equal to the outer diameter of the clamp 2. This structure allows for the manufacture of shielding cover 1, clamp 2, and base 3 with corresponding dimensions for different models and sizes of wafer stage products, facilitating convenient and reliable shielding protection for the products.

[0025] The shielding chuck 1 is provided with multiple chuck edge positioning posts 6, which are spaced apart around the circumference of the shielding chuck 2. Multiple base edge positioning holes 12 are provided at intervals along the edge of the device base. The base positioning hole 4 is located at the center of the device base 3, and the cover plate positioning post 5 is located at the center of the shielding cover plate 1. The wafer stage 7 has multiple wafer stage edge through holes 8 near its edge, and a wafer stage center through hole 9 at its center. In this structure, each chuck edge positioning post corresponds to a wafer stage edge through hole on the wafer stage. In this structure, the through hole can be a threaded hole, and the positioning post can be a bolt passing through the corresponding component, thereby achieving a fixed connection between the shielding cover plate 1 and the device base 3, or a fixed connection between the shielding chuck 2 and the device base 3. This ensures that the protective device does not fall off during use, does not create gaps between it and the part of the wafer stage that needs protection, and prevents sand leakage into the protected area.

[0026] The wafer stage 7 has a central sandblasting and arc welding area 10 in the middle of its surface, and an edge sandblasting area 11 around its outer ring. The base positioning hole 4 is correspondingly set with the cover plate positioning post 5.

[0027] The central sandblasting and arc blasting area 10 is circular, with its diameter equal to the outer diameter of the shielding chuck 2. The edge sandblasting area 11 is annular, with its inner diameter equal to the inner diameter of the shielding chuck 2, and its outer diameter equal to the outer diameter of the shielding chuck 2. This structure allows for convenient and reliable sandblasting of the wafer stage by shielding the central sandblasting and arc blasting area 10 when edge sandblasting of the area 11 is required, and vice versa.

[0028] The shielding cover 1, shielding clamp 2, and device base 3 are all made of steel. The shielding cover 1, shielding clamp 2, and device base 3 are made of stainless steel, resulting in high component strength. This allows the shielding cover 1, shielding clamp 2, and device base 3 to be cleaned and reused, extending the service life of the protective device and reducing the cost of protecting and shielding product components.

[0029] The semiconductor process wafer stage sandblasting shielding protection device of this utility model is structurally configured with a shielding cover plate 1, a shielding clamp 2, and a device base 3, each corresponding to the model and size of the wafer stage product to be shielded. The protection device is used in pairs to achieve the shielding protection effect. Application scenario 1: When sandblasting the edge sandblasting area 11 is required, the shielding cover plate 1 and the device base 3 are used together. The wafer stage 7 is placed on the device base 3, and then the shielding cover plate 1 is fastened onto the wafer stage 7. The cover plate positioning post 5 passes through the center hole of the wafer stage 7 and is inserted into the base positioning hole 4 of the device base 3, achieving reliable positioning of the shielding cover plate 1, the device base 3, and the wafer stage 7. The shielding cover plate 1 reliably shields the central sandblasting and arc spraying area 10, while the edge sandblasting area 11 is exposed, allowing for sandblasting treatment of the edge sandblasting area 11. Use Case 2: When the central sandblasting and arc welding area 10 needs to be sandblasted and arc welded, the shielding chuck 2 is combined with the device base 3, the wafer stage 7 is placed on the device base 3, and then the shielding chuck 2 is fastened onto the wafer stage 7. The positioning post 6 on the edge of the chuck passes through the wafer stage edge through hole 12 of the wafer stage 7 and is inserted into the positioning hole 4 on the base edge of the device base 3, so as to achieve reliable positioning of the shielding chuck 2, the device base 3, and the wafer stage 7. The shielding chuck 2 reliably shields the edge sandblasting area 11, while the central sandblasting and arc welding area 10 is exposed, so that the central sandblasting and arc welding area 10 can be sandblasted and arc welded. With the device of this invention, it is no longer necessary to use sandblasting tape to protect the areas of the wafer stage 7 that do not require sandblasting. For irregularly shaped wafer stage 7 components, using tape is not only inconvenient, but the tape on the surface is also easily broken by the sandblasting material, causing localized contamination of the wafer stage 7. Furthermore, adhesive residue is easily left on the surface of the wafer stage 7 when the tape is removed. The device of this invention completely changes the traditional method of sandblasting tape masking protection, using a contour-following protective device to directly fill the areas that need protection, avoiding the problems of adhesive residue and adhesive marks. Moreover, the device of this invention requires low operator skill and is suitable for mass production.

[0030] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, are all within the protection scope of the present invention.

Claims

1. A semiconductor wafer stage sandblasting and shielding protection device, characterized in that: It includes a shielding cover plate (1), a shielding clamp (2), and a device base (3). The inner shape and size of the shielding clamp (2) are the same as the outer shape and size of the shielding cover plate (1). The device base (3) is provided with a base positioning hole (4), and the shielding cover plate (1) is provided with a cover plate positioning post (5).

2. The semiconductor process wafer stage sandblasting and shielding protection device according to claim 1, characterized in that: The shielding cover (1) is circular, and the shielding clamp (2) is annular. The inner diameter of the shielding clamp (2) is equal to the outer diameter of the shielding cover (1).

3. The semiconductor process wafer stage sandblasting and shielding protection device according to claim 2, characterized in that: The device base (3) has a circular structure, and the outer diameter of the device base (3) is equal to the outer diameter of the shielding chuck (2).

4. The semiconductor process wafer stage sandblasting and shielding protection device according to claim 1 or 2, characterized in that: The shielding clamp (2) is provided with multiple clamping clamp edge positioning posts (6), and the multiple clamping clamp edge positioning posts (6) are arranged at intervals around the shielding clamp (2). The device base (3) is provided with multiple base edge positioning holes (12) at intervals.

5. The semiconductor process wafer stage sandblasting and shielding protection device according to claim 1 or 2, characterized in that: The base positioning hole (4) is located at the center of the device base (3), and the cover plate positioning post (5) is located at the center of the shielding cover plate (1).

6. The semiconductor process wafer stage sandblasting and shielding protection device according to claim 1 or 2, characterized in that: The wafer stage (7) is provided with multiple wafer stage edge through holes (8) near the edge, a wafer stage center through hole (9) is provided at the center of the wafer stage (7), a central sandblasting and arc welding area (10) is provided in the middle of the surface of the wafer stage (7), and an edge sandblasting area (11) is provided on the outer ring of the wafer stage (7).

7. The semiconductor process wafer stage sandblasting and shielding protection device according to claim 6, characterized in that: The central sandblasting and arc melting area (10) is a circular structure, and the diameter of the central sandblasting and arc melting area (10) is equal to the outer diameter of the shielding chuck (2).

8. The semiconductor process wafer stage sandblasting and shielding protection device according to claim 6, characterized in that: The edge sandblasting area (11) is a ring structure. The inner diameter of the edge sandblasting area (11) is equal to the inner diameter of the shielding chuck (2), and the outer diameter of the edge sandblasting area (11) is equal to the outer diameter of the shielding chuck (2).

9. The semiconductor process wafer stage sandblasting and shielding protection device according to claim 1 or 2, characterized in that: The shielding cover (1), shielding clamp (2), and device base (3) are all made of steel.

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